CN107248500A - It is a kind of to take brilliant, crystal solidifying apparatus and its use its bonder - Google Patents
It is a kind of to take brilliant, crystal solidifying apparatus and its use its bonder Download PDFInfo
- Publication number
- CN107248500A CN107248500A CN201710604147.5A CN201710604147A CN107248500A CN 107248500 A CN107248500 A CN 107248500A CN 201710604147 A CN201710604147 A CN 201710604147A CN 107248500 A CN107248500 A CN 107248500A
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- platform
- die bond
- wafer
- tool seat
- plane tool
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
Brilliant, crystal solidifying apparatus is taken the invention discloses one kind, die bond platform is moved along X, Y-direction, plane tool seat is embedded with die bond platform, plane tool seat is concordant with die bond platform, plane tool seat is connected with heater；Pivoted arm is provided with soldering tip, and soldering tip is used to take brilliant and die bond；Substrate is located above die bond platform and makees feed motion in X direction relative to die bond platform；First driving means are used to drive pivoted arm circular-rotation；Wafer platform is used to fix wafer, and wafer platform drive device is used to drive wafer platform to move and drive wafer platform to rotate about axis rotation along X, Y-direction.Beneficial effect of the present invention：Plane tool seat is set, and substrate is heated in certain scope, and stable temperature control is not likely to produce cavitation during load；In die bond, the power between soldering tip and substrate is concentrated on plane tool seat, greatly reduces the requirement to die bond platform integral smoothness, improves soldering tip and the depth of parallelism in load position substrate, it is ensured that the attachment flatness of semiconductor devices.
Description
Technical field
The present invention relates to bonder field, and in particular to a kind of to take brilliant, crystal solidifying apparatus and its use its bonder.
Background technology
In semiconductor devices such as IC encapsulation process, die bond is extremely important link.The process of die bond is：First
By glue applying mechanism (the also referred to as dispensing module) dispensing on the die bond station of substrate, then will partly it be led by the die bond swing arm of die bond mechanism
Body chip takes out from wafer, and then is transferred on the die bond station for having put glue.In identical die bond yields (quality) condition
Under, the die bond efficiency of bonder is to evaluate the important indicator of bonder performance.
Being sticked for back has the chip of DAF films, and package dimension is identical with die size, needs to be added in encapsulation
Heat, and heating when measurement tolerance at ± 3 degree, the conveying material road of current substrate is longer, to whole piece material road progress temperature control skill
Art difficulty is larger, and high energy consumption, and temperature control is uneven, causes easily to produce cavitation during chip package.
On the other hand, due to it is difficult to ensure that the level of soldering tip and whole substrate, therefore it is difficult that meet will to attachment flatness
Seek higher product.
The content of the invention
In order to overcome the above-mentioned deficiencies of the prior art, brilliant, crystal solidifying apparatus is taken the invention provides one kind.
To reach above-mentioned purpose, the technical solution adopted for the present invention to solve the technical problems is：
One kind takes brilliant, crystal solidifying apparatus, it is characterised in that including：
Die bond platform, the die bond platform is moved along X, Y-direction, and plane tool seat, the plane are embedded with the die bond platform
Tool seat is concordant with the die bond platform, and the plane tool seat is connected with heater；
Pivoted arm, the pivoted arm is provided with the soldering tip moved back and forth along the rotation axis parallel to the pivoted arm, and the soldering tip is used
In taking brilliant and die bond；
Substrate, the substrate is located above the die bond platform and makees feed motion in X direction relative to the die bond platform.
First driving means, the first driving means are connected with the pivoted arm, for driving the pivoted arm circular-rotation；
Wafer platform and wafer platform drive device, the wafer platform are used to fix wafer, and the wafer platform drive device is used for
The wafer platform is driven to move and drive the wafer platform to rotate about axis rotation along X, Y-direction.
It is using the beneficial effect of above-mentioned technical proposal：By setting plane tool seat, plane tool seat on die bond platform
It is concordant with die bond platform, heater, it is possible to achieve the heating to plane tool seat, the control of temperature, can make when being easy to die bond
Substrate is heated in certain scope, and temperature control is relatively stable, and load is not likely to produce cavitation；In die bond, soldering tip with
Power between substrate is concentrated on plane tool seat, is greatly reduced the requirement to die bond platform integral smoothness, is improved soldering tip
With the depth of parallelism in load position substrate, it is more easy to ensure the attachment flatness of semiconductor devices, improves the yields of die bond.Pivoted arm
It is fixed with vision positioning device, by driving die bond platform to be moved along Y-direction, it is possible to achieve the encapsulation to substrate Y-direction, lead to
The X-direction base plate driving mechanism crossed on die bond platform, it is possible to achieve the encapsulation to substrate Y-direction.By moving wafer platform, drive
Wafer is moved, and raising takes brilliant efficiency, by driving wafer platform to rotate, it is possible to achieve the die bond operation of chip multi-angle.
