JPS6151840A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS6151840A
JPS6151840A JP59175585A JP17558584A JPS6151840A JP S6151840 A JPS6151840 A JP S6151840A JP 59175585 A JP59175585 A JP 59175585A JP 17558584 A JP17558584 A JP 17558584A JP S6151840 A JPS6151840 A JP S6151840A
Authority
JP
Japan
Prior art keywords
wire bonding
chip
stem
semiconductor device
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59175585A
Other languages
Japanese (ja)
Inventor
Yukio Yamauchi
山内　幸雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59175585A priority Critical patent/JPS6151840A/en
Publication of JPS6151840A publication Critical patent/JPS6151840A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7865—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable wire bonding in sufficient strength by rotating a semiconductor device secured vertically with a chip to a stem so that the chip is disposed horizontally and wire bonding from above. CONSTITUTION:A semiconductor device 15a before wire bonding is placed on a tray 9, and one is fed to the position directly under a chuck 23. A semiconductor device 15a is placed on a retainer 26a of a holding rotor 26 by the chuck 23. The device 15a is attracted in vacuum from a vacuum evacuation hole 31, and held. The rotor 26 is rotated at 90 deg., and a chip 18 and external electrodes 16a are disposed at horizontal position. Fine metal wirings are bonded to a capillary chip 8 via the wire bonding body 6.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は、半導体チップをステムに対して立て方向に
装着し、金属細線で接続するワイヤボンディング装置に
関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a wire bonding device for mounting a semiconductor chip vertically on a stem and connecting the semiconductor chip with a thin metal wire.

〔従来技術〕[Prior art]

トランジスタなどの半導体装置では、半導体チップ（以
下「チップ」と称する）をステムに水平に装着したもの
が一般である。この種の半導体装置を第１図に斜視図で
示す。（１）は半導体装置で、次のように構成されてい
る。（２）はステムで、リード（３）が貫通して下方に
出されており、これらのり−ト責３）の上端は外部電極
（３ａ）をなしている０（４）はステム上に水平にダイ
ボンディングされたチップで、金属細線（５）により外
部電極（３ａ）とにワイヤボンディングされている。2. Description of the Related Art Semiconductor devices such as transistors generally have a semiconductor chip (hereinafter referred to as a "chip") mounted horizontally on a stem. This type of semiconductor device is shown in a perspective view in FIG. (1) is a semiconductor device, which is configured as follows. (2) is the stem, through which the leads (3) extend downward, and the upper ends of these leads (3) form the external electrodes (3a). The chip is die-bonded to the external electrode (3a) using a thin metal wire (5).

上記のように、ステム（２）上に水平に固着されたチッ
プ（４）を接続する、従来のワイヤボンディング装置は
、第２図に概要斜視図で示すようになっていた。（６）
はワイヤボンディング装置本体で、腕部（７）が出ささ
−４、先端のキャピラリチップ（８）により金属細線（
図示は略す）を超音波、又は熱圧着あるいは双方併用に
よ、リワイヤボンデイングする。As mentioned above, a conventional wire bonding apparatus for connecting a chip (4) fixed horizontally on a stem (2) is shown in a schematic perspective view in FIG. (6)
is the main body of the wire bonding device, the arm (7) is exposed -4, and the thin metal wire (
(not shown) is rewired using ultrasonic waves, thermocompression bonding, or a combination of both.

（９）は複数の収容穴にそれぞれリード（３）が出され
たワイヤボンド前の半導体装１（ｌａ）を載せ、間欠送
り手段（図示は略す）により１ピッチ宛送られ、半導体
装荷（１ａ）のステム（２）をキャピラリチップ（８）
の下にするトレイ、α１はキャピラリチップ（８）の下
に送られたステム（２）を、ワイヤボンディング中押え
ておくステム押え、αつは送られるトＬ／イ（９）を受
けて案内する案内レールである。(9) places the semiconductor device 1(la) before wire bonding, with leads (3) taken out in each of the plurality of accommodation holes, and feeds the semiconductor device 1(la) one pitch by an intermittent feeding means (not shown). ) stem (2) of the capillary tip (8)
The tray to be placed under the capillary chip (8), α1 is a stem holder that holds down the stem (2) sent under the capillary chip (8) during wire bonding, and α is the tray that receives and guides the tray L/I (9) being sent. This is a guide rail.

