JPS6127914B2 - - Google Patents
Info
- Publication number
- JPS6127914B2 JPS6127914B2 JP2502980A JP2502980A JPS6127914B2 JP S6127914 B2 JPS6127914 B2 JP S6127914B2 JP 2502980 A JP2502980 A JP 2502980A JP 2502980 A JP2502980 A JP 2502980A JP S6127914 B2 JPS6127914 B2 JP S6127914B2
- Authority
- JP
- Japan
- Prior art keywords
- evaporator
- liquid
- heat transport
- storage container
- liquid storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 29
- 239000004065 semiconductor Substances 0.000 claims description 22
- 238000003860 storage Methods 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 8
- 239000007791 liquid phase Substances 0.000 claims description 7
- 238000009835 boiling Methods 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 claims description 3
- 239000002826 coolant Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
この発明は凝縮性冷却媒体の液相と気相間の相
変化を利用して、半導体素子を冷却する半導体素
子用沸騰冷却装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an evaporative cooling device for semiconductor devices that cools semiconductor devices by utilizing a phase change between a liquid phase and a gas phase of a condensable cooling medium.
一般にこの種の半導体素子用冷却装置は、半導
体素子と接触した蒸発器の上部に液留め容器、凝
縮器を設け、蒸発器と液留め容器、および液留め
容器と凝縮器間にそれぞれ熱輸送管で連通して冷
却媒体を流通させるように構成してある。 In general, this type of cooling device for semiconductor devices has a liquid storage container and a condenser installed above the evaporator that is in contact with the semiconductor device, and heat transport pipes are installed between the evaporator and the liquid storage container, and between the liquid storage container and the condenser. They are configured to communicate with each other to allow a cooling medium to flow therethrough.
従来のものは第１図に示すように、フロン等の
凝縮性の冷却媒体が封入された蒸発器６と半導体
素子１または絶縁物２とを交互に積み重ねて図示
していない締付装置によつて圧接し、蒸発器６と
液留め容器７とを熱輸送管９で連通している。さ
らに液留め容器７と凝縮器８とを蒸発用熱輸送管
１０および液用熱輸送管１１で連通している。 As shown in FIG. 1, in the conventional system, an evaporator 6 filled with a condensable cooling medium such as fluorocarbon and semiconductor elements 1 or insulators 2 are stacked alternately, and a tightening device (not shown) is used. The evaporator 6 and liquid storage container 7 are connected to each other by a heat transport pipe 9. Further, the liquid storage container 7 and the condenser 8 are communicated with each other through an evaporation heat transport pipe 10 and a liquid heat transport pipe 11.
フロント等の冷却媒体１２は、蒸発器６、熱輸
送管９、液留め容器７に所定量の液相で封入さ
れ、液留め容器７の上部空間および凝縮器８の内
部は冷却媒体１２の液相が沸騰してその気相で満
たされる。 A predetermined amount of liquid phase of the cooling medium 12 at the front etc. is sealed in the evaporator 6, the heat transport pipe 9, and the liquid storage container 7, and the upper space of the liquid storage container 7 and the inside of the condenser 8 are filled with liquid of the cooling medium 12. The phase boils and is filled with its gas phase.
半導体装置の回路における最大電圧が半導体素
子の定格電圧を越える場合は、第２図に示すよう
に半導体素子を複数個直列に接続して用いられ、
抵抗器等の電圧分坦用素子３を半導体素子１に並
列に接続することは周知の如くである。 When the maximum voltage in the circuit of a semiconductor device exceeds the rated voltage of the semiconductor element, multiple semiconductor elements are connected in series as shown in Figure 2.
It is well known that a voltage equalizing element 3 such as a resistor is connected in parallel to the semiconductor element 1.
抵抗器等の電圧分坦用素子３は発熱を伴うので
半導体素子１と同様に冷却媒体による沸騰冷却を
行なうことによつて小形化を図り、装置全体を小
形化することが行なわれる。 Since the voltage equalizing element 3, such as a resistor, generates heat, it is reduced in size by performing boiling cooling with a cooling medium in the same manner as the semiconductor element 1, thereby reducing the size of the entire device.
