JPS61284075A - Multilayer-structure electric connection terminal - Google Patents

Multilayer-structure electric connection terminal

Info

Publication number
JPS61284075A
JPS61284075A JP12421885A JP12421885A JPS61284075A JP S61284075 A JPS61284075 A JP S61284075A JP 12421885 A JP12421885 A JP 12421885A JP 12421885 A JP12421885 A JP 12421885A JP S61284075 A JPS61284075 A JP S61284075A
Authority
JP
Japan
Prior art keywords
connection terminal
contact
electrical connection
multilayer
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12421885A
Other languages
Japanese (ja)
Other versions
JPH0521317B2 (en
Inventor
古屋 清人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DDK Ltd
Original Assignee
DDK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DDK Ltd filed Critical DDK Ltd
Priority to JP12421885A priority Critical patent/JPS61284075A/en
Publication of JPS61284075A publication Critical patent/JPS61284075A/en
Publication of JPH0521317B2 publication Critical patent/JPH0521317B2/ja
Granted legal-status Critical Current

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  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は電気コネクタ、スイッチ、リレー等の電気接続
端子、特に導電性の高い金属(以下「導電材料」という
)とばね性の優れた金属(以下「ばね材料」という)間
に、プラスチックを介在させた積層材からなる電気接続
端子の接触部の構造に関するものである。
[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to electrical connection terminals such as electrical connectors, switches, and relays, particularly metals with high conductivity (hereinafter referred to as "conductive materials") and metals with excellent spring properties. The present invention relates to the structure of the contact portion of an electrical connection terminal made of a laminated material with plastic interposed therebetween (hereinafter referred to as "spring material").

(従来の技術)  。(Conventional technology).

コネクタ、リレーやスイッチ等に使用される電気接続端
子は、その性格上高い導電性と高いぼね    性を兼
ね備えていることが要求される。しかし、この二つの要
件を同時に満足させる金属材料は現在のところ知られて
いない。そこで、本発明者等は、導電性の高い導電性付
与金属層とばね性の優れたばね性付与金属層とを、その
間にプラスチック層を介して積層した電気接続端子形成
材を提案した(例えば、特願昭59−139499参照
)。
Electrical connection terminals used in connectors, relays, switches, etc. are required to have both high conductivity and high elasticity due to their nature. However, no metal material is currently known that satisfies these two requirements at the same time. Therefore, the present inventors have proposed an electrical connection terminal forming material in which a conductivity-imparting metal layer with high conductivity and a spring-imparting metal layer with excellent spring properties are laminated with a plastic layer interposed therebetween (for example, (See patent application No. 59-139499).

(発明が解決しようとする問題点) 近年の電子技術の進歩に伴う電子機器の小形化は、接続
端子の小形化をも要求している。しかし、電子機器又は
その一部として使用される例えばコネクタ、スイッチ、
リレー等の接続端子は、小形化する程接触部の接触圧力
も小さくなるので、接触圧力によって左右されるばね圧
を利用した接触端子の接続信転性は接続端子の小形化に
より低下する傾向にある。
(Problems to be Solved by the Invention) The miniaturization of electronic devices accompanying the recent advances in electronic technology has also required miniaturization of connection terminals. However, for example, connectors, switches, etc. used as electronic equipment or a part thereof,
As connection terminals such as relays become smaller, the contact pressure at the contact part also decreases, so the connection reliability of contact terminals that utilize spring pressure, which is influenced by contact pressure, tends to decrease as connection terminals become smaller. be.

(発明の目的およびその達成手段) 本発明は斯る点に鑑みてなされたもので、接続端子が小
形化されても単位接触面積当たりの接触圧力を従来と同
等又はそれ以上の大きさにできる接続部の構造を提供す
ることを目的とし、これは接続端子接触部の接触面積を
小にすることによる単位接触面積当たりの接触圧力の増
大により達成される。
(Object of the invention and means for achieving the same) The present invention has been made in view of the above points, and even if the connecting terminal is downsized, the contact pressure per unit contact area can be made equal to or greater than that of the conventional one. The object is to provide a structure of the connection part, which is achieved by increasing the contact pressure per unit contact area by reducing the contact area of the connection terminal contact part.

