JPS6163428A - Mold assembly - Google Patents

Mold assembly

Info

Publication number
JPS6163428A
JPS6163428A JP18564784A JP18564784A JPS6163428A JP S6163428 A JPS6163428 A JP S6163428A JP 18564784 A JP18564784 A JP 18564784A JP 18564784 A JP18564784 A JP 18564784A JP S6163428 A JPS6163428 A JP S6163428A
Authority
JP
Japan
Prior art keywords
resin
torpedo
gate
product
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18564784A
Other languages
Japanese (ja)
Other versions
JPH0536215B2 (en
Inventor
Hiroshi Koyama
弘 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP18564784A priority Critical patent/JPS6163428A/en
Publication of JPS6163428A publication Critical patent/JPS6163428A/en
Publication of JPH0536215B2 publication Critical patent/JPH0536215B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/30—Flow control means disposed within the sprue channel, e.g. "torpedo" construction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C2045/2683—Plurality of independent mould cavities in a single mould
    • B29C2045/2687—Plurality of independent mould cavities in a single mould controlling the filling thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/30—Flow control means disposed within the sprue channel, e.g. "torpedo" construction
    • B29C2045/304—Adjustable torpedoes

Abstract

PURPOSE:To eliminate defect in flow of molten resin or generation of burrs, by providing a resin pressure sensor detecting pressure of the molten resin streamed within a product cavity and a driving mechanism controlling a position of a torpedo to control a quantity of an opening of a gate part based on this detected signal. CONSTITUTION:The insides of a stationary frame 5 and stationary mold 1 are provided with a runner 6 which is opened into cavities 3, 4 after the same has been penetrated through the inside. A movable mold 2 is provided with a resin pressure sensor 8 detecting the resin pressure of the inside of the respective product cavities. The resin pressure sensor 8 is wired with a computer 9 which stored appropriate pressure of the inside of the product cavities. A rod torpedo 10 for controlling a quantity of an opening of a gate 7 is arranged in the inside of the runner 6 and the other end of the same is connected with a piston 101. A position of the torpedo 10 is decided by making hydraulic pressure to be led into a chamber to be formed on both sides of the piston 101 vary through a control signal of the computer 9.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は金型装置に関するもので、特に樹脂成形を行な
う際に用いられる。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a mold device, and is particularly used for resin molding.

（従来の技術） 従来の金型装置を示すものに、例えば特開昭５５−８６
７２７号公報や特開昭５５−１３２２２６号公報がある
。(Prior art) For example, Japanese Patent Laid-Open No. 55-86 shows a conventional mold device.
There are Japanese Patent Application No. 727 and Japanese Unexamined Patent Publication No. 132226/1983.

前者に示されるものは、キャビティー（３）に開口する
ゲート（４）を棒体（５）によって開閉し、キャビティ
ー（３）内に充填される溶融樹脂の鼠および流れ込む方
向を制御している。In the former, a gate (4) opening into a cavity (3) is opened and closed by a rod (5), and the flow direction of the molten resin filled into the cavity (3) is controlled. There is.

後者に示されるものは、空胴部（１４）　、　　（１５
）に開口する流路（３３）をゲートピン（３７）によっ
て開閉し、空胴部（４）、（１５）への物質の供給、停
止を行なっている。Those shown in the latter are cavities (14), (15
) is opened and closed by a gate pin (37) to supply and stop the supply of substances to the cavities (4) and (15).

（発明が解決しようとする問題点） しかしながら、前者に示されるものでは棒体（５）及び
その駆動機構が移動金型（２）内に位置し、ゲー１−（
４）が固定金型（１）にて開口しているため、棒体（５
）はキャビティー（３）内を通過してゲート（４）の開
口量を調整しなければならない。従って、ゲート（４）
を完全に閉じようとすると棒体（５）がキャビティー（
３）内を貫通し、キャビティー（３）内で凝固する製品
が棒体（５）によって分離される。結局、棒体（５）は
ゲート（４）を完全に閉じることはできず、製品が凝固
した後、ゲート部にて凝固した不要部を別工程にて切除
しなければならないという問題がある。(Problems to be Solved by the Invention) However, in the former case, the rod (5) and its drive mechanism are located in the movable mold (2), and the game 1-(
4) is opened in the fixed mold (1), so the rod (5)
) must pass through the cavity (3) to adjust the opening amount of the gate (4). Therefore, gate (4)
When trying to completely close the rod (5), the rod (5) enters the cavity (
3) The product that penetrates and solidifies in the cavity (3) is separated by the rod (5). As a result, the rod (5) cannot completely close the gate (4), and after the product has solidified, there is a problem in that the unnecessary part that has solidified at the gate must be removed in a separate process.

また、後者に示されるものでは、ただ単に空胴部（１４
）　、　　（１５）に流入する物質を、ゲートピン（３
７）によって流路（３３）を開閉することによって、そ
の供給、停止を行なっているだけであり、その流路（３
３）の開口量を調整して空胴部（１４）　、　　（１５
）内に流入させる物質の量、圧力等を制御するというこ
とは不可能である。In addition, in the latter case, the cavity (14
), (15) is transferred to the gate pin (3).
7), the flow path (33) is simply opened and closed to supply and stop the flow path (33).
3) by adjusting the opening amount of the cavities (14) and (15).
) It is impossible to control the amount, pressure, etc. of the substance flowing into the chamber.

