JPS61296067A - Electrically-conductive resin composition - Google Patents
Electrically-conductive resin compositionInfo
- Publication number
- JPS61296067A JPS61296067A JP13610285A JP13610285A JPS61296067A JP S61296067 A JPS61296067 A JP S61296067A JP 13610285 A JP13610285 A JP 13610285A JP 13610285 A JP13610285 A JP 13610285A JP S61296067 A JPS61296067 A JP S61296067A
- Authority
- JP
- Japan
- Prior art keywords
- stainless steel
- resin composition
- resin
- less
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、Ｓ Ｕ Ｓ ３０４ステンレス繊雛を含有し
た導電↑１の優れた導電性樹脂組成物に関Ｊる。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a conductive resin composition containing SUS 304 stainless steel fiber and having an excellent conductivity of ↑1.
［発明の技術的前踏とその問題点］
従来、合成樹脂に導電性充填材を配合混練して導電性の
樹脂を得る場合は、炭素の粉末、炭素繊維、金属粉末、
金属ｌＩＨを１種又は２種Ｊスト用いて導電性を得てい
た。 しかし、体積抵抗率で１０−１０・ａｍ以下とい
う高い導電性を得るために１よ、炭素の粉末、炭素１１
紐では不十分であり、また金属粉末を混練する場合は、
樹脂に対して６０重量％以上充填しないと高い導電性が
得られないという欠点がある。 更に金属Ｉｌｌでも線
径が太い銅繊維や黄銅繊維は３０重９％以上の充填が必
要であり、そのため比重が大きくなる欠点がある。 ま
た、線径の細い５ＬＪＳ３１６ステンレスｍ＊ｔを充填
すると、樹脂の粘度が上昇したり、樹脂組成物製造時の
機械的混練によってｍＭが切断され所定の導電性を得ら
れないため、１５重ω％１ス十充填しなければならｔ【
いという欠点があった。[Technical Preliminaries of the Invention and Problems thereof] Conventionally, when mixing and kneading a conductive filler with a synthetic resin to obtain a conductive resin, carbon powder, carbon fiber, metal powder,
Conductivity was obtained by using one or two types of metal lIH. However, in order to obtain high conductivity with a volume resistivity of 10-10 am or less, carbon powder of 1 and carbon 11 is used.
If a string is not enough and you are kneading metal powder,
There is a drawback that high conductivity cannot be obtained unless the resin is filled in an amount of 60% by weight or more. Furthermore, even with metal Ill, copper fibers and brass fibers with a large wire diameter need to be filled with 30 weight or more of 9%, which has the disadvantage of increasing specific gravity. In addition, if 5LJS316 stainless steel m*t with a small wire diameter is filled, the viscosity of the resin will increase, and the mm will be cut during mechanical kneading during the production of the resin composition, making it impossible to obtain the desired conductivity. %1 must be filled with t [
There was a drawback.
［発明の目的１
本発明の目的は、上記従来の欠点を解消するためになさ
れたもので、充ＩＩＷ吊が少なくて、優れた導電性を有
し、かつ比重が小ざく、低コストの導電性樹脂組成物を
捏供しＪ、つとするものである。[Objective of the Invention 1 The object of the present invention has been made to solve the above-mentioned conventional drawbacks, and is to provide a low-cost conductive material with less charging IIW, excellent conductivity, and small specific gravity. This method involves kneading a synthetic resin composition.
［発明の概要１
本発明者は、上記の目的を達成しようと鋭意検討を重ね
た結果、所定量のＳ （Ｊ Ｓ ３０４ステンレス繊雛
を充填材として使用すれば、優れた導電性を有し、低比
重で、かつ低コスＩ−の樹脂組成物が得られることを児
いだし、本発明を完成するに至ったものである。[Summary of the Invention 1 As a result of intensive studies to achieve the above object, the present inventor has discovered that if a predetermined amount of S (JS 304 stainless steel fiber is used as a filler material), it will have excellent conductivity. The inventors have discovered that a resin composition with low specific gravity and low cost I- can be obtained, and have completed the present invention.
すなわち本発明は、合成樹脂に、導電付充填材として５
ＵＳ３０４ステンレス繊維を１〜１０重量％含有するこ
とを特徴とする導電性樹脂組成物である。 そしてＳ
Ｕ Ｓ ３０４ステンレス繊維の化学成分が、炭素０．
０８％以下、１素１．００％以下、マンガン２．００％
以下、リン０．０４５％以下、硫黄０．０３０％以下、
ニッケル８．００へ、１０．５０％、クロム１８．００
〜２０．００％、残部が鉄のものである。That is, the present invention adds 5% to the synthetic resin as a conductive filler.