以下図面に基づきその詳細を説明する。第1図は、コネ
クタの接続端子を、プリント回路板の端子に接触させた
状態を示した側面図、第2図は多層構造の接続端子の接
触部において、ばね材料が他の層に接着しない接続端子
を示した斜視図、第3図および第4図はそれぞれ本発明
の一実施例を示す断面図、第5図(a)〜(f)はそれ
ぞれ本発明の要部をなす接触部に設ける凸出部の他の変
形例を示す斜視図、第6図(a)〜(jりはそれぞれ単
極としての接続端子例の斜視図、第7図(ホ)、(n)
はそれぞれ多数の接続端子を一体にしたいわゆる多極接
続端子例の斜視図である。
The details will be explained below based on the drawings. Figure 1 is a side view showing the connection terminal of the connector in contact with the terminal of the printed circuit board, and Figure 2 is the contact area of the multi-layered connection terminal where the spring material does not adhere to other layers. A perspective view showing a connection terminal, FIGS. 3 and 4 are sectional views each showing an embodiment of the present invention, and FIGS. A perspective view showing another modification of the protrusion to be provided, FIGS. 6(a) to (j) are perspective views of examples of connection terminals as single poles, and FIGS. 7(e) and (n).
1 is a perspective view of an example of a so-called multi-polar connection terminal in which a large number of connection terminals are integrated.

第1図は接続端子(1)をプリント回路板(6)の端子
(7)に接触させた状態を示したもので、第1図におい
て、接続端子(1)のテール部(8)の導電材料(3)
に半田付aυ等によって接続された。図示していない電
気回路や電源等につながる電! (91とプリント回路
板(6)との電気的な接続を、接続端子(1)を介して
、接続端子(1)のばね圧によって、導電材料(3)を
プリント回路板(6)の端子(7)に押し付けることに
よって行う。
Figure 1 shows the connection terminal (1) in contact with the terminal (7) of the printed circuit board (6). Material (3)
It was connected to by soldering aυ etc. Electricity connected to electrical circuits and power supplies not shown! (The electrical connection between 91 and the printed circuit board (6) is established through the connecting terminal (1) by applying the conductive material (3) to the terminal of the printed circuit board (6) by the spring pressure of the connecting terminal (1). (7) This is done by pressing it against the surface.

第1図の例では、接続端子(1)は平板状のものを長手
方向に曲げて円弧状に接触部(5)を形成しているので
、接続端子(1)とプリント回路板(6)との接触は、
円弧状の接触部(5)のプリント回路板(6)との接触
点において、接触部(5)の幅を最大の長さとする線状
の接触となる。第2図は、多層構造の接続端子の斜視図
で接続端子の接触部において、ばね材料を接着しない接
続端子の一例を示している。すなわち接続端子(1)は
、ポリエステルやポリイミド等の厚さ10〜100μm
のプラスチック・フィルム(2)に、導電材料として厚
さ5〜50μmの金箔、銅箔。
In the example shown in Fig. 1, the connecting terminal (1) is a flat plate which is bent in the longitudinal direction to form an arc-shaped contact portion (5), so that the connecting terminal (1) and the printed circuit board (6) Contact with
At the contact point of the arcuate contact portion (5) with the printed circuit board (6), a linear contact is formed with the width of the contact portion (5) being the maximum length. FIG. 2 is a perspective view of a multilayered connecting terminal, and shows an example of a connecting terminal in which a spring material is not bonded to the contact portion of the connecting terminal. That is, the connection terminal (1) is made of polyester, polyimide, etc. with a thickness of 10 to 100 μm.
plastic film (2), gold foil or copper foil with a thickness of 5 to 50 μm as a conductive material.

