JPS61288973A - Polishing method - Google Patents
Polishing methodInfo
- Publication number
- JPS61288973A JPS61288973A JP60130688A JP13068885A JPS61288973A JP S61288973 A JPS61288973 A JP S61288973A JP 60130688 A JP60130688 A JP 60130688A JP 13068885 A JP13068885 A JP 13068885A JP S61288973 A JPS61288973 A JP S61288973A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- polishing layer
- work
- rotor
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、ワークを高Ｗ＠率で研磨するようにした研
磨方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a polishing method for polishing a workpiece at a high W@ rate.
（便米の技術）
周知のようにワークを研磨する方法は多極知られ℃いる
が、研磨精度や表面仕上げが轡に良好な研磨方法として
シツピングやポリッシングが知られている。この方法は
ラップヤボリツシャの表面に、砥粒にラップ液を混合し
たものな存在させ、その表面にワークを押圧してラップ
やポリラシャとワークとの相対的回転移動差により、砥
粒によってワークの表面を微少類切削しながら研磨する
。この方法によれば、仕上げ研磨されたワークの表面を
更に平滑にするとともに、寸法精度も向上させるもので
ある。(Binmai technology) As is well known, there are many methods for polishing a workpiece, but shipping and polishing are known as polishing methods that provide excellent polishing accuracy and surface finish. In this method, a mixture of abrasive grains and lapping liquid is placed on the surface of the lapping sander, and the work piece is pressed against the surface of the lapping sander, and the difference in relative rotational movement between the lapping or polisher and the workpiece causes the abrasive grains to be applied to the work piece. Polish the surface while cutting microscopic particles. According to this method, the surface of the finished workpiece is further smoothed and the dimensional accuracy is also improved.
（発明が解決しようとする問題点）
しかし上記した従来の方法では、ラップやポリラシャを
高速回転すると遠心力により砥粒が飛散するので、ラッ
プやポリラシャの回転速度を高くすることができない。(Problems to be Solved by the Invention) However, in the conventional method described above, when the lap or polisher is rotated at high speed, the abrasive grains are scattered due to centrifugal force, so it is not possible to increase the rotation speed of the lap or polisher.
したがって、ワークの研磨速度を速くできないので仕事
量に較べて加工量が少なく、研ｍ効率が患い。またラッ
プやポリラシャがワークの研層屑により目詰りするので
、研磨Ｍを除去したりラップなどを交侠しなければなら
ない。Therefore, since the polishing speed of the workpiece cannot be increased, the amount of processing is small compared to the amount of work, and the polishing efficiency suffers. In addition, since the lap and polisher become clogged with the polishing layer debris from the workpiece, it is necessary to remove the polishing M or replace the lap.
（問題を解決するための手段）
本発明は上記に鑑み提案されたもので、微細な逼絖空［
を無数に有する回転体の片面に吸引作用を与えるととも
に他の曲に砥粒を配設し、上記砥粒を吸引作用により回
転体に吸着保持させて回転体の回転によりワーク′ｌｆ
：研磨するようにしたことを特徴とする研磨方法に関す
るものである。(Means for solving the problem) The present invention was proposed in view of the above, and it
A suction action is applied to one side of a rotary body having a countless number of curves, and abrasive grains are arranged on the other side, and the abrasive grains are adsorbed and held on the rotary body by the suction action, and the workpiece 'lf is rotated by the rotation of the rotary body.
: This relates to a polishing method characterized by polishing.
（実施例） 以下に本発明の詳細な説明する。(Example) The present invention will be explained in detail below.
図面は本発明の方法な実施するだめの装置の概略を示す
もので、モータ／の駆動により回転する回転軸コには回
転体３ン取付ける。上記回転体３は、厚さ方向に複数の
造孔≠・・・を開設した受板５の上面に研＃層６を積層
したものである。上記研ｍ層６は倣細な連続空ｖＡ’に
無数に有するセラミック或は弾力性有る合成樹脂製であ
る。The drawing schematically shows an apparatus for implementing the method of the present invention, in which three rotating bodies are attached to a rotating shaft rotated by the drive of a motor. The rotating body 3 has a ground layer 6 laminated on the upper surface of a receiving plate 5 in which a plurality of holes are formed in the thickness direction. The abrasive layer 6 is made of ceramic or elastic synthetic resin and has a countless number of narrow continuous spaces vA'.