（問題点を解決するための手段） 本発明は上記問題点を解決することを目的とするもので
あり、以下の様な手段を講じた。つまり、固定金型と、
この固定金型に当接して製品キャビティーを形成する可
動金型と、前記製品キャビティー内に溶融樹脂を導くた
め前記固定金型を貫通しゲート部にて前記製品キャビテ
ィーに開口するランナーと、前記固定金型内に位置し前
記ランナーのゲート部を前記固定金型側から開閉するト
ーピードと、前記製品キャビティー内に流入された溶融
樹脂の圧力を検知する樹脂圧センサーと、この樹脂圧セ
ンサーの検知信号に基づいて前記ゲート部の開口量を調
整するため前記トーピードの位置を制御する駆動機構と
を備える金型装置としたのである。(Means for Solving the Problems) The present invention aims to solve the above problems, and has taken the following measures. In other words, the fixed mold and
a movable mold that comes into contact with the fixed mold to form a product cavity; and a runner that penetrates the fixed mold and opens into the product cavity at a gate portion to guide molten resin into the product cavity. , a torpedo located in the fixed mold that opens and closes the gate portion of the runner from the fixed mold side; a resin pressure sensor that detects the pressure of the molten resin flowing into the product cavity; and a resin pressure sensor that detects the pressure of the molten resin flowing into the product cavity. The mold apparatus includes a drive mechanism that controls the position of the torpedo in order to adjust the opening amount of the gate portion based on the detection signal of the sensor.

（実施例） 次に本発明の実施例を図に基づいて説明する。(Example) Next, embodiments of the present invention will be described based on the drawings.

第１図は第１実施例を示す断面図である。図中１は固定
金型で、工場の床等に固定されたベース（省図示）に固
定されている。この固定金型１に対向する位置には可動
金型２が配され、この可動金型２が固定金型１に当接す
ることによって、その当接面に第１製品キャビティー３
と第２製品キャビティー４を形成している。この第１、
第２製品キャビティー３．４はそれぞれ互いに独立して
いる。FIG. 1 is a sectional view showing a first embodiment. In the figure, reference numeral 1 is a fixed mold, which is fixed to a base (not shown) fixed to a factory floor or the like. A movable mold 2 is disposed at a position facing the fixed mold 1, and when the movable mold 2 comes into contact with the fixed mold 1, a first product cavity 3 is formed on the contact surface.
and forms a second product cavity 4. This first,
The second product cavities 3.4 are each independent of one another.

前記固定金型１の背面には固定枠５が配されており、こ
の固定枠５及び前記固定金型１の内部にはランナー６が
穿設されている。このランナー６の固定枠５側の端部は
樹脂注入装置（省図示）に連結されており、固定枠５内
部を貫通した後、固定金型１内部にて２本の通路に分岐
している。そして、この２本に分岐したランナー６のそ
れぞれは、前記第１製品キャビティー３及び第２製品キ
ャビティー４に向って固定金型１内部を進行し、その進
路面積を急激を減少させて前記第１．第２製品キャビテ
ィー３．４に開口しζいる。なお、上述の進路面積を急
激に減少させたランナー６の部分をゲート７と呼ぶ。A fixed frame 5 is disposed on the back side of the fixed mold 1, and a runner 6 is bored inside the fixed frame 5 and the fixed mold 1. The end of this runner 6 on the fixed frame 5 side is connected to a resin injection device (not shown), and after penetrating the inside of the fixed frame 5, it branches into two passages inside the fixed mold 1. . Each of these two branched runners 6 advances inside the fixed mold 1 toward the first product cavity 3 and the second product cavity 4, rapidly reducing its path area, and 1st. It opens into a second product cavity 3.4. Note that the portion of the runner 6 where the above-mentioned course area is rapidly reduced is called a gate 7.

前記可動金型２には、前記第１．第２製品キャビティー
３，４に対向する位置に、各製品キャビティー内の樹脂
圧力を検知する樹脂圧センサー８が設置されている。こ
の樹脂圧センナ−８は圧電素子あるいはひずみゲージ等
からなり、製品キャビティーの最端部とゲート７の開口
部との間の略中央部の樹脂圧力を検知するように設けら
れている。そして、この樹脂圧センサー８は、製品キャ
ビティー内の適正圧力を記憶したコンピュータ９に結線
されている。The movable mold 2 includes the first. A resin pressure sensor 8 is installed at a position facing the second product cavities 3 and 4 to detect the resin pressure within each product cavity. The resin pressure sensor 8 is composed of a piezoelectric element, a strain gauge, or the like, and is provided to detect the resin pressure approximately at the center between the end of the product cavity and the opening of the gate 7. This resin pressure sensor 8 is connected to a computer 9 that stores the appropriate pressure within the product cavity.