Further, in addition to First look positioner and the second vision positioning device, the First look positioning dress
Put and be fixed on above the wafer platform, second vision positioning device is fixed on the plane tool seat top.Using above-mentioned
The beneficial effect of technical scheme is：First look positioner is positioned when taking crystalline substance, and the second vision positioning device is in die bond
Shi Jinhang is positioned, and positioning precision is high.
Further, it is provided near four angles of the plane tool seat in shoulder hole, the shoulder hole and leveling is installed
Screw and spring, the spring housing is on the leveling serew.
It is using the beneficial effect of above-mentioned technical proposal：By the elastic reaction of spring on screw, can with Fast Installation and
Leveling plane tool seat, it is ensured that the level between soldering tip and plane tool seat, it is easy to processing and adjustment.
Further, the soldering tip be a telescopic structure, soldering tip include head rod, sleeve, the second connecting rod and
Stage clip, head rod is slidably connected with sleeve, and the second connecting rod is arranged in sleeve and is fixedly connected with sleeve, stage clip one end
It is connected with head rod, the other end of stage clip is connected with one end of the second connecting rod, head rod is circumferentially with groove,
Sleeve lining is provided with guide protrusions, and groove and guide protrusions coordinate, in tracheae insertion head rod and the second connecting rod and with
Suction nozzle is connected, and tracheae is connected with vacuum generator.
The invention also discloses bonder, including substrate feeding device, point glue equipment, it is characterised in that also including above-mentioned
One kind take brilliant, crystal solidifying apparatus.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to do simply to introduce, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the structural representation that plane tool seat of the present invention is installed
Fig. 3 is the structural representation of soldering tip of the present invention
Numeral and the title of the corresponding component represented by letter in figure：
1- wafer platforms；11- chips；2- die bond platforms；3- substrates；4- planes tool seat；5- pivoted arms；6- first driving means；
8- heaters；21- First look positioners；The vision positioning devices of 22- second；31- suction nozzles；32- head rods；33-
Sleeve；34- stage clips；The connecting rods of 35- second；36- tracheaes；321- grooves；331- guide protrusions；41- shoulder holes；42- leveling spiral shells
Silk；43- springs；100- clamping jaws.
Embodiment
With reference to specific embodiment, present disclosure is described in further detail：
In order to reach the purpose of the present invention, as illustrated, being in one embodiment of the present invention：One kind takes brilliant, die bond
Device, including：
Die bond platform 2, die bond platform 2 is moved along X, Y-direction, is embedded with plane tool seat 4 on die bond platform 2, plane tool seat 4 with
Die bond platform 2 is concordant, and plane tool seat 4 is connected with heater 8；
Pivoted arm 5, pivoted arm 5 is provided with the soldering tip moved back and forth along the rotation axis parallel to pivoted arm 5, and soldering tip is used to take crystalline substance and solid
It is brilliant；
Substrate 3, substrate 3 is located at the top of die bond platform 1 and makees feed motion in X direction relative to die bond platform 1, and substrate 3 passes through
Clamping jaw 100 is fixed, and driving stepper motor clamping jaw makees feed motion.
First driving means 6, first driving means 6 are connected with pivoted arm 5, for driving the circular-rotation of pivoted arm 5；
Wafer platform 4 and wafer platform drive device, wafer platform 1 are used to fix wafer, and wafer platform drive device is used to drive crystalline substance
Round platform 1 moves and driven wafer platform 1 to rotate about axis rotation along X, Y-direction.
It is using the beneficial effect of above-mentioned technical proposal：By setting plane tool seat, plane tool seat on die bond platform
It is concordant with die bond platform, heater, it is possible to achieve the heating to plane tool seat, the control of temperature, can make when being easy to die bond
Substrate is heated in certain scope, and temperature control is relatively stable, and encapsulation is not likely to produce cavitation；In die bond, soldering tip with
Power between substrate is concentrated on plane tool seat, and substrate is not allowed to be also easy to produce local deformation so that the flatness of die bond metacoxal plate
It is higher, the percent defective of die bond is greatly reduced, enterprise's production cost, by driving die bond platform to be moved along XY directions, pivoted arm is reduced
It is fixed with vision positioning device, it is possible to achieve the encapsulation to substrate XY directions, by moving wafer platform, drive wafer to move
Dynamic, raising takes brilliant efficiency, by driving wafer platform to rotate, it is possible to achieve the die bond operation of chip multi-angle.
In other embodiments of the present invention, in addition to the vision positioning device of First look positioner 21 and second
22, First look positioner 21 is fixed on above wafer platform, and the second vision positioning device 22 is fixed on plane tool seat top.
