JP6493740B2 - Polishing tool for loose abrasive machining, method for producing the same, and loose abrasive polishing apparatus - Google Patents
Polishing tool for loose abrasive machining, method for producing the same, and loose abrasive polishing apparatus Download PDFInfo
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- 238000005498 polishing Methods 0.000 title claims description 269
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000003754 machining Methods 0.000 title claims description 12
- 239000006061 abrasive grain Substances 0.000 claims description 43
- 239000002002 slurry Substances 0.000 claims description 38
- 239000005357 flat glass Substances 0.000 claims description 28
- 238000012545 processing Methods 0.000 claims description 27
- 239000007788 liquid Substances 0.000 claims description 24
- 230000003746 surface roughness Effects 0.000 claims description 23
- 238000003860 storage Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 9
- 238000005488 sandblasting Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 230000004308 accommodation Effects 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000003082 abrasive agent Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 description 44
- 238000007517 polishing process Methods 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
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- 239000000463 material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000005338 frosted glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000005337 ground glass Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
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- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本発明は遊離砥粒加工用研磨工具、その製造方法および遊離砥粒研磨装置に関し、さらに詳細には、シリコンウェーハ等の極めて高い平坦度や平行度が要求される工作物の表面に鏡面仕上げを施すための遊離砥粒加工技術に関する。 The present invention relates to a polishing tool for loose abrasive machining, a manufacturing method thereof, and a loose abrasive polishing apparatus. More specifically, a mirror finish is applied to the surface of a workpiece such as a silicon wafer that requires extremely high flatness and parallelism. The present invention relates to a free abrasive processing technique.
半導体材料、ガラス、金属材料等で、極めて高い平面度や平行度が要求される工作物（以下、ワークと称する。）の表面を鏡面に仕上るための加工技術としてポリッシング加工がある。 Polishing is a processing technique for finishing the surface of a workpiece (hereinafter referred to as a workpiece), which is made of a semiconductor material, glass, metal material, or the like that requires extremely high flatness and parallelism, into a mirror surface.
一般的なポリッシング加工は、ポリッシング用の研磨工具としての研磨布、いわゆるポリッシングパッドがポリッシング定盤の表面に一体的に貼付支持され、このポリッシングパッド上にワークをセットして、ポリッシングパッド上に砥粒と研磨液を混合してなる研磨スラリーを定量的に供給しながら、上記研磨定盤およびワークを相対的に押圧しつつ回転運動させて、その相対的な運動作用により、上記ワーク表面が鏡面に仕上げられる。 In a general polishing process, a polishing cloth as a polishing tool for polishing, a so-called polishing pad, is integrally attached and supported on the surface of a polishing surface plate, a workpiece is set on the polishing pad, and an abrasive is applied on the polishing pad. While the polishing slurry formed by mixing the grains and the polishing liquid is quantitatively supplied, the polishing surface plate and the workpiece are rotated while being relatively pressed, and the surface of the workpiece is mirror-finished by the relative movement action. Finished.
例えば、シリコンウェーハは、最終製品であるＩＣ、ＬＳＩ、超ＬＳＩ等の性能向上、生産性向上等の要請から、その原材料として、加工段階での厚さの均一化等の寸法安定性あるいは表面粗さの向上の要求が厳しく、このため、シリコンウェーハの製造においては、最終工程として鏡面仕上げを得るためにポリッシング加工が行われている。 For example, silicon wafers have dimensional stability or surface roughness such as uniform thickness at the processing stage as raw materials due to demands for improved performance and productivity of final products such as IC, LSI, and ultra LSI. In order to obtain a mirror finish as a final process in the manufacture of silicon wafers, polishing processing is performed.
このポリッシング加工においては、ワークとしてのシリコンウェーハの表面の高い平坦度を確保しつつ、その表面を数オングストローム以下の表面粗さに仕上げるとともに、マイクロクラック（微小な割れ目）フリー等の要求を満たす必要がある。 In this polishing process, while ensuring high flatness of the surface of the silicon wafer as the workpiece, it is necessary to finish the surface to a surface roughness of several angstroms or less and to satisfy requirements such as micro crack (micro crack) free. There is.
ところで、上記ポリッシングパッドは、一般にポリエステル不織布や発泡ポリウレタン等の軟質樹脂からなる軟質工具であることから、実際のポリッシング加工におけるワーク表面の平坦度の劣化は避けられず、これが最終製品であるＩＣ、ＬＳＩ、超ＬＳＩ等において大きな障害となり、その改良が要望されていた。 By the way, since the polishing pad is generally a soft tool made of a soft resin such as a polyester nonwoven fabric or polyurethane foam, deterioration of the flatness of the work surface in the actual polishing process is inevitable, and this is the final product IC, It has become a major obstacle in LSIs, VLSIs, etc., and improvements have been desired.
この点に関して、例えば特許文献１に記載されるように、有機高分子中に金属酸化物を微細かつ均一に複合化させた有機無機複合体で構成される研磨工具が開発され提案されているが、この研磨工具は、いわゆる消耗品として、その製造工程が複雑で、製造コストが高く、これがため、より安価な構造の開発が要請されていた。 In this regard, as described in Patent Document 1, for example, a polishing tool composed of an organic-inorganic composite in which a metal oxide is finely and uniformly combined in an organic polymer has been developed and proposed. As a so-called consumable product, the polishing tool has a complicated manufacturing process and high manufacturing cost. Therefore, development of a cheaper structure has been demanded.
本発明はかかる従来の問題点に鑑みてなされたものであって、その目的とするところは、平坦度特性に優れる板ガラスを使用することにより、形状精度が劣化することなく、ワークの表面の高い平坦度および平行度を確保しつつ、その表面を数オングストローム以下の表面粗さの鏡面に仕上げるとともに、マイクロクラックフリー等の要求を満たす研磨工具を提供することにある。 The present invention has been made in view of such conventional problems, and the object of the present invention is to use a plate glass having excellent flatness characteristics, so that the shape accuracy is not deteriorated and the surface of the workpiece is high. An object of the present invention is to provide a polishing tool that finishes its surface to a mirror surface with a surface roughness of several angstroms or less while ensuring flatness and parallelism, and satisfies requirements such as microcrack-free.
本発明のもう一つの目的とするところは、上記研磨工具を簡単かつ安価に製造することができる研磨工具の製造方法を提供することにある。 Another object of the present invention is to provide a polishing tool manufacturing method capable of manufacturing the above polishing tool easily and inexpensively.
本発明のさらにもう一つの目的とするところは、上記研磨工具を備えた遊離砥粒加工装置を提供することにある。 Still another object of the present invention is to provide a loose abrasive machining apparatus provided with the above polishing tool.
