JPS6129357A - Treatment by ultraviolet rays - Google Patents

Treatment by ultraviolet rays

Info

Publication number
JPS6129357A
JPS6129357A JP14935884A JP14935884A JPS6129357A JP S6129357 A JPS6129357 A JP S6129357A JP 14935884 A JP14935884 A JP 14935884A JP 14935884 A JP14935884 A JP 14935884A JP S6129357 A JPS6129357 A JP S6129357A
Authority
JP
Japan
Prior art keywords
ultraviolet
treated
temperature
ultraviolet rays
decomposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14935884A
Other languages
Japanese (ja)
Other versions
JPS6253190B2 (en
Inventor
晋次 杉岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Ushio Inc
Original Assignee
Ushio Denki KK
Ushio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK, Ushio Inc filed Critical Ushio Denki KK
Priority to JP14935884A priority Critical patent/JPS6129357A/en
Publication of JPS6129357A publication Critical patent/JPS6129357A/en
Publication of JPS6253190B2 publication Critical patent/JPS6253190B2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は紫外線処理方法、例えばUV10.クリーニン
グに関するもの□である。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides an ultraviolet treatment method, for example UV10. This is about cleaning.

紫外線ランプなどの据外線源よシ発生する紫外線を利用
して有機汚染物を分解洗浄などの処理をすることが行わ
れているが、この紫外線源、例えば低圧水銀ランプを点
灯すると、主として波長が254nmの水銀共鳴線の紫
外線が外部に放出され、従として波長が185nmの紫
外線が、更には他の波長のものがわずかに放出される。
Ultraviolet light emitted from stationary sources such as ultraviolet lamps is used to decompose and clean organic contaminants. Ultraviolet rays with a mercury resonance line of 254 nm are emitted to the outside, followed by ultraviolet rays with a wavelength of 185 nm, and a small amount of ultraviolet rays with other wavelengths are also emitted.

そして、波長185nmの紫外線によってオゾンが生成
し、次にこのオゾンが波長254nmにょシ分解されて
発生基の酸素が生゛成し、この発生基の酸素によって有
機汚染物が分解され、ガス状態で飛散することが知られ
ている。また、N、Oは波長185nmにより分解され
て発生基の酸素が生成し、オゾンと同様に有機汚染物を
分解し、ガス状態で飛散させる。
Then, ozone is generated by ultraviolet rays with a wavelength of 185 nm, and then this ozone is decomposed with a wavelength of 254 nm to generate oxygen, which is a generating group. Organic pollutants are decomposed by this oxygen, and organic pollutants are decomposed into a gaseous state. It is known to scatter. Furthermore, N and O are decomposed at a wavelength of 185 nm to generate oxygen as a generating group, which decomposes organic contaminants in the same way as ozone and scatters them in a gaseous state.

ところで従来の方法に、紫外線ランプが上面に配設され
た照射室内の下方に被処理体を配置し、照射室内に酸素
などの処理用ガスを含むガスを供給しながら、被処理体
に紫外線を照射していた。
By the way, in the conventional method, the object to be processed is placed below an irradiation chamber with an ultraviolet lamp disposed on the upper surface, and ultraviolet rays are applied to the object while a gas containing a processing gas such as oxygen is supplied into the irradiation chamber. It was irradiating.

