JPS61281088A - High machine processability ceramic composite body - Google Patents
High machine processability ceramic composite bodyInfo
- Publication number
- JPS61281088A JPS61281088A JP11962585A JP11962585A JPS61281088A JP S61281088 A JPS61281088 A JP S61281088A JP 11962585 A JP11962585 A JP 11962585A JP 11962585 A JP11962585 A JP 11962585A JP S61281088 A JPS61281088 A JP S61281088A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- ceramic composite
- ceramic
- volume
- composite according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、機械加工性に優れたセラミック複合体に関し
、特に本発明は、電子回路用基板材料として好適なスル
ーホール等を形成するためのドリル削孔性に優れたセラ
ミック複合体に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a ceramic composite with excellent machinability, and in particular, the present invention relates to a ceramic composite with excellent machinability. This article relates to a ceramic composite with excellent drilling properties.
従来、電子回路用基板材料としては、それぞれの目的に
応じて棚々の材料が使用されているが、なかでも機械的
強度、優れた電気絶縁性および寸法安定性が要求される
用途に対しては、アルミナ、ムライト、ベリリア、低温
焼成セラミックなどの焼結体よりなるセラＺｑり基板が
用いられている。Conventionally, a variety of materials have been used as substrate materials for electronic circuits, depending on the purpose. In this method, a ceramic ceramic substrate made of a sintered body of alumina, mullite, beryllia, low-temperature fired ceramic, etc. is used.
しかしながら、前述の如きセラミック焼結体はいずれも
硬度が高く機械加工性に著しく劣るため、特にスルーホ
ールが設けられる基板においては、あらかじめ生成形体
の段階で金型によるパンチングなどの手段によって孔あ
け加工した後焼成する方法が一般に行なわれている。However, all of the ceramic sintered bodies mentioned above have high hardness and are extremely poor in machinability, so in particular for substrates where through holes are to be provided, holes must be punched by means such as punching with a mold in advance at the stage of the formed body. A commonly used method is to carry out baking after heating.
しかしながら、通常セラミックは焼成時に焼成収縮を伴
うため、高い寸法精度の要求されるような場合にはこの
方法を適用することが困難であった。However, since ceramics usually undergo firing shrinkage during firing, it has been difficult to apply this method to cases where high dimensional accuracy is required.
本発明は、前述の如き欠点を解決することのできる電子
回路用基板材料として好適なセラミック複合体、すなわ
ち機械加工性に優れたセラｉ７り複合体を提供すること
を目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a ceramic composite suitable as a substrate material for electronic circuits that can solve the above-mentioned drawbacks, that is, a ceramic composite with excellent machinability.
本発明によれば、平均粒径が１０μｍ以下の結晶粒子が
三次元網目構造に結合してなるセラミック多孔質体の開
放気孔中に樹脂が充填されていることを特徴とする機械
加工性に優れたセラミック複合体によって前記目的を達
成することができる。According to the present invention, the ceramic porous body is formed by combining crystal particles with an average particle size of 10 μm or less into a three-dimensional network structure, and the open pores are filled with resin, which has excellent machinability. This objective can be achieved by means of a ceramic composite.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明のセラミック複合体は、平均粒径が１０μｍ以下
の結晶粒子が三次元網目構造に結合してなるセラミック
多孔質体の開放気孔中に樹脂が充填されているものであ
ることが必要である。The ceramic composite of the present invention must have a resin filled in the open pores of a ceramic porous body formed by crystal grains with an average particle size of 10 μm or less bonded into a three-dimensional network structure. .