この目的を達成するため、本発明の遊離砥粒加工用研磨工具は、回転する研磨定盤の研磨面上に、砥粒と研磨液を混合してなる研磨スラリーを供給散布しながら、ワークを押し付け擦り合わせて研磨する遊離砥粒加工において、上記研磨定盤の研磨面を形成するものであって、平坦な板ガラス表面に研磨面構造が形成されてなり、この研磨面構造は、所定の均一な表面粗さの梨地処理を施された研磨面に、研磨スラリーの砥粒を複数個層状に捕獲収容し得る大きさの収容ポケットが散点状に設けられてなることを特徴とする。 In order to achieve this object, the polishing tool for free abrasive grain processing of the present invention supplies a workpiece to a polishing surface of a rotating polishing platen while supplying and dispersing a polishing slurry obtained by mixing abrasive grains and a polishing liquid. In the free abrasive processing for polishing by pressing and rubbing, a polishing surface of the polishing surface plate is formed, and a polishing surface structure is formed on a flat plate glass surface, and this polishing surface structure has a predetermined uniform surface. to a surface roughness polished surface that has been subjected to satin finish the accommodating pockets that abrasive grains may be trapped housed in a plurality layered size of the abrasive slurry, characterized in that the thus provided for the scattered point-like manner.
好適な実施態様として、以下の構成が採用される。
（１）上記板ガラス表面にワークが押し付けられた状態において、上記研磨面構造の研磨面の表面粗さは、これら研磨面とワークの間に散布介在する研磨スラリー中の砥粒が有効に保持されるように設定されるとともに、上記収容ポケットは、上記研磨スラリー中の複数の砥粒が層状に収容保持される形状寸法に設定されている。
The following configuration is adopted as a preferred embodiment.
(1) In a state where a workpiece is pressed against the plate glass surface, the surface roughness of the polishing surface of the polishing surface structure is such that the abrasive grains in the polishing slurry dispersed and interposed between the polishing surface and the workpiece are effectively retained. In addition, the storage pocket is set to have a shape and dimension in which a plurality of abrasive grains in the polishing slurry are stored and held in layers .
（２）対象となる上記研磨スラリー中の砥粒の粒径が０．２５〜１０．０μｍであるのに対して、上記研磨面構造の研磨面の表面粗さがＲａ０．０１〜０．５μｍに設定されるとともに、収容ポケットの形状寸法が縦１．０〜１００．０μｍ、横１．０〜１００．０μｍおよび深さ０．１〜１０．０μｍに設定されている。 ( 2 ) While the particle size of the abrasive grains in the polishing slurry as a target is 0.25 to 10.0 μm, the surface roughness of the polishing surface of the polishing surface structure is Ra 0.01 to 0.5 μm. In addition, the shape dimensions of the accommodation pocket are set to 1.0 to 100.0 μm in length, 1.0 to 100.0 μm in width, and 0.1 to 10.0 μm in depth.
（３）上記板ガラスの片面に前記研磨面構造が設けられている。
（４）上記板ガラスの表裏両面に上記研磨面構造が設けられている。
(3) The polished surface structure is provided on one side of the plate glass.
(4) The polishing surface structure is provided on both the front and back surfaces of the plate glass.
本発明の遊離砥粒加工用研磨工具の製造方法は、上記本発明の研磨工具の製造に適したものであって、平坦な板ガラス表面にサンドブラスト処理を施すことにより、上記研磨面構造を形成することを特徴とする。 The method for manufacturing a polishing tool for processing free abrasive grains according to the present invention is suitable for manufacturing the polishing tool according to the present invention. The polishing surface structure is formed by subjecting a flat plate glass surface to sandblasting. It is characterized by that.
好適な実施態様として、上記サンドブラスト処理を、以下の条件で行う。
使用する研磨材：アルミナ（粒径：１６μｍ〜１６０μｍ）
研削圧力（噴射圧力）：０．０１Ｍｐａ〜０．５Ｍｐａ
加工時間：１０分〜６０分
As a preferred embodiment, the sandblast treatment is performed under the following conditions.
Abrasive used: Alumina (particle size: 16 μm to 160 μm)
Grinding pressure (injection pressure): 0.01 Mpa to 0.5 Mpa
Processing time: 10-60 minutes
本発明の遊離砥粒加工装置は、相対的に移動する研磨定盤とワークとの間に、砥粒と研磨液を混合してなる研磨スラリーを供給散布しながら、ワークを上記研磨定盤上に押し付け擦り合わせて研磨する遊離砥粒加工装置であって、回転可能に設けられて、その上面に研磨工具を取外し可能に備える研磨定盤と、この研磨定盤を回転駆動する定盤回転手段と、上記研磨定盤の回転中心と偏心した上方位置に回転可能に設けられて、その下面にワークを取外し可能に支持するワーク支持盤と、このワーク支持盤を回転駆動するワーク回転手段と、上記ワークを上記研磨定盤に対して相対的に加圧する加圧手段と、上記研磨定盤上の研磨工具に対して研磨スラリーを供給する研磨液供給手段と、上記定盤回転手段、ワーク回転手段、加圧手段および研磨液供給手段を連動して制御する制御手段とを備えてなり、上記研磨工具が上述した本発明の研磨工具からなることを特徴とする。 The loose abrasive processing apparatus of the present invention supplies and disperses a polishing slurry obtained by mixing abrasive grains and a polishing liquid between a relatively moving polishing surface plate and a workpiece while the workpiece is placed on the polishing surface plate. A free abrasive processing apparatus for polishing by pressing and rubbing against a polishing platen, a polishing platen provided rotatably and having a polishing tool detachable on the upper surface thereof, and a platen rotating means for rotating the polishing platen And a work support disk that is rotatably provided at an upper position that is eccentric to the center of rotation of the polishing surface plate, and that supports the work so as to be removable from the lower surface thereof, and a work rotation means that rotationally drives the work support disk, Pressurizing means for pressurizing the work relative to the polishing surface plate, polishing liquid supply means for supplying polishing slurry to the polishing tool on the polishing surface plate, the surface plate rotating means, work rotation Means, pressurizing means and And control means for controlling conjunction with the Migakueki supply means, said polishing tool is characterized in that it consists of the polishing tool of the present invention described above.
本発明は、本発明者による以下の着眼点に基づいた種々の試験研究の成果としてなされたものである。 This invention is made | formed as a result of the various test research based on the following viewpoints by this inventor.
すなわち、本発明者は、遊離砥粒加工に用いられる研磨工具には、砥粒を良好に保持する機能と、研磨工具の形状である研磨面形状を忠実にワークの被研磨面に転写させる機能の両機能が求められるところ、従来のポリッシングパッド等が軟質工具で平坦度特性に劣り、これが実際のポリッシング加工におけるワーク表面の平坦度の劣化を招いていることに鑑み、平坦度特性に優れる板ガラスのすりガラス技術に着目した。 That is, the present inventor has a function for holding abrasive grains well and a function for faithfully transferring the shape of the polishing surface, which is the shape of the polishing tool, to the surface to be polished of the workpiece. In view of the fact that the conventional polishing pad and the like are soft tools and inferior in flatness characteristics, and this causes deterioration of the flatness of the workpiece surface in actual polishing, the flat glass is excellent in flatness characteristics. We focused on frosted glass technology.
つまり、すり板ガラスの表面性状は、無数の微小な凹凸からなるいわゆる梨地模様を呈しているところ、平坦度特性に優れる板ガラス本来の特性に加えて、この梨地模様の凹凸形状が砥粒を保持する機能を発揮するのではないかという点に着眼した。 In other words, the surface texture of the ground glass exhibits a so-called satin pattern consisting of innumerable minute irregularities. In addition to the original characteristics of flat glass with excellent flatness characteristics, the irregular pattern of the satin pattern retains abrasive grains. We focused on the point that it might function.