そして、紫外線ランプと被処理体との距離が小さいと、
被処理体表面の光の照射分布が不均一にな9、有機汚染
物の分解に局部的な偏シが生じるなどの問題があるため
、紫外線ランプと被処理体との距離はある程度大きくし
なければならない。従って、照射室の容積が大きくなる
が、このため、照射室内の昇温は少なく、更にに、ラン
プよシ発生した紫外線は被処理体に到達するまでに酸素
および発生したオゾンに吸収されて減衰し、洗浄などの
処理速度を遅くする原因となっていた。また、処理速度
を高く保持するためにに、大きな容積の照射室内に多量
の酸素などの処理用ガスを供給する必要があり、しかも
この多量に供給された処理用ガスの極〈一部が有機汚染
物の分解に寄与するのみであって、大部分の処理用ガス
は無駄に照射室外に排気され、その効率は著しく悪かっ
た。
And if the distance between the ultraviolet lamp and the object to be treated is small,
There are problems such as uneven distribution of light irradiation on the surface of the object9 and local unevenness in the decomposition of organic contaminants, so the distance between the ultraviolet lamp and the object to be treated must be increased to some extent. Must be. Therefore, although the volume of the irradiation chamber becomes larger, the temperature rise inside the irradiation chamber is small, and furthermore, the ultraviolet rays generated by the lamp are absorbed by oxygen and generated ozone and attenuated by the time they reach the object to be treated. However, this was a cause of slowing down processing speeds such as cleaning. In addition, in order to maintain a high processing speed, it is necessary to supply a large amount of processing gas such as oxygen into the large volume irradiation chamber. Most of the processing gas was wastefully exhausted outside the irradiation chamber, only contributing to the decomposition of pollutants, and its efficiency was extremely low.

そこで本発明に、これらの事情にかんがみてなされたも
のであって、洗浄などの処理速度が早く、もって紫外線
強度や処理用ガスの供給量を少なくすることが可能とな
る紫外線処理方法を提供することを目的とする。そして
、その構成に、紫外線源の光によりオゾンもしltN、
Oを分解し、これにより生成される発生基の酸素により
被処理体の表面に付着する有機汚染物などを分解して洗
浄などの処理を行うに際し、紫外線源と被処理体との 
    、間を石英ガラスやエヤーカーテンなどで紫外
線が透過可能な状態で区画し、被処理体の近傍にのみ処
理用ガスを供給し、紫外線源を含む空間は真空や紫外線
を吸収しないガス雰囲気とし、かつ、被処理体の温度を
赤外線や抵抗加熱ヒーターなど忙よシ適温に調整し、有
機汚染物な−どの分解を促進することを特徴とする。
Therefore, the present invention has been made in view of these circumstances, and provides an ultraviolet treatment method that allows for faster processing speeds such as cleaning, thereby making it possible to reduce the intensity of ultraviolet rays and the amount of supply of processing gas. The purpose is to In addition, if ozone is added to the composition by the light of the ultraviolet source, ltN,
When O is decomposed and organic contaminants adhering to the surface of the object to be treated are decomposed by oxygen, which is a generated group, and cleaning is performed, the ultraviolet ray source and the object to be treated are separated.
The space between the two is divided with quartz glass or air curtains so that ultraviolet rays can pass through, the processing gas is supplied only in the vicinity of the object to be processed, and the space containing the ultraviolet source is kept in a vacuum or in a gas atmosphere that does not absorb ultraviolet rays. In addition, the temperature of the object to be treated is adjusted to an appropriate temperature using infrared rays or a resistance heater to promote the decomposition of organic contaminants.

以下に図面に示す実施例に基いて本発明を具体的に説明
する。
The present invention will be specifically described below based on embodiments shown in the drawings.

第1図は本発明の実施例に使用される装置の断面図を示
すが、照射室1は図示路の装置箱に内蔵されて二重構造
をなし、発生したオゾンが外部に漏洩しないようになっ
ている。照射室1内の上方には紫外線ランプ2としてU
字状の200W低圧水銀灯が2本配設され、その背部に
はミラー3が配置され、紫外線ランプ2の光は下方に向
けて照射される。そして、照射室1の天井上面には冷却
水路4が固着され、水冷されている。被処理体5は直径
約10cInのウェハーであって、底面に固着された支
持具6によって支持されているが、紫外線ランプ2から
被処理体5までの距離は10mである。そして、被処理
体5の下方にはハロゲンランプ8とミラー9からなる温
度調節装置が設けられているが、このハロゲンランプ8
は最大消費電力が150Wであって、これから照射され
る赤外線によって被処理体5の温度を常温から200 
C近傍までの範囲で調整できるようになっている。
FIG. 1 shows a cross-sectional view of the equipment used in the embodiment of the present invention. The irradiation chamber 1 is built into the equipment box along the path shown in the diagram and has a double structure to prevent the generated ozone from leaking outside. It has become. In the upper part of the irradiation chamber 1, there is a U as an ultraviolet lamp 2.
Two letter-shaped 200W low-pressure mercury lamps are arranged, a mirror 3 is arranged behind them, and the light from the ultraviolet lamp 2 is directed downward. A cooling water channel 4 is fixed to the upper surface of the ceiling of the irradiation chamber 1 and is water-cooled. The object to be processed 5 is a wafer with a diameter of about 10 cIn, and is supported by a support 6 fixed to the bottom surface, and the distance from the ultraviolet lamp 2 to the object to be processed 5 is 10 m. A temperature control device consisting of a halogen lamp 8 and a mirror 9 is provided below the object to be processed 5.
The maximum power consumption is 150W, and the temperature of the object to be processed 5 can be increased from room temperature to 200W by the infrared rays irradiated from this.
It can be adjusted within a range up to around C.