This is a conductive resin composition characterized by containing 1 to 10% by weight of US304 stainless steel fibers. and S
The chemical composition of US 304 stainless steel fiber is carbon 0.
08% or less, 1 element 1.00% or less, manganese 2.00%
Below, 0.045% or less of phosphorus, 0.030% or less of sulfur,
Nickel to 8.00, 10.50%, chromium 18.00
~20.00%, the balance being iron.
本発明に用いる合成樹脂としては、ポリスチレン樹脂、
ＡＢＳ樹脂、ポリカーボネー１へ樹脂、ポリブタジェン
樹脂、変性ＰＰＯ樹脂、ポリブチレンテレフタレート樹
脂、不飽和ポリエステル樹脂、フェノール樹脂、Ｔボキ
シ樹脂等が挙げられ、これらは単独もしくは２種以上混
合して使用する。The synthetic resin used in the present invention includes polystyrene resin,
Examples include ABS resin, polycarbonate resin, polybutadiene resin, modified PPO resin, polybutylene terephthalate resin, unsaturated polyester resin, phenol resin, and T-boxy resin, and these resins may be used alone or in combination of two or more.
本発明に用いる導電性充填材としてのステンレスｌＩＨ
は、５ＵＳ３０４と呼ばれる材質で、線径が６〜１５／
１ｍで１０００〜１５０００本束ねたものである。Stainless steel IIH as a conductive filler used in the present invention
is made of a material called 5US304 and has a wire diameter of 6 to 15/
It is a bundle of 1,000 to 15,000 pieces per meter.
線径が６μｍ未満であると樹脂の粘度が上界し、また１
５μｍを超えるとコスト高となり好ま１）くない。 Ｓ
Ｕ Ｓ ３０４ステンレス繊紺の化学成分は、炭素０
．０８％以下、硅素１．００％以下、マンガン２．００
％以下、リン０．０４５％以下、硫黄０．０３０％下、
ニッケル８．００〜１０．５０％、クロｌいｉｇ、ｏｏ
〜２０．００％、残部が鉄というもので、通常のＳ Ｕ
５３１６ステンレスよりクロムの含有崩が多く、ニッ
ケルの含有間が少なく、かつモリブデンを全（含まない
ものである。 従ってこのｌ１ＭはＳ Ｕ ５３１６の
１ｉＱＩｆｔにくらべて若干硬く、繊維の折れや切断が
少ないという性質がある。 また、Ｓ ＬＪ ５３１６
は非磁性であるがこの繊維は弱磁性である。If the wire diameter is less than 6 μm, the viscosity of the resin will reach an upper limit, or 1
If it exceeds 5 μm, the cost will be high and it is not preferable 1). S
The chemical composition of US 304 stainless steel navy blue is carbon 0.
．． 08% or less, silicon 1.00% or less, manganese 2.00%
% or less, phosphorus 0.045% or less, sulfur 0.030% or less,
Nickel 8.00-10.50%, chrome, oo
~20.00%, the balance being iron, normal S U
It contains more chromium than 5316 stainless steel, contains less nickel, and contains no molybdenum. Therefore, this l1M is slightly harder than S U 5316's 1iQlift, and has fewer fibers that break or break. There is a property that. Also, S LJ 5316
is non-magnetic, but this fiber is weakly magnetic.
Ｓ Ｕ Ｓ ３０４ステンレス繊維Ｍの充填割合は、樹
脂組成物に対して１〜１０重量％であることが好ましい
。 充ＩＩ４醋が１重石％未満の場合は、導電性に効果
がなく、１０千吊％を超えると比重が大きく、またコス
ト高となり好ましくない。 従って前記の範囲内に限定
される。The filling ratio of SUS 304 stainless steel fiber M is preferably 1 to 10% by weight based on the resin composition. If the amount of chlorine is less than 1%, there is no effect on conductivity, and if it exceeds 10,000%, the specific gravity becomes large and the cost increases, which is not preferable. Therefore, it is limited within the above range.
合成樹脂と５ｔＪＳ３０４ステンレス繊緒を用いて導電
性樹脂組成物を製造する方法は、通常行われるように、
合成樹脂とステンレス繊維を加熱混練して製造する。
本発明の導電性樹脂組成物は、必要に応じてまた本発明
に係る効果を損わない限りでその伯の添加剤を加えるこ
とができる。 こうして得られる導電ｆ生樹脂組成物は
電子機器等の電磁波シールド成形品として使用される。The method for producing a conductive resin composition using a synthetic resin and 5t JS304 stainless steel cord is usually carried out by
Manufactured by heating and kneading synthetic resin and stainless steel fiber.