本発明者は、このようにして得られた知見に基づいて、さらなる試験・研究を行った結果、本発明を完成するに至った。 As a result of further testing and research based on the knowledge thus obtained, the present inventor has completed the present invention.
すなわち、本発明の研磨工具によれば、回転する研磨定盤の研磨面上に、砥粒と研磨液を混合してなる研磨スラリーを供給散布しながら、ワークを押し付け擦り合わせて研磨する遊離砥粒加工において、上記研磨定盤の研磨面を形成するものであって、平坦な板ガラス表面に研磨面構造が形成されてなり、この研磨面構造は、所定の均一な表面粗さの梨地処理を施された研磨面に、研磨スラリーの砥粒を複数個層状に捕獲収容し得る大きさの収容ポケットが散点状に設けられてなるから、以下に列挙するような優れた効果が発揮されて、形状精度が劣化することなく、ワークの表面の高い平坦度および平行度を確保しつつ、その表面を数オングストローム以下の表面粗さの鏡面に仕上げるとともに、マイクロクラックフリー等の要求を満たす研磨工具を提供することができる。 That is, according to the polishing tool of the present invention, a free abrasive that polishes by pressing and rubbing a workpiece while supplying and dispersing a polishing slurry formed by mixing abrasive grains and a polishing liquid onto the polishing surface of a rotating polishing surface plate. In the grain processing, the polishing surface of the polishing surface plate is formed, and a polishing surface structure is formed on a flat plate glass surface. The polishing surface structure is subjected to a satin finish treatment with a predetermined uniform surface roughness. the polished surface was subjected, the abrasive grains of the abrasive slurry from the size of the storage bag capable of capturing housed in a plurality layers thus provided for the scattered point-like manner, are exhibited excellent effects as listed below , While ensuring high flatness and parallelism of the workpiece surface without deteriorating the shape accuracy, the surface is finished to a mirror surface with a surface roughness of several angstroms or less and meets requirements such as microcrack-free It is possible to provide a grinding tool.
（１）平坦度特性に優れる板ガラス表面に、すりガラス状の凹凸を有する研磨面構造が形成されてなるから、形状精度を劣化させることなく、ワークの表面を高い平坦度および平行度をもって研磨加工することができる。 (1) Since a polished surface structure having ground glass-like irregularities is formed on a flat glass surface having excellent flatness characteristics, the surface of the workpiece is polished with high flatness and parallelism without deteriorating the shape accuracy. be able to.
（２）板ガラス表面のすりガラス状の凹凸を有する研磨面構造が、所定の均一な表面粗さの梨地処理を施された研磨面に、研磨スラリーの砥粒を複数個層状に捕獲収容し得る大きさの収容ポケットが散点状に設けられてなるから、上記研磨面構造が研磨スラリーの砥粒を有効に保持することにより、研磨対象であるワークの表面に砥粒が有効に作用して、ワーク表面から微量の切屑を取り去りつつ、従来の軟質樹脂製の研磨工具と同等の鏡面に仕上げることができ、研磨疵の発生を防止することができる。
(2) The polishing surface structure having ground glass-like irregularities on the surface of the plate glass has a size capable of capturing and storing a plurality of abrasive grains of polishing slurry in a polishing surface that has been subjected to a matte treatment with a predetermined uniform surface roughness. since the storage bags is provided in a scattered point-like, by the abrasive surface structure is effectively hold the abrasive grains in the polishing slurry, the abrasive grains on the surface of the workpiece to act effectively to be polished, While removing a small amount of chips from the work surface, it can be finished to a mirror surface equivalent to that of a conventional soft resin polishing tool, and generation of polishing flaws can be prevented.
（３）本発明の製造方法によれば、平坦な板ガラス表面にサンドブラスト処理を施すことにより、上記研磨面構造を形成するから、材料コストが低く、製造工程も単純で、製造コストさらには製品コストの低減化が図れ、消耗品としての研磨工具にとって顕著な効果が得られる。 (3) According to the manufacturing method of the present invention, the above polishing surface structure is formed by subjecting a flat plate glass surface to sandblasting, so that the material cost is low, the manufacturing process is simple, the manufacturing cost and further the product cost. Can be reduced, and a remarkable effect can be obtained for a polishing tool as a consumable.
以下、本発明の実施形態を図面に基づいて詳細に説明する。なお、図面全体にわたって同一の符号は同一の構成部材または要素を示している。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Throughout the drawings, the same reference numeral indicates the same component or element.
本発明に係る遊離砥粒加工用研磨工具が図１〜図４に示されており、この研磨工具１は、図５に示す遊離砥粒加工装置２に使用されるものであって、平坦な板ガラス５の表裏両面５ａ、５ｂに、すりガラス状の凹凸を有する研磨面構造６がそれぞれ形成されてなる。研磨工具１の具体的構造については後述する。 A polishing tool for loose abrasive machining according to the present invention is shown in FIGS. 1 to 4, and this polishing tool 1 is used in the loose abrasive machining apparatus 2 shown in FIG. A polished surface structure 6 having ground glass-like irregularities is formed on both the front and back surfaces 5 a and 5 b of the plate glass 5. The specific structure of the polishing tool 1 will be described later.
上記遊離砥粒加工装置２は、具体的には、ワークＷの表面Ｗａに鏡面仕上げ加工を行なうポリッシング装置であって、図示の実施形態においては、ワークＷとしてシリコンウェーハに鏡面仕上げ加工を行なうものである。 Specifically, the loose abrasive machining apparatus 2 is a polishing apparatus that performs mirror finishing on the surface Wa of the workpiece W. In the illustrated embodiment, the polishing machine 2 performs mirror finishing on a silicon wafer as the workpiece W. It is.
このポリッシング装置２は、ポリッシング定盤（研磨定盤）１０、ワーク支持盤１１、加圧装置（加圧手段）１２、研磨液供給装置（研磨液供給手段）１３および制御装置（制御手段）１４を主要部として構成され、上記ポリッシング定盤１０の上面１０ａに上記研磨工具１が取外し交換可能に設けられている。 The polishing apparatus 2 includes a polishing surface plate (polishing surface plate) 10, a work support plate 11, a pressure device (pressure device) 12, a polishing liquid supply device (polishing liquid supply device) 13, and a control device (control device) 14. The polishing tool 1 is provided on the upper surface 10a of the polishing surface plate 10 so as to be removable and replaceable.
ポリッシング定盤（研磨定盤）１０は、回転軸１５を介して水平回転可能に設けられた円盤状のもので、その上面１０ａに上記研磨工具１が取外し交換可能に支持固定される構造とされている。 The polishing surface plate (polishing surface plate) 10 is a disk-like one provided so as to be horizontally rotatable via a rotating shaft 15, and has a structure in which the polishing tool 1 is detachably supported and fixed on the upper surface 10a. ing.
上記回転軸１５は、具体的には図示しないが、従来公知の基本構造を備えてなり、上記ポリッシング定盤１０を回転駆動する定盤回転手段に駆動連結されている。この定盤回転手段は、例えば、歯車機構や伝達ベルト機構等の動力伝達機構を介して、回転駆動源である駆動モータに連係されてなり、この駆動モータが、後述する制御装置１４に電気的に接続されている。 Although not specifically shown, the rotary shaft 15 has a conventionally known basic structure, and is drivingly connected to a surface plate rotating means for rotating the polishing surface plate 10. The surface plate rotating means is linked to a drive motor that is a rotational drive source via a power transmission mechanism such as a gear mechanism or a transmission belt mechanism, and this drive motor is electrically connected to a control device 14 to be described later. It is connected to the.