次に、被処理体5の上方2anの位置には石英ガラス板
7が配設されており、被処理体5と紫外線ランプ2とを
区画しているが、被処理体5を含む空間は紫外線ランプ
2を含む空間よりずっと小さい。石英ガラス板7の下方
にに、#素などの処理用ガスを含むガスを供給する吸入
孔11と、内部のガスを分解された汚染物とともに排出
する排気孔12が設けられているが、排気孔12より吸
引されたガスはオゾン分解室で処理された後に大気中に
放出される。そして、石英ガラース板7の上方であって
、紫外線ランプ2を含む空間にに、減圧装置に接続され
た減圧孔13と、窒素ガスのように不活性であって紫外
線を吸収しないガスの注入孔14が設けられている。も
っとも、注入孔14は設けずに、紫外線ランプ2を含む
空間を真空にすることにより、紫外線がこの空間内で吸
収されないようにしてもよい。
Next, a quartz glass plate 7 is arranged at a position 2 an above the object to be processed 5, and partitions the object to be processed 5 and the ultraviolet lamp 2. Much smaller than the space containing lamp 2. Below the quartz glass plate 7, there are provided an inlet hole 11 for supplying a gas containing a processing gas such as # element, and an exhaust hole 12 for discharging the internal gas together with decomposed contaminants. The gas sucked through the holes 12 is treated in an ozone decomposition chamber and then released into the atmosphere. Above the quartz glass plate 7, in the space containing the ultraviolet lamp 2, there is a pressure reduction hole 13 connected to a pressure reduction device and an injection hole for an inert gas that does not absorb ultraviolet light, such as nitrogen gas. 14 are provided. However, the injection hole 14 may not be provided and the space containing the ultraviolet lamp 2 may be evacuated so that ultraviolet rays are not absorbed within this space.

第2図に、他の実施例を示すが、温度調節装置はハロゲ
ンランプ8に代って抵抗加熱ヒーター10が配設され、
これの輻射熱によってハロゲンランプ8の場合と同様に
被処理体5の温度を調節できるようになっている。そし
て、石英ガラス板7に代ってエヤーカーテンが配役され
ており、第1図の石英ガラス板7に対応する位置に窒素
カスを流出するノズル81とこれを吸引して受入れる吸
引孔82とが対向して設けられている。従って、被処理
体5の少し上方には窒素ガスのエヤーカーテンが張られ
、紫外線はこれを透過するが、処理用ガスはこれを超え
て上方には拡散しないようになっている。
FIG. 2 shows another embodiment in which the temperature control device is provided with a resistance heater 10 instead of the halogen lamp 8.
The temperature of the object to be processed 5 can be adjusted by the radiant heat of the lamp, as in the case of the halogen lamp 8. An air curtain is provided in place of the quartz glass plate 7, and a nozzle 81 for discharging nitrogen scum and a suction hole 82 for sucking in the nitrogen scum are placed at a position corresponding to the quartz glass plate 7 in FIG. They are placed facing each other. Therefore, an air curtain of nitrogen gas is placed slightly above the object to be processed 5, and the ultraviolet rays are transmitted through this, but the processing gas is not diffused upward beyond this.