このように、トレイ（９）によりキャピラリチップ（８
）の下に送られてきたワイヤボンド前の半導体装置（１
ａ）は、ワイヤボンディング装置本体（Ｇ）の動作によ
り、キャピラリチップにより金属細線（図示は略す）で
ワイヤボンドする。こうして、第１図のような半導体装
置（１）が出来上る。In this way, the tray (9) allows the capillary tip (8
) Semiconductor device before wire bonding (1
In a), a thin metal wire (not shown) is wire-bonded using a capillary chip by the operation of the wire bonding device main body (G). In this way, a semiconductor device (1) as shown in FIG. 1 is completed.

上記従来のワイヤボンディング装置では、チップ（４）
がステム（２）上に水平にボンディングされである場合
に適用されたが、チップ（４）がステム（２）ＩＣ対し
立て方向に取付けられる場合には使用できなかった。In the above conventional wire bonding equipment, the chip (4)
It was applied when the chip (4) was bonded horizontally on the stem (2), but it could not be used when the chip (4) was attached vertically to the stem (2) IC.

〔発明の概要〕[Summary of the invention]

この発明は、チップがステムに対し立て方向に固着され
たワイヤボンド前の半導体装置を、保持回動装置に載せ
て保持し、チップが水平位置になるように回動し、上方
からキャピラリチップによりワイヤボンディングするよ
うにし、十分な強度のワイヤボンディングができる、ワ
イヤボンディング装置を提供することを目的としている
。In this invention, a semiconductor device before wire bonding, in which a chip is vertically fixed to a stem, is placed on a holding and rotating device and held, the chip is rotated to a horizontal position, and a capillary chip is inserted from above. It is an object of the present invention to provide a wire bonding device capable of performing wire bonding with sufficient strength.

〔発明の実施例〕[Embodiments of the invention]

レーザダイオードなど半導体装置では、レーザ光の投射
をステムに対し立て方向に出さなければならない。この
ため、ステム上にチップを立て方向に装着するようにし
ている。In semiconductor devices such as laser diodes, laser light must be projected in a vertical direction with respect to the stem. For this reason, the tip is mounted on the stem in an upright direction.

この種の半導体装置を第３図に示す０半導体装ｒｉ（イ
）は次のように構成されている。ステム（２）からり一
ド０Ｑが貫通して下方に出され、上端は外部電極（１６
ａ）をなしている。（１７）はステム（２）上に固着さ
れた保持体で、放熱体を兼ねている。（ト）はレーザダ
イオードなどのチップで、保持体α力の立て方向面にダ
イボンディングされており、金属細線（５）により外部
室％　（１６ａ）とにワイヤボンディングされている。A semiconductor device of this type shown in FIG. 3 is constructed as follows. The lead 0Q passes through the stem (2) and extends downward, and the upper end is connected to the external electrode (16
a). (17) is a holder fixed on the stem (2) and also serves as a heat sink. (g) is a chip such as a laser diode, which is die-bonded to the vertical surface of the holder α force, and is wire-bonded to the external chamber (16a) using a thin metal wire (5).