前記ランナー６の２本に分岐したそれぞれの内部には、
ゲート７の開口量を調整するための棒状のトーピード１
０が配されている。この棒状のトーピード１０のゲート
７側の一端は、その径が徐々に小さくなっており、前記
ゲート７を良好に閉じることができる形状となっている
。そして、トーピード１０がゲート７を完全に閉じた時
、トーピード１０の一端面と、前記固定金型１の製品キ
ャビティーに対向する面とは、同一平面上に位置してい
る。一方、トーピード１０の他端は前記固定金型ｌを貫
通し、ピストン１０１に連結されている。このピストン
１０１は、前記固定枠５内に設けられたシリンダ１１内
に摺動可能に挿入されており、このピストン１０１の両
側に形成される室に導入する流体圧力を変化させること
によりトーピード１０の位置が決定される。Inside each of the two branched runners 6,
Rod-shaped torpedo 1 for adjusting the opening amount of gate 7
0 is placed. One end of this rod-shaped torpedo 10 on the gate 7 side has a diameter that gradually becomes smaller, and has a shape that allows the gate 7 to be closed well. When the torpedo 10 completely closes the gate 7, one end surface of the torpedo 10 and the surface of the fixed mold 1 facing the product cavity are located on the same plane. On the other hand, the other end of the torpedo 10 passes through the fixed mold l and is connected to the piston 101. This piston 101 is slidably inserted into a cylinder 11 provided in the fixed frame 5, and the torpedo 10 is adjusted by changing the fluid pressure introduced into the chambers formed on both sides of this piston 101. The position is determined.

次に、このトーピード１０の位置を決定するため前記シ
リンダｌｌ内に供給する油圧を制御する駆動機構につい
て述べる。なお、第１図には第１製品キャビティー３側
のトーピード１０を駆動する駆動機構のみが描かれてい
るが、第２製品キャビティー４側のトーピード１０につ
いても全く同様であり、以下の説明も同様である。Next, a drive mechanism for controlling the hydraulic pressure supplied to the cylinder 11 to determine the position of the torpedo 10 will be described. Although FIG. 1 only depicts the drive mechanism for driving the torpedo 10 on the first product cavity 3 side, the same applies to the torpedo 10 on the second product cavity 4 side, and the following explanation will be given. The same is true.

前記シリンダ１１内は前記ピストン１０１によって第１
室１２と第２室１３とに区画される。この第１室１２に
は配管５１が、第２室１３には配管５２がそれぞれ接続
されており、この配管５１゜５２は３つの位置を有する
電磁方向切換弁１４に接続されている。そして、この配
管５１．５２は電磁方向切換弁１４によって配管５３あ
るいは配管５６に接続又は遮断される。配管５３は油圧
供給装置（省図示）に接続されており、また配管５６は
配管５４と配管５５の２本の管に分岐している。配管５
５にはその管通路面積を可変する流量制御弁１５が配さ
れ、さらに、その通路を連通あるいは遮断を行なう第１
電磁弁１６が配されており、配管中を流れる作動油を受
けいれる油溜装置（省図示）に接続される。なお、前記
第１電磁弁が開弁した時は、配管５５内の作動油は、前
記電磁方向切換弁１４から油溜装置に向う方向にしか流
れない。The inside of the cylinder 11 is opened by the piston 101.
It is divided into a chamber 12 and a second chamber 13. A pipe 51 and a pipe 52 are connected to the first chamber 12 and the second chamber 13, respectively, and the pipes 51 and 52 are connected to an electromagnetic directional control valve 14 having three positions. The pipes 51 and 52 are connected to or disconnected from the pipe 53 or the pipe 56 by the electromagnetic directional control valve 14. The pipe 53 is connected to a hydraulic supply device (not shown), and the pipe 56 is branched into two pipes, a pipe 54 and a pipe 55. Piping 5
5 is provided with a flow control valve 15 for varying the area of the pipe passage, and a first valve 15 for communicating or blocking the passage.
A solenoid valve 16 is provided and connected to an oil sump device (not shown) that receives hydraulic oil flowing through the piping. Note that when the first electromagnetic valve is opened, the hydraulic oil in the pipe 55 flows only in the direction from the electromagnetic directional switching valve 14 to the oil sump device.

前記配管５４は前記流量制御弁１５及び第１電磁弁１６
をバイパスして前記配管５５に合流しており、その通路
途中には連通あるいは遮断を行なう第２電磁弁１７が配
されている。The piping 54 connects the flow control valve 15 and the first solenoid valve 16.
It bypasses and joins the pipe 55, and a second solenoid valve 17 for communicating or blocking is disposed in the middle of the passage.

前記電磁方向切換弁１４．第１電磁弁１６．第２電磁弁
１７はそれぞれ前記コンピュータ９に結線されており、
このコンピユータ９０制御信号に基づいて合弁は駆動さ
れる。The electromagnetic directional control valve 14. First solenoid valve 16. The second solenoid valves 17 are each connected to the computer 9,
The joint venture is driven based on this computer 90 control signal.

なお、前記電磁方向切換弁１４は、配管５１と配管５３
、配管５２と配管５６との各々を連通される第１位置、
配管５１．５２共に遮断する第２位置、配管５１と配管
５６、配管５２と配管５３とをそれぞれ連通される第３
位置を有している。Note that the electromagnetic directional switching valve 14 is connected to a pipe 51 and a pipe 53.
, a first position communicating with each of the piping 52 and the piping 56,
A second position where both pipes 51 and 52 are blocked, and a third position where pipes 51 and 56 are communicated with each other, and pipes 52 and 53 are communicated with each other.
It has a location.