ワーク支持盤１１は、上記ポリッシング定盤１０の回転中心つまり上記回転軸１５の軸心に対して偏心した上方位置に回転可能に設けられた円盤状のもので、その下面１１ａが上記ポリッシング定盤１０上の研磨工具１の研磨面１ａに平行に対向するように配置されたワーク支持面とされている。このワーク支持面１１ａは、ワークＷが取外し可能に支持される支持構造（図示省略）を備える。 The work support plate 11 is a disc-like one that is rotatably provided at an upper position that is eccentric with respect to the center of rotation of the polishing surface plate 10, that is, the axis of the rotation shaft 15, and the lower surface 11a thereof is the polishing surface plate. 10 is a workpiece support surface arranged to face the polishing surface 1a of the polishing tool 1 on 10 in parallel. The work support surface 11a includes a support structure (not shown) on which the work W is detachably supported.
ワーク支持盤１１は、具体的には図示しないが、従来公知の基本構造を備えてなり、このワーク支持盤１１を回転駆動するワーク回転手段に駆動連結されている。このワーク回転手段は、例えば、歯車機構や伝達ベルト機構等の動力伝達機構を介して、回転駆動源である駆動モータに連係されている。この駆動モータは、後述する制御装置１４に電気的に接続されている。 Although not specifically shown, the work support board 11 has a conventionally known basic structure, and is drivingly connected to a work rotation means for rotating the work support board 11. This work rotation means is linked to a drive motor which is a rotation drive source via a power transmission mechanism such as a gear mechanism or a transmission belt mechanism. This drive motor is electrically connected to a control device 14 to be described later.
加圧装置（加圧手段）１２は、ワークＷを上記ポリッシング定盤１０に対して相対的に加圧するもので、具体的には、ワーク支持盤１１をポリッシング定盤１０に対して加圧する加圧体の形態とされている。この加圧体１２は、具体的には図示しないが、エアシリンダ等の押圧シリンダに駆動連結されており、この押圧シリンダによって上記ワーク支持盤１１に負荷する圧力を調整可能とされている。上記押圧シリンダの駆動源は、後述する制御装置１４に電気的に接続されている。 The pressurizing device (pressurizing means) 12 pressurizes the work W relative to the polishing surface plate 10. Specifically, the pressurizing device (pressurizing means) 12 pressurizes the work support surface 11 against the polishing surface plate 10. It is in the form of a pressure body. Although not specifically shown, the pressurizing body 12 is drivingly connected to a pressing cylinder such as an air cylinder, and the pressure applied to the work support board 11 can be adjusted by the pressing cylinder. The drive source of the pressing cylinder is electrically connected to a control device 14 to be described later.
研磨液供給装置（研磨液供給手段）１３は、上記ポリッシング定盤１０上の研磨工具１の研磨面１ａに対して研磨スラリーＧＳを供給するもので、供給ノズル１３ａが上記研磨面１ａに上方から臨んで設けられており、この供給ノズル１３ａは、具体的には図示しないが研磨液供給回路を介して研磨液供給源に連通されている。この研磨液供給源は、後述する制御装置１４に電気的に接続されている。 The polishing liquid supply device (polishing liquid supply means) 13 supplies the polishing slurry GS to the polishing surface 1a of the polishing tool 1 on the polishing surface plate 10, and the supply nozzle 13a is applied to the polishing surface 1a from above. The supply nozzle 13a is communicated with a polishing liquid supply source via a polishing liquid supply circuit (not shown). This polishing liquid supply source is electrically connected to a control device 14 described later.
上記研磨スラリーＧＳとしては、所定の粒径を有する微細な砥粒ＡＧ、ＡＧ、…をその分散媒体である研磨液に混合分散させてなる従来公知の各種研磨スラリーが使用され、例えば、水性または油性の研磨液に、微細な砥粒ＡＧ、ＡＧ、…としてダイヤモンド微粒子が分散混合されてなるダイヤモンドスラリーや、研磨液に、微細な砥粒ＡＧ、ＡＧ、…としてコロイド状の酸化ケイ素微細粒子が分散混合されてなる、スラリー状のいわゆるコロイダルシリカが使用される。 As the polishing slurry GS, various conventionally known polishing slurries in which fine abrasive grains AG, AG,... Having a predetermined particle diameter are mixed and dispersed in a polishing liquid that is a dispersion medium are used. Diamond slurry in which diamond fine particles are dispersed and mixed as fine abrasive grains AG, AG,... In an oil-based polishing liquid, and colloidal silicon oxide fine particles as fine abrasive grains AG, AG,. So-called colloidal silica in the form of a slurry, which is dispersed and mixed, is used.
制御装置（制御手段）１３は、上記ポリッシング定盤１０の定盤回転手段、ワーク支持盤１１のワーク回転手段、加圧装置１２の駆動源および研磨液供給装置１３の研磨液供給源を相互に連動して自動制御するもので、具体的には、ＣＰＵ、ＲＡＭ、ＲＯＭおよびＩ／Ｏポート等からなるマイクロコンピュータで構成されている。 The control device (control means) 13 mutually connects the surface plate rotating means of the polishing surface plate 10, the work rotating means of the work support plate 11, the driving source of the pressurizing device 12, and the polishing liquid supply source of the polishing liquid supply device 13. It is automatically controlled in conjunction with each other, and is specifically composed of a microcomputer comprising a CPU, RAM, ROM, I / O port and the like.
この制御装置１４は、上記各構成手段等に電気的に接続されて、後述するポリッシング加工を自動で実行するように、上記各構成手段を駆動制御する。 This control device 14 is electrically connected to each of the above-described constituent means and the like, and drives and controls each of the constituent means so as to automatically perform a polishing process described later.
上記研磨工具１の具体的構造は、図１に示すように、板ガラス５が上記ポリッシング定盤１０の上面１０ａに対応した円形状とされるとともに、その表裏両面５ａ、５ｂがそれぞれポリッシング加工時のワークＷとの接触面となる、いわゆるリバーシブルタイプとされている。 As shown in FIG. 1, the specific structure of the polishing tool 1 is such that the plate glass 5 has a circular shape corresponding to the upper surface 10a of the polishing surface plate 10, and the front and back surfaces 5a, 5b are respectively polished during polishing. It is a so-called reversible type that becomes a contact surface with the workpiece W.
この目的のため、上記表裏両面５ａ、５ｂを構成する上記研磨面構造６は、後述するポリッシング加工時において、研磨スラリーＧＳ中の砥粒ＡＧ、ＡＧ、…を良好に保持する機能と、研磨工具１の形状である表裏面５ａ、５ｂの平面形状を忠実にワークＷの被研磨面Ｗａに転写させる機能の両機能を兼備する。 For this purpose, the polishing surface structure 6 constituting the front and back surfaces 5a and 5b has a function of satisfactorily holding the abrasive grains AG, AG,... 1 has both the functions of faithfully transferring the planar shape of the front and back surfaces 5a and 5b, which is the shape of No. 1, to the polished surface Wa of the workpiece W.