第１図は、この電圧分坦用素子３を液留め容器
７内に冷却媒体１２に浸漬するようにして設け、
液留め容器７の壁面を貫通して設けた気密端子４
と電圧分坦用素子３とを導体５で接続し、気密端
子４と蒸発器６に設けた端子６Ａとを導体５で接
続し、第２図に示す回路を構成したものである。 In FIG. 1, this voltage leveling element 3 is provided in a liquid storage container 7 so as to be immersed in a cooling medium 12,
Airtight terminal 4 provided through the wall of liquid container 7
and the voltage equalizing element 3 are connected by a conductor 5, and the hermetic terminal 4 and a terminal 6A provided on the evaporator 6 are connected by the conductor 5, thereby constructing the circuit shown in FIG.
しかし、上記構成のものにおいては、液留め容
器７の壁面を貫通して気密端子４を設けているた
めに、気密端子４自体の機械的強度が小さく、し
かも溶接個所が増えることから蒸発器６、液留め
容器７、凝縮器８および熱輸送管９，１０，１１
で構成した密封容器の気密に対する信頼性が低下
するとともに、製作コストが高価となるという欠
点があつた。 However, in the above configuration, since the airtight terminal 4 is provided penetrating the wall surface of the liquid retaining container 7, the mechanical strength of the airtight terminal 4 itself is low, and the number of welding points increases. , liquid storage container 7, condenser 8 and heat transport pipes 9, 10, 11
The disadvantages are that the reliability of the airtightness of the sealed container constructed by the method is lowered and the manufacturing cost is increased.
この発明は、上記従来の欠点を除去するために
なされたもので、電圧分坦用素子と蒸発器とを電
気的に接続する導体を液留め容器と蒸発器とを連
結する熱輸送管の内部に配置することにより、気
密に対する信頼性の向上と製作コストの低減が可
能な半導体素子用沸騰冷却装置を提案するもので
ある。 This invention was made in order to eliminate the above-mentioned conventional drawbacks, and the conductor that electrically connects the voltage equalizing element and the evaporator is connected to the inside of the heat transport pipe that connects the liquid storage container and the evaporator. The present invention proposes an evaporative cooling device for semiconductor devices that can improve airtight reliability and reduce manufacturing costs by arranging the cooling device.
第３図はこの発明の一実施例を示す図で、蒸発
器６、液留め容器７、熱輸送管９の構成を示す断
面図であり、第１図と同符号は同一物を示してい
る。 FIG. 3 is a diagram showing one embodiment of the present invention, and is a sectional view showing the structure of an evaporator 6, a liquid storage container 7, and a heat transport pipe 9, and the same reference numerals as in FIG. 1 indicate the same parts. .
図に示す如く、液留め容器７の内部には電圧分
坦用素子３を冷却媒体１２の液相に十分浸漬して
設ける。（取付構造は図示せず）電圧分坦用素子
３と半導体素子１との電気的接続は第３図に示す
ように、半導体素子１に圧接している蒸発器６の
内部に導体５の一端をろう付けやねじ止め等の方
法で接続し、導線５の他端を熱輸送管９の内部を
通つて電圧分坦用素子３の端子に半田付け等の方
法で接続する。 As shown in the figure, a voltage equalizing element 3 is provided inside the liquid holding container 7 so as to be fully immersed in the liquid phase of the cooling medium 12. (The mounting structure is not shown) The electrical connection between the voltage dividing element 3 and the semiconductor element 1 is as shown in FIG. are connected by a method such as brazing or screwing, and the other end of the conducting wire 5 is connected to a terminal of the voltage equalizing element 3 by a method such as soldering through the inside of the heat transport pipe 9.
このように、電圧分坦用素子３を液留め容器７
内の冷却媒体１２の液相に浸漬して設け、且つ導
体５を熱輸送管９の内部に配置することは、電圧
分坦用素子３と半導体素子１との電気的接続を内
部空間を利用して外部に露出することなく行なう
ことができる。 In this way, the voltage equalizing element 3 is placed in the liquid holding container 7.