その理由は、従来知られている緻密質セラミック焼結体
は硬度が高く機械加工性に極めて劣るものであるが、本
発明の平均粒径が１０μｍ以下の結晶粒子が三次元網目
構造に結合してなるセラミック多孔質体は機械加工性が
極めて良好で容易に精密な加工を施すことができるから
であり、また樹脂を開放気孔中に充填することにより、
前記機械加工性を劣化させることなく多孔質体の強度を
向上させることができ、さらに電子回路用基板として不
可欠な気体不透過性を付与することができるからである
。The reason for this is that conventionally known dense ceramic sintered bodies have high hardness and extremely poor machinability, but the crystal grains of the present invention with an average grain size of 10 μm or less are combined into a three-dimensional network structure. This is because the ceramic porous body made of resin has extremely good machinability and can be easily processed with precision, and by filling the open pores with resin,
This is because the strength of the porous body can be improved without deteriorating the machinability, and further, gas impermeability, which is essential for an electronic circuit board, can be imparted.
本発明のセラミック複合体は、特にドリル削孔性に優れ
ているものであることが好ましい。その理由は、本発明
のセラミック複合体は主としてスルーホール等を有する
電子回路用基板材料としての使用に適するものであり、
ドリル削孔性に優れることにより任意の箇所にスルーホ
ールを容易に形成することができるからである。It is preferable that the ceramic composite of the present invention has particularly excellent drilling properties. The reason is that the ceramic composite of the present invention is mainly suitable for use as a substrate material for electronic circuits having through holes etc.
This is because through-holes can be easily formed at any location due to excellent drilling properties.
本発明のセラミック多孔質体の開放気孔率は１０〜７０
容積％の範囲内であることが好ましい。The open porosity of the ceramic porous body of the present invention is 10 to 70.
It is preferably within the range of volume %.
その理由は、開放気孔率が１０容梼％より少ないと機械
加工性が著しく劣化するからであり、一方７０容槓％よ
り大きいと実質的な強度が殆どなくなり、取扱中にこわ
れ易くなるばかりでなく電子回路用基板材料として重要
な熱伝導率が著しく劣化するからである。The reason for this is that if the open porosity is less than 10% by volume, the machinability will be significantly degraded, while if it is greater than 70% by volume, there will be almost no substantial strength and it will only break easily during handling. This is because the thermal conductivity, which is important as a substrate material for electronic circuits, deteriorates significantly.
本発明のセラ２ツク多孔質体はＡＩｈＯｓ、Ｓ ｉｏ２
、Ｚｒ０ｚ、ＭｆＯ１Ｆｅｚ０３、Ｔｉ０ｚ、５ｉｓＮ
４あるいはＡＩＮより選択されるいずれか少なくとも１
種を主として含有するもの全使用することができる。The ceramic porous body of the present invention is made of AIhOs, Sio2
, Zr0z, MfO1Fez03, Ti0z, 5isN
At least one selected from 4 or AIN
All those containing mainly seeds can be used.
前記多孔質体に充填する樹脂としては、エポキシ樹脂、
ポリイミド樹脂、トリマシン樹脂、ポリパラパン酸樹脂
、ポリアミドイミド樹脂、シリコン樹脂、エポキシシリ
コン樹脂、アクリル酸樹脂、メタクリル酸樹脂、アニリ
ン酸樹脂、フェノール樹脂、ウレタン系樹脂、フラン系
樹脂、フッ素樹脂、アセタール樹脂、ポリアミド樹脂、
ポリエチレン樹脂、ポリカーボネート樹脂、ポリブチレ
ンテレフタレート樹脂、スチレンアクリロニトリル樹脂
、ポリプロピレン樹脂、ポリウレタン樹脂あるいはポリ
フエニレンサルフフイド樹脂から選択されるいずれか少
なくと６１柾を使用することができる。The resin to be filled in the porous body includes epoxy resin,
Polyimide resin, trimachine resin, polyparapanic acid resin, polyamideimide resin, silicone resin, epoxy silicone resin, acrylic acid resin, methacrylic acid resin, anilic acid resin, phenol resin, urethane resin, furan resin, fluororesin, acetal resin, polyamide resin,
Any one selected from polyethylene resin, polycarbonate resin, polybutylene terephthalate resin, styrene acrylonitrile resin, polypropylene resin, polyurethane resin, or polyphenylene sulfide resin can be used.