次に、本実施例装置の作動について説明する。Next, the operation of the apparatus of this embodiment will be explained.

製品キャビティー内の圧力は、その値が低すぎるとでき
上った製品の密度が小さくなって変形の原因となったり
、溶融樹脂の流れ不良が起ったりする。また、圧力が高
すぎると可動金型２と固定金型１との当接面の隙間に溶
融樹脂が浸入し、ハリ発生の原因となる。そごで、ラン
ナー６を通って製品キャビティー３，４内に溶融樹脂が
流れてくると、その圧力を樹脂圧センサー８が検知し、
その検知信号をコンピュータ９に送る。コンピュータ９
には適正樹脂圧力が記憶されており、この適正樹脂圧力
と樹脂圧センサー８から送られてきた圧力を比較し、前
記電磁方向切換弁１４．第１゜第２電磁弁１６．１７に
駆動信号を送る。If the pressure inside the product cavity is too low, the density of the finished product will decrease, causing deformation or causing poor flow of the molten resin. Furthermore, if the pressure is too high, the molten resin will enter the gap between the contact surfaces of the movable mold 2 and the fixed mold 1, causing firmness. When the molten resin flows through the runner 6 into the product cavities 3 and 4, the resin pressure sensor 8 detects the pressure.
The detection signal is sent to the computer 9. computer 9
A proper resin pressure is stored in , and this proper resin pressure is compared with the pressure sent from the resin pressure sensor 8, and the electromagnetic directional control valve 14. Sends a drive signal to the first and second solenoid valves 16 and 17.

まず、製品キャビティー３，４内の樹脂圧力が適正値よ
り低い場合は、電磁方向切換弁１４を第り位置、第１電
磁弁１６は連通、第２電磁弁１７は遮断となる様に合弁
を切換える。すると、作動油が配管５３、配管５１を介
して第１室５１内に流入し、第２室５２内の作動油は配
管５２．配管５６、配管５５を通って油溜装置へと流出
する。First, if the resin pressure in the product cavities 3 and 4 is lower than the appropriate value, set the solenoid directional control valve 14 to the first position, the first solenoid valve 16 in communication, and the second solenoid valve 17 in the cutoff position. Switch. Then, the hydraulic oil flows into the first chamber 51 through the piping 53 and the piping 51, and the hydraulic oil in the second chamber 52 flows into the piping 52. It flows out through piping 56 and piping 55 to the oil sump device.

よって、第１室１２と第２室１３との圧力バランスがく
ずれ、ピストン１０１及び（・−ピード１０は、ゲート
７を開く方向く第１図中右方向）に移動する。そして、
ランナー６を流れる溶融樹脂がさらにゲート７より製品
キャビティー３．４内に流入し、製品キャビティー３．
４内の樹脂圧力を上昇させる。この時、トーピード１０
の移動速度は流量制御弁１５によって決定され、この流
量制御弁１５を絞ればトーピード１０の移動速度は遅く
なり、開けば速くなる。また、第１電磁弁１６を閉じれ
ば、（・−ピード１０はその位置で停止する。Therefore, the pressure balance between the first chamber 12 and the second chamber 13 is disrupted, and the piston 101 and the piston 10 move toward the right in FIG. 1 in the direction of opening the gate 7. and,
The molten resin flowing through the runner 6 further flows into the product cavity 3.4 through the gate 7.
Increase the resin pressure in 4. At this time, Torpedo 10
The moving speed of the torpedo 10 is determined by the flow rate control valve 15. If the flow rate control valve 15 is closed, the moving speed of the torpedo 10 will be slowed down, and if it is opened, the moving speed will be increased. Furthermore, when the first solenoid valve 16 is closed, the speed 10 stops at that position.

次に、製品キャビティー３．４内の樹脂圧力が適正値よ
りも大きくなると、電磁方向弁１４を第３位置、第１電
磁弁１６を開、第２電磁弁１７を閉の位置にする。する
と、第１室１２内の作動油は配管５１，５６．５５を通
って油溜装置に流出し、第２室１３内には配管５３．５
１を通って作動油が流入する。よって、トーピードは第
１．第２室１２．１３の圧力差によりゲート７を閉じる
方向（第１図中左方）に移動し、ランナー６から製品キ
ャビティー３，４内に流入する溶融樹脂の量が減少され
、同時に樹脂圧も減少される。なお、この場合も、トー
ピード１０の移動速度は流量制御弁１５によって制御さ
れる。Next, when the resin pressure in the product cavity 3.4 becomes larger than the appropriate value, the solenoid directional valve 14 is set to the third position, the first solenoid valve 16 is opened, and the second solenoid valve 17 is set to the closed position. Then, the hydraulic oil in the first chamber 12 flows out to the oil sump device through the pipes 51, 56.55, and the hydraulic oil in the second chamber 13 flows through the pipe 53.5.
Hydraulic oil flows through 1. Therefore, Torpedo is the first. Due to the pressure difference between the second chambers 12 and 13, the gate 7 is moved in the direction of closing (to the left in Figure 1), the amount of molten resin flowing from the runner 6 into the product cavities 3 and 4 is reduced, and at the same time Pressure is also reduced. In this case as well, the moving speed of the torpedo 10 is controlled by the flow rate control valve 15.