By immersing the conductor 5 in the liquid phase of the cooling medium 12 inside the heat transport pipe 9 and arranging the conductor 5 inside the heat transport pipe 9, the electrical connection between the voltage equalizing element 3 and the semiconductor element 1 can be made by utilizing the internal space. This can be done without being exposed to the outside.
熱輸送管９は、一端が液留め容器７に連結され
た絶縁管９Ａと各端が絶縁関９Ａの他端と蒸発器
６に連結されたベローズ９Ｂとから構成されてい
る。 The heat transport tube 9 is composed of an insulating tube 9A having one end connected to the liquid storage container 7, and a bellows 9B having each end connected to the insulating tube 9A and the evaporator 6 at the other end.
この熱輸送管９の内部に導体５を通す方法は、
次の製作順序により達成することができる。 The method for passing the conductor 5 inside this heat transport pipe 9 is as follows:
This can be achieved by the following manufacturing sequence.
蒸発器６にあらかじめ導体５を接続し導体５を
ベローズ９Ｂに通した後、ベローズ９Ｂの一端と
蒸発器６とを溶接する。その後更に導体５を絶縁
管９Ａに通して絶縁管９Ａの一端とベローズ９Ｂ
の他端とを溶接する。その後、上部が開放した液
留め容器７の底板に設けられた穴７Ａに導体５を
通した後、絶縁管９Ａの他端と液留め容器７とを
溶接連結する。上記順序で蒸発器６、熱輸送管
９、液留め容器７とを結合した後、電圧分坦用素
子３に上記導体５の他端を半田付け等により接続
することにより達成される。 After connecting the conductor 5 to the evaporator 6 in advance and passing the conductor 5 through the bellows 9B, one end of the bellows 9B and the evaporator 6 are welded. After that, the conductor 5 is further passed through the insulating tube 9A, and the bellows 9B is connected to one end of the insulating tube 9A.
Weld the other end of the After that, the conductor 5 is passed through the hole 7A provided in the bottom plate of the liquid storage container 7 whose top is open, and then the other end of the insulating tube 9A and the liquid storage container 7 are connected by welding. This is achieved by connecting the evaporator 6, heat transport pipe 9, and liquid storage container 7 in the above order, and then connecting the other end of the conductor 5 to the voltage equalizing element 3 by soldering or the like.
上記の作業の後、液留め容器７の底板に上ぶた
を溶接し、第３図に示す沸騰冷却装置を構成す
る。 After the above operations, the upper lid is welded to the bottom plate of the liquid retaining container 7, and the boiling cooling device shown in FIG. 3 is constructed.
尚、以上述べた実施例では、液留め容器７内に
電圧分坦用素子３を設けた場合について説明した
が、凝縮器８の底部に冷却媒体１２の液相部が存
在するものに於いては、凝縮器８の底部に電圧分
坦用素子３を設置してもよい。この場合、電圧分
坦用素子３が浸漬され冷却媒体１２が存在する凝
縮器８の底部、即ち液留室が前記液留め容器７に
相当することになる。 In the embodiments described above, the case where the voltage equalizing element 3 is provided in the liquid holding container 7 has been explained, but in the case where the liquid phase part of the cooling medium 12 is present at the bottom of the condenser 8, Alternatively, the voltage equalizing element 3 may be installed at the bottom of the condenser 8. In this case, the bottom of the condenser 8 in which the voltage equalizing element 3 is immersed and the cooling medium 12 is present, that is, the liquid storage chamber, corresponds to the liquid holding container 7.