上記した回転体３の下面には吸引室７を設置する。この
吸引室りは底板ｇと、咳低板ｔの外縁から直豆する壁板
デとからなる上面開放の円形枠状で、戚吸引室りの開放
面に回転体３が一一状に位置し、また前記した回転軸−
が底板ざの中央を通っている。そして、回転体３の外周
と壁板デの上端内周との間にシール材１０を介装すると
ともに、回転＠コと底板ｇの中央との間にもシール材／
／を介装して吸引室７を気密に保持する。A suction chamber 7 is installed on the lower surface of the rotating body 3 described above. This suction chamber has a circular frame shape with an open top surface, consisting of a bottom plate g and a wall plate de extending straight from the outer edge of the cough lower plate t. Moreover, the above-mentioned rotation axis -
passes through the center of the bottom plate. A sealing material 10 is interposed between the outer periphery of the rotating body 3 and the inner periphery of the upper end of the wall plate, and a sealing material 10 is also interposed between the rotating body 3 and the center of the bottom plate g.
/ to keep the suction chamber 7 airtight.
また上記した吸引室７には吸引菅／コを接続し、該吸引
管／コの途中にドレーンボックス／３を設けるとともに
、先端に吸引ポンプ（図示せず）を連続する。Further, a suction pipe/co is connected to the above-mentioned suction chamber 7, a drain box/3 is provided in the middle of the suction pipe/co, and a suction pump (not shown) is connected to the tip.
したがって、上記吸引ポンプを作動すると吸引室りが減
圧状態になり、通孔弘を介して研磨層重に吸引作用が生
じる。Therefore, when the suction pump is operated, the pressure in the suction chamber is reduced, and a suction action is generated on the polishing layer through the through hole.
前記した回転体３の上方には縦方向のシリンダ／４４
、 ／ｌを２本並設し、各シリンダ／弘から下方に地山
するロッド／ｊの下端にワークホルダ／６を設け、該ワ
ークホルダ／６にワーク／７を装脱可能に支持する。上
記したロッド／ｊはシリンダ／ｌＩにより昇神町組で、
しかもモータのプーリなどに掛けたベルト（図示せず）
などにより高速回転することができ、ロッド１５の回転
によりワークホルダ／６及びワークｌりが高速回転する
。Above the rotating body 3 is a vertical cylinder /44.
, /l are arranged in parallel, and a work holder /6 is provided at the lower end of a rod /j extending downward from each cylinder /hiro, and a workpiece /7 is removably supported on the work holder /6. The above-mentioned rod /j is Shogamicho group due to cylinder /lI,
Moreover, a belt (not shown) hung around the motor pulley, etc.
The rotation of the rod 15 causes the work holder 6 and the workpiece 1 to rotate at high speed.
上記した両シリンダ／ｌＩ、 ／４Ｃ間には複数のノズ
ル／ｇ・・・を下向きに形成した砥粒供給機／９を設置
し、該砥粒供１１１機／デによって砥粒のみを、又は砥
粒と液体（水や油）ｆｔ［ｇ１転体３の研磨層重の上面
に供給する。An abrasive grain supply machine /9 with a plurality of nozzles /g... formed downward is installed between the above-mentioned two cylinders /1I, /4C, and the abrasive grain supply machine /9 is used to supply only abrasive grains or Abrasive grains and liquid (water or oil) ft [g1 are supplied to the upper surface of the polishing layer of rolling body 3.
