JPS61295691A - Flexible substrate - Google Patents
Flexible substrateInfo
- Publication number
- JPS61295691A JPS61295691A JP13693785A JP13693785A JPS61295691A JP S61295691 A JPS61295691 A JP S61295691A JP 13693785 A JP13693785 A JP 13693785A JP 13693785 A JP13693785 A JP 13693785A JP S61295691 A JPS61295691 A JP S61295691A
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- copper foil
- thickness
- conductive circuit
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、オーディオ、電卓および事務器などの用途
に用いて好適なフレキシブル基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a flexible substrate suitable for use in audio equipment, calculators, office equipment, and the like.
〈従来の技術）
従来のフレキシブル基板としては、フィルムベースにポ
リイミドやポリエステルの被覆を施したものが、主に使
用されていた。(Prior Art) As conventional flexible substrates, those in which a film base is coated with polyimide or polyester have been mainly used.
（発明が解決しようとする問題点）
しかしながらポリイミドは、高価である他、耐熱性の限
界が３２０℃位と低く、また吸湿によって寸法が変化し
やすいという問題があり、一方ポリエステルは、ポリイ
ミドよりは安価ではあるものの、耐熱性の制約からはん
だ付けができないというところに問題を残していた。(Problems to be Solved by the Invention) However, polyimide is expensive, has a low heat resistance limit of about 320°C, and has the problem that its dimensions change easily due to moisture absorption.On the other hand, polyester is more expensive than polyimide. Although it was inexpensive, it still had the problem of not being able to be soldered due to heat resistance limitations.
この発明は、上記の問題を有利に解決するもので、安価
でしかも該基板に要求される諸特性を兼ね備えるフレキ
シブル基板を与えることが、この発明の目的である。The present invention advantageously solves the above problems, and an object of the present invention is to provide a flexible substrate that is inexpensive and has various characteristics required of the substrate.
（問題点を解決するための手段）
さて発明者らは、上記の目的を達成すべく種々検討を重
ねたところ、フレキシブル基板の母板として金属薄板を
活用することにより、耐熱性、耐吸湿性および寸法安定
性については勿論、放熱性や強度の点でも、従来の有機
材ベースのフレキシブル基板よりもはるかに優れた特性
のものが得られ、しかも価格的にも安価であることを見
出した。(Means for Solving the Problems) In order to achieve the above object, the inventors have made various studies and found that by utilizing a thin metal plate as the mother plate of the flexible substrate, it has improved heat resistance and moisture absorption resistance. We have found that this material has far superior properties than conventional organic material-based flexible substrates in terms of not only dimensional stability but also heat dissipation and strength, and is also less expensive.
この発明は、上記の知見に立脚するものである。This invention is based on the above knowledge.
すなわちこの発明は、厚み： ０．１５ｍｍ以下の金
属薄板を母板とし、その片面又は両面に、絶縁層を兼ね
た接着剤を介して貼着した銅箔のフォト・エッチング処
理により形成した導電回路と、その上に重ねて被成した
絶縁被膜をそなえて成る、フレキシブル基板である。In other words, this invention provides a conductive circuit formed by photo-etching a copper foil that uses a thin metal plate with a thickness of 0.15 mm or less as a base plate and is attached to one or both sides of the base plate through an adhesive that also serves as an insulating layer. It is a flexible substrate consisting of an insulating film overlaid on top of the insulating film.
この発明において、フレキシブル基板の母板として用い
る金ａ蒲板としては、ステンレス鋼、銅。In this invention, the gold a-lined plate used as the mother plate of the flexible substrate is stainless steel or copper.
アルミニウム、鉄および種々の合金が有利に適合するが
、安価にしてさびにくいという意味からステンレス鋼た
とえば５ＵＳ３０４などが好適である。Aluminum, iron, and various alloys are advantageously suitable, but stainless steel, such as 5US304, is preferred because of its low cost and resistance to rust.
ここにかかる母板としての金ａＳ板は、曲げが自由にで
きるすなわちフレキシビリティに富む厚みとする必要が
あるが、通常の体心立方構造（ｂ。The gold aS plate used as the base plate here needs to have a thickness that allows it to bend freely, that is, has a high degree of flexibility, but it has a normal body-centered cubic structure (b.
Ｃ，Ｃ０）または面心立方構造（ｆ、ｃ、ｃ、）の金属
では、その厚みが０，１５ｓｎ以下であれば、所望のフ
レキシビリティを確保することができる。C, C0) or face-centered cubic structure (f, c, c,), the desired flexibility can be ensured if the thickness is 0.15 sn or less.