以上の様に１・−ビートの位置を繰り返し制御するごと
によって製品キャビティー３．４内の樹脂圧力を適正値
に保つことができるのである。As described above, by repeatedly controlling the position of the 1.-beat, the resin pressure within the product cavity 3.4 can be maintained at an appropriate value.

その後、製品キャビティー３．４内への〆容部樹脂の充
填か完了すると、電磁方向切換弁１４を第３位置、第１
電磁弁１６を閉、第２電磁弁１７を開とする。すると、
第１室１２内の作動油は配管５１．５６．５４を介し、
流量制御弁１５をバイパスして油溜装置に流出するので
、トーピードｌＯを高速にて第１図中左方向に移動させ
ケート７を閉じることができる。After that, when the filling of the container resin into the product cavity 3.4 is completed, the electromagnetic directional control valve 14 is moved to the third position and the first position.
The solenoid valve 16 is closed and the second solenoid valve 17 is opened. Then,
The hydraulic oil in the first chamber 12 is supplied through pipes 51, 56, 54,
Since the flow rate control valve 15 is bypassed and the oil flows out to the oil sump device, the torpedo lO can be moved leftward in FIG. 1 at high speed and the cage 7 can be closed.

そして、所定時間経過後、製品キャビティー３゜４内の
樹脂が完全に凝固したら、可動金型２を固定金型１より
引き離し製品を取り出して樹脂成形が完了する。After a predetermined period of time has elapsed, when the resin in the product cavity 3.degree. 4 has completely solidified, the movable mold 2 is separated from the fixed mold 1 and the product is taken out, completing the resin molding.

第２図は本発明の第２実施例を示すもので、第１実施例
装置に樹脂温センサー２０．固定型温度センサー２１．
可動型温度センサー２２を、さらに設けたものである。FIG. 2 shows a second embodiment of the present invention, in which a resin temperature sensor 20 is added to the apparatus of the first embodiment. Fixed temperature sensor 21.
A movable temperature sensor 22 is further provided.

樹脂温センサー２０は、固定金型Ｉのランナー６に対向
する位置に設けられ、ランナー６内の溶融樹脂の温度を
検知している。The resin temperature sensor 20 is provided at a position facing the runner 6 of the fixed mold I, and detects the temperature of the molten resin within the runner 6.

また、固定型温度センサー２１．可動型温度センサー２
２は各々固定金型ｌ及び可動金型２内部に設置されてお
り、各金型の温度を検知している。Additionally, a fixed temperature sensor 21. Movable temperature sensor 2
2 are installed inside the fixed mold 1 and the movable mold 2, respectively, and detect the temperature of each mold.

なお、各センサー２０，２１．２２はコンピュータ９に
結線されている。Note that each sensor 20, 21, 22 is connected to the computer 9.

この第２実施例の様な装置を用いれば、型温度。If a device like this second embodiment is used, the temperature of the mold.

樹脂温度が変動した場合でも、充分製品キャビティー内
の樹脂圧を適正に保つことができる。Even when the resin temperature fluctuates, the resin pressure within the product cavity can be sufficiently maintained at an appropriate level.

なお、第１．第１品キャビティー３，４の容量が特に異
っている場合、通電の成形法では小さい製品にパリが、
大きい製品に量不足を生ずることが多い。そこで、大き
い製品のゲートを先に開いて射出を開始し、後に小さい
製品のゲートを遅れて開くことにより、両製品とも良品
を得ることが可能である。In addition, 1. If the capacities of the cavities 3 and 4 of the first product are particularly different, the molding method using an electric current may result in a small product being damaged.
This often results in insufficient quantities for large products. Therefore, by opening the gate for the larger product first to start injection, and later opening the gate for the smaller product later, it is possible to obtain good products for both products.

また、多点ゲートの製品の場合、各ゲートから流れてき
た樹脂が接した所にウェルドラインが発生するが、その
位置を製品上のある箇所（目立ちやすい所等）から遠ざ
けたい場合がある。この場合、各ゲートを開くタイミイ
ングを適切に設定することにより、ウェルドラインを所
望の位置にすることができる。Furthermore, in the case of products with multi-point gates, weld lines occur where the resin flowing from each gate comes into contact with each other, but there are cases where it is desirable to move the weld line away from a certain location on the product (such as a conspicuous location). In this case, by appropriately setting the timing to open each gate, the weld line can be placed at a desired position.

また、前述の実施例ではトーピード５を油圧で動かして
いたがモータと歯車機構を組合せた動力源等を使用する
ことも可能である。Further, in the above-mentioned embodiment, the torpedo 5 was moved by hydraulic pressure, but it is also possible to use a power source that combines a motor and a gear mechanism.

また、前述の実施例では、樹脂圧が良品時の波形値に従
う様、ゲート開度の制御を行なって射たが、樹脂圧が設
定した値になったらゲートを閉じるといった制御方法も
可能である。この場合、コンピュータ１４を使わず、簡
単な制御回路を使用すれば良い。Furthermore, in the above embodiment, the gate opening was controlled so that the resin pressure followed the waveform value when the product was good, but a control method in which the gate is closed when the resin pressure reaches a set value is also possible. . In this case, a simple control circuit may be used without using the computer 14.