上記した研磨装置によりワーク／７な研磨処理するには
、ワーク１７をワークホルダｌ乙の下面に取付け、また
前記したように吸引室りを減圧状態にして造孔ダにより
研磨ＩＩＩ ＆の下面に吸引作用を与えながら回転体３
をモータｌで？Ｉ１１運回転し、しかも砥粒供給機／９
によりノズル／ｌから噴出する砥粒を研磨１５１４の上
面に供給し、かつシリンダｌ弘によってワーク／７を回
転させながら研磨層６の上聞に押圧する。この場合、彎
虐層重の上面に供給される砥粒は、吸引室７かもの吸引
作用により連続空隙を閉基するようにして吸着保持され
るので、回転体３０回転による遠心力で飛散しないし、
ワーク／７に接し℃も移動したり跳ね上らない。したが
って、回転体３０回転とワーク／７の回転とによる相対
的な差により、ワーク／７は研磨層重の上面に供給され
た砥粒により効果的に研磨処理される。そして、砥粒は
研磨層の上面に吸着保持されているので、回転体３が高
速回転しても遠心力によって飛散することがない。した
がって、回転体３を充分に高速回転することにより、研
磨効率を高めることができる。また、研磨層６は下面が
吸引作用を受けているので、微細な連続空隙により砥粒
とワークの研磨層や供給流体とのＦ別作用が有る。In order to polish the workpiece 17 using the polishing device described above, the workpiece 17 is attached to the lower surface of the work holder lB, and the suction chamber is depressurized as described above, and the hole former is used to polish the lower surface of the workpiece III &7. Rotating body 3 while giving suction action
with motor l? I11 rotation, and abrasive grain feeder/9
The abrasive grains ejected from the nozzle /l are supplied to the upper surface of the polishing layer 1514, and the workpiece /7 is pressed onto the upper surface of the polishing layer 6 while being rotated by the cylinder lhiro. In this case, the abrasive grains supplied to the upper surface of the tortoise layer are adsorbed and held by the suction action of the seven suction chambers so as to close the continuous voids, so they are not scattered by the centrifugal force caused by the 30 rotations of the rotor. death,
When in contact with workpiece/7, the temperature does not move or jump. Therefore, due to the relative difference between the rotation of the rotating body 30 and the rotation of the workpiece/7, the workpiece/7 is effectively polished by the abrasive grains supplied to the upper surface of the polishing layer. Since the abrasive grains are adsorbed and held on the upper surface of the polishing layer, they will not be scattered by centrifugal force even if the rotating body 3 rotates at high speed. Therefore, by rotating the rotating body 3 at a sufficiently high speed, polishing efficiency can be improved. Further, since the lower surface of the polishing layer 6 is subjected to a suction action, the abrasive grains and the polishing layer of the workpiece and the supply fluid have different effects due to the fine continuous voids.
換言すれは、研磨層の連続空隙は砥粒の平均粒径以下で
あり、ワークの研磨層が砥粒より極めて微細なので、連
続空隙が研磨層や研磨層の上面に供給される流体を吸引
室７に導くフィルターとしての機能を持つ。したがって
研磨層の上面や連続空隙が、研磨層により目詰りするこ
とがない。In other words, the continuous voids in the polishing layer are smaller than the average grain size of the abrasive grains, and the polishing layer of the workpiece is much finer than the abrasive grains, so the continuous voids allow the polishing layer and the fluid supplied to the top surface of the polishing layer to flow into the suction chamber. It functions as a filter that leads to 7. Therefore, the upper surface of the polishing layer and the continuous voids are not clogged by the polishing layer.
なお、図面の実施例では回転体３を受板！と研磨層６と
の二層により構成したが、研磨層６が硬貞であれは、回
転体３を研磨層６だけで構成してもよい。In addition, in the embodiment shown in the drawings, the rotating body 3 is a receiving plate! Although the rotating body 3 is composed of two layers, ie, the polishing layer 6 and the polishing layer 6, the rotating body 3 may be composed of only the polishing layer 6 as long as the polishing layer 6 is hard.
次に本発明の具体的実施例を記載する。Next, specific examples of the present invention will be described.
（実施例１）
直径４００ｍ、厚さ５■の多孔性アルミナ質のラップを
用い、吸引しながら砥粒Ｃす２００を水に懸濁した研磨
液で炭素工具鋼を研磨した。(Example 1) Using a porous alumina wrap with a diameter of 400 m and a thickness of 5 cm, carbon tool steel was polished with a polishing liquid containing C200 abrasive grains suspended in water while being suctioned.
ラップの回転数を最大５６０ｒｐｍまで行ったが砥粒の
大部分はラップ上に吸引保持されており、研磨後の仕上
面あらさは約８μｍＲ２で加工能率は以下のようであっ
た。Although the rotation speed of the lap was increased to a maximum of 560 rpm, most of the abrasive grains were suctioned and held on the lap, the finished surface roughness after polishing was approximately 8 μmR2, and the processing efficiency was as follows.
（実施例２ン
実施例１のラップ上にナイロン織布のポリシャを貼付け
、砥粒Ｃ≠１０００な用いて実施例１と同様に炭素工具
鋼の仕上ｄｌｌｌ’ｌ：行った０仕上ＩＩＩｏあらさは
？ｆＪ０ 、２μｍル２であり加工能率は以下のようで
あった。(Example 2) Finishing of carbon tool steel was carried out in the same manner as in Example 1 by pasting a nylon woven polisher on the wrap of Example 1 and using abrasive grain C≠1000. ?fJ0 was 2 μm 2, and the processing efficiency was as follows.
