JPS61260660A - Heat sink for cooling semiconductor element - Google Patents

Heat sink for cooling semiconductor element

Info

Publication number
JPS61260660A
JPS61260660A JP10143385A JP10143385A JPS61260660A JP S61260660 A JPS61260660 A JP S61260660A JP 10143385 A JP10143385 A JP 10143385A JP 10143385 A JP10143385 A JP 10143385A JP S61260660 A JPS61260660 A JP S61260660A
Authority
JP
Japan
Prior art keywords
cooling
cooling pipe
pipe
plates
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10143385A
Other languages
Japanese (ja)
Inventor
Hiroshi Yamamoto
博 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10143385A priority Critical patent/JPS61260660A/en
Publication of JPS61260660A publication Critical patent/JPS61260660A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To manufacture a cooling plate, length thereof extends over at least a hole-processing limit or more, while reducing weight, and to eliminate the need for silver soldering work by notching grooves having diameters larger than a cooling pipe consisting of a copper material to each of first and second cooling plates composed of an aluminum material. CONSTITUTION:A cooling pipe 2 is held by first and second cooling plates 3, 4 under the state in which the cooling pipe 2 is inserted into grooves 9 having diameters slightly larger than the cooling pipe 2 composed of a copper material notched to the first and second cooling pipes 3, 4 consisting of an aluminum material having the same shape, the first and second cooling plates 3, 4 are contact-bonded mutually, and the cooling pipe 2 is expanded, thus fast sticking the cooling pipe 2 to the grooves 9. The hole-processing work of a refrigerant flowing hole is also unnecessitated, the problem of difficulty with hole-processing work is also generated, and silver soldering in case of the mounting of the cooling pipe to the cooling plates is also unnecessitated, thus obtaining the shortening of working time, the extension of the range of work dimension of the cooling plates, the decrease of the weight of products and the reduction of manufacturing cost.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体素子の冷却ブロックとして使用され
る液冷形ヒートシンクの改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a liquid-cooled heat sink used as a cooling block for semiconductor devices.

〔従来の技術〕[Conventional technology]

第４図は従来の半導体素子冷却用ヒート７ンクを示す斜
視図であシ、図において、１はスタッド形の半導体素子
、５は冷却管、６は冷却管、Ｔは冷却板、８は冷媒流通
穴を示す。FIG. 4 is a perspective view showing a conventional heat sink for cooling semiconductor devices. In the figure, 1 is a stud-shaped semiconductor device, 5 is a cooling pipe, 6 is a cooling pipe, T is a cooling plate, and 8 is a refrigerant. Shows flow holes.

第４図に示された半導体素子冷却用ヒートシンクは冷却
効果の最も良い水冷方式を採用する場合が多いので、冷
却管５、冷却管６および冷却板Ｉの材質は腐蝕を考慮し
銅材を使用しておシ、第５図に示すように冷却板Ｔに冷
却管５，６の外径よシ若干大きい冷媒流通穴８を穿設し
た後冷却管５゜６を穴８に銀ろう付することにより構成
されていた。The heat sink for cooling semiconductor devices shown in Fig. 4 often uses a water cooling method with the best cooling effect, so the materials of cooling pipes 5, 6, and cooling plate I are made of copper in consideration of corrosion. Then, as shown in Fig. 5, after drilling a refrigerant circulation hole 8 slightly larger than the outer diameter of the cooling pipes 5 and 6 in the cooling plate T, silver solder the cooling pipe 5゜6 to the hole 8. It was made up of.

次に動作圧ついて説明する。流通冷媒である水は冷却管
６から冷媒流通穴８に入シ冷却管５からＵターンして冷
媒流通穴８から冷却管６へ還流する。水は冷却板Ｉ内の
往復に際し半導体素子１からの熱を吸熱し、結果的に半
導体素子１を冷却する。Next, the operating pressure will be explained. Water, which is a circulating refrigerant, enters the cooling pipe 6 into the cooling pipe 6, makes a U-turn from the cooling pipe 5, and returns from the cooling pipe 6 to the cooling pipe 6. The water absorbs heat from the semiconductor element 1 while reciprocating within the cooling plate I, and cools the semiconductor element 1 as a result.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来の半導体素子冷却用ヒートシンクは以上のように構
成されているので、冷却板に取り付けられる半導体素子
の数が増加すると必然的に冷却板の長さが長くなシ、冷
却板への冷媒流通穴の加工が困難となる。従って、冷媒
流通穴の加工可能な限界値内で冷却板の長さが制限され
ることとなる。Conventional heat sinks for cooling semiconductor devices are configured as described above, so as the number of semiconductor devices attached to the cooling plate increases, the length of the cooling plate inevitably becomes longer, and the number of holes for coolant distribution to the cooling plate increases. It becomes difficult to process. Therefore, the length of the cooling plate is limited within the machinable limit value of the coolant flow holes.

