JPS61255872A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS61255872A JPS61255872A JP9833485A JP9833485A JPS61255872A JP S61255872 A JPS61255872 A JP S61255872A JP 9833485 A JP9833485 A JP 9833485A JP 9833485 A JP9833485 A JP 9833485A JP S61255872 A JPS61255872 A JP S61255872A
- Authority
- JP
- Japan
- Prior art keywords
- thermal
- thermal expansion
- layer
- substrate
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種プリンタやファクシミリなどに用いられ
るサーマルヘッドに関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a thermal head used in various printers, facsimile machines, and the like.
従来の技術
従来のファクシミリ、プリンタ等で用いられているサー
マルヘッドは第4図に示すものが代表的な構成となって
いる。第4図で、1は絶縁性セラミック基板、2は蓄熱
ガラス層、3はエツチング防止層、4は抵抗体、6は一
対の電極および導体配線、eは耐摩耗層、7は駆動用I
Cである。8は冷却基板で、接着剤層9によって基板1
の裏面に接合されている。2. Description of the Related Art The thermal head used in conventional facsimiles, printers, etc. has a typical configuration as shown in FIG. In FIG. 4, 1 is an insulating ceramic substrate, 2 is a heat storage glass layer, 3 is an etching prevention layer, 4 is a resistor, 6 is a pair of electrodes and conductor wiring, e is a wear-resistant layer, and 7 is a driving I
It is C. 8 is a cooling board, which is attached to the board 1 by an adhesive layer 9.
is attached to the back side of the
発明が解決しようとする問題点
記録の高速化、高密度化などの要請によりサーマルヘッ
ドは、第3図のようにセラミック基板の上面にのみ蓄熱
ガラス層を設ける構成が一般的になっている。さらに、
駆動用Ic7や一対の電極および導体配線6などサーマ
ルヘッドの他に駆動回路や配線などぎも基環上に搭載し
て、コンパクト化が図られている。Problems to be Solved by the Invention Due to the demand for higher speed and higher recording density, thermal heads have generally been constructed in such a way that a heat storage glass layer is provided only on the upper surface of a ceramic substrate, as shown in FIG. moreover,
In addition to the thermal head such as the driving IC 7, a pair of electrodes, and the conductor wiring 6, the driving circuit and wiring are also mounted on the base ring to achieve compactness.
このようにセラミック基板の片面にのみ機能部を積み重
ねた構成では、セラミック基板の上下で熱膨張が異なシ
歪を生じることになる。In such a structure in which the functional parts are stacked only on one side of the ceramic substrate, distortion occurs due to the difference in thermal expansion between the upper and lower portions of the ceramic substrate.
第6図は幅16.7 ff 、長さ275jff、厚さ
0.66jffの極めて平坦なセラミック基板1の上に
、第4図のようなサーマルヘッドの機能部を設けた場合
の歪の程度を表してお9.27tswyの長さに対し、
室温で約1.5〜2. Offの歪を生じることになる
。Fig. 6 shows the degree of distortion when the functional part of the thermal head as shown in Fig. 4 is provided on an extremely flat ceramic substrate 1 with a width of 16.7 ff, a length of 275 jff, and a thickness of 0.66 jff. For the length of 9.27tswy,
Approximately 1.5-2. Off distortion will occur.
この歪はサーマルヘッドを使用するとヘッド部が400
〜esolvとなるため歪がさらに2〜3倍に拡大され
るとと釦なる。また、基体の厚みは昭和53年頃は1,
6〜2.53ffであったものが、最近では0.65〜
1.20となシ、近い将来0.4〜0.5絹になること
が予測される。基体が薄くなると熱歪はさらに拡大され
る傾向にある。This distortion occurs when the head part is 400% when using a thermal head.
~esolv, so if the distortion is further expanded by 2 to 3 times, it becomes a button. Also, the thickness of the base was 1, around 1973.
What used to be 6~2.53ff has recently become 0.65~
1.20, and it is predicted that it will become 0.4 to 0.5 silk in the near future. As the substrate becomes thinner, thermal strain tends to be further magnified.
このような熱歪はエツチング防止層(厚さ500〜1o
oO人)や抵抗体(厚さ1oOo〜5000x)などに
悪影響をおよぼすので、第4図に示すような堅牢で、重
量のある冷却基板8に、特別な冶具を用いて、サーマル
ヘッドの歪を矯正しながら熱伝導の改良剤を含有する耐
熱性接着剤を用いた接合層9を介して固定されている。Such thermal distortion can be prevented by using an etching prevention layer (thickness 500~10m).