The conductive resin composition of the present invention may contain additives as required and as long as the effects of the present invention are not impaired. The conductive raw resin composition thus obtained is used as an electromagnetic shielding molded product for electronic equipment and the like.
「発明の実施例１
次に本発明を実施例によって説明するが、本発明はこの
実施例によって限定されるものではない。Embodiment 1 of the Invention Next, the present invention will be explained with reference to Examples, but the present invention is not limited to these Examples.
実施例 １〜２
第１表に示した組成によって、線径８μｍの５ＵＳ３０
４ステンレスｌＩｉ雑６０００本束ねたものをポリエチ
レンテレフタレートで収束し１、長さ５ＩＩｌにカット
して、ポリスチレン樹脂と加熱混練して導電性樹脂組成
物を製造した。 これを用いて射出成形して成形品を得
、その体積抵抗率および比重を試験したのでその結果を
第１表に示した。Examples 1-2 5US30 with a wire diameter of 8 μm was prepared according to the composition shown in Table 1.
A bundle of 6,000 pieces of 4 stainless steel was bundled with polyethylene terephthalate, cut into lengths of 5 II, and heated and kneaded with polystyrene resin to produce a conductive resin composition. A molded article was obtained by injection molding using this, and its volume resistivity and specific gravity were tested. The results are shown in Table 1.
本発明の導電性樹脂組成物は体積抵抗率が小さく、かつ
比重も小さく本発明の効果が認められた。The conductive resin composition of the present invention had a low volume resistivity and a low specific gravity, and the effects of the present invention were observed.
比較例
第１表に示した組成によって、線径８ｔ１ｍの５ＵＳ３
１６ステンレス＄９９６０００本を束ねたものをポリエ
チレンテレフタレートで収束し、長さＳＲＩｍにカット
して実施例１〜２と同様にして導電性樹脂組成物を製造
した。 次いで実施例１〜２と同様にして導電性樹脂組
成物を用い射出成形によって成形品を得、実施例と同様
にして試験を行った。 その結果を第１表に示した。Comparative Example With the composition shown in Table 1, 5US3 with a wire diameter of 8t1m
A conductive resin composition was produced in the same manner as in Examples 1 and 2 by converging $996,000 pieces of No. 16 stainless steel with polyethylene terephthalate and cutting them into lengths SRIm. Next, a molded article was obtained by injection molding using the conductive resin composition in the same manner as in Examples 1 and 2, and tested in the same manner as in the Example. The results are shown in Table 1.
第１表
＊１ ：線径８Ｉ１ｍ、長さ５ｍｍの１ｌｌｆｔ「発明
の効果Ｊ
本発明の導電Ｍ樹脂組成物は、所定量の５ＵＳ３０４ス
テンレスｔｉＪＩｆｆを充填することによって、少ない
充填量にもかかわらず優れた導電性を有し、比重の小さ
い、低コストの成形品を（昇ることができる。 ステン
レス綴紐の充填量が少ないため樹脂の粘度上昇や比重の
増大がなくなり、また機械的混線による繊組の切断もな
くなり優れた導電性を示した。Table 1 *1: 1llft with a wire diameter of 8I1m and a length of 5mm "Effects of the invention J The conductive M resin composition of the present invention has excellent performance despite the small amount of filling by filling a predetermined amount of 5US304 stainless steel tiJIff. It has high conductivity, low specific gravity, and low-cost molded products.The small filling amount of stainless steel cord eliminates increases in resin viscosity and specific gravity, and prevents fiber assembly due to mechanical cross-wires. There was no cutting, and excellent conductivity was exhibited.
Claims (1)
ンレス繊維を１〜１０重量％含有することを特徴とする
導電性樹脂組成物。 ２ ＳＵＳ３０４ステンレス繊維の化学成分が、炭素０
．０８％以下、硅素１．００％以下、マンガン２．００
％以下、リン０．０４５％以下、硫黄０．０３０％以下
、ニッケル８．００〜１０．５０％、クロム１８．００
〜２０．００％、残部が鉄である特許請求の範囲第１項
記載の導電性樹脂組成物。[Scope of Claims] 1. A conductive resin composition comprising 1 to 10% by weight of SUS304 stainless fiber as a conductive filler in a synthetic resin. 2 The chemical composition of SUS304 stainless steel fiber is carbon 0.