本発明のセラミック複合体は、前記セラミック多孔質体
の開放気孔１００容槽部に対し、樹脂を少なくとも１０
容積部充填したものであることが好ましい。その理由は
、樹脂の充填量が１０容積部より少ないとセラミック複
合体としての靭性が不充分で機械加工時に割れたり、欠
けたりし易いからである。In the ceramic composite of the present invention, at least 100% of the resin is added to 100 open pores of the ceramic porous body.
Preferably, it is filled by volume. The reason for this is that if the amount of resin filled is less than 10 parts by volume, the toughness of the ceramic composite will be insufficient and it will easily crack or chip during machining.
なお、前記セラミック複合体を電子回路用基板材料とし
て適用する場合には、気体不透過性を付与せしめること
が重要であり、複合体の気孔率を１０容積％以下とする
ことが有利である。Note that when the ceramic composite is used as a substrate material for electronic circuits, it is important to provide gas impermeability, and it is advantageous for the porosity of the composite to be 10% by volume or less.
次に本発明のセラミック複合体の製造方法について説明
する。Next, a method for manufacturing the ceramic composite of the present invention will be explained.
前記セラミック複合体は、前述の如き出発原料を生成形
体に成形した後、前記生成形体が焼成時に液相を生成す
る組成よりなっているものについては液相の生成量が５
重量％以下である温度域で焼成するか、あるいは前記生
成形体が焼成時に揮散を伴う組成よりなっているものに
ついては揮散量を５重虜％以下に制御して焼成すること
によりセラミック多孔質体となし、次いで前記多孔質体
の開放気孔中へ樹脂を充填することにより製造すること
ができる。In the ceramic composite, after the starting material as described above is molded into a green body, if the green body has a composition that generates a liquid phase during firing, the amount of liquid phase produced is 5.
Ceramic porous bodies can be produced by firing in a temperature range of 5% by weight or less, or by controlling the amount of volatilization to 5% by weight or less if the formed body has a composition that causes volatilization during firing. It can be manufactured by filling the open pores of the porous body with a resin.
なお、前記樹脂を多孔質体の開放気孔中へ充填する方法
としては、樹脂を加熱して溶融させて含浸する方法、樹
脂を溶剤に溶解させて含浸する方法、樹脂をモノマー状
態で含浸した後ポリマーに転化する方法あるいは微粒化
した樹脂を分散媒液中に分散し、この分散液を含浸し乾
燥した後樹脂の溶融温度で樹脂を焼き着ける方法が通用
できる。In addition, methods for filling the open pores of the porous body with the resin include a method in which the resin is heated and melted and impregnated, a method in which the resin is dissolved in a solvent and impregnated, and a method in which the resin is impregnated in a monomer state and then impregnated. A method of converting the resin into a polymer or a method of dispersing a finely divided resin in a dispersion medium, impregnating the resin with this dispersion, drying it, and then baking the resin at the melting temperature of the resin can be used.
前記セラミック多孔質体を製造するための出発原料とし
ては、より高強度でしかも機械加工性の良好な多孔質体
を得ろ上で平均粒径が１０μｍ以下の微粉末を使用する
ことが有利である。As a starting material for producing the ceramic porous body, it is advantageous to use fine powder with an average particle size of 10 μm or less in order to obtain a porous body with higher strength and good machinability. .
次に本発明を実施例によって説明する。Next, the present invention will be explained by examples.
実施例１
平均粒径が１．２μｍで不純物含有型が第１表に示した
如きアルミナ粉末１００重量部に対し、ポリビニルアル
コール２ Ｍ、’Ｗ＝ 部、ポリエチレングリコール１
重量部、ステアリン酸０．５重量部および水１００重量
部を配合し、ボールミル中で８時間混合した後噴霧乾燥
した。Example 1 To 100 parts by weight of alumina powder having an average particle size of 1.2 μm and containing impurities as shown in Table 1, 2 M,'W= parts of polyvinyl alcohol and 1 part of polyethylene glycol were added.
0.5 parts by weight of stearic acid and 100 parts by weight of water were mixed in a ball mill for 8 hours and then spray-dried.
