JPS61254619A - Epoxy resin composition for encapsulation of semiconductor - Google Patents
Epoxy resin composition for encapsulation of semiconductorInfo
- Publication number
- JPS61254619A JPS61254619A JP9645085A JP9645085A JPS61254619A JP S61254619 A JPS61254619 A JP S61254619A JP 9645085 A JP9645085 A JP 9645085A JP 9645085 A JP9645085 A JP 9645085A JP S61254619 A JPS61254619 A JP S61254619A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- powder
- quartz
- phenol
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野］
本発明は半導体封止用エポキシ樹脂組成物、特には半導
体装置成形時に極めて高い流動性を示すと共にパリの発
生が少なく、さらには熱膨張係数の小さい成形物を与え
る半導体封止用エポキシ樹脂組成物に関するものである
。Detailed Description of the Invention (Industrial Field of Application) The present invention provides an epoxy resin composition for semiconductor encapsulation, in particular, which exhibits extremely high fluidity during semiconductor device molding, has little generation of flakes, and has a low thermal expansion coefficient. The present invention relates to an epoxy resin composition for semiconductor encapsulation that provides small molded products.
（従来の技術〕
半導体封止用樹脂についてはすでに各種のものが知られ
ており、これＫはエポキシ樹脂、シリコーン樹脂、ジア
リルフタレート樹脂、フェノール樹脂、ポリフェニレン
サルファイド樹脂などを主剤とする組成物が用いられて
いるが、耐湿性、ｍ械特性、生産性１価格などの面から
フェノール硬化性エポキシ樹脂が最も多く便用されてい
る。(Prior art) Various types of resins for semiconductor encapsulation are already known, and K uses compositions based on epoxy resins, silicone resins, diallyl phthalate resins, phenol resins, polyphenylene sulfide resins, etc. However, phenol-curable epoxy resins are most commonly used due to their moisture resistance, mechanical properties, productivity, and cost.
しかし、最近における低圧トランスファー成形用金型は
キャピテイ数の増加に伴なって金型寸法が大型化してき
ており、このような金型で半導体装置の成形を行なうと
一部に樹脂が未充填となるという事故が発生するおそれ
があるため、この封止用樹ｊｌｉｉＪｌｆＬ成物には流
動性のよいものとすることが求められている。However, the dimensions of recent low-pressure transfer molding molds have become larger as the number of cavities has increased, and when semiconductor devices are molded using such molds, some parts may not be filled with resin. Since there is a risk that an accident may occur, this sealing tree jliiJlfL composition is required to have good fluidity.
七のため、フェノール硬化性エポキシ８１脂についても
ｌ）溶融粘度の低い樹脂を使用するか、低分子の希釈剤
を混合する。２）硬化触媒の置を減量する。３）無機質
充填剤量を減量する−という方法が提案されているが、
この１）の方法では流動性は向上しても成形時のパリの
発生が大吉くな１１、希釈剤を使用すると成形物表面に
ニジミが出たり、揮発分が多くなるので寸法変化が大き
くなるという不利があり、さらｋはアルミニウム配線の
腐蝕が速くなるという欠点も発生する。また。7) For phenol-curing epoxy 81 resins, l) Use resins with low melt viscosity or mix low-molecular-weight diluents. 2) Reduce the amount of curing catalyst. 3) Reducing the amount of inorganic filler has been proposed, but
Although method 1) improves fluidity, it often causes cracks during molding11, and if a diluent is used, smudges appear on the surface of the molded product, and the volatile content increases, resulting in large dimensional changes. In addition, k has the disadvantage that the aluminum wiring corrodes more quickly. Also.