Since this will have a negative effect on the thermal head) and the resistor (thickness 1000x to 5000x), a special jig is used to prevent the distortion of the thermal head from being applied to the solid and heavy cooling board 8 as shown in Figure 4. While being straightened, it is fixed via a bonding layer 9 using a heat-resistant adhesive containing a heat conduction improver.
このような操作を常温で行なうため、常温で矯正して接
合されたサーマルヘッドは、実使用時にはかえって熱膨
張の逃げる余裕がなくなり、このことがサーマルヘッド
の信頼性と耐久性に重要な悪影響を与えている。Because such operations are performed at room temperature, thermal heads that are straightened and bonded at room temperature have no room for thermal expansion to escape during actual use, and this has a significant negative impact on the reliability and durability of the thermal head. giving.
また、サーマルヘッドを冷却基板8に接合する際、前記
のように熱歪による接着困難である他に、一般に、セラ
ミック基板1の裏面の表面粗度RmO01〜0.5μm
にラッピング加工またはポリッシング加工されていて、
接着するには表面が平滑すぎるのである。Furthermore, when bonding the thermal head to the cooling substrate 8, in addition to the difficulty of adhesion due to thermal strain as described above, the surface roughness of the back surface of the ceramic substrate 1 is generally RmO01 to 0.5 μm.
It has been wrapped or polished,
The surface is too smooth for adhesion.
したがって本発明では、セラミック基体の熱歪を矯正す
ること及び冷却基板との接着性を改善することを目的と
する。Therefore, the present invention aims to correct the thermal distortion of the ceramic substrate and improve the adhesiveness with the cooling substrate.
問題点を解決するための手段
上記の問題点を解決する本発明の技術的手段は、セラミ
ック基体の裏面に、熱膨張調整層を設けることである。Means for Solving the Problems The technical means of the present invention for solving the above problems is to provide a thermal expansion adjustment layer on the back side of the ceramic substrate.
ここで、熱膨張調整層は、セラミック、サーメット、金
属または合金などの材料を用いて、膜厚5〜60μm、
中心線表面粗度Ra 1〜10μmの皮膜によって形成
するのが好ましい。Here, the thermal expansion adjustment layer is made of a material such as ceramic, cermet, metal, or alloy, and has a thickness of 5 to 60 μm.
It is preferable to form a film having a centerline surface roughness Ra of 1 to 10 μm.
作用
サーマルヘッド機能部を設ける表面側と熱膨張調整層を
有する裏面の熱膨張率が整合され、セラミック基体は室
温においても熱歪のない平坦性を有し、かつ、裏面が接
着に有利な適度の表面粗度を有するため、従来のような
特別複雑な冶具を用いることなく、信頼性の高い、耐久
性に優れたサーマルヘッドを提供することが可能となる
。The thermal expansion coefficients of the front side where the functional part of the thermal head is provided and the back side with the thermal expansion adjustment layer are matched, and the ceramic substrate has flatness without thermal distortion even at room temperature, and the back side has a moderate expansion coefficient that is advantageous for adhesion. Since it has a surface roughness of , it is possible to provide a thermal head with high reliability and excellent durability without using a particularly complicated jig as in the past.
実施例
第1図は本発明によるサーマルヘッドの構成を示す。1
は絶縁性セラミック基体、2は蓄熱ガラス層、3はエツ
チング防止層、4は抵抗体、6は一対の電極および導体
配線、6は耐摩耗層、7は駆動用IC,8は冷却基板で
あシ、これらは従来例と同様である。1oはセラミック
基体1の裏面に形成した熱膨張調整層であシ、基体1は
熱膨張調整層1oを介して接着剤層9によって冷却基板
8に接合されている。ここで、第1図のセラミック基体
上に積層された蓄熱ガラス層2から耐摩耗層6までのサ
ーマルヘッド本体機能部をムで表す。Embodiment FIG. 1 shows the structure of a thermal head according to the present invention. 1
2 is an insulating ceramic substrate, 2 is a heat storage glass layer, 3 is an etching prevention layer, 4 is a resistor, 6 is a pair of electrodes and conductor wiring, 6 is a wear-resistant layer, 7 is a driving IC, and 8 is a cooling board. These are the same as the conventional example. 1o is a thermal expansion adjustment layer formed on the back surface of the ceramic substrate 1, and the substrate 1 is bonded to the cooling substrate 8 by an adhesive layer 9 via the thermal expansion adjustment layer 1o. Here, the functional parts of the thermal head main body from the heat storage glass layer 2 to the wear-resistant layer 6 laminated on the ceramic substrate in FIG. 1 are represented by M.
