JPS6039883A - Flexible circuit board - Google Patents
Flexible circuit boardInfo
- Publication number
- JPS6039883A JPS6039883A JP14833183A JP14833183A JPS6039883A JP S6039883 A JPS6039883 A JP S6039883A JP 14833183 A JP14833183 A JP 14833183A JP 14833183 A JP14833183 A JP 14833183A JP S6039883 A JPS6039883 A JP S6039883A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- circuit pattern
- wiring board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は最近特に応用分野の拡大がなされている、電子
機器に利用される可撓性配線基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a flexible wiring board used in electronic equipment, the field of which has recently been particularly expanded.
従来例の構成とその問題点
近年、可撓性プリント基板は精密電−ｒ−機器分野で部
品の小型化、精密化、複雑化と相まって多く使用されて
いる。Conventional configurations and their problems In recent years, flexible printed circuit boards have come into widespread use in the field of precision electrical equipment as parts become smaller, more precise, and more complex.
以下に従来の可撓性プリント基板について説明する。第
１図は従来の構成を示すものであり可撓性を有するベー
ス基材１Ｆｉポリイミド樹脂やポリエステル樹脂からな
る高分子材料のフィルム材が用いられ、接着層２を介し
て金属銅箔３を積属して１枚の可撓性プリント基板を形
成する。そして第２図に示すように、フォトエツチング
工程を経過して必要な電気回路パター７４を形成する。A conventional flexible printed circuit board will be explained below. FIG. 1 shows a conventional configuration, in which a flexible base material 1Fi is made of a polymeric film material made of polyimide resin or polyester resin, and a metal copper foil 3 is laminated via an adhesive layer 2. together to form one flexible printed circuit board. Then, as shown in FIG. 2, a necessary electric circuit pattern 74 is formed through a photo-etching process.
以上のように構成された従来の可撓性プリント基板は、
可撓性にすぐれているところから多くの回路パターン−
１７１′同時に結線され、捷だ屈曲部分に使用しても高
い信頼性と共に小型化が実現するため多くの分野に使用
されてきている。The conventional flexible printed circuit board configured as described above is
Many circuit patterns are available due to its excellent flexibility.
171' is connected at the same time, and it has been used in many fields because it achieves high reliability and miniaturization even when used in twisted and bent parts.
しかしながら」二記のような構成では、ベース基板が、
ポリイミド樹脂やポリエステル樹脂の高分子材料よりな
る熱伝導率の悪いフィルム材質により形成されているた
めに、電気回路パターン４に電流が流れて発熱した場合
に、放熱効果が悪いため、あまり大きな電流が流れると
回路の切断や剥離が発生する欠点があり、その使用範囲
に限界があるという問題点があった。However, in the configuration described in ``2'', the base board is
Because it is made of a film material with poor thermal conductivity, such as a polymeric material such as polyimide resin or polyester resin, when electric current flows through the electric circuit pattern 4 and generates heat, the heat dissipation effect is poor, so it is difficult to carry too much current. It has the disadvantage that if it flows, the circuit will be cut or peeled off, and there is a problem that its range of use is limited.
発明の目的
本発明は上記従来の問題点を解消するもので、従来のも
のよりも大電流を通電することができ、放熱効果が良く
、かつシールド効果を兼ね備えた安価な可撓性配線基板
を提供することｆｆ：１．４的とする。Purpose of the Invention The present invention solves the above-mentioned conventional problems, and provides an inexpensive flexible wiring board that can carry a larger current than the conventional one, has a good heat dissipation effect, and has a shielding effect. Provide ff: 1.4.
発明の構成
本発明はベース基材に熱伝導率が高い金属音用い、電気
的絶縁層と接着層を介して金属銅箔を回路パターンとし
た可撓性配線基板であり、放熱効果とシールド効果を兼
ね備えることのできるものである。Structure of the Invention The present invention is a flexible wiring board that uses a metal foil with high thermal conductivity as a base material and has a circuit pattern of metallic copper foil through an electrical insulating layer and an adhesive layer, and has a heat dissipation effect and a shielding effect. It is possible to have both.