この２）の方法では樹脂組成物の硬化性がわるくなるた
めに生産性向上のために速硬化性にするという要求に逆
行するといつ不利があり、３）の方法には樹脂組成物の
熱膨張係数や応力が太き（なって耐クラツク性が低下し
、さらＫはシリコンチップ表面のアルミニウム配線やパ
ッシベーション膜に加わる力が太きくな１３．耐湿性も
低下するという不利が発生する。In method 2), the curability of the resin composition deteriorates, so if it goes against the demand for rapid curing in order to improve productivity, there is a disadvantage in method 3). The coefficient and stress are large (as a result, crack resistance is reduced), and the force applied to the aluminum wiring and passivation film on the surface of the silicon chip is also large.
また、このエポキシ樹脂組成物についてはこ＼に添加さ
れる無機質充填剤として球状石英粉末を用いることが知
られており、これについては球状石英を配合すると応力
が低下するということから樹脂組成物に平均粒子径が１
〜６０１１ｍの球状溶融シリカを３０〜８０ｆｒｉｉ％
添加することも提案されている（特開昭５８−１３８７
４０号公報参照）が、これＫは流動性が十分満足すべき
ものでないために大型化した成形金型を用いたときに未
充填が発生するほか樹脂モレ、パリの発生が多いという
問題点がある。In addition, it is known that spherical quartz powder is used as an inorganic filler in this epoxy resin composition, and this is because adding spherical quartz reduces stress. Average particle size is 1
30-80 frii% of ~6011m spherical fused silica
It has also been proposed to add
(Refer to Publication No. 40) However, since this K does not have sufficiently satisfactory fluidity, there are problems such as underfilling occurs when a larger mold is used, and resin leakage and flaking occur frequently. .
（発明の構成）
本発明はこのような不利を解決することのできる半導体
封止用エポキシ樹脂組成物に関するもので、これはｌ）
フェノール硬化性エポキシ樹脂１００重量部、２）平均
粒径１〜２５μｍの球状石英粉末２０〜９９重量％と、
９０重量％以上が粒径１１１ｍ Ｒ下の粉末である微細
石英粉末１〜８０［３１％とからなる石英質充填剤１０
０〜５００重量部とからなることを特徴とするものであ
る。(Structure of the Invention) The present invention relates to an epoxy resin composition for semiconductor encapsulation that can solve the above-mentioned disadvantages.
100 parts by weight of a phenol-curable epoxy resin, 2) 20-99% by weight of spherical quartz powder with an average particle size of 1-25 μm;
Quartz filler 10 consisting of fine quartz powder 1 to 80 [31%] of which 90% by weight or more is powder with a particle size of 111 m R or less
0 to 500 parts by weight.
すなわち１本発明者らは流動性が高（、パリの発生も少
ない半導体封止用エポキシ樹脂組成物について種々検討
した結果、これにはエポキシ樹脂に添加する無機質充填
剤として石英粉末を使用するが、この石英粉末を特に粒
径が１μｍ以下の微細石英粉末を含んだものとすると流
動性が増大するし、パリの発生も減少することができる
ということを見出し、この）微細石英粉末についてはそ
の９ｏｉ１％以上が粒径１μｍ以下のものとし、これを
平均粒径が１〜２５μｍである球状石英粉末と混合して
使用すればよいということ、またこれＫよればフェノー
ル硬化性エポキシ樹脂に対する石英粉末の高充填が可能
となるのでこの組成物から作られた成形物の熱膨張係数
を小さくすることができるということを確認し、こ＼に
使用する石英粉末の種類、配合比などについての研究を
進めて本発明を完成させた。In other words, the present inventors have conducted various studies on epoxy resin compositions for semiconductor encapsulation that have high fluidity (and less generation of paris), and have found that quartz powder is used as an inorganic filler added to the epoxy resin. found that when this quartz powder contains fine quartz powder with a particle size of 1 μm or less, the fluidity increases and the occurrence of paris can be reduced. According to K, 1% or more of 9oi should have a particle size of 1 μm or less, and this should be used by mixing it with spherical quartz powder having an average particle size of 1 to 25 μm. We confirmed that it was possible to reduce the coefficient of thermal expansion of molded products made from this composition by allowing high filling of quartz powder, and conducted research on the type of quartz powder to be used and the blending ratio. We proceeded to complete the present invention.