It is using the beneficial effect of above-mentioned technical proposal：First look positioner is positioned when taking crystalline substance, the second vision positioning dress
Put and positioned in die bond, positioning precision is high.
In other embodiments of the present invention, it is provided near four angles of plane tool seat in shoulder hole, shoulder hole
Leveling serew and spring are installed, spring housing is on leveling serew.It is using the beneficial effect of above-mentioned technical proposal：Pass through spiral shell
The elastic reaction of spring on silk, can be with Fast Installation and leveling plane tool seat, it is ensured that the water between soldering tip and plane tool seat
It is flat, it is easy to processing and adjustment.
In other embodiments of the present invention, soldering tip is a telescopic structure, and soldering tip includes head rod 32, set
The 33, second connecting rod 35 of cylinder and stage clip 34, head rod 32 are slidably connected with sleeve 33, and the second connecting rod 35 is arranged in sleeve
It is fixedly connected in 33 and with sleeve 33, the one end of stage clip 34 is connected with head rod 32, and the other end of stage clip 34 is connected with second
One end connection of bar 35, head rod 32 is circumferentially with groove 321, and the inwall of sleeve 33 is provided with guide protrusions 331, groove
321 coordinate with guide protrusions 331, and tracheae 36 is inserted in the connecting rod 35 of head rod 32 and second and is connected with suction nozzle 31, gas
Pipe 36 is connected with vacuum generator, and sleeve 33 can be made of elastomeric material, and groove 321 can both make in guide protrusions 331
Lower slider, can play and slide spacing effect again.It is using the beneficial effect of above-mentioned technical proposal：When preventing from taking crystalline substance soldering tip with
Hard collision between wafer.
The invention also discloses bonder, including substrate feeding device, point glue equipment, it is characterised in that also including above-mentioned
One kind take brilliant, crystal solidifying apparatus.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and be carried out, and it is not intended to limit the scope of the present invention, all according to the present invention
The equivalent change or modification that Spirit Essence is done, should all cover within the scope of the present invention.
Claims (5)
1. one kind takes brilliant, crystal solidifying apparatus, it is characterised in that including：
Die bond platform, the die bond platform is moved along X, Y-direction, and plane tool seat, the plane tool are embedded with the die bond platform
Seat is concordant with the die bond platform, and the plane tool seat is connected with heater；
Pivoted arm, the pivoted arm is provided with the soldering tip moved back and forth along the rotation axis parallel to the pivoted arm, and the soldering tip is used to take
Brilliant and die bond；
Substrate, the substrate is located above the die bond platform and makees feed motion in X direction relative to the die bond platform.
First driving means, the first driving means are connected with the pivoted arm, for driving the pivoted arm circular-rotation；
Wafer platform and wafer platform drive device, the wafer platform are used to fix wafer, and the wafer platform drive device is used to drive
The wafer platform moves and driven the wafer platform to rotate about axis rotation along X, Y-direction.
2. one kind according to claim 1 takes brilliant, crystal solidifying apparatus, it is characterised in that also including First look positioner
With the second vision positioning device, the First look positioner is fixed on above the wafer platform, second vision positioning
Device is fixed on the plane tool seat top.
3. one kind according to claim 2 takes brilliant, crystal solidifying apparatus, it is characterised in that four angles of the plane tool seat
Nearby it is provided with shoulder hole, the shoulder hole and leveling serew and spring is installed, the spring housing is on the leveling serew.
4. one kind according to claim 3 is quick to take brilliant, crystal solidifying apparatus, it is characterised in that the soldering tip is one telescopic
Structure, soldering tip includes head rod, sleeve, the second connecting rod and stage clip, and head rod is slidably connected with sleeve, and second connects
Extension bar is arranged in sleeve and is fixedly connected with sleeve, and stage clip one end is connected with head rod, the other end of stage clip and second
One end connection of connecting rod, head rod is circumferentially with groove, and sleeve lining is provided with guide protrusions, groove and guide protrusions
Coordinate, be connected in tracheae insertion head rod and the second connecting rod and with suction nozzle, tracheae is connected with vacuum generator.
