JPS6165432A - Pre-alignment device - Google Patents
Pre-alignment deviceInfo
- Publication number
- JPS6165432A JPS6165432A JP59186468A JP18646884A JPS6165432A JP S6165432 A JPS6165432 A JP S6165432A JP 59186468 A JP59186468 A JP 59186468A JP 18646884 A JP18646884 A JP 18646884A JP S6165432 A JPS6165432 A JP S6165432A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- displacement
- alignment
- image
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
（発明の分野）
本発明は、半導体製造装置等に使用され、画像処理を用
いてウェハのプリアライメントを行なうプリアライメン
ト装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of the Invention) The present invention relates to a pre-alignment device used in semiconductor manufacturing equipment and the like, which performs pre-alignment of a wafer using image processing.
（発明の背景〉
従来、半導体製造装置においでは、パターン露光に先た
ち、半導体ウェハのスクライブラインに設けたプリアラ
イメントマークを用いて画像処理によりプリアライメン
トを行なっていた。ところが、最初にウェハに露光を行
なう第１マスク工程では、ウェハにプリアライメントマ
ークが入っていないため、プリアライメントを用いた画
像処理を行なうことができず、他の何らかの方法でプリ
アライメントを行なう必要があった。(Background of the Invention) Conventionally, in semiconductor manufacturing equipment, prior to pattern exposure, pre-alignment was performed by image processing using pre-alignment marks provided on the scribe lines of the semiconductor wafer. In the first mask step, since there is no pre-alignment mark on the wafer, image processing using pre-alignment cannot be performed, and it is necessary to perform pre-alignment using some other method.
このため、従来は機械的にウェハの位置を検出してプリ
アライメントを行なうか、あるいはステ−シ上に載置し
たウェハを回中云さぜ該ウェハの−［ッジ部分をＣＣＤ
等の一次７′ｃＬ−ンサで検出することによってウェハ
の変化量を求めプリアライメントを行なっていた。For this reason, in the past, the position of the wafer was detected mechanically and pre-alignment was performed, or the wafer placed on a stage was rotated and the -[edge part of the wafer was
Pre-alignment was performed by detecting the amount of change in the wafer by using a primary 7'cL-sensor such as the above.
しかしながら、前者の方法では高精度のアライメントが
不可能であり、また後者の方法てもウェハの回転精度が
充分高くできないためアライメント精度を高くすること
か不可能であるとともに、ウェハを少なくとも１回転さ
せる必要があるためウェハの変化量の検出時間が長くな
り結局プリアライメントに長時間を要するという不都合
があった。However, the former method does not allow for highly accurate alignment, and the latter method also does not allow for sufficiently high wafer rotation accuracy, making it impossible to increase alignment accuracy and requiring the wafer to rotate at least once. As a result, it takes a long time to detect the amount of change in the wafer, resulting in a disadvantage that pre-alignment takes a long time.
（発明の目的）
本発明は、上述の従来形における問題点に鑑み、１１ノ
アライメント装置に６いて、ウェハに７ライメントマー
クが形成されていない第１マスク工程等の場合において
も画像処理によりプリアライメントを可能にし、高精度
の露光ができるようにすることを目的とする。(Object of the Invention) In view of the above-mentioned problems with the conventional type, the present invention provides a 11-no alignment device that uses image processing to perform pre-printing even in the first mask process where no alignment marks are formed on the wafer. The purpose is to enable alignment and high-precision exposure.
本発明に、よれば、テレビカメラ等の画像検出装置（こ
よってステージ上に載置されたウェハの外径像を求め、
この外（子像を用いて検出したつＪ−ハの基準位置から
の変位量にもとづきウェハのプリアライメントか行なわ
れる。According to the present invention, an image detection device such as a television camera (thereby obtaining an outer diameter image of a wafer placed on a stage,
In addition to this, pre-alignment of the wafer is also performed based on the amount of displacement from the reference position of J-C detected using the child image.
（発明の実施例） 以下、図面により本発明の詳細な説明する。(Example of the invention) Hereinafter, the present invention will be explained in detail with reference to the drawings.