つぎに本発明の組成物を構成する各成分について説明す
る。Next, each component constituting the composition of the present invention will be explained.
まず１本発明において使用される第１成分としてのフェ
ノール硬化性エポキシ樹脂は、１分子中に２個以上のエ
ポキシ基を有するエポキシ樹脂とフェノール系硬化剤と
からなる硬化可能なエポキシ樹脂であり、このものは後
述するフェノール系硬化剤によって硬化されるものであ
ればその分子構造１分子量などに特に制限はなく、従来
から知られている種々のものを使用することができ、こ
れには例えばエピクロルヒドリンとビスフェノールをは
じめとする各棟のノボラック樹脂から合成されるエポキ
シ樹脂、脂環式エポキシ樹脂あるいは塩素や臭素などの
ハロゲン原子を導入したエポキシ樹脂などがあげられる
。このエポキシ樹脂にモノエポキシ化合物を適宜併用す
ることは差支えなく−このモノエポキシ化合物としては
スチレンオキシド−シクロヘキセンオキシド、プロピレ
ンオキシド、メチルグリシジルエーテル、エチルグリシ
ジルエーテル、フェニルグリシジルエーテル。First, the phenol-curable epoxy resin as the first component used in the present invention is a curable epoxy resin consisting of an epoxy resin having two or more epoxy groups in one molecule and a phenolic curing agent, This material is not particularly limited in its molecular structure and molecular weight as long as it can be cured with the phenolic curing agent described later, and various conventionally known products can be used, such as epichlorohydrin. Examples include epoxy resins synthesized from various novolac resins such as and bisphenol, alicyclic epoxy resins, and epoxy resins into which halogen atoms such as chlorine and bromine are introduced. There is no problem in appropriately using a monoepoxy compound in combination with this epoxy resin; examples of the monoepoxy compound include styrene oxide-cyclohexene oxide, propylene oxide, methyl glycidyl ether, ethyl glycidyl ether, and phenyl glycidyl ether.
アリルグリシジルエーテルーオクチレンオキシド。Allyl glycidyl ether-octylene oxide.
ドデセンオキシドなどが例示される。Examples include dodecene oxide.
また、このフェノール系硬化剤としては従来公知の種々
のものを使用することができ、これＫは例えばフェノー
ルノボラック、クレゾールノボラックなどのようＫ１分
子中に２個以上の水酸基を有するものをあげることがで
きる。In addition, various conventionally known phenolic curing agents can be used, and examples of K include those having two or more hydroxyl groups in each K molecule, such as phenol novolac and cresol novolac. can.
なお、このエポキシ樹脂には上記した硬化剤とエポキシ
樹脂との反応を促進させる目的で各種の硬化促進剤１例
えばイミダゾールあるいはその誘導体、第三級アミン誘
導体、ホスフィン系誘導体。The epoxy resin may contain various curing accelerators 1, such as imidazole or its derivatives, tertiary amine derivatives, and phosphine derivatives, for the purpose of promoting the reaction between the above-mentioned curing agent and the epoxy resin.
シクロアミジン誘導体などを併用することは任意とされ
る。It is optional to use a cycloamidine derivative or the like in combination.
つぎにこの組成物に使用される第２成分としての石英系
充填剤は平均粒径が１〜２５μｍの球状石英と９０重量
％以上が１μｒｒＬ以下の微細石英粉末とからなるもの
とされる。Next, the quartz-based filler as the second component used in this composition is made of spherical quartz having an average particle size of 1 to 25 μm and 90% by weight or more of fine quartz powder having a size of 1 μrrL or less.