具体的には、上記研磨面構造６（５ａ、５ｂ）は、図２および図３に示すように、所定の均一な表面粗さの梨地処理を施された研磨面２０に、研磨スラリーＧＳ中の砥粒ＡＧを複数個捕獲収容し得る大きさの収容ポケット２１が均一に散点状に設けられてなる。 Specifically, as shown in FIGS. 2 and 3, the polishing surface structure 6 (5a, 5b) has a polishing surface GS that has been subjected to a satin treatment having a predetermined uniform surface roughness in the polishing slurry GS. The storage pockets 21 having a size capable of capturing and storing a plurality of abrasive grains AG are uniformly provided in the form of dots.
これら研磨面構造６を構成する研磨面２０と収容ポケット２１、２１、…の具体的構成は、加工対象となるワークＷの材質、および使用対象となる研磨スラリーＧＳ中の砥粒ＡＧ、ＡＧ、ＡＧ、…の粒径等に対応して設定される。 The specific configuration of the polishing surface 20 and the storage pockets 21, 21,... Constituting the polishing surface structure 6 is as follows. The material of the workpiece W to be processed and the abrasive grains AG, AG in the polishing slurry GS to be used. It is set corresponding to the particle size of AG,.
上記研磨面構造６の研磨面２０の表面粗さ、つまり、上記研磨面２０に施された梨地処理による表面粗さは、図４に示すように、上記板ガラス５表面５ａ（５ｂ）にワークＷが押し付けられた状態つまりポリッシング加工状態において、これら研磨面２０とワークＷの間に供給散布され介在する研磨スラリーＧＳ中の砥粒ＡＧ、ＡＧ、…が有効に保持されるように設定されている。 As shown in FIG. 4, the surface roughness of the polishing surface 20 of the polishing surface structure 6, that is, the surface roughness due to the matte treatment applied to the polishing surface 20 is applied to the surface 5 a (5 b) of the plate glass 5. Is set so that the abrasive grains AG, AG,... In the polishing slurry GS supplied and dispersed between the polishing surface 20 and the workpiece W are effectively held in the state where the pressure is pressed, that is, in the polishing process state. .
また、上記収容ポケット２１は、図２に示すように、いわゆるクレーター形状のもので、円形もしくは正方形に近い平面輪郭形状を有する。この収容ポケット２１の形状寸法は、図４に示すポリッシング加工状態において、上記研磨スラリーＧＳ中の複数の砥粒ＡＧ、ＡＧ、…が層状に収容保持されるように設定されている。 Further, as shown in FIG. 2, the storage pocket 21 has a so-called crater shape, and has a planar outline shape close to a circle or a square. The shape dimension of the accommodation pocket 21 is set so that the plurality of abrasive grains AG, AG,... In the polishing slurry GS are accommodated and held in layers in the polishing state shown in FIG.
上記表裏両面５ａ、５ｂが、このような均一に梨地処理された研磨面２０とクレーター形状の収容ポケット２１、２１、…とからなる研磨面構造６を有することにより、ポリッシングされたワークＷの表面Ｗａは、所定の鏡面に仕上がるとともに、マイクロクラックも生じない。 The front and back surfaces 5a and 5b have a polished surface structure 6 composed of such a uniformly polished surface 20 and crater-shaped storage pockets 21, 21,. Wa is finished to a predetermined mirror surface and does not cause microcracks.
つまり、図４を参照して、研磨工具１を用いたポリッシング加工時のポリッシングメカニズムを説明すると、上記研磨面構造６の研磨面２０においては、砥粒ＡＧ、ＡＧ、…が良好に保持されて、ワークＷの表面Ｗａ（図示の場合は下面）のポリッシングに有効に作用している。一方、上記収容ポケット２１においては、砥粒ＡＧ、ＡＧ、…が層状（図示の場合は２または３層）に収容保持される結果、上記研磨面２０における砥粒ＡＧ、ＡＧ、…よりも弱い作用力をもってワークＷの表面Ｗａのポリッシングに有効に作用している。 That is, the polishing mechanism at the time of polishing using the polishing tool 1 will be described with reference to FIG. 4. On the polishing surface 20 of the polishing surface structure 6, the abrasive grains AG, AG,. It effectively acts on the polishing of the surface Wa (the lower surface in the case of illustration) of the workpiece W. On the other hand, in the accommodation pocket 21, the abrasive grains AG, AG,... Are accommodated and held in a layered manner (two or three layers in the illustrated case), so that they are weaker than the abrasive grains AG, AG,. The acting force effectively acts on the polishing of the surface Wa of the workpiece W.
この結果、上記研磨面構造６に保持される砥粒ＡＧ、ＡＧ、…は、所定の均一な表面粗さの梨地処理を施された研磨面２０と、この研磨面２０に散点状に存在する収容ポケット２１、２１、…とによりそれぞれ良好に保持されるとともに、これら両者（研磨面２０と収容ポケット２１、２１、…）の異なる保持状態により、ワークＷの表面Ｗａのポリッシングに強弱の圧力差をもって有効に作用して、研磨工具１の表面１ａ（１ｂ）の平面形状を忠実にワークＷの表面（被研磨面）Ｗａに転写させながら鏡面に仕上げる。 As a result, the abrasive grains AG, AG,... Held by the polishing surface structure 6 are present on the polishing surface 20 which has been subjected to a matte treatment with a predetermined uniform surface roughness, and are scattered on the polishing surface 20. Are held well by the storage pockets 21, 21,... That are different from each other (the polishing surface 20 and the storage pockets 21, 21,...), So that the pressure on the polishing of the surface Wa of the workpiece W is strong. It works effectively with the difference, and finishes the mirror surface while faithfully transferring the planar shape of the surface 1a (1b) of the polishing tool 1 to the surface (surface to be polished) Wa of the workpiece W.
なお、上記研磨面構造６を構成する研磨面２０と収容ポケット２１、２１、…の具体的な構成（研磨面２０に施される梨地処理による表面粗さ、収容ポケット２１の形状寸法等）は、加工対象となる特定のワークＷを、特定の研磨スラリーＧＳ（砥粒ＡＧ、ＡＧ、ＡＧ、…）を用いて実際にポリッシングする実験を通じて、選択設定されることとなる。 The specific configuration of the polishing surface 20 and the storage pockets 21, 21,... Constituting the polishing surface structure 6 (surface roughness due to the matte treatment applied to the polishing surface 20, the shape dimensions of the storage pocket 21) is as follows. The specific workpiece W to be processed is selected and set through an experiment in which actual polishing is performed using a specific polishing slurry GS (abrasive grains AG, AG, AG,...).
一例として、対象となる研磨スラリーＧＳ中の砥粒ＡＧ、ＡＧ、ＡＧ、…の粒径が０．２５〜１０．０μｍであるのに対して、上記研磨面構造６の均一な梨地処理面である研磨面２０の表面粗さが、Ｒａ０．０１〜０．５μｍに設定されるとともに、クレーター形状の収容ポケット２１の形状寸法が、横１．０〜１００．０μｍ、縦１．０〜１００．０μｍ（または径寸法１．０〜１００．０μｍ）および深さ０．１〜１０．０μｍに設定されている。 As an example, the grain size of the abrasive grains AG, AG, AG,... In the target polishing slurry GS is 0.25 to 10.0 μm, whereas the polishing surface structure 6 has a uniform textured surface. The surface roughness of a certain polished surface 20 is set to Ra 0.01 to 0.5 μm, and the shape dimensions of the crater-shaped accommodation pocket 21 are 1.0 to 100.0 μm in width and 1.0 to 100.10 in length. It is set to 0 μm (or a diameter of 1.0 to 100.0 μm) and a depth of 0.1 to 10.0 μm.