銀箔、アルミニウム箔等(3)を全面に渡って接着した
積層材料のプラスチック・フィルム(2)の面に、ステ
ンレス鋼や銅合金等からなる厚さ50〜300μmのば
ね材料(4)を、接続端子(1)の接触部(5)を残し
て接着したものである。プラスチック・フィルム(2)
とw4P& (3)やプラスチック・フィルム(2)と
ステンレス鋼(4)との接着は、加熱や超音波等による
融着または熱融着性接着剤等種々の接着剤によって行う
ことができる。また接続端子(1)の接触部(5)の曲
げ加工は、プラスチック・フィルム(2)に銅箔(3)
を貼り合わせた積層材料とステンレス鋼(4)を接着す
る前に個々に行っても、接着した後に行っても良い。
A spring material (4) with a thickness of 50 to 300 μm made of stainless steel, copper alloy, etc. is connected to the surface of the plastic film (2), which is a laminated material with silver foil, aluminum foil, etc. (3) adhered over the entire surface. The contact portion (5) of the terminal (1) is left intact and bonded. Plastic film (2)
and w4P& (3) or the plastic film (2) and the stainless steel (4) can be bonded by fusion by heating, ultrasonic waves, etc., or by various adhesives such as a heat-fusible adhesive. In addition, the contact part (5) of the connection terminal (1) is bent using copper foil (3) on the plastic film (2).
It may be performed individually before adhering the laminated material and the stainless steel (4), or may be performed after adhering.

第3図は本発明の一実施例の断面図で、接触部(5)の
中央部においてその導電材料(3)とばね材料(4)の
双方に半球状の凸出部αのを設けることによって接続端
子(1)とプリント回路板との接触を点で行うことがで
きる。
FIG. 3 is a sectional view of an embodiment of the present invention, in which a hemispherical protrusion α is provided on both the conductive material (3) and the spring material (4) at the center of the contact portion (5). This allows point contact between the connecting terminal (1) and the printed circuit board.

第4図は本発明の他の実施例の断面図で、凸出部(至)
をばね材料(4)の側にのみ設けたものであるが、第3
図の場合は凸出部α〔が柔らかい導電材料のため凸出部
(至)がプリント回路板等との着脱時に急激に摩耗して
しまい、僅かな着脱回数で実質的に凸出部α〔としての
用をなさないおそれがあるのに対し、第4図の場合はそ
のおそれはなく、ばね材料(4)に設けた凸出部αので
導電材料(4)をプリント回路板等に実質的に点に近い
微小な面積で接触させることができる。なおばね材料(
4)とプラスチック・フィルム(2)との間には図示の
ように接触部(5)において隙間があるが、これはこの
部分における凸出部側の設置を容易にするのに役立つこ
とは勿論である。
FIG. 4 is a cross-sectional view of another embodiment of the present invention, showing the convex portion (toward).
is provided only on the spring material (4) side, but the third
In the case shown in the figure, since the protruding part α [ is made of a soft conductive material, the protruding part (to) is rapidly worn out when it is attached to and detached from a printed circuit board, etc., and the protruded part α [ However, in the case of Fig. 4, there is no such risk, and the convex portion α provided on the spring material (4) effectively prevents the conductive material (4) from attaching to the printed circuit board, etc. can be brought into contact with a small area close to a point. Furthermore, spring material (
4) and the plastic film (2), there is a gap at the contact area (5) as shown in the figure, which of course helps to facilitate the installation of the protrusion side in this area. It is.

なお凸出部Q(Itの形状は半円球とする外、第5図山
)〜(f)に示したように円錐形、多角錐形、三角形等
の切り起しゃ先端部の曲げ起し等、所要の形状とするこ
とができる。また凸出部α呻の先端の形状は必ずしも鋭
角に限定するものでは無く、必要に応じて先端部に丸み
を付けたり、平坦部を設けるようにしても良い。また凸
出部0ωは、ばね材料(4)の所要の場所に必要な数だ
け設けることができる。
In addition, if the convex part Q (It is assumed that the shape is a semicircular sphere, and the shape of the cone, polygonal pyramid, triangle, etc. is cut and raised as shown in Figure 5) to (f), the tip of the protrusion is bent and raised. etc., it can be made into any desired shape. Further, the shape of the tip of the protruding portion α is not necessarily limited to an acute angle, and the tip may be rounded or provided with a flat portion as necessary. Further, the protruding portions 0ω can be provided in required numbers at required locations on the spring material (4).