この平均粒径が１〜２５μｍの球状石英はアスペクト比
が１〜１．３とされるものであるが、このものは例えば
合成あるいは天然の石英粉末を水素またはグロパンなど
の可燃ガスと酸素ガスとを用いて火炎中で溶融するか一
テトラエトキシシランやテトラメトキシシランを加水分
解することＫよって得たものあるいは加水分解後に焼結
処理または溶融したものとすればよい。This spherical quartz with an average particle size of 1 to 25 μm has an aspect ratio of 1 to 1.3, and is produced by mixing synthetic or natural quartz powder with combustible gas such as hydrogen or glopane and oxygen gas. It may be obtained by melting in a flame using a silane, by hydrolyzing monotetraethoxysilane or tetramethoxysilane, or by sintering or melting after hydrolysis.
また、この微細石英粉末は天然あるいは合成の石英塊を
粉砕するか、粉砕後さらに分級することＫよって得たも
のとすればよいが、このものは１μｒｒＬ以下の粒径を
もつものが９０重童％以下ではこれを添Ｗしたエポキシ
樹脂組成物に十分満足すべき流動性が与えられず、さら
Ｋは樹脂モレ、パリの発生が太き（なるので９０！ｉｔ
％以上が１ｐＷＬａ下の粒径のものとする必要がある。In addition, this fine quartz powder may be obtained by crushing a natural or synthetic quartz lump, or by further classifying it after crushing. % or less, the epoxy resin composition to which it is added will not have sufficiently satisfactory fluidity, and further K will cause resin leakage and flaking (because it will become 90!
It is necessary that at least % of the particles have a particle size below 1 pWLa.
この第２成分における上記した球状石英と微細石英粉末
との配合比は微細石英粉末が全祉の１重量％以下では本
発明のエポキシ樹脂組成物に流動性向上、パリの減少と
いう目的が達成されず。When the blending ratio of the above-mentioned spherical quartz and fine quartz powder in this second component is such that the fine quartz powder is less than 1% by weight of the total weight, the purpose of improving fluidity and reducing paris in the epoxy resin composition of the present invention is achieved. figure.
８０重惜％以上とするとこの組成物から作られる成形体
が樹脂クラックの発生し易いものとなるので、微細石英
粉末を１〜８０重量％含有するものとすることが必要と
される。If the content is more than 80% by weight, molded articles made from this composition will be prone to resin cracks, so it is necessary to contain 1 to 80% by weight of fine quartz powder.
なお、この第２成分としての石英充填剤の配合量は第１
成分としてのエポキシ樹脂１００重量部に対し、１００
重蓼部以下とするとこの組成物から作られる成形品が線
膨張係数の大きいものとなり、耐クラツク性も満足する
ものにならないし。The amount of the quartz filler as the second component is the same as the first component.
100 parts by weight of epoxy resin as a component
If the weight is less than the weight, the molded product made from this composition will have a large coefficient of linear expansion and its crack resistance will not be satisfactory.
５００重量部以上とするとこれのエポキシ樹脂への分散
性がわるくなり−この組成物の流動性もわるくなるので
、これは１００〜５００１ｆｆｉ部の範囲とする必要が
あるが、この好ましい範囲は２００〜３５０重量部とさ
れる。If it exceeds 500 parts by weight, the dispersibility in the epoxy resin will be poor, and the fluidity of the composition will also be poor, so it needs to be in the range of 100 to 5001 parts by weight, but the preferred range is 200 to 5001 parts by weight. The amount is 350 parts by weight.
本発明のエポキシ樹脂組成物は上記した第１〜第２成分
の所定量を均一に混合することＫよって。The epoxy resin composition of the present invention is produced by uniformly mixing predetermined amounts of the first and second components described above.
得ることができるが、この石英系充填剤は予じめその表
面をカーボンファンクショナルシランなどで処理したも
のとしてもよく、これにはまた必要に応じ各種の添加剤
１例えばカーボンブラックなどの顔料、天然ワラ身スな
どの離型剤、難燃剤。However, the surface of this quartz-based filler may be treated with carbon functional silane or the like in advance, and if necessary, various additives 1, such as pigments such as carbon black, Mold release agents and flame retardants such as natural straw.