しかして、被処理体5の近傍に処理用ガスが供給され、
紫外線ランプ2を含む空間が減圧され、もしくは更に窒
素ガスが注入されるとともにハロゲンランプ8もしくは
抵抗加熱ヒーター10に通電される。そして、紫外線ラ
ンプ2が点灯されると紫外線は被処理体5の表面に照射
され、表面に付着していた有機汚染物は分解されて洗浄
などの処理がなされる。
Thus, the processing gas is supplied near the object to be processed 5,
The space containing the ultraviolet lamp 2 is depressurized or nitrogen gas is further injected, and the halogen lamp 8 or resistance heater 10 is energized. Then, when the ultraviolet lamp 2 is turned on, the surface of the object to be processed 5 is irradiated with ultraviolet rays, and organic contaminants adhering to the surface are decomposed and processing such as cleaning is performed.

ここで、被処理体5が温度調節装置により適温に調節さ
れているので、有機汚染物の分解は著しく促進はれる。
Here, since the temperature of the object to be processed 5 is adjusted to an appropriate temperature by the temperature control device, the decomposition of the organic contaminants is significantly accelerated.

因みに、従来例の適温に調節しないときに、350W高
出力低圧水銀灯を2本点灯して2分間で処理が完了する
ような汚染度のものを、本実施例で70℃に加熱すると
、2本の200W低圧水銀灯のうち1本のみ点灯し、同
じ2分間     Iで処理が完了した。従って、紫外
線強度に、70℃に加熱することによって1/も以下と
することができる。次に、被′処理体5の加熱温度を変
化させて処理時間への影響を詞べた結果を第3図に示す
By the way, if the contamination level is such that the treatment can be completed in 2 minutes by turning on two 350W high output low pressure mercury lamps when the temperature is not adjusted to the appropriate temperature in the conventional example, if heated to 70°C in this example, two 350W high output low pressure mercury lamps will be turned on. Only one of the 200W low-pressure mercury lamps was turned on, and the treatment was completed in the same 2 minutes. Therefore, the intensity of ultraviolet rays can be reduced to less than 1/1 by heating to 70°C. Next, FIG. 3 shows the results of varying the heating temperature of the object to be processed 5 and its effect on the processing time.

ここで被処理体5はガラス板であり、純水の接触角によ
り清浄度の判定を行ない、a = 10 deg、をも
って処理の完了とした。これから明らかなように、加熱
温度を上げると処理時間は反比例して短かくなり、12
0〜150℃に調節すれば20〜30秒で処理を完了で
き、紫外線強度や処理ガス供給量を少なくすることも可
能であることが判明した。
Here, the object to be treated 5 was a glass plate, and the cleanliness was determined based on the contact angle of pure water, and the treatment was completed when a = 10 degrees. As is clear from this, as the heating temperature is increased, the processing time is inversely shortened, and 12
It has been found that if the temperature is adjusted to 0 to 150°C, the treatment can be completed in 20 to 30 seconds, and it is also possible to reduce the intensity of ultraviolet rays and the amount of treatment gas supplied.

そして、石英ガラス板やエヤーカーテンなどKより紫外
線源と被処理体とを紫外線透過可能に区画したので、こ
れにより、紫外線の処理用ガスへの吸収を少なくして処
理速度を更に向上でき、また、処理用ガスの供給量を著
しく少なくできる効果がある。
Since the ultraviolet light source and the object to be treated are separated by K, such as a quartz glass plate or an air curtain, so that the ultraviolet rays can pass therethrough, it is possible to further improve the processing speed by reducing the absorption of ultraviolet rays into the processing gas. This has the effect of significantly reducing the amount of processing gas supplied.