又、冷却板に冷却管は銀ろう付により取シ付けられてお
シ、冷却板と冷却管との材質は銅材であることからヒー
トシンクの価格が高く、重置も大きくなシ更に製作に要
する時間も長くなるなどの問題点があった。In addition, the cooling pipes are attached to the cooling plate by silver soldering, and the material of the cooling plate and cooling pipes is copper, which makes the heat sink expensive and requires large stacking, which makes it difficult to manufacture. There were problems such as the amount of time required.

この発明は上記のような問題点を解消するためになされ
たもので、冷却板の長さが、少なくとも穴加工限界以上
のものが製作できるとともに、重量軽減および銀ろう付
作業が解消できる半導体素子冷却用ヒートシンクを櫓る
ことを目的とする。This invention was made to solve the above-mentioned problems, and it is possible to manufacture a cooling plate with a length that is at least longer than the hole machining limit, as well as to reduce the weight and eliminate the need for silver brazing. The purpose is to provide a cooling heat sink.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係る半導体素子冷却用ヒートシンクは、本体
を構成するアルミ材より成る第１．第２の冷却板の夫々
に銅材より成る冷却管より大径の溝を刻設し、上記溝に
上記冷却管を嵌め込んだ状態で上記第１．第２の冷却板
で上記冷却管を挾持圧着した後、上記冷却管を拡管し上
記冷却管外周を上記冷却管の上記溝に密着させたもので
ある。The heat sink for cooling a semiconductor device according to the present invention has a main body made of an aluminum material. A groove having a diameter larger than that of the cooling pipe made of copper material is cut into each of the second cooling plates, and the cooling pipe is fitted into the groove. After the cooling pipe is clamped and crimped with the second cooling plate, the cooling pipe is expanded and the outer periphery of the cooling pipe is brought into close contact with the groove of the cooling pipe.

〔作用〕[Effect]

この発明における冷却管は、銅材より成りアルミ材より
成る第１．第２の冷却板に刻設された上記冷却管よシ大
径の溝に嵌め込まれた状態で上記第１．第２の冷却板に
挾持圧着された後拡管されることにより上記冷却板の上
記溝に密着される。The cooling pipe in this invention is made of copper material and the first one is made of aluminum material. The first cooling pipe is fitted into a groove having a larger diameter than the cooling pipe cut into the second cooling plate. After being clamped and crimped to the second cooling plate, the pipe is expanded and brought into close contact with the groove of the cooling plate.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第１
図において、１はスタンド形の半導体素子、２は銅材よ
構成る冷却管、３．４はアルミ材よ構成る第１．第２の
冷却板であり、第１．第２の冷却板３，４の相違点は半
導体取付用の穴加工の有無のみである。尚、９＃−を第
１．第２の冷却板３．４に刻設された冷却管２より若干
大径の溝である。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, 1 is a stand-shaped semiconductor element, 2 is a cooling pipe made of copper material, and 3.4 is a first tube made of aluminum material. a second cooling plate; The only difference between the second cooling plates 3 and 4 is the presence or absence of holes for semiconductor mounting. In addition, 9#- is the 1st. This groove has a slightly larger diameter than the cooling pipe 2 cut into the second cooling plate 3.4.

この発明の実施例においては、同一形状のアルミ材よ構
成る第１．第２の冷却板３，４に刻設されたアルミ材よ
り成る冷却管２よシ若干大径の溝９に冷却管２を嵌め込
んだ状態で第１．第２の冷却板３．４で冷却管２を挾持
し、第１．第２の冷却板３，４相互を圧着せしめた後、
冷却管２を拡管させることにより冷却管２を溝９に密着
せしめている。In the embodiment of the present invention, the first. With the cooling pipe 2 fitted into the groove 9 made of aluminum material and having a slightly larger diameter than the cooling pipe 2 carved in the second cooling plates 3 and 4, the cooling pipe 2 is inserted into the groove 9 made of aluminum material. The cooling pipe 2 is held between the second cooling plate 3.4 and the first cooling plate 3.4 is held between the cooling pipes 2 and 3.4. After pressing the second cooling plates 3 and 4 together,
By expanding the cooling pipe 2, the cooling pipe 2 is brought into close contact with the groove 9.