第2図a、b、cは熱膨張調整層10の形成例を示す。2a, b, and c show examples of forming the thermal expansion adjustment layer 10. FIG.
第3図a、b、cはそれぞれ対応する第2図の断面図で
ある。3a, b, and c are respective cross-sectional views of the corresponding FIG. 2. FIG.
これらの図で、aは基体の裏面の全体に熱膨張調整層を
設けた例、bは基体の裏面の中央部を残して両側にのみ
層10を設けたものである。Cは基体の裏面の中央部に
層10を設けたものである。In these figures, a shows an example in which the thermal expansion adjustment layer is provided on the entire back surface of the base, and b shows an example in which the layer 10 is provided only on both sides of the back surface of the base, leaving the central part. C has a layer 10 provided at the center of the back surface of the base.
その他、斜線縞模様(ゼブラル帯)のように設けてもよ
い。In addition, a diagonal striped pattern (zebral band) may be provided.
次に本発明を効果的に実施するための好ましい条件を説
明する。Next, preferred conditions for effectively implementing the present invention will be explained.
熱膨張調整層を形成する物質は金属9合金、セラミック
、サーメットなどがある。具体的には、Ni、Or、F
s、Cu、τa、ムJ 、 Ti 、 Hf’ 、 Z
r 、 Mo 。Materials forming the thermal expansion adjustment layer include metal 9 alloys, ceramics, cermets, and the like. Specifically, Ni, Or, F
s, Cu, τa, MuJ, Ti, Hf', Z
r, Mo.
Wなどの単体金属、これらの合金がある。There are single metals such as W and alloys of these metals.
また、セラミックとしてはム120s 、 5i02
、 ZrO2。Also, as ceramics, Mu120s, 5i02
, ZrO2.
TiO2およびム/205・5in2.ム1205・T
iO2のような複合酸化物、ガラス質などがある。サー
メットは、Or 、 Fe 、 Ni 、 Ti 、τ
a 、 Zr 、ム7 、 Mo 、 Wb 、 Wな
どの金属およびこれらの合金を主として用いる。また、
サーメットを構成する絶縁物として酸化物。TiO2 and Mu/205・5in2. Mu1205・T
Examples include composite oxides such as iO2 and glass. Cermets are Or, Fe, Ni, Ti, τ
Metals such as a, Zr, Mu7, Mo, Wb, W, and alloys thereof are mainly used. Also,
Oxide is an insulator that makes up cermet.
炭化物、窒化物などのセラミックを用いる。Use ceramics such as carbides and nitrides.
熱膨張調整層を効果的に形成するには、基体1の裏面の
表面粗度が重要である。このため基体1の裏面の表面粗
度をタリサー7表面粗度計で1〜10μmの範囲にする
のが好ましく、特に2〜4μmの範囲がよい。In order to effectively form the thermal expansion adjustment layer, the surface roughness of the back surface of the base 1 is important. For this reason, it is preferable that the surface roughness of the back surface of the substrate 1 be in the range of 1 to 10 μm, particularly preferably in the range of 2 to 4 μm, as measured by a Taliser 7 surface roughness meter.
次に、熱膨張調整層の厚みであるが、3〜60μmが好
ましく、特に、6〜30μmの範囲がよい。Next, the thickness of the thermal expansion adjustment layer is preferably 3 to 60 μm, particularly preferably 6 to 30 μm.
次に、本発明に用いる絶縁性基体であるが、アルミナ基
板、グレイズアルミナ基板、ホーロ基板などを用いるこ
とができる。また、アルミナ基板の代替として、ムライ
ト基板、コージライト基板。Next, regarding the insulating substrate used in the present invention, an alumina substrate, a glazed alumina substrate, a hollow substrate, etc. can be used. Mullite substrates and cordierite substrates are also available as alternatives to alumina substrates.
ガラス基板を用いることも可能である。It is also possible to use a glass substrate.