（発明の効果）
以上要するに本発明によれば、回転体の片面に与える吸
引作用により、回転体の他面に砥粒が吸着保持している
ので、回転体が高速回転しても遠心力により砥粒が飛散
しない。したがって、回転体を高速回転できるので、ワ
ークを高能率に研磨処坤することができる。そして、回
転体の微細な連続空隙によりワークの研ｌｊＩ屑をＰ別
して除去できるので、研磨面に研Ｊｌｌ屑が残存して研
磨効果が低減したり、連続９隙が閉基して砥粒が飛散す
ることがなく、実用的価値が看しく高いものとなる。(Effects of the Invention) In summary, according to the present invention, the abrasive particles are adsorbed and retained on the other side of the rotating body due to the suction action applied to one side of the rotating body, so even if the rotating body rotates at high speed, the centrifugal force Abrasive grains do not scatter. Therefore, since the rotating body can be rotated at high speed, the workpiece can be polished with high efficiency. Since the fine continuous gaps of the rotating body allow grinding debris on the workpiece to be removed separately, grinding debris may remain on the polishing surface, reducing the polishing effect, or the continuous 9 gaps may close, causing the abrasive grains to It does not scatter and has a beautiful practical value.
図面は本発明の方法を実施するための装置の概略図であ
る。
特許出願人 タイホー工業株式会社・・二≧、
同 代埋人 福 田 責 三，、・一−゛・、
、、□・ 、／゛′
゛５−一〆The drawing is a schematic illustration of an apparatus for carrying out the method of the invention. Patent applicant: Taiho Kogyo Co., Ltd. 2≧、Contemporary person: Tsunei Fukuda 3,,・1-゛・,
,,□・ ,/゛′ ゛5-1〆
Claims (1)
を与えるとともに他の面に砥粒を配設し、上記砥粒を吸
引作用により回転体に吸着保持させて回転体の回転によ
りワークを研磨するようにしたことを特徴とする研磨方
法。A suction effect is applied to one side of a rotating body having countless fine continuous voids, and abrasive grains are arranged on the other side, and the abrasive particles are attracted and held by the rotating body by the suction effect, and the workpiece is removed by the rotation of the rotating body. A polishing method characterized by polishing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60130688A JPS61288973A (en) | 1985-06-18 | 1985-06-18 | Polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60130688A JPS61288973A (en) | 1985-06-18 | 1985-06-18 | Polishing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61288973A true JPS61288973A (en) | 1986-12-19 |
| JPH0551426B2 JPH0551426B2 (en) | 1993-08-02 |
Family
ID=15040241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60130688A Granted JPS61288973A (en) | 1985-06-18 | 1985-06-18 | Polishing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61288973A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011018706A (en) * | 2009-06-02 | 2011-01-27 | Cpumate Inc | Heat dissipation instrument with polished heat receiving surface, and method and equipment for polishing the same |
| KR101455474B1 (en) * | 2012-12-18 | 2014-10-27 | 골든 선 뉴스 테크닉스 컴파니 리미티드 | Cooler with ground heated plane and grinding method and apparatus thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS591160A (en) * | 1982-06-23 | 1984-01-06 | Toyo Kenmazai Kogyo Kk | Device for magnetically polishing flat surface of work |
| JPS59183748A (en) * | 1983-04-04 | 1984-10-18 | 工業技術院長 | Artificial foot equipped with earth detecting sensor |
-
1985
- 1985-06-18 JP JP60130688A patent/JPS61288973A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS591160A (en) * | 1982-06-23 | 1984-01-06 | Toyo Kenmazai Kogyo Kk | Device for magnetically polishing flat surface of work |
| JPS59183748A (en) * | 1983-04-04 | 1984-10-18 | 工業技術院長 | Artificial foot equipped with earth detecting sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011018706A (en) * | 2009-06-02 | 2011-01-27 | Cpumate Inc | Heat dissipation instrument with polished heat receiving surface, and method and equipment for polishing the same |
| KR101455474B1 (en) * | 2012-12-18 | 2014-10-27 | 골든 선 뉴스 테크닉스 컴파니 리미티드 | Cooler with ground heated plane and grinding method and apparatus thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0551426B2 (en) | 1993-08-02 |
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