5. bonder, including substrate feeding device, point glue equipment, it is characterised in that also including as described in claim 1-4 is any
One kind take brilliant, crystal solidifying apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710604147.5A CN107248500B (en) | 2017-07-21 | 2017-07-21 | Crystal taking and fixing device and crystal fixing machine adopting same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710604147.5A CN107248500B (en) | 2017-07-21 | 2017-07-21 | Crystal taking and fixing device and crystal fixing machine adopting same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107248500A true CN107248500A (en) | 2017-10-13 |
| CN107248500B CN107248500B (en) | 2023-06-27 |
Family
ID=60015138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710604147.5A Active CN107248500B (en) | 2017-07-21 | 2017-07-21 | Crystal taking and fixing device and crystal fixing machine adopting same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107248500B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962791A (en) * | 2018-07-10 | 2018-12-07 | 唐人制造（宁波）有限公司 | A kind of chip alignment mounting device and its method |
| WO2019210627A1 (en) * | 2018-05-03 | 2019-11-07 | 苏州艾科瑞思智能装备股份有限公司 | High-precision fast chip taking and loading device and chip loading machine using same |
| CN110444499A (en) * | 2018-05-03 | 2019-11-12 | 苏州艾科瑞思智能装备股份有限公司 | It is a kind of to take piece, loading device and the loader using it |
| CN111415895A (en) * | 2020-02-19 | 2020-07-14 | 苏州艾科瑞思智能装备股份有限公司 | Get piece and chip bonding device and chip bonding machine |
| CN114300368A (en) * | 2022-03-07 | 2022-04-08 | 成都先进功率半导体股份有限公司 | Method for welding scattered crystal grain chips by using welding piece equipment |
| TWI767711B (en) * | 2021-05-19 | 2022-06-11 | 梭特科技股份有限公司 | Stably chip-bonding device |
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| JPH10141350A (en) * | 1996-11-14 | 1998-05-26 | Kokusai Electric Co Ltd | Horizontal planeness adjusting mechanism |
| CN103996648A (en) * | 2014-05-30 | 2014-08-20 | 沈阳拓荆科技有限公司 | Screw joint type ceramic ring positioning pins |
| CN106876307A (en) * | 2017-04-07 | 2017-06-20 | 江苏艾科瑞思封装自动化设备有限公司 | It is vertical to take brilliant, die bond mechanism and its use its vertical bonder |
| CN207217478U (en) * | 2017-07-21 | 2018-04-10 | 江苏艾科瑞思封装自动化设备有限公司 | It is a kind of to take brilliant, crystal solidifying apparatus and its use its bonder |
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2017
- 2017-07-21 CN CN201710604147.5A patent/CN107248500B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10141350A (en) * | 1996-11-14 | 1998-05-26 | Kokusai Electric Co Ltd | Horizontal planeness adjusting mechanism |
| CN103996648A (en) * | 2014-05-30 | 2014-08-20 | 沈阳拓荆科技有限公司 | Screw joint type ceramic ring positioning pins |
| CN106876307A (en) * | 2017-04-07 | 2017-06-20 | 江苏艾科瑞思封装自动化设备有限公司 | It is vertical to take brilliant, die bond mechanism and its use its vertical bonder |
| CN207217478U (en) * | 2017-07-21 | 2018-04-10 | 江苏艾科瑞思封装自动化设备有限公司 | It is a kind of to take brilliant, crystal solidifying apparatus and its use its bonder |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019210627A1 (en) * | 2018-05-03 | 2019-11-07 | 苏州艾科瑞思智能装备股份有限公司 | High-precision fast chip taking and loading device and chip loading machine using same |
| CN110444488A (en) * | 2018-05-03 | 2019-11-12 | 苏州艾科瑞思智能装备股份有限公司 | A kind of high-precision quickly takes piece, loading device and the loader using it |
| CN110444499A (en) * | 2018-05-03 | 2019-11-12 | 苏州艾科瑞思智能装备股份有限公司 | It is a kind of to take piece, loading device and the loader using it |
| CN110444488B (en) * | 2018-05-03 | 2021-12-07 | 苏州艾科瑞思智能装备股份有限公司 | High-precision rapid chip taking and loading device and chip loading machine adopting same |
| CN110444499B (en) * | 2018-05-03 | 2022-01-04 | 苏州艾科瑞思智能装备股份有限公司 | Sheet taking and loading device and sheet loading machine adopting same |
| CN108962791A (en) * | 2018-07-10 | 2018-12-07 | 唐人制造（宁波）有限公司 | A kind of chip alignment mounting device and its method |
| CN108962791B (en) * | 2018-07-10 | 2021-08-03 | 唐人制造（宁波）有限公司 | Chip alignment and mounting device and method thereof |
| CN111415895A (en) * | 2020-02-19 | 2020-07-14 | 苏州艾科瑞思智能装备股份有限公司 | Get piece and chip bonding device and chip bonding machine |
| CN111415895B (en) * | 2020-02-19 | 2023-08-04 | 苏州艾科瑞思智能装备股份有限公司 | Get piece and dress piece device and dress piece machine |
| TWI767711B (en) * | 2021-05-19 | 2022-06-11 | 梭特科技股份有限公司 | Stably chip-bonding device |
| CN114300368A (en) * | 2022-03-07 | 2022-04-08 | 成都先进功率半导体股份有限公司 | Method for welding scattered crystal grain chips by using welding piece equipment |
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|---|---|
| CN107248500B (en) | 2023-06-27 |
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