実施例の説明
第３図は本発明の第１の実施例における１拝撓ｆ／：Ｌ
配線基板を示すものである。第３図においてアルミニウ
ム金属箔よりなるベース基材６の表面にアルマイト処理
を施すことにより電気的絶縁層６を構成し、さらに接着
層７を介して銅箔８を積層構造として構成する。そして
回路パターン全フ４トエッチングにより形成する際に金
属銅箔８のみを−フォトエツチングするために接着層７
’４″レジストとし、必要に応じて裏面にレジスト層９
を設ける。DESCRIPTION OF THE EMBODIMENT FIG. 3 shows the first embodiment of the present invention.
It shows a wiring board. In FIG. 3, an electrically insulating layer 6 is formed by subjecting the surface of a base substrate 6 made of aluminum metal foil to an alumite treatment, and further a copper foil 8 is formed in a laminated structure via an adhesive layer 7. Then, in order to photo-etch only the metal copper foil 8 when forming the circuit pattern by full-length etching, an adhesive layer 7 is applied.
'4'' resist, and resist layer 9 on the back side if necessary.
will be established.
なお、上記実施例によれば片面にのみ回路パターンを構
成したが、同様にベース基板の両面に回路パターンを構
成した両面パターン’ｊ’ ；／ｒｊ ｊ’、ｆＩ（ｌ
ｆ’ｌ Ｊ（’、１板を作成することもできる。According to the above embodiment, the circuit pattern was formed only on one side, but a double-sided pattern 'j';/rjj', fI (l
f'l J(', one board can also be created.
本発明の他の応用として、−１−記実施例と回灯の構成
にて、回路パターンをコイル状にり、ｆｒン’＋Ｊント
コイルを実現したり、また肉厚のアルミニラｌ、基板を
用いて可撓性の小さい配線基板を実現することができる
ことは言うまでもな°・′・−発明の効果
本発明はベース基板にアルミニウム金属箔を用いその表
面にアルマイｉ・処理を施しているため、表面の電気的
絶縁性が維持される。一方熱伝導率は従来の高分子（′
Ａ＊」のベース基材のものに比べてはるかに高く、回路
パターンに大電流が流れ発熱があっても、このアルミニ
ウム金属ベースが高い放熱効果を示し、より高電流まで
使用することができる。同時に回路パターンに対しアル
ミニウム金属ベースは電気的シールド効果を発揮するた
め、シールドの必要な回路部分に採用することにより、
外部の悪影響を受けないようにすることができる。As another application of the present invention, in the embodiment described in -1- and the configuration of the turntable, the circuit pattern can be made into a coil shape to realize a fr' + J'nt coil, or a thick aluminum plate or board can be used. Needless to say, it is possible to realize a wiring board with low flexibility by using aluminum metal foil for the base board. Electrical insulation is maintained. On the other hand, the thermal conductivity of conventional polymers (′
Even if a large current flows through the circuit pattern and generates heat, this aluminum metal base exhibits a high heat dissipation effect and can be used up to higher currents. At the same time, the aluminum metal base exhibits an electrical shielding effect on the circuit pattern, so by adopting it for circuit parts that require shielding,
It is possible to avoid being influenced by external influences.
また可撓性については、アルミニウム金属箔の有する可
撓性が十分発揮される。したがって本発明によれば、総
合的に従来の可撓性プリント基板に比べて、低コストで
耐電流性が高く、シールド効果を兼ね備えた可撓性配線
基板を実現することができる。In addition, regarding flexibility, the flexibility of the aluminum metal foil is fully exhibited. Therefore, according to the present invention, it is possible to realize a flexible wiring board that is lower in cost, has higher current resistance, and has a shielding effect than conventional flexible printed circuit boards.