この乾燥物を適量採取し、金属製押し型を用いて１．Ｏ
ｔ／ｄの圧力で成形し、直径４０口、厚さ１鰭、密度１
．９９ｆ／ｄ （５１容積％）の生成形体を得た。Collect an appropriate amount of this dried material and use a metal press to perform 1. O
Molded with t/d pressure, diameter 40 holes, thickness 1 fin, density 1
．． A product form of 99 f/d (51% by volume) was obtained.
前記生成形体をアルミナ製ルツボに装入し、大気圧下の
空気中で１８００°Ｃの温度で１時間焼成した。The formed body was placed in an alumina crucible and fired at a temperature of 1800° C. for 1 hour in air under atmospheric pressure.
得られた焼結体の密度は２．１２ｆ／ａれ開放気孔率は
４４容積％であった。また、この焼結体の平均曲げ強度
は９．７ｋｇ／−であった。The density of the obtained sintered body was 2.12 f/a, and the open porosity was 44% by volume. Moreover, the average bending strength of this sintered body was 9.7 kg/-.
次いで、この焼結体を二液性タイプのエポキシ樹脂に真
空下で浸漬し含浸させた後、約１５０℃の温度で硬化さ
せ、複合体を得た。この複合体中に充填されたエポキシ
樹脂の含有量は１９．４重ｔ％であり、焼結体の空隙に
占めるエポキシ樹脂の割合はほぼ９５．２容槽％であっ
た。Next, this sintered body was immersed in a two-component type epoxy resin to impregnate it under vacuum, and then cured at a temperature of about 150° C. to obtain a composite. The content of the epoxy resin filled in this composite was 19.4% by weight, and the proportion of the epoxy resin in the voids of the sintered body was approximately 95.2% by volume.
この複合体に超硬ドリル（ＷＣ−Ｃｏ）で直径０．８
Ｅｌｌのスルーホールを削孔したところ、同一ドリル刃
でもって１０００穴以上カケや割れなどを生じさせるこ
となく迅速に加工することができ機械加工性に優れてい
ることが認められた。This composite was drilled with a carbide drill (WC-Co) with a diameter of 0.8 mm.
When Ell through-holes were drilled, it was found that more than 1,000 holes could be rapidly machined with the same drill blade without chipping or cracking, and it was found to have excellent machinability.
また、この複合体の熱膨張率（θ〜１５０″Ｃ）は７Ｘ
１０−６／”Ｃ，比電気抵抗は１０１４Ωα以上、比誘
電率は５ （Ｉ ＭＨｚ ）であり、電子回路用基板と
して優れた特性を有していた。In addition, the thermal expansion coefficient (θ~150″C) of this composite is 7X
It had a specific electrical resistance of 10<14 >[Omega][alpha] or more and a relative dielectric constant of 5 (I MHz), and had excellent characteristics as a substrate for electronic circuits.
実施例２
実施例１と同様であるが、第１表に示した如き平均粒径
および化学組成のアルミナ粉末を使用して得た焼結体を
使用して複合体を得た。Example 2 A composite was obtained as in Example 1, but using a sintered body obtained using alumina powder with an average particle size and chemical composition as shown in Table 1.
得られた焼結体および複合体の物性は第２表に示した。The physical properties of the obtained sintered body and composite body are shown in Table 2.
第１表
なお、前記ドリル耐用度は、実施例１で使用したものと
同様の超硬ドリル刃で削孔を繰返し行いドリルの摩耗に
よってスルーホール壁面等にカケや割れが発生し始める
までの削孔度数である。Table 1 Note that the drill durability is determined by repeatedly drilling a hole with a carbide drill bit similar to that used in Example 1 until chipping or cracking begins to occur on the through-hole wall surface due to wear of the drill. It is the porosity number.
実施例８
実施例１と同様であるが、成形圧を１４０−に変えて得
た焼結体を使用して複合体を得た。Example 8 A composite was obtained using the same method as in Example 1, but using a sintered body obtained by changing the molding pressure to 140-.
得られた焼結体および複合体の物性は第２表に示した。The physical properties of the obtained sintered body and composite body are shown in Table 2.