第１図は、本発明の１実施例に係るプリアライメント装
買を示す。同図の装置は、ウェハ１に対向する囮影レン
ズ２、テレビカメラ３、△７″Ｄ変（９器４、ウーＦハ
像がデジタル化されＣ２逐されるメモリ５、そしＣテレ
ビカメラ３．Ａ、、／Ｄ変換器４、メモリ５、ステージ
制御部７を制御するプロセラ＋±（以下、ＣＰＵど称す
る〉６を有する。FIG. 1 shows a pre-alignment device according to one embodiment of the invention. The apparatus shown in the figure includes a decoy lens 2 facing a wafer 1, a television camera 3, a △7''D lens 4, a memory 5 in which the UFF image is digitized and stored in C2, and a C television camera 3. It has a processor +/- (hereinafter referred to as CPU) 6 that controls the A, , /D converter 4, the memory 5, and the stage control section 7.
第２図は、本発明に係るプリアライメント装量における
ウェハの位置決めのための処理過程を示す。同図におい
て、２１はメモリ５に記憶されたウェハ画像を示す。２
２は、画像２１のオリエンテーションフラット部２１ａ
を除外して丸形ウェハを理論的に求めた画像を示す。こ
れらの処理はＣＰＵ６によってメモリ５に記憶された画
像データを変更処理することにより行なわれる。２３は
、画像２２のＸ、Ｙ方向の変位量を求めたものである。FIG. 2 shows a process for positioning a wafer in a pre-alignment procedure according to the present invention. In the figure, 21 indicates a wafer image stored in the memory 5. 2
2 is the orientation flat part 21a of the image 21
An image of a round wafer theoretically obtained by excluding the wafer is shown. These processes are performed by changing the image data stored in the memory 5 by the CPU 6. 23 indicates the amount of displacement of the image 22 in the X and Y directions.
ＸＯ、Ｙｏはメモリ中の基準軸であり、Ｘ。XO and Yo are reference axes in memory;
ｙは対象とイするウェハの中心の座標である。これによ
り、ウェハのＸ、Ｙ方向の変位量が求められる。２４は
、画像２３と画像２１を合成し、これよりオリエンテー
ションフラット部２１ａの角度θを求めたものであるう
以上のような測定処理によりウェハの変位量×、ｙ、θ
が求められ、これらのＦ！１直はメ七り５に記憶される
。y is the coordinate of the center of the target wafer. As a result, the amount of displacement of the wafer in the X and Y directions is determined. 24 is the image obtained by combining the image 23 and the image 21 and determining the angle θ of the orientation flat portion 21a. Through the above measurement process, the amount of displacement of the wafer x, y, θ is obtained.
is required, and these F! The 1st shift will be memorized in Me7ri 5.
以−ヒのようにして求められたウェハの変位ｆｌＸ。Wafer displacement flX obtained as described below.
ｙ、θにもとづきステージ制御回路７がつ丁ハのアライ
メントを行なう。第３図において、３１はウェハ位置測
定場所を示し、３２は最終アライメント場所Ｃある。ウ
ェハは場所３１から場所３２までＸＸ、ＹＹだけ移動す
る。このとき、ステージ１ｔｉＩＩ ６０部７にはＸＸ
、ＹＹと共に前述のウェハ位置の変位（ｄの測定ＩＤｘ
、ｙ、θか与えられＸ方向にＸＸ＋Ｘ
Ｙ方向にｙｙ＋−ｙ
θ方向にθ
だけ移動及び回転する。上記操作はＣＰＵ６の制御によ
り自動的に行なわれ、各々のウェハは常に正しい位置に
プリアライメントされる。The stage control circuit 7 performs alignment based on y and θ. In FIG. 3, reference numeral 31 indicates a wafer position measurement location, and 32 indicates a final alignment location C. The wafer moves from location 31 to location 32 by XX, YY. At this time, stage 1tiII 60 part 7 has XX
, YY as well as the aforementioned wafer position displacement (d measurement IDx
, y, and θ are given, it moves and rotates by XX+X in the X direction, yy+−y in the Y direction, and θ in the θ direction. The above operations are automatically performed under the control of the CPU 6, and each wafer is always pre-aligned at the correct position.
なお、上述においては、場所３１において測定を行ない
、場所３２へ移動するとき同時にＩＷｊ記Ｘ。In addition, in the above description, when the measurement is performed at the location 31 and moved to the location 32, the measurement is performed at the same time as IWj.