尚、冷却管２を第１．第２の冷却板３．４の溝９に嵌め
込む際に予め、冷却管２と第１．第２の冷却板３，４と
の密着度を増加させるために冷却管２の外周及び第１．
第２の冷却板３，４の溝９に熱伝導性の優れたコンパウ
ンドを塗布しておいてもよい。Note that the cooling pipe 2 is connected to the first. When fitting the second cooling plate 3.4 into the groove 9, the cooling pipe 2 and the first. In order to increase the degree of adhesion with the second cooling plates 3 and 4, the outer periphery of the cooling pipe 2 and the first.
The grooves 9 of the second cooling plates 3 and 4 may be coated with a compound having excellent thermal conductivity.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの４れ明によればアルミ材より成る第１
．第２の冷却板に銅材より成る冷却管の外径より若干大
径の溝を刻設し、上記溝に冷却管を嵌め込んだ状態で上
記第１．第２の冷却板で上記冷却管を挾持圧着した後上
記冷却管を拡管させ上記冷却管外周が上記冷却管の溝に
密着せしめられるように構成したので、従来の如く冷却
板を単体とした場合の冷媒流通穴を穿設し、上記冷媒流
通穴に夫々別体の冷却管を銀ろう付けしたものに比べ、
冷媒流通穴の穴加工作業も不必要で且つ穴加工作業に伴
なう困難性の問題も発生せず、また、冷却板への冷却管
の取）付けに際しての銀ろう付けも不必要であシ、製作
時間の短縮化、冷却板の製作寸法範囲の拡大化、製品重
量の軽減化、製作コストの低減化が得られる効果がある
。As mentioned above, according to these four principles, the first part made of aluminum material
．． A groove with a diameter slightly larger than the outside diameter of the cooling pipe made of copper material is cut into the second cooling plate, and the cooling pipe is fitted into the groove. After the cooling pipe is clamped and crimped with the second cooling plate, the cooling pipe is expanded and the outer periphery of the cooling pipe is brought into close contact with the groove of the cooling pipe, so when the cooling plate is used as a single unit as in the conventional case. Compared to the case where refrigerant distribution holes are drilled and separate cooling tubes are silver-brazed to each of the refrigerant distribution holes,
There is no need for hole machining work for refrigerant distribution holes, and there is no problem of difficulty associated with hole machining work, and there is no need for silver brazing when attaching the cooling pipes to the cooling plate. This has the effect of shortening the manufacturing time, expanding the range of manufacturing dimensions of the cooling plate, reducing product weight, and reducing manufacturing costs.

【図面の簡単な説明】 第１図はこの発明の一実施例による半導体素子冷却用ヒ
ートシンクを示す斜視図、第２図はこの発明の一実施例
による半導体素子冷却用ヒートシンクを示す冷却板と冷
却管の組立図、第３図はこの発明の一実施例による半導
体素子冷却用ヒートシンクの縦断面図、第４図は従来の
半導体素子冷却用ヒートシンクを示す斜視図、第５図は
従来の半導体素子冷却用ヒートシンクを示す冷却板と冷
却管の組立図、第６図は従来の半導体素子冷却用ヒート
シンクを示す縦断面図である。 図において、１は半導体素子、２，５．６は冷却管、３
，４．７は冷却板、８は冷媒流通穴、９は溝である。 なお、図中、同一符号は同一、又は相当部分を示す。[Brief Description of the Drawings] Fig. 1 is a perspective view showing a heat sink for cooling semiconductor devices according to an embodiment of the present invention, and Fig. 2 shows a cooling plate and a heat sink for cooling semiconductor devices according to an embodiment of the present invention. FIG. 3 is a vertical sectional view of a heat sink for cooling semiconductor devices according to an embodiment of the present invention, FIG. 4 is a perspective view of a conventional heat sink for cooling semiconductor devices, and FIG. 5 is a diagram of a conventional heat sink for cooling semiconductor devices. FIG. 6 is an assembled view of a cooling plate and a cooling pipe showing a cooling heat sink, and FIG. 6 is a vertical cross-sectional view showing a conventional heat sink for cooling semiconductor elements. In the figure, 1 is a semiconductor element, 2, 5.6 is a cooling pipe, and 3
, 4.7 is a cooling plate, 8 is a coolant circulation hole, and 9 is a groove. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (2)