第１図は従来例の加工前の構成図、第２図は従来例の加
工後の構成図、第３図は本発明の第１の実施例における
可撓性配線基板の構成図である。
５・・・・・・アルミニウム金属箔よりなるベース基材
、６・・・・・・アルマイト処理による電気的絶縁層、
７・・・・・・接着層、８・・・・・・銅箔、９・・・
・・・レジスト層。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第３図FIG. 1 is a configuration diagram of a conventional example before processing, FIG. 2 is a configuration diagram of a conventional example after processing, and FIG. 3 is a configuration diagram of a flexible wiring board according to a first embodiment of the present invention. 5...Base material made of aluminum metal foil, 6...Electrical insulating layer formed by alumite treatment,
7... Adhesive layer, 8... Copper foil, 9...
...Resist layer. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 3
Claims (1)
ターンを形成し、前記アルミニウム金属箔の少くとも一
面にアルマイト処理を施し電気的絶縁層を形成したこと
を特徴とする可撓性配線基板。1. A flexible wiring board, characterized in that a circuit pattern of metallic copper foil is formed on an aluminum metallic foil via an adhesive layer, and at least one surface of the aluminum metallic foil is subjected to alumite treatment to form an electrically insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14833183A JPS6039883A (en) | 1983-08-12 | 1983-08-12 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14833183A JPS6039883A (en) | 1983-08-12 | 1983-08-12 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6039883A true JPS6039883A (en) | 1985-03-01 |
Family
ID=15450382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14833183A Pending JPS6039883A (en) | 1983-08-12 | 1983-08-12 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6039883A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61248493A (en) * | 1985-04-25 | 1986-11-05 | 日本メクトロン株式会社 | Conducting construction of flexible metal base circuit board |
| JPH01249451A (en) * | 1988-03-31 | 1989-10-04 | Matsushita Kogei Kk | Gauze frame used for screen printing |
| JPH0219570U (en) * | 1988-07-26 | 1990-02-08 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5750872B2 (en) * | 1975-03-12 | 1982-10-29 | ||
| JPS5755973B2 (en) * | 1977-05-11 | 1982-11-27 |
-
1983
- 1983-08-12 JP JP14833183A patent/JPS6039883A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5750872B2 (en) * | 1975-03-12 | 1982-10-29 | ||
| JPS5755973B2 (en) * | 1977-05-11 | 1982-11-27 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61248493A (en) * | 1985-04-25 | 1986-11-05 | 日本メクトロン株式会社 | Conducting construction of flexible metal base circuit board |
| JPH01249451A (en) * | 1988-03-31 | 1989-10-04 | Matsushita Kogei Kk | Gauze frame used for screen printing |
| JPH0219570U (en) * | 1988-07-26 | 1990-02-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3330387B2 (en) | Flexible multilayer circuit wiring board | |
| JPH06349339A (en) | Anisotropic conductive film | |
| JPH0685461B2 (en) | Metal core printed wiring board | |
| JPS6039883A (en) | Flexible circuit board | |
| JPS60257191A (en) | Printed circuit board | |
| JPH0529490A (en) | Circuit board for mounting semiconductor | |
| JPS62125691A (en) | Electric circuit forming substrate | |
| JP2634592B2 (en) | Circuit board with low resistance and method of manufacturing the same | |
| JPS61123197A (en) | Manufacture of printed wiring board | |
| JPH05327156A (en) | Printed-circuit board | |
| JPS6260286A (en) | Printed circuit board | |
| JPS60236278A (en) | Plate for circuit | |
| JPS6076186A (en) | Printed circuit board | |
| JPS60165790A (en) | Method of producing electronic circuit board | |
| JPS6293993A (en) | Electronic circuit device and mounting of the same | |
| JPS5848496A (en) | Miniature electronic circuit part | |
| JPS59201488A (en) | Printed board | |
| JPH01152687A (en) | Etched circuit wiring board | |
| JPS58132990A (en) | Method of producing printed circuit board | |
| JPH069167U (en) | Flexible circuit board | |
| JPS6221297A (en) | Manufacture of printed wiring board | |
| JPS6396990A (en) | High radiation printed board | |
| JPS6260287A (en) | Printed circuit board | |
| JPH0715136A (en) | Manufacture of printed wiring board | |
| JPS6158289A (en) | Printed circuit board |