第２表より、本願発明の実施例２および実施例８で得ら
れた複合体は機械加工性に著しく優れていることがわか
る。From Table 2, it can be seen that the composites obtained in Example 2 and Example 8 of the present invention have extremely excellent machinability.
実施例４
実施例１と同様であるが、第３表に示した粉末を使用し
、第３表に示した温度で焼結体を得た。Example 4 A sintered body was obtained in the same manner as in Example 1, but using the powders shown in Table 3 and at the temperatures shown in Table 3.
次いで実施例１と同様の方法でエポキシ樹脂を含浸し、
複合体を得た。Then impregnated with epoxy resin in the same manner as in Example 1,
Obtained a complex.
得られた焼結体と複合体の物性は第２表に示した。The physical properties of the obtained sintered body and composite are shown in Table 2.
第３表
実施例５
平均粒径が０．４μｍ１純度が９６重量％の窒化珪素粉
末１００重量部に対し、ワックス２重量部、ポリエチレ
ングリコール１重量部、ステアリン酸０．５重量部およ
びベンゼン１００重量部を配合し、ボールミル中で５時
間混合した後噴霧乾燥した。なお、前記窒化珪素粉末は
酸素を２重量％、炭素を１重１１９６、鉄を０．０７重
景％、カルシウムを０．０１重量％、アルミニウムを０
．２重量％、マグネシウムを０．０８重量％含有してい
た。Table 3 Example 5 100 parts by weight of silicon nitride powder with an average particle size of 0.4 μm and a purity of 96% by weight, 2 parts by weight of wax, 1 part by weight of polyethylene glycol, 0.5 parts by weight of stearic acid and 100 parts by weight of benzene parts were mixed in a ball mill for 5 hours and then spray dried. The silicon nitride powder contains 2% by weight of oxygen, 1% of carbon, 0.07% of iron, 0.01% of calcium, and 0% of aluminum.
．． 2% by weight, and 0.08% by weight of magnesium.
この乾燥混合物を適量採取し、金属製押し型を用いて１
．０しＵの圧力で成形し、直径４０ｎ１厚さ１ｆｆ、密
度１゜８１９／ｄ（５７容積％）の生成形体を得た。Take an appropriate amount of this dry mixture and use a metal mold to
．． Molding was carried out under a pressure of 0.0 U to obtain a formed body having a diameter of 40 n, a thickness of 1 ff, and a density of 1°819/d (57% by volume).
前記生成形体を黒鉛製ルツボに装入し、大気圧下の窒素
ガス雰囲気中で１７００°Ｃの温度で１時間焼成した。The resulting shaped body was placed in a graphite crucible and fired at a temperature of 1700° C. for 1 hour in a nitrogen gas atmosphere under atmospheric pressure.
得られた焼結体は、結晶が三次元網目構造で結合してお
り、その密度は１．８１ ’ｌ／ｃれ平均曲げ強度は１
１．８ ｋｔｔｆ／ｄであった。In the obtained sintered body, the crystals are connected in a three-dimensional network structure, the density is 1.81'l/c, and the average bending strength is 1.
It was 1.8 kttf/d.
次いで、この焼結体に実施例１と同様の方法でエポキシ
樹脂を含浸し、複合体を得た。Next, this sintered body was impregnated with an epoxy resin in the same manner as in Example 1 to obtain a composite.
得られた複合体の特性は第２表に示した。The properties of the obtained composite are shown in Table 2.
実施例６
実施例５と同様であるが、窒化珪素粉末に換えて平均粒
径が０．８μｍ、純度が９７重量％の窒化アルｊニウム
扮末を使用し、１６００℃の温度で焼結体を得た。なお
、前記窒化アルミニウム粉末は炭素を０．１６重Ｊ１％
、珪素を０．１重量％、鉄を０−１ｆ！！１Ｉ１９６マ
グネシウムを０．０７重ｊ１ ％、酸化イツトリウムを
５．６重量％含有していた。Example 6 Same as Example 5, but instead of silicon nitride powder, aluminum nitride powder with an average particle size of 0.8 μm and a purity of 97% by weight was used, and the material was sintered at a temperature of 1600°C. I got it. Note that the aluminum nitride powder contains 0.16 weight J1% of carbon.