熱膨張形成層を形成する方法としては、プラズマ法、L
P(jプラズマ法、スパッタ法、EB蒸着法、蒸着法、
およびスクリーン印刷後に焼成する方法等がある。これ
らのうち、プラズマ法およびLPOプラズマ法がスピー
ド、コスト、量産性の観点から最も好ましい。Methods for forming the thermal expansion forming layer include plasma method, L
P(j plasma method, sputtering method, EB evaporation method, evaporation method,
There is also a method of baking after screen printing. Among these, the plasma method and the LPO plasma method are most preferred from the viewpoints of speed, cost, and mass productivity.
次に具体的な実施例を述べる。Next, a specific example will be described.
基体1として、幅16.73ff、長さ275fl、肉
厚0.66jlllで、片面に厚さ80μmのグレーズ
層を有するセラミック基体を用いる。この基板のグレー
ズ層と反対側(裏面)に各種の条件で熱膨張調整層を形
成し、グレーズ層上にサーマルヘッド機能部を形成した
。As the substrate 1, a ceramic substrate with a width of 16.73 ff, a length of 275 fl, a wall thickness of 0.66 ml, and a glaze layer of 80 μm thick on one side is used. A thermal expansion adjustment layer was formed under various conditions on the side opposite to the glaze layer (back side) of this substrate, and a thermal head functional section was formed on the glaze layer.
(以下余白)
表は、熱膨張調整層の形成条件と得られたサーマルヘッ
ドの熱歪を比較したものである。熱膨張調整層の形成に
は、プラズマ溶射機とXB蒸着装置を用いた。材料はT
a、幻205.幻203.TiO2、ガラス・アルミニ
ウムからなるサーメット、0r−Ou金合金などを用い
た。表面粗度は研削紙、表面研磨機を用いて調製した。(The following is a blank space.) The table compares the formation conditions of the thermal expansion adjustment layer and the thermal strain of the obtained thermal head. A plasma spraying machine and an XB vapor deposition apparatus were used to form the thermal expansion adjustment layer. The material is T
a, illusion 205. Illusion 203. TiO2, cermet made of glass/aluminum, Or-Ou gold alloy, etc. were used. The surface roughness was adjusted using grinding paper and a surface polisher.
熱膨張調整層のパターン例は第2図に示すパターン例を
用いた。The pattern example shown in FIG. 2 was used as the pattern example of the thermal expansion adjustment layer.
膜厚は皮膜形成時間を変化させて調整した。熱歪は、定
盤を用いて、第5図に示す歪率の高さを測定した結果を
示す。?11kL14〜凪16は逆に熱歪を生じたため
マイナスを記した。The film thickness was adjusted by changing the film formation time. The thermal strain is the result of measuring the height of the strain rate shown in FIG. 5 using a surface plate. ? On the contrary, thermal distortion occurred in 11kL14 to Nagi16, so negative numbers were written.
また、接着性については、冷却板に接合する際に、冶具
を用いてヘッドを押圧して熱歪を修正しながら接合しな
ければならない凪1(従来例)を除いて、他は特別の冶
具を用いることなく容易にサーマルヘッドと冷却板との
接合が可能であった。Regarding adhesion, with the exception of Nagi 1 (conventional example), which requires a jig to press the head and correct thermal distortion when bonding to the cooling plate, the others require a special jig. It was possible to easily join the thermal head and the cooling plate without using.
表の結果を総合的に判断して、表面粗度は2〜4μm程
度で良く、熱膨張調整層の膜厚は6〜30μmが好まし
いことがわかる。Comprehensively judging the results in the table, it can be seen that the surface roughness may be approximately 2 to 4 μm, and the thickness of the thermal expansion adjustment layer is preferably 6 to 30 μm.
また、熱膨張調整層を形成すると熱歪率が著しく小さく
なシ、同時に、サーマルヘッドを冷却基板に接合するこ
とが容易となることがみとめられる。It has also been found that forming a thermal expansion adjustment layer significantly reduces the thermal strain rate and at the same time makes it easier to bond the thermal head to the cooling substrate.
発明の効果
本発明によれば、セラミック基体の熱歪を解決するとと
もに、冷却基板とサーマルヘッドとの接合強度を改善す
ることができる。その結果セラミック基体をさらに肉厚
にすることが可能となシ、また、信頼性の向上、耐久寿
命の改善も可能となる。Effects of the Invention According to the present invention, thermal distortion of the ceramic substrate can be solved, and the bonding strength between the cooling substrate and the thermal head can be improved. As a result, it is possible to make the ceramic substrate even thicker, and it is also possible to improve reliability and durability.
