JPS6149447U - - Google Patents

Info

Publication number
JPS6149447U
JPS6149447U JP13369184U JP13369184U JPS6149447U JP S6149447 U JPS6149447 U JP S6149447U JP 13369184 U JP13369184 U JP 13369184U JP 13369184 U JP13369184 U JP 13369184U JP S6149447 U JPS6149447 U JP S6149447U
Authority
JP
Japan
Prior art keywords
wafer cassette
view
protrusions
manufacturing process
identification code
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13369184U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13369184U priority Critical patent/JPS6149447U/ja
Publication of JPS6149447U publication Critical patent/JPS6149447U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の第一実施例を正面から見た図
、第２図は第一の実施例を側面から見た図、第３
図は第二の実施例を正面から見た図、第４図は第
二の実施例を側面から見た図、第５図は第３図の
Ａ−Ａ′断面を示す図、第６図は従来のウエハー
カセツトを正面から見た図、第７図は従来のウエ
ハーカセツトを側面から見た図である。 １…ウエハーカセツトの側壁、２…位置決め用
突起、３…符号用突起、４…位置決め用孔、５…
符号用孔。 Figure 1 is a front view of the first embodiment of the present invention, Figure 2 is a side view of the first embodiment, and Figure 3 is a side view of the first embodiment.
The figure is a front view of the second embodiment, FIG. 4 is a side view of the second embodiment, FIG. 5 is a cross-sectional view taken along line A-A' in FIG. 3, and FIG. 7 is a front view of a conventional wafer cassette, and FIG. 7 is a side view of a conventional wafer cassette. DESCRIPTION OF SYMBOLS 1... Side wall of wafer cassette, 2... Positioning protrusion, 3... Code protrusion, 4... Positioning hole, 5...
Sign hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体製造工程において使用されるウエハーカ
セツトにおいて、該ウエハーカセツト底部のあら
かじめ定められた複数箇所に選択的に配設された
突起または孔からなるウエハーカセツト識別符号
を具備することを特徴とするウエハーカセツト。 A wafer cassette used in a semiconductor manufacturing process, characterized in that the wafer cassette is provided with a wafer cassette identification code consisting of protrusions or holes selectively disposed at a plurality of predetermined locations on the bottom of the wafer cassette.
JP13369184U 1984-09-03 1984-09-03 Pending JPS6149447U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13369184U JPS6149447U (en) 1984-09-03 1984-09-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13369184U JPS6149447U (en) 1984-09-03 1984-09-03

Publications (1)

Publication Number Publication Date
JPS6149447U true JPS6149447U (en) 1986-04-03

Family

ID=30692229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13369184U Pending JPS6149447U (en) 1984-09-03 1984-09-03

Country Status (1)

Country Link
JP (1) JPS6149447U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153517U (en) * 1987-03-28 1988-10-07
JP2011018908A (en) 2010-07-15 2011-01-27 Hitachi Kokusai Electric Inc Substrate processing apparatus, and method of manufacturing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153517U (en) * 1987-03-28 1988-10-07
JP2011018908A (en) 2010-07-15 2011-01-27 Hitachi Kokusai Electric Inc Substrate processing apparatus, and method of manufacturing semiconductor device

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