上記のように、ステム（２）に対し立て方向に固着され
たチップ（ト）を接続する、この発明の一実施例による
ワイヤボンディング装置を、第４図に斜視図で示し、（
６）〜（９）、α℃は上記従来装置と同一のものである
。（１）はトレイ（９）に載せられ搬入されてきたワイ
ヤボンディング前の半導体装置（１５ａ）を、矢印Ａ、
Ｂ方向に移載する移載装置で、次のように構成されてい
る。Ｑ］）は移動駆動部で、前方に出された可動棒（イ
）を前進、後退及び上下移動させる。A wire bonding device according to an embodiment of the present invention, which connects the chip fixed vertically to the stem (2) as described above, is shown in a perspective view in FIG.
6) to (9) and α°C are the same as those of the conventional device. (1) shows the semiconductor device (15a) before wire bonding, which has been carried in on a tray (9), as indicated by the arrow A.
This is a transfer device for transferring in direction B, and is configured as follows. Q]) is a moving drive unit that moves the movable rod (A) extended forward, backward, and up and down.

（イ）は可動棒（イ）の前端に取付けられたチャック部
で、下方に１対の爪（ハ）が出されていて開閉させ、ス
テム（２）の外円周を挾付け保持及び開放をさせる。(A) is a chuck part attached to the front end of the movable rod (A), which has a pair of claws (C) protruding from the bottom to open and close, and clamps the outer circumference of the stem (2) to hold and release it. make them do

つぎに、（イ）はキャピラリチップ（８）の下方に配設
された保持回動装置で、次のように構成されている。＠
は保持回動体で、上部中央に半導体装置（１５ａ）のス
テム（２）を載せる受け座（２６ａ）及び各ＩＪ　−ド
αＱを下方に逃がす穴（２６＋））が設けられている０
この受け座（２６ａ）から下方に貫通する真空吸引穴０
１）（第５図参照）があ汁られている０保持回動体（イ
）の上部両端には腕部（２６ｃ　）が上方に延び、これ
らの外端に１対の支持軸勾が固着されているＯ（財）は
１対の軸受台で、軸受翰を介し支持軸（イ）を回動自在
に支持している。（１）は軸受台（ハ）に取付けられた
ステップモータで、制御装置（図示は略す）により支持
軸（財）を介し保持回動体（ハ）を所要の角度、例えば
９０　　復往回動させる。Next, (a) is a holding/rotating device disposed below the capillary chip (8), which is constructed as follows. @
0 is a holding rotary body, which is provided with a receiving seat (26a) on which the stem (2) of the semiconductor device (15a) is placed and a hole (26+)) through which each IJ-doe αQ escapes downward.
Vacuum suction hole 0 penetrating downward from this receiving seat (26a)
1) Arms (26c) extend upward at both upper ends of the 0-holding rotary body (a), which is soaked with water (see Figure 5), and a pair of support shafts are fixed to the outer ends of these arms (26c). O (Incorporated) is a pair of bearing stands that rotatably support the support shaft (A) via the bearing holder. (1) is a step motor attached to a bearing stand (c), which rotates the holding rotating body (c) back and forth through a support shaft (c) by a control device (not shown) to a required angle, for example, 90 degrees. .

上記一実施例の装置によるワイヤボンディング動作を、
ｖ、４図ないし第７図により説明する。まず、第４図の
ように、ワイヤボンド前の半導体装！（１５ａ）がトレ
イ（９）に載せられ、間欠送り機構（図示は略す）によ
シチャック部（イ）の直下に１個宛送られてくる。そこ
で、第５図のように、チャック部□□□が矢印Ｃのよう
に下降し、両方の爪＠をせばめステム（２）を挾付けて
半導体装置（１５ａ）を保持し、矢印りのように上昇し
、矢印Ｅのように前進し保持回動体（イ）の直上に至る
０つづいて、チャック部のは矢印Ｆのように下降し半導
体装置（１５ａ）を保持回動体（至）の受け座（２６ａ
）上に載せ、両爪Ｈを開き矢印Ｇのように上昇し、矢印
Ｈのように後退する。The wire bonding operation by the apparatus of the above embodiment is as follows:
This will be explained with reference to FIGS. 4 to 7. First, as shown in Figure 4, the semiconductor device before wire bonding! (15a) is placed on the tray (9), and one piece is delivered directly below the chuck part (A) by an intermittent feeding mechanism (not shown). Then, as shown in Fig. 5, the chuck part □□□ descends as shown by arrow C, squeezes both claws @, clamps the stem (2), holds the semiconductor device (15a), and holds the semiconductor device (15a) as shown by the arrow. The chuck part moves forward as shown by arrow E until it is directly above the holding rotating body (A).Then, the chuck part descends as shown by arrow F and moves forward as shown by arrow E until it reaches the receiving position of the holding rotating body (to). za (26a
), open both claws H, move up as shown by arrow G, and move back as shown by arrow H.