図示の実施形態の研磨面構造６においては、対象となる研磨スラリーＧＳ中の砥粒ＡＧ、ＡＧ、ＡＧ、…の粒径が０．２５〜１０．０μｍであるのに対して、図３に示すように、上記研磨面２０の表面粗さが、Ｒａ０．０１〜０．５μｍに設定されるとともに、上記収容ポケット２１の形状寸法が、横寸法Ｘ（図２おけるＡ−Ａ線に平行な方向の寸法）が約１０μｍ、縦寸法Ｙ（図示しないが横寸法Ｘに直交する方向の寸法で、横寸法Ｘにほぼ対応）が約１０μｍ（≒径寸法Ｄが約１０μｍ）、および深さ寸法Ｚが約５μｍに設定されている。 In the polishing surface structure 6 of the illustrated embodiment, the grain size of the abrasive grains AG, AG, AG,... In the target polishing slurry GS is 0.25 to 10.0 μm, whereas FIG. As shown, the surface roughness of the polishing surface 20 is set to Ra 0.01 to 0.5 μm, and the shape dimension of the storage pocket 21 is set to a lateral dimension X (parallel to the line AA in FIG. 2). Direction dimension) of about 10 μm, vertical dimension Y (not shown, but in a direction perpendicular to the horizontal dimension X and substantially corresponding to the horizontal dimension X) is about 10 μm (≈ diameter dimension D is about 10 μm), and depth dimension Z is set to about 5 μm.
上記のように構成された研磨工具１は、具体的には、平坦な板ガラス５の表裏面５ａ、５ｂにサンドブラスト処理をそれぞれ施すことにより、上記研磨面構造６、６が形成される。 Specifically, in the polishing tool 1 configured as described above, the polishing surface structures 6 and 6 are formed by subjecting the front and back surfaces 5a and 5b of the flat plate glass 5 to sandblasting, respectively.
このサンドブラスト処理は、図示の実施形態においては以下の条件で行われる。
使用する研磨材：アルミナ（粒径：１６μｍ〜１６０μｍ）
研削圧力（噴射圧力）：０．０１Ｍｐａ〜０．５Ｍｐａ
加工時間：１０分〜６０分
加工後のフッ酸処理：なし
This sandblasting process is performed under the following conditions in the illustrated embodiment.
Abrasive used: Alumina (particle size: 16 μm to 160 μm)
Grinding pressure (injection pressure): 0.01 Mpa to 0.5 Mpa
Processing time: 10 to 60 minutes Hydrofluoric acid treatment after processing: None
特に、サンドブラスト処理における加工時間が研磨面構造６に与える影響は大きく、延いてはポリッシング加工時間およびポリッシングが施されるワークＷの表面Ｗａの性状（スクラッチやマイクロクラックの発生の有無等）にも大きく影響することが試験的に判明した。 In particular, the processing time in the sand blasting process has a great influence on the polished surface structure 6, and the polishing process time and the properties of the surface Wa of the workpiece W to be polished (whether or not scratches or microcracks are generated, etc.) It has been experimentally found to have a large effect.
つまり、加工時間が１０分よりも短いと、研磨面構造６の収容ポケット２１が少なく、一方、６０分よりも長いと、収容ポケット２１の形状寸法が大きくなり過ぎ、また配設数も多くなり過ぎる。加工時間が１０〜６０分の範囲では、研磨面構造６の研磨面の表面粗さが砥粒ＡＧ、ＡＧ、…の保持に適するとともに、収容ポケット２１の形成数と形状寸法が複数の砥粒ＡＧ、ＡＧ、…を収容保持するのに適し、またポリッシング加工時間が従来に比較して短くなり（つまり加工速度が速くなり）、ポリッシングが施されるワークＷの表面Ｗａのスクラッチやマイクロクラックの発生もないことが試験的に判明した。 That is, if the processing time is shorter than 10 minutes, the number of the storage pockets 21 of the polishing surface structure 6 is small. On the other hand, if the processing time is longer than 60 minutes, the shape dimensions of the storage pockets 21 become too large and the number of arrangements increases. Pass. When the processing time is in the range of 10 to 60 minutes, the surface roughness of the polishing surface of the polishing surface structure 6 is suitable for holding the abrasive grains AG, AG,... Suitable for accommodating and holding AG, AG,..., And the polishing time is shorter than before (that is, the processing speed is increased), and scratches and microcracks on the surface Wa of the workpiece W to be polished It was experimentally found that there was no occurrence.
しかして、以上のように構成されたポリッシング装置２において、回転するポリッシング定盤１０の研磨工具１上に、加圧装置１２により加圧されたワーク支持盤１１に支持されたワークＷを押し当て、ポリッシング定盤１０およびワーク支持盤１１を回転させながらワークＷの表面（下面）Ｗａにポリッシング加工が行われる。 Thus, in the polishing apparatus 2 configured as described above, the workpiece W supported by the workpiece support plate 11 pressurized by the pressure device 12 is pressed onto the polishing tool 1 of the rotating polishing table 10. The polishing process is performed on the surface (lower surface) Wa of the workpiece W while rotating the polishing surface plate 10 and the workpiece support plate 11.
このポリッシング加工の間、研磨液供給装置１３の供給ノズル１３ａから、研磨スラリーＧＳが上記研磨工具１上に適宜供給されて散布される。ワークＷは、回転するポリッシング定盤１０の研磨工具１上の偏心位置でワーク支持盤１１と共に自転することになり、ワークＷの表面Ｗａが押し付け擦り合わせながら全面を均一にポリッシング加工される。 During the polishing process, the polishing slurry GS is appropriately supplied from the supply nozzle 13a of the polishing liquid supply device 13 and dispersed on the polishing tool 1. The workpiece W rotates together with the workpiece support plate 11 at an eccentric position on the polishing tool 1 of the rotating polishing platen 10, and the entire surface of the workpiece W is uniformly polished while being pressed and rubbed.
次に、ワークＷの表裏面Ｗａ、Ｗｂが上下裏返しされて、ワークＷの裏面Ｗｂが下面となるように上記ワーク支持盤１１にセットされ、上記と同様に裏面（下面）Ｗｂにポリッシング加工が行われる。 Next, the front and back surfaces Wa and Wb of the work W are turned upside down and set on the work support board 11 so that the back surface Wb of the work W becomes the lower surface, and the back surface (lower surface) Wb is polished similarly to the above. Done.