また第4図の実施例ではばね材料(4)を、接触部(5
)を残してプラスチック層(2)に接着し、一体の接続
端子(1)としたが、ばね材料(4)を接着することな
く、単にプラスチック層(2)に重ね合わせたり、重ね
合わせた後に一部を折曲げることによって一体にしたり
、接続端子(13に貫通する穴や切欠きを設けて、接続
端子(1)を組み込むケースに設けた凸出部にはめ込む
ことによって一体にすることができる。
Further, in the embodiment shown in FIG. 4, the spring material (4) is
) was glued to the plastic layer (2) to form an integral connection terminal (1), but the spring material (4) was simply superimposed on the plastic layer (2) without bonding, or after the spring material (4) was superimposed on the plastic layer (2). It can be integrated by bending a part of it, or it can be integrated by providing a hole or notch through the connecting terminal (13) and fitting it into a protrusion provided in a case in which the connecting terminal (1) is installed. .

また接続端子(11としては第2図に示した例の外、第
6図(al〜(12)及び第7図(ロ)、(n)で示し
た多極端子のように種々あるが、本発明はその何れにも
適用しうろことは言うまでもない。
In addition to the example shown in Fig. 2, there are various connection terminals (11), such as the multi-pole terminals shown in Fig. 6 (al to (12)) and Fig. 7 (b) and (n). It goes without saying that the present invention can be applied to any of them.

また本発明の接続端子は、所要の形状に成形したプラス
チック部品等に組み込むことによって、コネクタ、スイ
ッチ、リレー等の電気機器の接続端子として利用するこ
とができることは勿論である。
Furthermore, it goes without saying that the connection terminal of the present invention can be used as a connection terminal for electrical equipment such as connectors, switches, and relays by incorporating it into a plastic component molded into a desired shape.

(発明の作用効果) 以上の説明から明らかなように、本発明によるときは接
触部に凸出部を設けて接触面積を小さくしているので、
単位面積当たりの接触圧力の低下を防止しうろことは勿
論、増すことも出来るもので、従って多層構造の電気接
続端子の小形化に伴う接続の信顧性すなわち接触圧力に
左右される接続の信頼性の低下を簡単に防ぐことが出来
る。
(Operations and Effects of the Invention) As is clear from the above description, in the present invention, the contact area is provided with a protrusion to reduce the contact area.
Of course, it is possible to prevent the contact pressure per unit area from decreasing, but it can also be increased. Therefore, as the electrical connection terminal with a multilayer structure becomes smaller, the reliability of the connection, that is, the reliability of the connection that depends on the contact pressure, increases. Sexual decline can be easily prevented.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はコネクタの接続端子をプリント回路板の端子に
接触させた状態を示した側面図、第2図は多層構造の電
気接続端子の斜視図、第3図及び第4図はそれぞれ本発
明の実施例の断面図、第5図(a=f)はそれぞれ接続
端子の接触部に設ける凸出部の実施例斜視図、第6図(
a −1)はそれぞれ単極接触子例図、第7図(翔〜n
)はそれぞれ多極接触子側斜視図である。 1・・・電気接触子、2・・・プラスチック材料、3・
・・導電材料、4・・・ばね材料、5・・・接触子、6
・・・プリント回路板、7・・・プリント回路板の端子
、8・・・接触子のテール部、9・・・電線、10・・
・接触子の接触部に設けた凸出部、11・・・半田接着
Fig. 1 is a side view showing the connection terminal of the connector in contact with the terminal of the printed circuit board, Fig. 2 is a perspective view of the electrical connection terminal with a multilayer structure, and Figs. 3 and 4 are each according to the present invention. FIG. 5 (a=f) is a cross-sectional view of the embodiment, and FIG.
a-1) is an example of a single-pole contact, and Figure 7 (Sho~n
) are perspective views of the multipolar contactor side, respectively. 1... Electric contact, 2... Plastic material, 3...
...Conductive material, 4...Spring material, 5...Contactor, 6
...Printed circuit board, 7...Terminal of printed circuit board, 8...Tail part of contact, 9...Electric wire, 10...
・Convex part provided on the contact part of the contactor, 11...Solder adhesion.