この状態を第６図に示し、半導体装置（１５ａ）は受け
座（２６ａ　）上にあって、真空吸引穴０１）の外部か
らの真空引きにより吸着保持される。This state is shown in FIG. 6, where the semiconductor device (15a) is placed on the receiving seat (26a) and is held by suction by vacuuming from the outside of the vacuum suction hole 01).

ついで、第７図のように、保持回動体（イ）が矢印Ｇ方
向に９０°回動され、チップ（至）と外部電極（１６ａ
　）面とを水平位置にする０こうして、ワイヤボンディ
ング装置本体（６）によりキャピラリチップ（８）で金
属細線をボンディングする０ ワイヤボンディングが終った半導体装置αＱは、チャッ
ク（ハ）の前進、下降、両爪（ハ）の挾付けで保持され
、チャック（ト）の上昇、後退、下降でトレイ（９）上
の元の載せ座（９ａ）上に戻され、チャック（イ）は両
爪（ハ）を開き上昇復帰し、−行程を終了する。Next, as shown in FIG.
) surface is placed in a horizontal position 0 In this way, the capillary chip ( 8 ) is bonded to the fine metal wire using the wire bonding device main body ( 6 ) 0 After wire bonding, the semiconductor device αQ is moved forward and downward by the chuck (c). It is held by the clamping of both jaws (C), and is returned to the original mounting seat (9a) on the tray (9) by raising, retreating, and lowering the chuck (G), and the chuck (A) is held by the clamping of both jaws (Ha). ) and return to the upward position, completing the -stroke.

保持回動体（イ）はステップモータ（７）Ｋより所要の
角度に回動することができ、チップ（至）がステム（２
）に対し、上記一実施例の垂直方向にある場合の外、傾
斜した方向にグイボンドされてあっても、チップ（１枠
を水平位置にすることにより上方から確実にワイヤボン
ディングすることができる。The holding rotating body (A) can be rotated to a desired angle by a step motor (7) K, and the tip (to) can be rotated by the stem (2).
), in addition to the vertical direction as in the above embodiment, even if the chip is wire bonded in an inclined direction, wire bonding can be reliably performed from above by placing the chip (one frame in a horizontal position).

なお、上記実施例では、保持回動体（イ）に半導体装置
（１５ａ）を保持固定するのに、真空吸着によったが、
機械的なステム押えによる固定であってもよい。In addition, in the above embodiment, vacuum suction was used to hold and fix the semiconductor device (15a) to the holding rotating body (a).
It may be fixed by a mechanical stem presser.

また、上記実施例では、保持回動体（４）を回動駆動す
るのに、ステップモータ（１）を用いたが、これに限ら
す回動角度を制限できる他の種の電動機を用いてもよく
、あるいはエアシリンダとストッパを用いたものであっ
てもよい。Further, in the above embodiment, the step motor (1) is used to rotate the holding rotary body (4), but other types of electric motors that can limit the rotation angle may also be used. Alternatively, an air cylinder and a stopper may be used.

さらに１ワイヤボンディング装置本体（６）の仕様によ
っては、トレイ（９）及び保持回動体（イ）に可熱装置
を設けてもよい。Furthermore, depending on the specifications of the one-wire bonding apparatus main body (6), a heatable device may be provided on the tray (9) and the holding rotating body (A).