以上詳述したように、本実施形態の研磨工具１は、回転するポリッシング定盤１０の研磨面１ａ上に、砥粒ＡＧ、ＡＧ、…と研磨液を混合してなる研磨スラリーＧＳを供給散布しながら、ワークＷを押し付け擦り合わせて研磨する遊離砥粒加工において、上記研磨定盤１０の研磨面１ａを形成するものであって、平坦な板ガラス５の表裏両面５ａ、５ｂにすりガラス状の凹凸を有する研磨面構造６、６が形成されてなり、これら研磨面構造６、６はそれぞれ、所定の均一な表面粗さの梨地処理を施された研磨面２０に、研磨スラリーＧＳの砥粒ＡＧを複数個捕獲収容し得る大きさの収容ポケット２１が散点状に設けられているから、以下に列挙するような優れた効果が発揮されて、形状精度が劣化することなく、ワークＷの表面Ｗａ（Ｗｂ）の高い平坦度および平行度を確保しつつ、その表面Ｗａ（Ｗｂ）を数オングストローム以下の表面粗さの鏡面に仕上げるとともに、マイクロクラックフリー等の要求を満たすことができる。 As described in detail above, the polishing tool 1 of the present embodiment supplies and disperses the polishing slurry GS formed by mixing the abrasive grains AG, AG,... And the polishing liquid onto the polishing surface 1a of the rotating polishing platen 10. On the other hand, in the free abrasive grain processing in which the workpiece W is pressed and rubbed and polished, the polishing surface 1a of the polishing platen 10 is formed, and ground glass-like irregularities are formed on the front and back surfaces 5a and 5b of the flat plate glass 5. The polishing surface structures 6 and 6 are formed, and the polishing surface structures 6 and 6 are respectively formed on the polishing surface 20 that has been subjected to a matte treatment with a predetermined uniform surface roughness, and abrasive grains AG of the polishing slurry GS. Since the storage pockets 21 having a size capable of capturing and storing a plurality of the storage pockets 21 are provided in the form of dots, the surface of the workpiece W can be obtained without any deterioration of the shape accuracy by exhibiting the excellent effects listed below. Wa (Wb) While ensuring a high degree of flatness and parallelism, with finish its surface Wa to (Wb) on the mirror surface of surface roughness of less than several angstroms, can meet the requirements such as a micro crack-free.
（ａ）平坦度特性に優れる板ガラス５の表裏面５ａ、５ｂに、すりガラス状の凹凸を有する研磨面構造６、６が形成されてなるから、形状精度を劣化させることなく、ワークＷの表面Ｗａを高い平坦度および平行度をもって研磨加工することができる。 (A) Since the polished surface structures 6 and 6 having ground glass-like irregularities are formed on the front and back surfaces 5a and 5b of the plate glass 5 having excellent flatness characteristics, the surface Wa of the workpiece W is not deteriorated. Can be polished with high flatness and parallelism.
（ｂ）板ガラス５の表裏両面５ａ、５ｂのすりガラス状の凹凸を有する研磨面構造６が、所定の均一な表面粗さの梨地処理を施された研磨面２０に、研磨スラリーＧＳの砥粒ＡＧを複数個捕獲収容し得る大きさの収容ポケット２１が散点状に設けられているから、上記研磨面２０が研磨スラリーＧＳの砥粒ＡＧを有効に保持することにより、研磨対象であるワークＷの表面Ｗａに砥粒ＡＧが有効に作用して、ワークＷの表面Ｗａから微量の切屑を取り去りつつ、従来の軟質樹脂製の研磨工具と同等の鏡面に仕上げることができ、研磨疵の発生を防止することができる。 (B) Abrasive surface structure 6 having ground glass-like irregularities on both front and back surfaces 5a and 5b of plate glass 5 is subjected to polishing surface 20 having a predetermined uniform surface roughness, and abrasive grains AG of polishing slurry GS. Since the storage pockets 21 having a size capable of capturing and storing a plurality of particles are provided in the form of dots, the polishing surface 20 effectively holds the abrasive grains AG of the polishing slurry GS, so that the workpiece W to be polished can be obtained. The abrasive grains AG effectively act on the surface Wa of the workpiece W, and while removing a small amount of chips from the surface Wa of the workpiece W, it can be finished to a mirror surface equivalent to that of a conventional soft resin polishing tool. Can be prevented.
（ｃ）本実施形態の研磨工具１の製造方法によれば、平坦な板ガラス５の表裏面５ａ、５ｂにサンドブラスト処理を施すことにより、上記研磨面構造６を形成するから、材料コストが低く、製造工程も少なく単純で、製造コストさらには製品コストの低減化が図れる。 (C) According to the manufacturing method of the polishing tool 1 of the present embodiment, the polishing surface structure 6 is formed by subjecting the front and back surfaces 5a and 5b of the flat plate glass 5 to sand blasting. The number of manufacturing processes is small and simple, and the manufacturing cost and the product cost can be reduced.
なお、上述した実施形態はあくまでも本発明の好適な実施態様を示すものであって、本発明はこれに限定されることなく、その範囲内で種々の設計変更が可能である。 Note that the above-described embodiment is merely a preferred embodiment of the present invention, and the present invention is not limited to this, and various design changes can be made within the scope thereof.
例えば、図示の実施形態においては、上記板ガラス５の表裏両面５ａ、５ｂに研磨面構造６、６がそれぞれ設けられて、研磨工具１を表裏１ａ、１ｂ裏返して２回使用できるいわゆるリバーシブル構造とされているが、目的に応じて、片面だけ使用できる構造としても良いことはもちろんである。 For example, in the illustrated embodiment, the front and back surfaces 5a and 5b of the plate glass 5 are provided with polishing surface structures 6 and 6, respectively, so that the polishing tool 1 can be used twice by turning the front and back 1a and 1b upside down. However, it is of course possible to adopt a structure that can be used only on one side according to the purpose.
また、図示の実施形態においては、ポリッシング加工に使用される研磨工具１について説明したが、本発明の研磨工具はラッピング加工用の研磨工具としても適用可能である。具体的には、本発明の研磨工具は、特にシリコンウェーハ等の製造において、最終工程としてのポリッシング加工だけでなく、その前工程のウェーハ表面の高い平坦度を得るラッピング加工にも適用可能であり、汎用性に富む。 In the illustrated embodiment, the polishing tool 1 used for the polishing process has been described. However, the polishing tool of the present invention can also be applied as a polishing tool for lapping. Specifically, the polishing tool of the present invention can be applied not only to the polishing process as a final process, but also to the lapping process for obtaining high flatness of the wafer surface in the previous process, particularly in the manufacture of silicon wafers and the like. Rich in versatility.
さらに、ポリッシング装置２の具体的構造も、図示の実施形態に限定されず、同様の機能を有する他の構造も採用可能である。 Furthermore, the specific structure of the polishing apparatus 2 is not limited to the illustrated embodiment, and other structures having similar functions can be employed.
一例として、図示の実施形態のポリッシング装置２は、ポリッシング定盤１０の上にワークＷを載せるとともに、その隙間に研磨スラリーＧＳを供給分散して擦り合わせながらワークＷを研磨していくいわゆる片面タイプであるが、具体的には図示しないが、ワークＷの上下両面Ｗａ、Ｗｂを２つのポリッシング定盤１０、１０で挟み込み、上下両面Ｗａ、Ｗｂを同時に研磨するいわゆる両面タイプも採用可能である。 As an example, the polishing apparatus 2 of the illustrated embodiment is a so-called single-sided type in which the workpiece W is placed on the polishing surface plate 10 and the workpiece W is polished while supplying and dispersing the polishing slurry GS in the gap. However, although not specifically illustrated, a so-called double-sided type in which the upper and lower surfaces Wa and Wb of the work W are sandwiched between two polishing surface plates 10 and 10 and the upper and lower surfaces Wa and Wb are simultaneously polished can be employed.