オルガノポリシロキサン、オルガノポリシロキサンとフ
ェノールノボラック樹脂とのブロック共重合体−変性ポ
リブタジェンなどの可撓性付与剤。Flexibility imparting agents such as organopolysiloxane and block copolymer-modified polybutadiene of organopolysiloxane and phenol novolac resin.
カーボンファンクショナルシランなどを添加してもよい
。Carbon functional silane or the like may be added.
つぎに本発明の実施例をあげるが１例中の部は奮量部を
示したものであり、各表中における物性値は下記の方法
による試験結果を示したものである。Next, examples of the present invention will be given, and the part in each example indicates the active part, and the physical property values in each table show the test results according to the following method.
ｌ）スパイラルフロー
エポキシ樹脂組成物の粉末２０．Ｆを、ＥＭＭＩ−１−
６６に準じた金型な用いて金型温度１７５℃、プランジ
ャー圧カフ０Ｋｔ／−で成形したときの値を測定した。l) Powder of spiral flow epoxy resin composition 20. F, EMMI-1-
The values were measured when molding was performed using a mold according to No. 66 at a mold temperature of 175°C and a plunger pressure cuff of 0 Kt/-.
２）樹脂もれ、パリ
エポキシ樹脂組成物の粉末２（ｌを、１０μｍ３０μｍ
のスリットをもつパリ測定用金型を用いて金型温度１７
５℃、プランジャー圧カフ０Ｋｆ／−で成形し、このと
きのスリットに洩れた樹脂の長さをノギスで測定した。2) Resin leakage, Paris epoxy resin composition powder 2 (l, 10 μm 30 μm
The mold temperature was set to 17 using a Paris measurement mold with a slit of
Molding was carried out at 5° C. with a plunger pressure cuff of 0 Kf/−, and the length of the resin leaking into the slit at this time was measured with a caliper.
３）熱膨張係数
エポキシ樹脂組成物を１７５℃、２分の成形条件で、４
ｉｇｍｐＸ高さ１５ｍｍの円柱状に成形し、１８０℃で
４時間アフターキュアーしてからアグネＤＬ１５００（
真空瑚化社製商品名〕を用いて２５℃から１２０℃まで
の熱膨張係数を測定した。3) Thermal expansion coefficient The epoxy resin composition was molded at 175°C for 2 minutes.
igmp
The thermal expansion coefficient was measured from 25° C. to 120° C. using a product manufactured by Shinku Goka Co., Ltd. (trade name).
４）曲げ弾性率
エポキシ樹脂組成物を１７５℃、２分の成形条件で１１
００Ｘ１０Ｘ４の抵抗棒に成形し、１８０℃で４時間ア
フターキュアーしてからＪＩ８に６９１１の方法に準じ
て曲げ弾性率を測定した。4) Flexural modulus The epoxy resin composition was molded at 175°C for 2 minutes at 11
It was molded into a 00x10x4 resistance bar, after-cured at 180°C for 4 hours, and then its flexural modulus was measured according to the method of JI8/6911.
５）耐クラツクテスト
９、ＯＸ４．５Ｘ０．５ｍのシリコンチップ４０個を１
４ＰＸＮＩＯフレームに貼も）付け、これにエポキシ樹
脂組成物を１７５℃、２分の成形条件で成形し、１８０
℃で４時間アフターキュアーしてから、−１９６℃（１
分）〜＋３００℃（１分）の温度サイクルテストを行な
い、１０サイクル後における樹脂クラック発生率を測定
した。5) Crack resistance test 9, 40 silicon chips of OX4.5x0.5m
4PXNIO frame) and molded the epoxy resin composition on it at 175°C for 2 minutes.