第1図は本発明によるサーマルヘッドの構成例を示す縦
断面図、第2図はセラミック基体の裏面に形成した熱膨
張調整層のパターン例を示す平面図、第3図は同断面図
、第4図は従来のサーマルヘッドの縦断面図、第5図は
その熱歪の状態を示す横断面図である。
1・・・・・・セラミック基体、2・・・・・・蓄熱ガ
ラス層、も・・・・・・エツチング防止層、4・・・・
・・抵抗体、6・・・・・・導体配線、6・・・・・・
耐摩耗層、7・・・・・・駆動用I(j。
8・・・・・・冷却基板、9・・・・・・接着剤層、1
0・・・・・・熱膨張調整層。
代理人の氏名 弁理士、中 尾 敏 男 ほか1名f・
、、基板
第2図FIG. 1 is a longitudinal cross-sectional view showing an example of the structure of a thermal head according to the present invention, FIG. 2 is a plan view showing an example of a pattern of a thermal expansion adjustment layer formed on the back surface of a ceramic substrate, and FIG. FIG. 4 is a longitudinal cross-sectional view of a conventional thermal head, and FIG. 5 is a cross-sectional view showing the state of thermal distortion thereof. 1...Ceramic base, 2...Heat storage glass layer, Etching prevention layer, 4...
...Resistor, 6...Conductor wiring, 6...
Wear-resistant layer, 7... Drive I (j. 8... Cooling board, 9... Adhesive layer, 1
0...Thermal expansion adjustment layer. Name of agent: Patent attorney Toshio Nakao and one other person f.
,, Board figure 2
Claims (3)
抗体及びその電極と、前記発熱抵抗体および電極を被覆
するように形成した耐摩耗層と、前記基板の裏面に形成
した熱膨張調整層とを有するサーマルヘッド。(1) An insulating substrate, a heating resistor and its electrode formed on the surface of the substrate, a wear-resistant layer formed to cover the heating resistor and the electrode, and a thermal expansion layer formed on the back surface of the substrate. A thermal head having an adjustment layer.
または合金から構成された特許請求の範囲第1項記載の
サーマルヘッド。(2) The thermal head according to claim 1, wherein the thermal expansion adjustment layer is made of ceramic, cermet, metal, or alloy.
0^−^7cm/℃である特許請求の範囲第2項記載の
サーマルヘッド。(3) The thermal expansion coefficient of the thermal expansion adjustment layer is (30 to 140) x 1
The thermal head according to claim 2, which has a temperature of 0^-^7cm/°C.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60098334A JP2568492B2 (en) | 1985-05-09 | 1985-05-09 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60098334A JP2568492B2 (en) | 1985-05-09 | 1985-05-09 | Thermal head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61255872A true JPS61255872A (en) | 1986-11-13 |
JP2568492B2 JP2568492B2 (en) | 1997-01-08 |
Family
ID=14217003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60098334A Expired - Lifetime JP2568492B2 (en) | 1985-05-09 | 1985-05-09 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2568492B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4972205A (en) * | 1988-12-08 | 1990-11-20 | Rohm Co., Ltd. | Thermal printing head |
FR2662395A1 (en) * | 1990-05-23 | 1991-11-29 | Axiohm | IMPROVEMENT TO THERMAL PRINTER HEADS. |
JP2008062616A (en) * | 2006-09-11 | 2008-03-21 | Tdk Corp | Thermal head and printer |
CN112123938A (en) * | 2019-06-24 | 2020-12-25 | 东芝泰格有限公司 | Ink jet head and ink jet printer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5583349U (en) * | 1978-12-05 | 1980-06-09 |
-
1985
- 1985-05-09 JP JP60098334A patent/JP2568492B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5583349U (en) * | 1978-12-05 | 1980-06-09 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4972205A (en) * | 1988-12-08 | 1990-11-20 | Rohm Co., Ltd. | Thermal printing head |
FR2662395A1 (en) * | 1990-05-23 | 1991-11-29 | Axiohm | IMPROVEMENT TO THERMAL PRINTER HEADS. |
JP2008062616A (en) * | 2006-09-11 | 2008-03-21 | Tdk Corp | Thermal head and printer |
CN112123938A (en) * | 2019-06-24 | 2020-12-25 | 东芝泰格有限公司 | Ink jet head and ink jet printer |
CN112123938B (en) * | 2019-06-24 | 2022-06-17 | 东芝泰格有限公司 | Ink jet head and ink jet printer |
Also Published As
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---|---|
JP2568492B2 (en) | 1997-01-08 |
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