以上のようにこの発明によれば、凝縮性の冷媒
が封入された蒸発器と共に交互に積み重ねて圧接
された半導体素子のそれぞれに並列接続された電
圧分坦用素子を液留め容器内の冷媒の液相に浸漬
し、前記電圧分坦用素子と前記蒸発器とを電気的
に接続する導体を前記液留め容器と前記蒸発器と
を連結する熱輸送管の内部に配置したので、電圧
分坦用素子と半導体素子との電気的接続を外部に
露出することなく行なうことができるため、従来
装置の如く気密端子を設ける必要がなく、気密に
対する信頼性が向上すると共に製作費も安価とな
る。しかもこのように内部空間を利用して配線方
式は従来の如くの外部配線方式に比べ短い配線長
さで接続を行なうことができ、回路インピーダン
スの低減にも大きな効果があり、電圧分坦性能の
改善にも有効である。更に、配線が外部に露出し
ないということは、配線部分を周囲から保護する
ことになり、例えば半導体素子の交換時に誤まつ
て配線に外力を与えて断線するという様な事故も
防止できる。 As described above, according to the present invention, a voltage equalizing element connected in parallel to each of the semiconductor elements stacked alternately and pressure-welded together with an evaporator filled with a condensable refrigerant is connected to Since a conductor that is immersed in the liquid phase and electrically connects the voltage equalization element and the evaporator is placed inside the heat transport pipe that connects the liquid storage container and the evaporator, the voltage distribution Since the electrical connection between the semiconductor element and the semiconductor element can be made without being exposed to the outside, there is no need to provide an airtight terminal as in the conventional device, and the reliability of airtightness is improved and the manufacturing cost is reduced. Moreover, by utilizing the internal space in this way, the wiring method can make connections with shorter wiring lengths than conventional external wiring methods, and has a great effect on reducing circuit impedance, which improves voltage distribution performance. It is also effective for improvement. Furthermore, the fact that the wiring is not exposed to the outside means that the wiring portion is protected from the surroundings, and it is possible to prevent accidents such as, for example, when replacing a semiconductor element, an external force is accidentally applied to the wiring and the wiring breaks.
第１図ａ，ｂ，は従来の半導体素子用沸騰冷却
装置を示す図で、ａは正面図、ｂは側面図であ
る。第２図は半導体素子回路の接続を示す接続
図、第３図はこの発明の一実施例を示す正面要部
縦断面図である。
図中、１は半導体素子、３は電圧分坦用素子、
５は導体、６は蒸発器、７は液留め容器、８は凝
縮器、９は熱輸送管である。なお、図中同一符号
は同一もしくは相当部分を示す。
FIGS. 1A and 1B are views showing a conventional evaporative cooling device for semiconductor devices, in which FIG. 1A is a front view and FIG. 1B is a side view. FIG. 2 is a connection diagram showing connections of semiconductor element circuits, and FIG. 3 is a front longitudinal cross-sectional view of essential parts showing one embodiment of the present invention. In the figure, 1 is a semiconductor element, 3 is a voltage flattening element,
5 is a conductor, 6 is an evaporator, 7 is a liquid container, 8 is a condenser, and 9 is a heat transport pipe. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
に積み重ねて圧接された半導体素子のそれぞれに
並列接続された電圧分坦用素子を液留め容器内の
冷媒の液相に浸漬し、前記電圧分坦用素子と前記
蒸発器とを電気的に接続する導体を前記液留め容
器と前記蒸発器とを連結する熱輸送管の内部に配
置したことを特徴とする半導体素子用沸騰冷却装
置。1 A voltage equalizing element connected in parallel to each of the semiconductor elements stacked alternately and pressure-welded together with an evaporator filled with a condensable refrigerant is immersed in the liquid phase of the refrigerant in a liquid holding container, and the voltage equalizing element is 1. A boiling cooling device for a semiconductor device, characterized in that a conductor for electrically connecting a carrier element and the evaporator is disposed inside a heat transport pipe connecting the liquid storage container and the evaporator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2502980A JPS56122150A (en) | 1980-02-28 | 1980-02-28 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2502980A JPS56122150A (en) | 1980-02-28 | 1980-02-28 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56122150A JPS56122150A (en) | 1981-09-25 |
| JPS6127914B2 true JPS6127914B2 (en) | 1986-06-27 |
Family
ID=12154478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2502980A Granted JPS56122150A (en) | 1980-02-28 | 1980-02-28 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56122150A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2592988B1 (en) * | 1986-01-16 | 1988-03-18 | Jeumont Schneider | SEMICONDUCTOR COOLING DEVICES |
-
1980
- 1980-02-28 JP JP2502980A patent/JPS56122150A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56122150A (en) | 1981-09-25 |
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