, 0.1% by weight of silicon, 0-1f of iron! ! It contained 0.07% by weight of 1I196 magnesium and 5.6% by weight of yttrium oxide.
次いで、この焼結体に実施例１と同様の方法でエポキシ
樹脂を含浸し、複合体を得た。Next, this sintered body was impregnated with an epoxy resin in the same manner as in Example 1 to obtain a composite.
得られた複合体の特性は第２表に示した。The properties of the obtained composite are shown in Table 2.
以上述べた如く、本発明のセラミック複合体は機械加工
性に極めて優れており、スルーホール等をドリル削孔に
よって形成することのできる電子回路用基板材料を供給
することができ、特に試作品等の極めてロフト数の少な
い配線基板を製造するような場合に適したものであって
産業上極めて有用である。As described above, the ceramic composite of the present invention has extremely excellent machinability, and can be used as a substrate material for electronic circuits in which through holes etc. can be formed by drilling, especially for prototypes. It is suitable for manufacturing wiring boards with extremely small loft numbers, and is extremely useful industrially.
Claims (1)
造に結合してなるセラミック多孔質体の開放気孔中に樹
脂が充填されていることを特徴とする機械加工性に優れ
たセラミック複合体。 ２、前記セラミック多孔質体の開放気孔率は１０〜７０
容積％の範囲内である特許請求の範囲第１項記載のセラ
ミック複合体。 ３、前記セラミック複合体はドリル削孔性に優れる特許
請求の範囲第１あるいは２項記載のセラミック複合体。 ４、前記セラミック多孔質体はＡｌ＿２Ｏ＿３、ＳｉＯ
＿２、ＺｒＯ＿２、ＭｇＯ、Ｆｅ＿２Ｏ＿３、Ｓｉ＿３
Ｎ＿４あるいはＡｌＮより選択されるいずれか少なくと
も１種を主として含有する特許請求の範囲第１〜３項記
載のセラミック複合体。 ５、前記樹脂はエポキシ樹脂、ポリイミド樹脂、トリマ
シン樹脂、ポリパラパン酸樹脂、ポリアミドイミド樹脂
、シリコン樹脂、エポキシシリコン樹脂、アクリル酸樹
脂、メタクリル酸樹脂、アニリン酸樹脂、フェノール樹
脂、ウレタン系樹脂、フラン系樹脂、フッ素樹脂、アセ
タール樹脂、ポリアミド樹脂、ポリエチレン樹脂、ポリ
カーボネート樹脂、ポリブチレンテレフタレート樹脂、
スチレンアクリロニトリル樹脂、ポリプロピレン樹脂、
ポリウレタン樹脂あるいはポリフェニレンサルファイド
樹脂から選択されるいずれか少なくとも１種である特許
請求の範囲第１〜４項のいずれかに記載のセラミック複
合体。 ６、前記樹脂の充填量は前記開放気孔１００容積部に対
し、少なくとも１０容積部である特許請求の範囲第１〜
５項のいずれかに記載のセラミック複合体。[Claims] 1. Machinability characterized by filling the open pores of a ceramic porous body formed by crystal grains with an average particle size of 10 μm or less combined into a three-dimensional network structure with a resin. Excellent ceramic composite. 2. The open porosity of the ceramic porous body is 10 to 70.