（発明の効果） 以上述べた様に、本発明の金型装置を用いれば固形金型
に設けたランナーのゲート部を、固定金型側から１・−
ピート“によって開閉しているので、製品には全く態形
になしにゲート部の開閉を行なうことができる。そして
、このゲート部の開閉は、製品キャビティー内の樹脂圧
力に応じてその開口量を調整されるため、品に樹脂圧力
を適正値に保つことができ、溶融樹脂の流れ不良、ある
いはハリの発生等の不具合は生じることはない。(Effects of the Invention) As described above, if the mold device of the present invention is used, the gate portion of the runner provided in the solid mold can be moved from the fixed mold side by 1.
Since the gate is opened and closed by the peat, the gate can be opened and closed without changing the shape of the product.The opening and closing of the gate is controlled by the amount of opening depending on the resin pressure inside the product cavity. This allows the resin pressure to be maintained at an appropriate value for the product, and problems such as poor flow of molten resin or the occurrence of firmness do not occur.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の第１実施例を示す断面図、第２図は第
２実施例を示す断面図である。 ■・・・固定金型、２・・・可動金型、３・・・第１製
品キャビティー、４・・・第２製品キャビティー、６・
・・ランナー、７・・・ゲート部、８−・・樹脂圧セン
サー、１０・・・ｌ・−ビード、１４・・・電磁方向切
換弁、１５・・・流量制御弁、１６・・・第１電磁弁、
１７・・・第２電磁弁。FIG. 1 is a sectional view showing a first embodiment of the present invention, and FIG. 2 is a sectional view showing a second embodiment. ■... Fixed mold, 2... Movable mold, 3... First product cavity, 4... Second product cavity, 6...
...Runner, 7...Gate part, 8-...Resin pressure sensor, 10...L-bead, 14...Electromagnetic directional control valve, 15...Flow rate control valve, 16...No. 1 solenoid valve,
17...Second solenoid valve.

Claims (1)

【特許請求の範囲】[Claims] 固定金型と、この固定金型に当接して製品キャビティー
を形成する可動金型と、前記製品キャビティー内に溶融
樹脂を導くため前記固定金型を貫通しゲート部にて前記
製品キャビティーに開口するランナーと、前記固定金型
内に位置し前記ランナーのゲート部を前記固定金型側か
ら開閉するトーピードと、前記製品キャビティー内に流
入された溶融樹脂の圧力を検知する樹脂圧センサーと、
この樹脂圧センサーの検知信号に基づいて前記ゲート部
の開口量を調整するため前記トーピードの位置を制御す
る駆動機構とを備える金型装置。a fixed mold; a movable mold that comes into contact with the fixed mold to form a product cavity; a torpedo located in the fixed mold that opens and closes a gate portion of the runner from the fixed mold side; and a resin pressure sensor that detects the pressure of molten resin flowing into the product cavity. and,
A mold device comprising: a drive mechanism that controls the position of the torpedo in order to adjust the opening amount of the gate portion based on the detection signal of the resin pressure sensor.
JP18564784A 1984-09-04 1984-09-04 Mold assembly Granted JPS6163428A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18564784A JPS6163428A (en) 1984-09-04 1984-09-04 Mold assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18564784A JPS6163428A (en) 1984-09-04 1984-09-04 Mold assembly

Publications (2)

Publication Number Publication Date
JPS6163428A true JPS6163428A (en) 1986-04-01
JPH0536215B2 JPH0536215B2 (en) 1993-05-28

Family

ID=16174428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18564784A Granted JPS6163428A (en) 1984-09-04 1984-09-04 Mold assembly

Country Status (1)

Country Link
JP (1) JPS6163428A (en)