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によれば、ステムに載せられ搬
入されたワイヤボンド前の半導体装置を、移載装置によ
り爪で挾付けて保持し、保持回動装置に移載して保持し
、チップが水平位置になるように回動し、上方からキャ
ピラリチップによ抄ワイヤボンディングするようにしだ
ので、チップがステム上面に対し立て一方向に、垂直又
は傾斜して固着されてあっても、十分な接着強度をもつ
ワイヤボンディングがすることができる０As described above, according to the present invention, a semiconductor device before wire bonding that has been carried in on a stem is held by the transfer device with the claws, and is transferred to the holding rotation device and held, The chip is rotated to a horizontal position and wire bonded to the capillary chip from above, so even if the chip is fixed to the top surface of the stem in one direction, vertically or at an angle, Wire bonding with sufficient adhesive strength is possible.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はステム上面に水平にチップが装着された半導体
装置の斜視図、第２図は従来のツイヤボンディング装置
の概要斜視図、第３図はステム上面に対し立て方向にチ
ップが装着された半導体装置の斜視図、第４図はこの発
明の一実施例によるワイヤボンディング装置の概要斜視
図、第５図なワ いし第＊〆１は第４図の装置によるワイヤボンディング
を工程順に示す要部縦断面図である０２・・・ステｌ２
．５・・・金属細線、６・・・ワイヤボンディング装置
本体、ワ・・・腕部、８・・・キャビラリチツブ、９・
・・トレイ、１１・・・案内レール、１５・・・半導体
装置、１５ａ・・・ワイヤボンド前の半導体装置、１６
・・・リード、１６ａ・・・外部雪極、１８・・・半導
体チップ、２０・・・移載装置、２１・・・９動駆動部
、２２・・・可動棒、２３・・・チャック部、２４・・
爪、２５・・・保持口＃Ｊ装置、２６・・保持回動体、
２６ａ・・・受け座、２７・・・支持軸、２８軸受台、
２９・・・軸受、３０・・・ステップモータ、３１・・
・真空吸引穴（保持手段） なお、図中同一符号は同−又は相当部分を示す。Fig. 1 is a perspective view of a semiconductor device in which a chip is mounted horizontally on the top surface of a stem, Fig. 2 is a schematic perspective view of a conventional Tsuya bonding device, and Fig. 3 is a perspective view of a semiconductor device in which a chip is mounted vertically on the top surface of a stem. FIG. 4 is a schematic perspective view of a wire bonding device according to an embodiment of the present invention, and FIG. 02 which is a vertical cross-sectional view of part 12...
．． 5... Metal thin wire, 6... Wire bonding device main body, W... Arm portion, 8... Cabillary tip, 9...
...Tray, 11... Guide rail, 15... Semiconductor device, 15a... Semiconductor device before wire bonding, 16
. . . Lead, 16a . . . External snow pole, 18 . . . Semiconductor chip, 20 . . . Transfer device, 21 . , 24...
Claw, 25... Holding port #J device, 26... Holding rotating body,
26a... Receiving seat, 27... Support shaft, 28 Bearing stand,
29...Bearing, 30...Step motor, 31...
・Vacuum suction hole (holding means) The same reference numerals in the drawings indicate the same or equivalent parts.

Claims (6)