The ceramic composite according to claim 1, wherein the % by volume range is within the range of % by volume. 3. The ceramic composite according to claim 1 or 2, wherein the ceramic composite has excellent drilling properties. 4. The ceramic porous body is Al_2O_3, SiO
_2, ZrO_2, MgO, Fe_2O_3, Si_3
The ceramic composite according to claims 1 to 3, which mainly contains at least one selected from N_4 and AlN. 5. The resins include epoxy resin, polyimide resin, trimachine resin, polyparapanic acid resin, polyamideimide resin, silicone resin, epoxy silicone resin, acrylic acid resin, methacrylic acid resin, anilic acid resin, phenol resin, urethane resin, and furan resin. Resin, fluororesin, acetal resin, polyamide resin, polyethylene resin, polycarbonate resin, polybutylene terephthalate resin,
Styrene acrylonitrile resin, polypropylene resin,
The ceramic composite according to any one of claims 1 to 4, which is at least one selected from polyurethane resin and polyphenylene sulfide resin. 6. The filling amount of the resin is at least 10 parts by volume per 100 parts by volume of the open pores.
The ceramic composite according to any one of Item 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11962585A JPS61281088A (en) | 1985-05-31 | 1985-05-31 | High machine processability ceramic composite body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11962585A JPS61281088A (en) | 1985-05-31 | 1985-05-31 | High machine processability ceramic composite body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61281088A true JPS61281088A (en) | 1986-12-11 |
Family
ID=14766074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11962585A Pending JPS61281088A (en) | 1985-05-31 | 1985-05-31 | High machine processability ceramic composite body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61281088A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6226886A (en) * | 1985-07-26 | 1987-02-04 | イビデン株式会社 | Substrate for electronic circuit comprising ceramic composite |
| JPH0330392A (en) * | 1989-06-28 | 1991-02-08 | Toshiba Corp | Pyrogenic conductive and low-dielectric constant circuit board |
| JPH0364984A (en) * | 1989-08-03 | 1991-03-20 | Ibiden Co Ltd | Electronic circuit board |
| US6762925B2 (en) | 2002-04-01 | 2004-07-13 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and method for making the same |
| WO2004108332A1 (en) * | 2003-06-06 | 2004-12-16 | Sumitomo Electric Industries, Ltd. | Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| CN100398238C (en) * | 2003-06-06 | 2008-07-02 | 住友电气工业株式会社 | Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| WO2017221932A1 (en) * | 2016-06-23 | 2017-12-28 | アダマンド株式会社 | Ceramic composite and production method for ceramic composite |
-
1985
- 1985-05-31 JP JP11962585A patent/JPS61281088A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6226886A (en) * | 1985-07-26 | 1987-02-04 | イビデン株式会社 | Substrate for electronic circuit comprising ceramic composite |
| JPH0582760B2 (en) * | 1985-07-26 | 1993-11-22 | Ibiden Co Ltd | |
| JPH0330392A (en) * | 1989-06-28 | 1991-02-08 | Toshiba Corp | Pyrogenic conductive and low-dielectric constant circuit board |
| JPH0364984A (en) * | 1989-08-03 | 1991-03-20 | Ibiden Co Ltd | Electronic circuit board |
| JP2787953B2 (en) * | 1989-08-03 | 1998-08-20 | イビデン株式会社 | Electronic circuit board |
| US6762925B2 (en) | 2002-04-01 | 2004-07-13 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and method for making the same |
| WO2004108332A1 (en) * | 2003-06-06 | 2004-12-16 | Sumitomo Electric Industries, Ltd. | Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| CN100398238C (en) * | 2003-06-06 | 2008-07-02 | 住友电气工业株式会社 | Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| US8147911B2 (en) | 2003-06-06 | 2012-04-03 | Sumitomo Electric Industries, Ltd. | Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive. |
| WO2017221932A1 (en) * | 2016-06-23 | 2017-12-28 | アダマンド株式会社 | Ceramic composite and production method for ceramic composite |
| JPWO2017221932A1 (en) * | 2016-06-23 | 2019-06-06 | アダマンド並木精密宝石株式会社 | Ceramic composite and method of manufacturing the same |
| EP3476820A4 (en) * | 2016-06-23 | 2019-12-25 | Adamant Namiki Precision Jewel Co., Ltd. | Ceramic composite and production method for ceramic composite |
| US11390568B2 (en) | 2016-06-23 | 2022-07-19 | Adamant Namiki Precision Jewel Co., Ltd. | Ceramic composite and production method for ceramic composite |
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