．． 08% or less, silicon 1.00% or less, manganese 2.00%
% or less, phosphorus 0.045% or less, sulfur 0.030% or less, nickel 8.00-10.50%, chromium 18.00%
2. The conductive resin composition according to claim 1, wherein the conductive resin composition comprises iron in an amount of 20.00% and the remainder is iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13610285A JPS61296067A (en) | 1985-06-24 | 1985-06-24 | Electrically-conductive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13610285A JPS61296067A (en) | 1985-06-24 | 1985-06-24 | Electrically-conductive resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61296067A true JPS61296067A (en) | 1986-12-26 |
| JPH055264B2 JPH055264B2 (en) | 1993-01-21 |
Family
ID=15167320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13610285A Granted JPS61296067A (en) | 1985-06-24 | 1985-06-24 | Electrically-conductive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61296067A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6386755A (en) * | 1986-09-30 | 1988-04-18 | Mitsubishi Monsanto Chem Co | Electrically conductive thermoplastic resin composition |
| WO2002015302A3 (en) * | 2000-08-14 | 2003-01-23 | World Properties Inc | Thermosetting composition for electrochemical cell components and methods of making thereof |
| US7138203B2 (en) | 2001-01-19 | 2006-11-21 | World Properties, Inc. | Apparatus and method of manufacture of electrochemical cell components |
| WO2019088063A1 (en) * | 2017-10-30 | 2019-05-09 | ダイセルポリマー株式会社 | Electromagnetic wave shielding/absorbing molded article |
| JP2019161209A (en) * | 2017-10-30 | 2019-09-19 | ダイセルポリマー株式会社 | Electromagnetic wave shielding/absorbing molding |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3379000A (en) * | 1965-09-15 | 1968-04-23 | Roehr Prod Co Inc | Metal filaments suitable for textiles |
| JPS5159944A (en) * | 1974-11-20 | 1976-05-25 | Daidoh Plant Eng | |
| JPS58150203A (en) * | 1981-12-30 | 1983-09-06 | エヌ・ヴイ・ベカルト・エス・エイ | Prastic product with conductive fiber |
| JPS58222124A (en) * | 1982-06-18 | 1983-12-23 | Aron Kasei Co Ltd | Thermoplastic resin composition |
| JPS5941246A (en) * | 1982-07-22 | 1984-03-07 | ダ−ト・インダストリ−ス・インコ−ポレ−テツド | Fiber reinforced composite material |
| JPS6088063A (en) * | 1983-10-21 | 1985-05-17 | Seiko Epson Corp | Electrically conductive resin composition |
-
1985
- 1985-06-24 JP JP13610285A patent/JPS61296067A/en active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3379000A (en) * | 1965-09-15 | 1968-04-23 | Roehr Prod Co Inc | Metal filaments suitable for textiles |
| JPS5159944A (en) * | 1974-11-20 | 1976-05-25 | Daidoh Plant Eng | |
| JPS58150203A (en) * | 1981-12-30 | 1983-09-06 | エヌ・ヴイ・ベカルト・エス・エイ | Prastic product with conductive fiber |
| JPS58222124A (en) * | 1982-06-18 | 1983-12-23 | Aron Kasei Co Ltd | Thermoplastic resin composition |
| JPS5941246A (en) * | 1982-07-22 | 1984-03-07 | ダ−ト・インダストリ−ス・インコ−ポレ−テツド | Fiber reinforced composite material |
| JPS6088063A (en) * | 1983-10-21 | 1985-05-17 | Seiko Epson Corp | Electrically conductive resin composition |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6386755A (en) * | 1986-09-30 | 1988-04-18 | Mitsubishi Monsanto Chem Co | Electrically conductive thermoplastic resin composition |
| WO2002015302A3 (en) * | 2000-08-14 | 2003-01-23 | World Properties Inc | Thermosetting composition for electrochemical cell components and methods of making thereof |
| GB2383892A (en) * | 2000-08-14 | 2003-07-09 | World Properties Inc | Thermosetting composition for electrochemical cell components and methods of making thereof |
| GB2383892B (en) * | 2000-08-14 | 2004-10-27 | World Properties Inc | Thermosetting composition for electrochemical cell components and methods of making thereof |
| US6811917B2 (en) | 2000-08-14 | 2004-11-02 | World Properties, Inc. | Thermosetting composition for electrochemical cell components and methods of making thereof |
| US7138203B2 (en) | 2001-01-19 | 2006-11-21 | World Properties, Inc. | Apparatus and method of manufacture of electrochemical cell components |
| WO2019088063A1 (en) * | 2017-10-30 | 2019-05-09 | ダイセルポリマー株式会社 | Electromagnetic wave shielding/absorbing molded article |
| JP2019161209A (en) * | 2017-10-30 | 2019-09-19 | ダイセルポリマー株式会社 | Electromagnetic wave shielding/absorbing molding |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH055264B2 (en) | 1993-01-21 |
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