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4781561A (en) * 1987-02-16 1988-11-01 Consiglio Nazionale Delle Ricerche Apparatus for controlling the cross-linking of elastomers in a mould
JPH0292513A (en) * 1988-09-29 1990-04-03 Toshiba Mach Co Ltd Injection molding
JPH06106583A (en) * 1992-09-29 1994-04-19 Victor Co Of Japan Ltd Mold for injectin molding
US5336074A (en) * 1991-10-09 1994-08-09 Kabushiki Kaisha Kobe Seiko Sho Pressing speed controller for hydraulic press
WO1999054109A1 (en) * 1998-04-21 1999-10-28 Dynisco Hotrunners, Inc. Manifold system having flow control
WO2001021377A1 (en) * 1999-09-21 2001-03-29 Synventive Molding Solutions, Inc. Manifold system having flow control
WO2001060580A1 (en) * 2000-02-15 2001-08-23 Dynisco Hotrunners, Inc. Dynamic feed control system
US6287107B1 (en) 1997-09-02 2001-09-11 Synventive Molding Solutions, Inc. Apparatus for proportionally controlling fluid delivery to a mold
EP1142686A1 (en) * 1999-11-19 2001-10-10 Dynisco Hotrunners, Inc. Apparatus and method for proportionally controlling fluid delivery to readily replaceable mold inserts
US6309208B1 (en) 1997-06-13 2001-10-30 Synventive Molding Solutions, Inc. Apparatus for proportionally controlling fluid delivery to a mold
US6514440B1 (en) 1998-04-21 2003-02-04 Synventive Molding Solutions, Inc. Apparatus and method for purging injection molding system
US6585505B2 (en) 1998-04-21 2003-07-01 Synventive Molding Solutions, Inc. Machine for proportionally controlling fluid delivery to a mold
US6589039B1 (en) 1998-04-21 2003-07-08 Synventive Molding Solutions, Inc. Controlled injection using manifold having multiple feed channels
US6638049B1 (en) 1997-06-13 2003-10-28 Synventive Molding Solutions, Inc. Apparatus and method for proportionally controlling fluid delivery to readily replaceable mold inserts
US6683283B2 (en) 2002-05-10 2004-01-27 Dynisco Hot Runners Inc. Canada Apparatus and method for heating injection molding fluid
US6824379B2 (en) 1998-04-21 2004-11-30 Synventive Molding Solutions, Inc. Apparatus for utilizing an actuator for flow control valve gates
WO2005113215A1 (en) * 2004-05-14 2005-12-01 University Of Massachusetts Methods and devices for melt pressure regulation
US7029268B2 (en) 2001-12-26 2006-04-18 Synventive Molding Solutions, Inc. Non-coaxial injection molding valve flow control
US7234929B2 (en) 1999-09-21 2007-06-26 Synventive Molding Solutions, Inc. Injection molding flow control apparatus and method
US7559762B2 (en) 2006-06-16 2009-07-14 Mold-Masters (2007) Limited Open loop pressure control for injection molding
JP2009279871A (en) * 2008-05-23 2009-12-03 Toyota Auto Body Co Ltd Injection molding machine
US7731489B2 (en) 2006-12-21 2010-06-08 Mold-Masters (2007) Limited Valve for co-injection molding apparatus
EP2418064A1 (en) * 2009-06-18 2012-02-15 Michio Komatsu Thin container production method
JP2013539425A (en) * 2010-11-23 2013-10-24 シンベンティブ モールディング ソリューソンズ，インク． Injection molding flow control apparatus and method
JP2014534100A (en) * 2011-11-23 2014-12-18 ハスキー インジェクション モールディング システムズ リミテッドＨｕｓｋｙ Ｉｎｊｅｃｔｉｏｎ Ｍｏｌｄｉｎｇ Ｓｙｓｔｅｍｓ Ｌｉｍｉｔｅｄ Control structure for molding systems
JP2017505730A (en) * 2013-11-22 2017-02-23 プリーアムス ジステーム テヒノロギース アーゲー Method for controlling the filling of at least one cavity
EP3019322A4 (en) * 2013-07-09 2017-08-16 Husky Injection Molding Systems Luxembourg IP Development S.à.r.l A mold stack
JP2018176727A (en) * 2017-04-04 2018-11-15 イングラス エス． ピー． エー． Method, apparatus and press for injection molding of plastic material

Citations (2)

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JPS5586727A (en) * 1978-12-22 1980-06-30 Toshiba Mach Co Ltd Control of mold gate
JPS59169827A (en) * 1983-03-17 1984-09-25 Mitsubishi Heavy Ind Ltd Valve gate device of injection molding metal die

Patent Citations (2)

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JPS5586727A (en) * 1978-12-22 1980-06-30 Toshiba Mach Co Ltd Control of mold gate
JPS59169827A (en) * 1983-03-17 1984-09-25 Mitsubishi Heavy Ind Ltd Valve gate device of injection molding metal die