【特許請求の範囲】[Claims] （１）半導体チップがステム上面に対し立て方向に固着
されたワイヤボンド前の半導体装置を保持し、上記半導
体チップと上記ステム上に設けられた外部電極とを、ワ
イヤボンディング装置本体から出された腕部の先端のキ
ャピラリチップにより金属細線でワイヤボンディングす
る装置において、上記キャピラリチップの下方に位置し
立て方向の回動可能に支持され、上部の受け座に上記半
導体装のステムを受け保持手段により保持した保持回動
体を、回動駆動手段により所要の角度回動し、保持した
上記半導体装置の半導体チップを水平位置にし上方から
ワイヤボンディングされるようにする保持回動装置、上
部に複数個の上記半導体装置を前後の間隔をあけて支持
し間欠送りするトレイ、移動駆動部から出された可動棒
の先端にチャック部が取付けられ、このチャック部から
下方に１対の爪が出されており、チャック部の下方に送
り込まれた上記半導体装置を、上記１対の爪で挾付け保
持し、前進により上記保持回動体の上方に至り、チャッ
ク部の下降で上記半導体装置を上記受け座上に移す移載
装置、及びこの受け座に載せられた半導体装置を固定し
ておく保持手段を備えたワイヤボンディング装置。(1) Hold the semiconductor device before wire bonding, in which the semiconductor chip is vertically fixed to the upper surface of the stem, and connect the semiconductor chip and the external electrode provided on the stem to the wire bonding device body. In an apparatus for wire bonding with a thin metal wire using a capillary chip at the tip of an arm, the capillary chip is positioned below the capillary chip and supported so as to be rotatable in the vertical direction, and the stem of the semiconductor device is received on the upper receiving seat by the holding means. A holding and rotating device includes a holding and rotating device that rotates the held holding and rotating body by a required angle by a rotation drive means to bring the held semiconductor chip of the semiconductor device into a horizontal position so that wire bonding can be performed from above; A tray is used to support and intermittently feed the semiconductor devices at intervals in the front and rear, and a chuck part is attached to the tip of a movable rod that comes out from a moving drive part, and a pair of claws protrudes downward from this chuck part. The semiconductor device fed into the lower part of the chuck part is clamped and held by the pair of claws, and as it moves forward, it reaches the upper part of the holding rotary body, and as the chuck part descends, the semiconductor device is placed on the receiving seat. A wire bonding device comprising a transfer device for transferring and a holding means for fixing a semiconductor device placed on the receiving seat. （２）半導体チップがステム上面に対し垂直に装着され
た特許請求の範囲第１項記載のワイヤボンディング装置
。(2) The wire bonding apparatus according to claim 1, wherein the semiconductor chip is mounted perpendicularly to the upper surface of the stem. （３）半導体チップがステム上面に対し傾斜して装着さ
れた特許請求の範囲第１項記載のワイヤボンディング装
置。(3) The wire bonding apparatus according to claim 1, wherein the semiconductor chip is mounted obliquely with respect to the upper surface of the stem. （４）回動駆動手段はステップモータからなる特許請求
の範囲第１項ないし第３項のいづれかに記載のワイヤボ
ンディング装置。(4) The wire bonding apparatus according to any one of claims 1 to 3, wherein the rotational drive means comprises a step motor. （５）回動駆動手段はエアシリンダ及び回動角度を規制
するストッパからなる特許請求の範囲第１項ないし第３
項のいづれかに記載のワイヤボンディング装置。(5) The rotational driving means comprises an air cylinder and a stopper that regulates the rotational angle.
The wire bonding device according to any one of paragraphs. （６）保持手段は受け座から下方に貫通した真空吸引穴
からの真空引きによる特許請求の範囲第１項ないし第５
項のいづれかに記載のワイヤボンディング装置。(6) The holding means is vacuum drawn from a vacuum suction hole penetrating downward from the receiving seat according to Claims 1 to 5.
The wire bonding device according to any one of paragraphs.
JP59175585A 1984-08-21 1984-08-21 Wire bonding device Pending JPS6151840A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59175585A JPS6151840A (en) 1984-08-21 1984-08-21 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59175585A JPS6151840A (en) 1984-08-21 1984-08-21 Wire bonding device

Publications (1)

Publication Number Publication Date
JPS6151840A true JPS6151840A (en) 1986-03-14

Family

ID=15998653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59175585A Pending JPS6151840A (en) 1984-08-21 1984-08-21 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS6151840A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117226A (en) * 1982-12-24 1984-07-06 Hitachi Tokyo Electronics Co Ltd Bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117226A (en) * 1982-12-24 1984-07-06 Hitachi Tokyo Electronics Co Ltd Bonding device

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