一方厚みの下限は、コスト及び取扱い易さの面から２０
μｌ程度とするのが好ましい。On the other hand, the lower limit of the thickness is 20 mm from the viewpoint of cost and ease of handling.
It is preferable to use about μl.
なおかかる金属薄板を所定の板厚にする方法としては、
従来公知の圧延法、直接製板法および電解法などいずれ
もが使用できる。The method for making such a thin metal plate to a predetermined thickness is as follows:
Any conventionally known rolling method, direct plate manufacturing method, electrolytic method, etc. can be used.
次に絶縁層を兼ねた接着剤どしては、液状又はドライフ
ィルム状のポリエステル系、フェノール系、エポキシ系
およびポリエチレン系の樹脂などが有利に適合し、これ
らの中から電気絶縁性、可どう性、耐熱性および耐薬品
性に優れ、しかも銅箔及び母板金属との接着性に優れた
ものを選べばよい。Next, as adhesives that also serve as an insulating layer, liquid or dry film polyester, phenol, epoxy, and polyethylene resins are advantageously suitable. A material that has excellent properties, heat resistance, and chemical resistance, as well as excellent adhesion to the copper foil and base metal may be selected.
銅箔は、目的とするフレキシブル基板の用途に応じ、電
解鋼箔および圧延銅箔の３５μｍ、１８μｌ。The copper foil was 35 μm and 18 μl of electrolytic steel foil or rolled copper foil, depending on the intended use of the flexible board.
１２μｌの厚みのものの中から適切なものを選択使用す
る。Select and use an appropriate one from among those with a thickness of 12 μl.
このようにして銅箔を母板に貼着したのち、導電回路を
形成するわけであるが、この形成に当っては、フォト・
エッチング法すなわちフォトマスクによって回路パター
ンを印刷したのちエツチングによって不要部分を除去す
る処理を活用する。After attaching the copper foil to the motherboard in this way, a conductive circuit is formed.
An etching method is utilized, in which a circuit pattern is printed using a photomask and then unnecessary portions are removed by etching.
かくして形成された導電回路の保護用絶縁被膜としては
、フィルムもしくはンルダレジストインクのカバーレイ
材料が好適である。As the protective insulating coating for the conductive circuit thus formed, a coverlay material such as a film or a resist ink is suitable.
なおかかるフレキシブル基板の用途や基板の部位によっ
ては、他の回路・電子部品と母板金属とが接触してショ
ートするのを防ぐために、母板金属をカバーレイ材料で
被覆する必要がある場合もある。Depending on the use of the flexible board and the location of the board, it may be necessary to cover the base metal with a coverlay material to prevent short circuits due to contact between other circuits/electronic components and the base metal. be.
（作 用）
フレキシブル基板の母板として金属薄板を活用すること
によって、耐熱性、耐吸湿性１寸法安定性、放熱性およ
び強度の効果的な向上を図り得る。(Function) By utilizing a metal thin plate as a base plate of a flexible substrate, it is possible to effectively improve heat resistance, moisture absorption resistance, one-dimensional stability, heat dissipation performance, and strength.
（実施例）
及ｌｉ１
厚み：３０μｍのステンレス薄帯の片面に、エポキシ系
接着剤を介して厚み：１８μｍの銅箔を、１００℃、２
０分間、 ２０ｋｇｆ ／ ｃ！の成形加熱・加圧条件
下に貼り付けた。ついでフォト・エッチング処理によっ
て所定の回路パターンの導電回路を形成したのち、その
上にポリエステルのカバーレイを施した。(Example) and li1 A copper foil with a thickness of 18 μm was placed on one side of a stainless steel ribbon with a thickness of 30 μm via an epoxy adhesive at 100°C for 2 hours.
0 minutes, 20kgf/c! It was pasted under the following molding heating and pressurizing conditions. Next, a conductive circuit with a predetermined circuit pattern was formed by photo-etching, and then a polyester coverlay was applied thereon.
第１図に、かくして得られたフレキシブル基板を模式で
示す。図中番号１はステンレス薄帯からなる金属薄板、
２は絶縁性接着剤、３は導電回路、そして４は導電回路
保護用の絶縁被膜である。FIG. 1 schematically shows the flexible substrate thus obtained. Number 1 in the figure is a thin metal plate made of stainless steel ribbon.
2 is an insulating adhesive, 3 is a conductive circuit, and 4 is an insulating coating for protecting the conductive circuit.
このフレキシブル基板は、十分に満足のいくフレキシビ
リティをそなえ、またはんだ耐熱性も１８０秒以上と長
く、ざらに銅箔のはく離もなく密着性にも優れていた。This flexible board had a sufficiently satisfactory flexibility, had a long soldering heat resistance of 180 seconds or more, and had excellent adhesion without any rough peeling of the copper foil.