Cited By (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4781561A (en) * 1987-02-16 1988-11-01 Consiglio Nazionale Delle Ricerche Apparatus for controlling the cross-linking of elastomers in a mould
JPH0292513A (en) * 1988-09-29 1990-04-03 Toshiba Mach Co Ltd Injection molding
US5336074A (en) * 1991-10-09 1994-08-09 Kabushiki Kaisha Kobe Seiko Sho Pressing speed controller for hydraulic press
JPH06106583A (en) * 1992-09-29 1994-04-19 Victor Co Of Japan Ltd Mold for injectin molding
US6638049B1 (en) 1997-06-13 2003-10-28 Synventive Molding Solutions, Inc. Apparatus and method for proportionally controlling fluid delivery to readily replaceable mold inserts
US6309208B1 (en) 1997-06-13 2001-10-30 Synventive Molding Solutions, Inc. Apparatus for proportionally controlling fluid delivery to a mold
US6287107B1 (en) 1997-09-02 2001-09-11 Synventive Molding Solutions, Inc. Apparatus for proportionally controlling fluid delivery to a mold
US8016581B2 (en) 1998-04-21 2011-09-13 Synventive Molding Solutions, Inc. Injection molding flow control apparatus
US6824379B2 (en) 1998-04-21 2004-11-30 Synventive Molding Solutions, Inc. Apparatus for utilizing an actuator for flow control valve gates
WO1999054109A1 (en) * 1998-04-21 1999-10-28 Dynisco Hotrunners, Inc. Manifold system having flow control
US6254377B1 (en) 1998-04-21 2001-07-03 Synventive Molding Solutions, Inc. Manifold system having flow control using extended valve pin
US6343922B1 (en) 1998-04-21 2002-02-05 Synventive Molding Solutions Manifold system having flow control using pressure transducers
US6343921B1 (en) 1998-04-21 2002-02-05 Synventive Molding Solutions Manifold system having flow control using separate cavities
US6361300B1 (en) 1998-04-21 2002-03-26 Synventive Molding Solutions, Inc. Manifold system having flow control
US6464909B1 (en) 1998-04-21 2002-10-15 Synventive Molding Solutions, Inc. Manifold system having flow control
US6514440B1 (en) 1998-04-21 2003-02-04 Synventive Molding Solutions, Inc. Apparatus and method for purging injection molding system
US6585505B2 (en) 1998-04-21 2003-07-01 Synventive Molding Solutions, Inc. Machine for proportionally controlling fluid delivery to a mold
US6589039B1 (en) 1998-04-21 2003-07-08 Synventive Molding Solutions, Inc. Controlled injection using manifold having multiple feed channels
US6632079B1 (en) 1998-04-21 2003-10-14 Synventive Molding Solutions, Inc. Dynamic feed control system
US7901601B2 (en) 1998-04-21 2011-03-08 Synventive Molding Solutions, Inc. Injection molding flow control apparatus and method
US7569169B2 (en) 1998-04-21 2009-08-04 Synventive Molding Solutions, Inc. Injection molding flow control apparatus and method
US6767486B2 (en) 1998-04-21 2004-07-27 Synventive Molding Solutions, Inc. Controlled injection using manifold having multiple feed channels
US6769896B2 (en) 1998-04-21 2004-08-03 Synventive-Molding Solutions, Inc. Manifold system having flow control
US7419625B2 (en) 1999-09-21 2008-09-02 Synventive Molding Solutions, Inc. Injection molding flow control method
US7234929B2 (en) 1999-09-21 2007-06-26 Synventive Molding Solutions, Inc. Injection molding flow control apparatus and method
WO2001021377A1 (en) * 1999-09-21 2001-03-29 Synventive Molding Solutions, Inc. Manifold system having flow control
EP1142686A1 (en) * 1999-11-19 2001-10-10 Dynisco Hotrunners, Inc. Apparatus and method for proportionally controlling fluid delivery to readily replaceable mold inserts
WO2001060580A1 (en) * 2000-02-15 2001-08-23 Dynisco Hotrunners, Inc. Dynamic feed control system
US7597828B2 (en) 2001-12-26 2009-10-06 Synventive Molding Solutions, Inc. Injection molding valve flow control
US7029268B2 (en) 2001-12-26 2006-04-18 Synventive Molding Solutions, Inc. Non-coaxial injection molding valve flow control
US7270537B2 (en) 2001-12-26 2007-09-18 Synventive Molding Solutions, Inc. Non-coaxial injection molding valve flow control
US6683283B2 (en) 2002-05-10 2004-01-27 Dynisco Hot Runners Inc. Canada Apparatus and method for heating injection molding fluid
WO2005113215A1 (en) * 2004-05-14 2005-12-01 University Of Massachusetts Methods and devices for melt pressure regulation
US7766647B2 (en) 2006-06-16 2010-08-03 Mold-Masters (2007) Limited Open loop pressure control for injection molding
US7559762B2 (en) 2006-06-16 2009-07-14 Mold-Masters (2007) Limited Open loop pressure control for injection molding
US7731489B2 (en) 2006-12-21 2010-06-08 Mold-Masters (2007) Limited Valve for co-injection molding apparatus
JP2009279871A (en) * 2008-05-23 2009-12-03 Toyota Auto Body Co Ltd Injection molding machine
EP2418064A1 (en) * 2009-06-18 2012-02-15 Michio Komatsu Thin container production method
EP2418064A4 (en) * 2009-06-18 2013-09-04 Michio Komatsu Thin container production method
JP2013539425A (en) * 2010-11-23 2013-10-24 シンベンティブ モールディング ソリューソンズ，インク． Injection molding flow control apparatus and method
JP2014534100A (en) * 2011-11-23 2014-12-18 ハスキー インジェクション モールディング システムズ リミテッドＨｕｓｋｙ Ｉｎｊｅｃｔｉｏｎ Ｍｏｌｄｉｎｇ Ｓｙｓｔｅｍｓ Ｌｉｍｉｔｅｄ Control structure for molding systems
EP3019322A4 (en) * 2013-07-09 2017-08-16 Husky Injection Molding Systems Luxembourg IP Development S.à.r.l A mold stack
CN108127865A (en) * 2013-07-09 2018-06-08 赫斯基注塑***有限公司 Mold stack
EP3338990A1 (en) * 2013-07-09 2018-06-27 Husky Injection Molding Systems Luxembourg IP Development S.à.r.l A method of operating a molding apparatus
US10421226B2 (en) 2013-07-09 2019-09-24 Husky Injection Molding Systems Ltd. Stack mold
CN108127865B (en) * 2013-07-09 2020-06-30 赫斯基注塑***有限公司 Mold stack
JP2017505730A (en) * 2013-11-22 2017-02-23 プリーアムス ジステーム テヒノロギース アーゲー Method for controlling the filling of at least one cavity
JP2018176727A (en) * 2017-04-04 2018-11-15 イングラス エス． ピー． エー． Method, apparatus and press for injection molding of plastic material

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