以上説明した実施例からも理解される様に、本発明に、
被処理体の温度を適温に調整し、かつ、石英ガラス板や
エヤーカーテンなどによシ紫外線源と被処理体とを紫外
線透過可能に区画したので、有機汚染物などの分解を促
進できるようになり、処理速度が早く、紫外線強度や処
理用ガスの供給量も少なくすることが可能な紫外線処理
方法とすることができる。なお、この方法に、洗浄の他
にフォトレジストのアッシング等にもそっくりそのま\
適用できる。
As understood from the embodiments described above, the present invention includes
The temperature of the object to be treated is adjusted to an appropriate temperature, and the ultraviolet source and the object to be treated are separated using a quartz glass plate or air curtain so that ultraviolet light can pass through, so that the decomposition of organic contaminants can be promoted. Therefore, it is possible to provide an ultraviolet treatment method that has a high processing speed and can reduce the intensity of ultraviolet rays and the amount of processing gas supplied. In addition to cleaning, this method can also be used for photoresist ashing, etc.
Applicable.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明実施例の断面図、第2図は同じく他の実
施例の断面図、第3図は加熱温度と処理存間の関係図で
ある。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a sectional view of another embodiment, and FIG. 3 is a diagram showing the relationship between heating temperature and treatment duration.

Claims (1)

【特許請求の範囲】 1、紫外線源の光によりオゾンもしくはN_2O(亜酸
化窒素)を分解し、これにより生成される発生基の酸素
により被処理体の表面に付着する有機汚染物などを分解
して洗浄などの処理を行うに際し、紫外線源と被処理体
との間を石英ガラスやエヤーカーテンなどで紫外線が透
過可能な状態で区画し、被処理体の近傍にのみ紫外線に
より発生基の酸素を生成するガスを供給するとともに、
紫外線源を含む空間に、真空や紫外線を吸収しないガス
雰囲気とし、かつ、被処理体の温度を適温に調整し、有
機汚染物などの分解を促進することを特徴とする紫外線
処理方法。 2、赤外線の照射により被処理体の温度を調整すること
を特徴とする特許請求の範囲第1項記載の紫外線処理方
法。 3、抵抗加熱ヒーターにより被処理体の温度を調整する
ことを特徴とする特許請求の範囲第1項記載の紫外線処
理方法。
[Claims] 1. Ozone or N_2O (nitrous oxide) is decomposed by light from an ultraviolet source, and organic contaminants etc. that adhere to the surface of the object to be treated are decomposed by the generated radical oxygen. When carrying out processing such as cleaning, the space between the ultraviolet source and the object to be treated is separated using quartz glass or an air curtain so that the ultraviolet rays can pass through. In addition to supplying the generated gas,
An ultraviolet treatment method characterized by creating a vacuum or a gas atmosphere that does not absorb ultraviolet rays in a space containing an ultraviolet source, adjusting the temperature of the object to be treated to an appropriate temperature, and promoting the decomposition of organic contaminants. 2. The ultraviolet treatment method according to claim 1, wherein the temperature of the object to be treated is adjusted by irradiation with infrared rays. 3. The ultraviolet treatment method according to claim 1, wherein the temperature of the object to be treated is adjusted by a resistance heater.
JP14935884A 1984-07-20 1984-07-20 Treatment by ultraviolet rays Granted JPS6129357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14935884A JPS6129357A (en) 1984-07-20 1984-07-20 Treatment by ultraviolet rays

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14935884A JPS6129357A (en) 1984-07-20 1984-07-20 Treatment by ultraviolet rays

Publications (2)

Publication Number Publication Date
JPS6129357A true JPS6129357A (en) 1986-02-10
JPS6253190B2 JPS6253190B2 (en) 1987-11-09

Family

ID=15473381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14935884A Granted JPS6129357A (en) 1984-07-20 1984-07-20 Treatment by ultraviolet rays

Country Status (1)

Country Link
JP (1) JPS6129357A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016083193A (en) * 2014-10-27 2016-05-19 岩崎電気株式会社 Sterilization apparatus
JP2018102635A (en) * 2016-12-27 2018-07-05 株式会社トクヤマ Sterilization method, and sterilizer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11285566B2 (en) 2017-03-14 2022-03-29 Honda Motor Co., Ltd. Laser machining apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016083193A (en) * 2014-10-27 2016-05-19 岩崎電気株式会社 Sterilization apparatus
JP2018102635A (en) * 2016-12-27 2018-07-05 株式会社トクヤマ Sterilization method, and sterilizer

Also Published As

Publication number Publication date
JPS6253190B2 (en) 1987-11-09

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