【特許請求の範囲】[Claims] （１）冷却媒体が流通する冷却管を装着した冷却部材に
より半導体素子を冷却させる半導体素子冷却用ヒートシ
ンクにおいて、上記冷却部材を構成し上記冷却管より大
径の溝が夫々刻設された第１、第２の冷却板と、上記第
１、第２の冷却板の溝に嵌め込まれ上記第１、第２の冷
却板に挾持圧着された後拡管されることにより上記本体
に気密に装着される上記冷却管と、上記本体に装着され
る上記半導体素子とより成ることを特徴とする半導体素
子冷却用ヒートシンク。(1) In a heat sink for cooling a semiconductor device in which a semiconductor device is cooled by a cooling member equipped with a cooling pipe through which a cooling medium flows, first grooves constituting the cooling member and each having a diameter larger than the cooling pipe are carved. , is fitted into the grooves of the second cooling plate and the first and second cooling plates, is clamped and crimped to the first and second cooling plates, and is then expanded to be airtightly attached to the main body. A heat sink for cooling a semiconductor device, comprising the cooling pipe and the semiconductor device attached to the main body. （２）上記第１、第２の冷却板にアルミ材、上記冷却管
に銅材を用いたことを特徴とする特許請求の範囲第１項
記載の半導体素子冷却用ヒートシンク。(2) The heat sink for cooling a semiconductor device according to claim 1, wherein the first and second cooling plates are made of aluminum, and the cooling pipe is made of copper.
JP10143385A 1985-05-15 1985-05-15 Heat sink for cooling semiconductor element Pending JPS61260660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10143385A JPS61260660A (en) 1985-05-15 1985-05-15 Heat sink for cooling semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10143385A JPS61260660A (en) 1985-05-15 1985-05-15 Heat sink for cooling semiconductor element

Publications (1)

Publication Number Publication Date
JPS61260660A true JPS61260660A (en) 1986-11-18

Family

ID=14300559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10143385A Pending JPS61260660A (en) 1985-05-15 1985-05-15 Heat sink for cooling semiconductor element

Country Status (1)

Country Link
JP (1) JPS61260660A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01286350A (en) * 1988-05-12 1989-11-17 Nec Corp Cooling device of integrated circuit
EP0800890A1 (en) * 1996-04-08 1997-10-15 Tousui Ltd Heat sink
WO2002074032A1 (en) * 2001-03-02 2002-09-19 Sanyo Electric Co., Ltd. Electronic device
EP1585173A2 (en) * 2004-03-31 2005-10-12 Dowa Mining Co., Ltd. Aluminium bonding member and method for producing same
CN102244011A (en) * 2011-06-14 2011-11-16 东莞市永兴电子科技有限公司 Manufacturing process of water-cooled liquid cooling plate
EP2840603A1 (en) * 2012-04-20 2015-02-25 Daikin Industries, Ltd. Refrigeration device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01286350A (en) * 1988-05-12 1989-11-17 Nec Corp Cooling device of integrated circuit
EP0800890A1 (en) * 1996-04-08 1997-10-15 Tousui Ltd Heat sink
US6967842B2 (en) 2001-03-02 2005-11-22 Sanyo Electric Co., Ltd. Electronic device
EP1372367A1 (en) * 2001-03-02 2003-12-17 Sanyo Electric Co., Ltd. Electronic device
WO2002074032A1 (en) * 2001-03-02 2002-09-19 Sanyo Electric Co., Ltd. Electronic device
EP1372367A4 (en) * 2001-03-02 2008-09-03 Sanyo Electric Co Electronic device
EP1585173A2 (en) * 2004-03-31 2005-10-12 Dowa Mining Co., Ltd. Aluminium bonding member and method for producing same
JP2005317890A (en) * 2004-03-31 2005-11-10 Dowa Mining Co Ltd Aluminum jointing member and its manufacturing method
EP1585173A3 (en) * 2004-03-31 2006-10-11 Dowa Mining Co., Ltd. Aluminium bonding member and method for producing same
JP4543279B2 (en) * 2004-03-31 2010-09-15 Ｄｏｗａメタルテック株式会社 Manufacturing method of aluminum joining member
US8745841B2 (en) * 2004-03-31 2014-06-10 Dowa Metaltech Co., Ltd. Aluminum bonding member and method for producing same
CN102244011A (en) * 2011-06-14 2011-11-16 东莞市永兴电子科技有限公司 Manufacturing process of water-cooled liquid cooling plate
EP2840603A1 (en) * 2012-04-20 2015-02-25 Daikin Industries, Ltd. Refrigeration device
EP2840603A4 (en) * 2012-04-20 2015-04-22 Daikin Ind Ltd Refrigeration device
US9377237B2 (en) 2012-04-20 2016-06-28 Daikin Industries, Ltd. Refrigeration apparatus

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