Claims (5)

【特許請求の範囲】[Claims] (1)導電材料とばね材料をプラスチック材料を介して
積層した接続端子において、その接触部に凸出部を設け
たことを特徴とする多層構造の電気接続端子。
(1) An electrical connection terminal with a multilayer structure, characterized in that a contact portion of the connection terminal is formed by laminating a conductive material and a spring material with a plastic material interposed therebetween, and a protruding portion is provided at the contact portion.
(2)凸出部を導電材料側とばね材料側の双方に設けた
ことを特徴とする特許請求の範囲第1項記載の多層構造
の電気接続端子。
(2) The multilayer electrical connection terminal according to claim 1, characterized in that the protruding portions are provided on both the conductive material side and the spring material side.
(3)凸出部をばね材料側のみに設けたことを特徴とす
る特許請求の範囲第1項記載の多層構造の電気接続端子
(3) The multilayer electrical connection terminal according to claim 1, characterized in that the protrusion is provided only on the spring material side.
(4)ばね材料は接触部ではプラスチック材に接着しな
いように構成したことを特徴とする特許請求の範囲第1
項記載の多層構造の電気接続端子。
(4) Claim 1, characterized in that the spring material is configured so that it does not adhere to the plastic material at the contact portion.
Multi-layered electrical connection terminal as described in Section 1.
(5)コネクタ、スイッチ、リレーの電気接続端子とし
て組込まれた特許請求の範囲第1項記載の多層構造の電
気接続端子。
(5) The multilayer electrical connection terminal according to claim 1, which is incorporated as an electrical connection terminal for a connector, switch, or relay.
JP12421885A 1985-06-10 1985-06-10 Multilayer-structure electric connection terminal Granted JPS61284075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12421885A JPS61284075A (en) 1985-06-10 1985-06-10 Multilayer-structure electric connection terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12421885A JPS61284075A (en) 1985-06-10 1985-06-10 Multilayer-structure electric connection terminal

Publications (2)

Publication Number Publication Date
JPS61284075A true JPS61284075A (en) 1986-12-15
JPH0521317B2 JPH0521317B2 (en) 1993-03-24

Family

ID=14879915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12421885A Granted JPS61284075A (en) 1985-06-10 1985-06-10 Multilayer-structure electric connection terminal

Country Status (1)

Country Link
JP (1) JPS61284075A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250221A (en) * 1995-03-15 1996-09-27 Nec Corp Receiving side connector
JP2007012618A (en) * 2005-06-30 2007-01-18 Hitachi-Lg Data Storage Korea Inc Terminal and connector using the same
JP2009104915A (en) * 2007-10-24 2009-05-14 Kel Corp Connector
JP2011082007A (en) * 2009-10-07 2011-04-21 Japan Aviation Electronics Industry Ltd Contact and connection device equipped with the same
JP2014067706A (en) * 2012-09-05 2014-04-17 Iriso Electronics Co Ltd Connector
JP2018500746A (en) * 2014-12-30 2018-01-11 ギブソン ブランズ インコーポレイテッド Multi-contact jack

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6119080A (en) * 1984-07-05 1986-01-27 第一電子工業株式会社 Electric contactor forming material
JPH0361313A (en) * 1989-07-28 1991-03-18 Nisshin Steel Co Ltd Repairing device for rh furnace

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6119080A (en) * 1984-07-05 1986-01-27 第一電子工業株式会社 Electric contactor forming material
JPH0361313A (en) * 1989-07-28 1991-03-18 Nisshin Steel Co Ltd Repairing device for rh furnace

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250221A (en) * 1995-03-15 1996-09-27 Nec Corp Receiving side connector
JP2007012618A (en) * 2005-06-30 2007-01-18 Hitachi-Lg Data Storage Korea Inc Terminal and connector using the same
JP2009104915A (en) * 2007-10-24 2009-05-14 Kel Corp Connector
JP2011082007A (en) * 2009-10-07 2011-04-21 Japan Aviation Electronics Industry Ltd Contact and connection device equipped with the same
JP2014067706A (en) * 2012-09-05 2014-04-17 Iriso Electronics Co Ltd Connector
JP2014067723A (en) * 2012-09-05 2014-04-17 Iriso Electronics Co Ltd Connector
US9281594B2 (en) 2012-09-05 2016-03-08 Iriso Electronics Co., Ltd. Connector
JP2018500746A (en) * 2014-12-30 2018-01-11 ギブソン ブランズ インコーポレイテッド Multi-contact jack
GB2548517B (en) * 2014-12-30 2021-09-01 Gibson Brands Inc Multiple contact jack

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