Ｗ ワーク（工作物）
Ｗａ、Ｗｂ ワークの表裏面（被研磨面）
ＳＧ 研磨スラリー
ＡＧ 砥粒
１ 研磨工具
１ａ 研磨工具の研磨面
２ ポリッシング装置（遊離砥粒加工装置）
５ 板ガラス
５ａ、５ｂ 板ガラスの表裏面
６ 研磨面構造
１０ ポリッシング定盤（研磨定盤）
１１ ワーク支持盤
１２ 加圧装置（加圧手段）
１３ 研磨液供給装置（研磨液供給手段）
１３ａ 供給ノズル
１４ 制御装置（制御手段）
２０ 研磨面構造の研磨面
２１ 研磨面構造の収容ポケット
W Work (Workpiece)
Wa, Wb Front and back surfaces of workpiece (surface to be polished)
SG Polishing slurry AG Abrasive grain 1 Polishing tool 1a Polishing surface 2 of polishing tool Polishing device (free abrasive processing device)
5 plate glass 5a, 5b front and back of plate glass 6 polishing surface structure 10 polishing surface plate (polishing surface plate)
11 Work support board 12 Pressurizing device (pressurizing means)
13 Polishing liquid supply device (polishing liquid supply means)
13a Supply nozzle 14 Control device (control means)
20 Polishing surface 21 with polishing surface structure Storage pocket with polishing surface structure
Claims (8)
平坦な板ガラス表面に研磨面構造が形成されてなり、
この研磨面構造は、所定の均一な表面粗さの梨地処理を施された研磨面に、研磨スラリーの砥粒を複数個層状に捕獲収容し得る大きさの収容ポケットが散点状に設けられてなる
ことを特徴とする遊離砥粒加工用研磨工具。 Polishing of the polishing surface plate in the free abrasive processing, in which a workpiece is pressed against and rubbed while supplying and dispersing a polishing slurry formed by mixing abrasive particles and a polishing liquid on the polishing surface of a rotating polishing surface plate Forming a surface,
A polished surface structure is formed on the flat plate glass surface,
This polishing surface structure is provided with a plurality of storage pockets in the form of dots on a polishing surface that has been subjected to a satin finish treatment with a predetermined uniform surface roughness and is capable of capturing and storing a plurality of abrasive grains of polishing slurry in layers. comprising Te <br/> be loose-abrasive machining polishing tool according to claim.
ことを特徴とする請求項１に記載の遊離砥粒加工用研磨工具。 In a state where the workpiece is pressed against the surface of the plate glass, the surface roughness of the polishing surface of the polishing surface structure effectively holds the abrasive grains in the polishing slurry dispersed between the polishing surface and the workpiece. 2. The loose abrasive machining according to claim 1, wherein the accommodation pocket is set to have a shape and dimension in which a plurality of abrasive grains in the polishing slurry are accommodated and held in layers. Polishing tool.
前記研磨面構造の研磨面の表面粗さがＲａ０．０１〜０．５μｍに設定されるとともに、収容ポケットの形状寸法が横１．０〜１００．０μｍ、縦１．０〜１００．０μｍおよび深さ０．１〜１０．０μｍに設定されている
ことを特徴とする請求項１または２に記載の遊離砥粒加工用研磨工具。 Whereas the particle size of the abrasive grains in the polishing slurry to be targeted is 0.25 to 10.0 μm,
The surface roughness of the polished surface of the polished surface structure is set to Ra 0.01 to 0.5 μm, and the shape dimensions of the storage pocket are 1.0 to 100.0 μm in width, 1.0 to 100.0 μm in length, and depth. loose-abrasive machining polishing tool according to claim 1 or 2, characterized in that it is set to be 0.1～10.0Myuemu.
ことを特徴とする請求項１から３のいずれか一つに記載の遊離砥粒加工用研磨工具。The polishing tool for loose abrasive machining according to any one of claims 1 to 3, wherein
ことを特徴とする請求項１から３のいずれか一つに記載の遊離砥粒加工用研磨工具。 The polishing tool for loose abrasive machining according to any one of claims 1 to 3 , wherein the polishing surface structure is provided on both front and back surfaces of the plate glass.
平坦な板ガラス表面にサンドブラスト処理を施すことにより、請求項１から５のいずれか一つに記載の遊離砥粒加工用研磨工具の研磨面構造を形成する
ことを特徴とする遊離砥粒加工用研磨工具の製造方法。 A method for producing a polishing tool used for loose abrasive machining,
Polishing for free abrasive processing , characterized in that the polishing surface structure of the polishing tool for free abrasive processing according to any one of claims 1 to 5 is formed by subjecting a flat plate glass surface to sandblasting. Tool manufacturing method.
使用する研磨材：アルミナ（粒径：１６μｍ〜１６０μｍ）
研削圧力（噴射圧力）：０．０１Ｍｐａ〜０．５Ｍｐａ
加工時間：１０分〜６０分 The said sandblasting process is performed on condition of the following, The manufacturing method of the polishing tool for loose abrasives processing of Claim 6 characterized by the above-mentioned.
Abrasive used: Alumina (particle size: 16 μm to 160 μm)
Grinding pressure (injection pressure): 0.01 Mpa to 0.5 Mpa
Processing time: 10-60 minutes
回転可能に設けられて、その上面に研磨工具を取外し可能に備える研磨定盤と、
この研磨定盤を回転駆動する定盤回転手段と、
前記研磨定盤の回転中心と偏心した上方位置に回転可能に設けられて、その下面に工作物を取外し可能に支持するワーク支持盤と、
このワーク支持盤を回転駆動するワーク回転手段と、
前記工作物を前記研磨定盤に対して相対的に加圧する加圧手段と、
前記研磨定盤上の研磨工具に対して研磨スラリーを供給する研磨液供給手段と、
前記定盤回転手段、ワーク回転手段、加圧手段および研磨液供給手段を連動して制御する制御手段とを備えてなり、
前記研磨工具は、請求項１〜５のいずれか一つに記載の研磨工具からなる
ことを特徴とする遊離砥粒加工装置。 While supplying and dispersing a polishing slurry made by mixing abrasive grains and polishing liquid between the relatively moving polishing platen and the workpiece, the workpiece is pressed against the polishing platen and rubbed to rub the workpiece. An abrasive processing device,
A polishing platen that is rotatably provided and has a polishing tool detachable on its upper surface;
A platen rotating means for rotating the polishing platen;
A workpiece support plate that is rotatably provided at an upper position that is eccentric to the rotation center of the polishing surface plate, and that supports a workpiece removably on its lower surface;
A workpiece rotating means for rotationally driving the workpiece support plate;
Pressurizing means for pressurizing the workpiece relative to the polishing surface plate;
A polishing liquid supply means for supplying a polishing slurry to a polishing tool on the polishing surface plate;
A control means for controlling the surface plate rotating means, the work rotating means, the pressurizing means and the polishing liquid supplying means in conjunction with each other,
The said abrasive | polishing tool consists of the abrasive | polishing tool as described in any one of Claims 1-5, The loose abrasive processing apparatus characterized by the above-mentioned.
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