！
亜鉛めっきを施した厚み１００μｍの鉄板の両面に、フ
ェノール系樹脂を塗布し、その上に３５μｌ厚の銅箔を
重ねてから熱硬化させて両面銅張りとし、ついでフォ］
〜・エツチング処理によって導電回路を形成したのち、
その上にガラスエポキシのカバーレイを施した。! Phenolic resin was applied to both sides of a galvanized iron plate with a thickness of 100 μm, and then a 35 μl thick copper foil was layered on top of it, and then heat cured to make both sides copper-clad.
～・After forming a conductive circuit by etching,
A glass epoxy coverlay was applied on top of that.
第２図に、かくして得られたフレキシブル基板を模式で
示したが、かかるフレキシブル基板は、フレキシビリテ
ィに冨むのはいうまでもなく、はんだ耐熱性も１８０秒
以上と長く、しかも両面とも銅箔のはく離はなく、密着
性にも優れていた。FIG. 2 schematically shows the flexible board thus obtained. It goes without saying that such a flexible board has great flexibility, and also has a long soldering heat resistance of 180 seconds or more, and the copper foil on both sides does not peel off. There was no problem, and the adhesion was also excellent.
（発明の効果）
かくしてこの発明によれば、フレキシビリティに富むの
みならず、耐熱性や寸法安定性などの諸特性に優れるフ
レキシブル基板を、安価に得ることができる。(Effects of the Invention) Thus, according to the present invention, a flexible substrate that is not only highly flexible but also has excellent properties such as heat resistance and dimensional stability can be obtained at a low cost.
第１図および第２図はそれぞれ、この発明に従う片面お
よび両面銅張りフレキシブル基板の模式％式％
３・・・銅箔からなる導電回路
４・・・導電回路保護用絶縁被膜
第１図1 and 2 are schematic percentage formulas of single-sided and double-sided copper-clad flexible boards according to the present invention, respectively. 3...Conductive circuit made of copper foil 4...Insulating coating for protecting the conductive circuit
Claims (1)
の片面又は両面に、絶縁層を兼ねた接着剤を介して貼着
した銅箔のフォト・エッチング処理により形成した導電
回路と、その上に重ねて被成した導電回路保護用の絶縁
被膜をそなえて成る、フレキシブル基板。1. A conductive circuit formed by photo-etching a copper foil attached to one or both sides of a thin metal plate with a thickness of 0.15 mm or less using an adhesive that also serves as an insulating layer, and A flexible substrate with an overlying insulating film for protecting conductive circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13693785A JPS61295691A (en) | 1985-06-25 | 1985-06-25 | Flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13693785A JPS61295691A (en) | 1985-06-25 | 1985-06-25 | Flexible substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61295691A true JPS61295691A (en) | 1986-12-26 |
Family
ID=15187026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13693785A Pending JPS61295691A (en) | 1985-06-25 | 1985-06-25 | Flexible substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61295691A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01130581U (en) * | 1988-03-01 | 1989-09-05 | ||
| JPH02164091A (en) * | 1988-12-19 | 1990-06-25 | Fuji Photo Film Co Ltd | Printed wiring board |
| JP2002359448A (en) * | 2001-06-01 | 2002-12-13 | Nec Corp | Electronic circuit mounting structure and manufacturing method therefor |
| WO2006112478A1 (en) * | 2005-04-19 | 2006-10-26 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal base circuit board, led, and led light source unit |
| JP2021097121A (en) * | 2019-12-17 | 2021-06-24 | 日東電工株式会社 | Manufacturing method of double-sided wiring circuit board and double-sided wiring circuit board |
-
1985
- 1985-06-25 JP JP13693785A patent/JPS61295691A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01130581U (en) * | 1988-03-01 | 1989-09-05 | ||
| JPH02164091A (en) * | 1988-12-19 | 1990-06-25 | Fuji Photo Film Co Ltd | Printed wiring board |
| JP2002359448A (en) * | 2001-06-01 | 2002-12-13 | Nec Corp | Electronic circuit mounting structure and manufacturing method therefor |
| WO2006112478A1 (en) * | 2005-04-19 | 2006-10-26 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal base circuit board, led, and led light source unit |
| JP2021097121A (en) * | 2019-12-17 | 2021-06-24 | 日東電工株式会社 | Manufacturing method of double-sided wiring circuit board and double-sided wiring circuit board |
| WO2021124747A1 (en) * | 2019-12-17 | 2021-06-24 | 日東電工株式会社 | Manufacturing method for double-sided wiring circuit board and double-sided wiring circuit board |
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