ｙ、θにより補正する方法をｊホべたが、場所３１にお
いてｘ、ｙ、θの補正のための移動を行なってもよいこ
とは明らかである。また、ウェハｌｆｆ１ ’Ｒ測定用
にテレビカメラを用いたが、これに限定されることはな
くレーザスキャン法等の他の手段を用いることも可能で
ある。Although the method of correcting by y and θ has been described above, it is clear that movement for correcting x, y, and θ may also be performed at the location 31. Further, although a television camera was used to measure the wafer lff1'R, the present invention is not limited to this, and other means such as a laser scanning method may also be used.
（発明の効果）
以上のように、本発明によれば、ウェハに非接触で精度
良くウェハの位置ｆｆ１ｌｌ定および位置決めを行なう
ことが可能になる。これにより、従来の（大域的な位置
決め方法で問題となっていたフオトレシストイ・」着に
よる位置ずれ等を除去することが可能になる。(Effects of the Invention) As described above, according to the present invention, it is possible to accurately determine and position the wafer without contacting the wafer. This makes it possible to eliminate positional deviations caused by photoresist placement, which have been a problem with conventional global positioning methods.
第１図（よ本発明の１実施例に係るプリアライメント装
置を示すブロック回路図、第２図は第１図の装置におい
て変位ｆｆ１ｘ、ｙ、θを求める過程を示す説明図、第
３図は測定場所と最終アライメント場所の関係を示す説
明図である。
これらの図において、１はウェハ、２は日影レンズ、３
はテレビカメラ、４はＡ／Ｄ変換器、５はメモリ、６は
ＣＰ ＩＪ、７はステージ制御品、３１はウェハ位貿測
定場所、３２は最終アライメント場所である。FIG. 1 is a block circuit diagram showing a pre-alignment device according to an embodiment of the present invention, FIG. 2 is an explanatory diagram showing the process of determining displacements ff1x, y, and θ in the device of FIG. FIG. 3 is an explanatory diagram showing the relationship between the measurement location and the final alignment location. In these diagrams, 1 is the wafer, 2 is the shadow lens, and 3 is the wafer.
4 is a television camera, 4 is an A/D converter, 5 is a memory, 6 is a CP IJ, 7 is a stage control product, 31 is a wafer position measurement location, and 32 is a final alignment location.
Claims (1)
画像検出装置、アライメント制御部およびアライメント
制御部からの制御信号に基づきステージの移動を行なう
ステージ制御部を具備し、該アライメント制御部は画像
検出装置によって検出された外径像情報に基づきウェハ
の基準位置からの変位量を求め、この変位量に基づきウ
ェハの位置決めを行なうことを特徴とするプリアライメ
ント装置。 ２、前記アライメント制御部は画像検出装置によつて検
出された外径像よりウェハのオリエンテーションフラッ
ト部を除いた画像データを作成し、該画像データに基づ
きウェハの中心位置を求め、かつ該中心位置を用いて前
記変位量を求める特許請求の範囲第１項記載のプリアラ
イメント装置。 ３、前記変位量はウェハの中心位置の基準位置からのず
れおよびオリエンテーションフラット部の基準線からの
変位角である特許請求の範囲第１または２項に記載のプ
リアライメント装置。[Claims] 1. An image detection device that detects an outer diameter image of a wafer placed on a stage, an alignment control section, and a stage control section that moves the stage based on a control signal from the alignment control section. A pre-alignment device characterized in that the alignment control section determines the amount of displacement of the wafer from a reference position based on the outer diameter image information detected by the image detection device, and positions the wafer based on this amount of displacement. 2. The alignment control unit creates image data by removing the orientation flat part of the wafer from the outer diameter image detected by the image detection device, determines the center position of the wafer based on the image data, and determines the center position of the wafer. 2. The pre-alignment device according to claim 1, wherein the displacement amount is determined using . 3. The pre-alignment apparatus according to claim 1 or 2, wherein the displacement amount is a deviation of the center position of the wafer from the reference position and a displacement angle of the orientation flat portion from the reference line.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59186468A JPS6165432A (en) | 1984-09-07 | 1984-09-07 | Pre-alignment device |
| US06/772,460 US4635373A (en) | 1984-09-07 | 1985-09-04 | Wafer conveying apparatus with alignment mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59186468A JPS6165432A (en) | 1984-09-07 | 1984-09-07 | Pre-alignment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6165432A true JPS6165432A (en) | 1986-04-04 |
Family
ID=16188995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59186468A Pending JPS6165432A (en) | 1984-09-07 | 1984-09-07 | Pre-alignment device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6165432A (en) |
-
1984
- 1984-09-07 JP JP59186468A patent/JPS6165432A/en active Pending
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