JPS6169857U - - Google Patents
Info
- Publication number
- JPS6169857U JPS6169857U JP15355384U JP15355384U JPS6169857U JP S6169857 U JPS6169857 U JP S6169857U JP 15355384 U JP15355384 U JP 15355384U JP 15355384 U JP15355384 U JP 15355384U JP S6169857 U JPS6169857 U JP S6169857U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor laser
- notch
- laser
- end surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000008188 pellet Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Description
第１図及び第２図は本考案半導体レーザの実施
の一例を示すもので、第１図は斜視図、第２図は
第１図の２−２線の沿う断面図、第３図Ａ乃至Ｅ
は第１図及び第２図に示した半導体レーザの製造
方法を工程順に示す斜視図、第４図Ａ乃至Ｃは上
記製造方法の各工程Ａ乃至Ｃの終了後における状
態を示す断面図、第５図は上記製造方法に付加し
たスクライブ工程を説明するための半導体基板を
裏面を上向きにして示す斜視図、第６図は本考案
半導体レーザの別の実施例を示す斜視図、第７図
Ａ，Ｂは従来の問題点を説明する断面図である。
符号の説明、１……半導体ペレツト、１ａ……
端面、４……受光素子、６……レーザチツプマウ
ント切欠、８……半導体レーザチツプ、８ａ……
レーザ光出射端面。
1 and 2 show an example of the implementation of the semiconductor laser of the present invention. FIG. 1 is a perspective view, FIG. 2 is a sectional view taken along line 2-2 in FIG. 1, and FIGS. E
4A to 4C are perspective views showing the manufacturing method of the semiconductor laser shown in FIGS. 1 and 2 in the order of steps, FIGS. FIG. 5 is a perspective view showing a semiconductor substrate with its back side facing upward for explaining the scribing step added to the above manufacturing method, FIG. 6 is a perspective view showing another embodiment of the semiconductor laser of the present invention, and FIG. 7A , B are sectional views illustrating conventional problems. Explanation of symbols, 1...Semiconductor pellet, 1a...
End face, 4... Light receiving element, 6... Laser chip mount notch, 8... Semiconductor laser chip, 8a...
Laser light emitting end face.
Claims (1)
の一端部表面にレーザチツプマウント切欠が形成
され、該切欠上に半導体レーザチツプがそのレー
ザ光出射端面と半導体ペレツトの一端面とが同一
平面上に位置するように接続されてなることを特
徴とする半導体レーザ。 A laser chip mount notch is formed in the surface of one end of the semiconductor pellet on which the light receiving element is formed, and the semiconductor laser chip is placed on the notch so that its laser beam emitting end surface and one end surface of the semiconductor pellet are located on the same plane. A semiconductor laser characterized in that it is connected as shown in FIG.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15355384U JPS6169857U (en) | 1984-10-09 | 1984-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15355384U JPS6169857U (en) | 1984-10-09 | 1984-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6169857U true JPS6169857U (en) | 1986-05-13 |
Family
ID=30711566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15355384U Pending JPS6169857U (en) | 1984-10-09 | 1984-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169857U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010212491A (en) * | 2009-03-11 | 2010-09-24 | Sharp Corp | Mounting member and semiconductor light-emitting device with mounting member |
-
1984
- 1984-10-09 JP JP15355384U patent/JPS6169857U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010212491A (en) * | 2009-03-11 | 2010-09-24 | Sharp Corp | Mounting member and semiconductor light-emitting device with mounting member |
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