After cure for 4 hours at -196°C (1
A temperature cycle test of 1 minute) to +300°C (1 minute) was conducted, and the resin crack occurrence rate after 10 cycles was measured.
実施例１〜３．比較例１〜３
クレゾールノボラック型エポキシ樹脂・ＥＯＮ−１２７
０（チパ社製商品名）６００部、フェノールノボラック
樹脂・ＴＤ２０９３（大日本インキ社製商品名〕３００
部に一藁１表に示した量の石英系充填剤とシリコーンオ
イル変性エポキシ樹脂（シリコーン変性率３０％）１０
０部、トリフェニルホスフィンｌＯ部、カルナバワック
スｌＯ部、三酸化アンチモン１００部、γ−グリシドキ
シグロビルトリメトキシシランｌＯ部およびカーボンブ
ラソフ１０部を配合し、ヘンシェルミキサーで〒備ブレ
ンドしてから押出機で混練し、冷却後粉砕してフェノー
ル硬化性エポキシ樹脂組成物６種を作１）、ついで、こ
れＫついての物性をしろべたところ、第２表に示したと
おりの結果が得られた。Examples 1-3. Comparative Examples 1 to 3 Cresol novolac type epoxy resin/EON-127
0 (trade name manufactured by Chipa Co., Ltd.) 600 parts, phenol novolac resin TD2093 (trade name manufactured by Dainippon Ink Co., Ltd.) 300 parts
quartz filler and silicone oil-modified epoxy resin (silicone modification rate 30%) in the amounts shown in the table.
0 parts, 10 parts of triphenylphosphine, 10 parts of carnauba wax, 100 parts of antimony trioxide, 10 parts of γ-glycidoxyglobyltrimethoxysilane, and 10 parts of carbonbrasof were blended in a Henschel mixer. Six types of phenol-curable epoxy resin compositions were prepared by kneading them in an extruder, cooling and pulverizing them1).Then, when the physical properties of these K were investigated, the results shown in Table 2 were obtained. .
実施例４〜７．比較例４〜５
クレゾールノボラック型エポキシ樹脂・ＫＯＣＮ１０２
（日本化薬社製商品名）６５０部、フェノールノボラッ
ク樹脂・ＴＤ２０９３（前出ン３００部、プロふ化エポ
キシ樹脂・ＹＤＢ ３４０（東部化成社製商品名）５０
部に、第３表に示した量の石英系充填剤と実施例１〜３
で使用したものと同じ種類、量の硬化触媒、離型剤、シ
ランカップリング剤を配合して一上記と同様に処理して
フェノール硬化性エポキシ樹脂組成物６棟を作り一つい
でこれについての物性をしらべたところ、第４表に示し
たとおＩ】の結果が得られた。Examples 4-7. Comparative Examples 4-5 Cresol novolac type epoxy resin/KOCN102
(Product name manufactured by Nippon Kayaku Co., Ltd.) 650 parts, Phenol novolak resin TD2093 (300 parts of the above mentioned product), Professional epoxy resin YDB 340 (Product name manufactured by Tobu Kasei Co., Ltd.) 50
quartz-based filler in the amount shown in Table 3 and Examples 1 to 3.
The same types and amounts of curing catalyst, mold release agent, and silane coupling agent as those used in were mixed and treated in the same manner as above to prepare six phenol-curable epoxy resin compositions and the physical properties thereof were determined. The results shown in Table 4 were obtained.
Claims (1)
量％と、９０重量％以上が粒径１μｍ以下の粉末である
微細石英粉末１〜８０重量とからなる石英質充填剤 １００〜５００重量部 とからなることを特徴とする半導体封止用エポキシ樹脂
組成物。[Claims] 1.1) 100 parts by weight of a phenol-curing epoxy resin 2) 20-99% by weight of spherical quartz powder with an average particle size of 1-25 μm, and 90% by weight or more of powder having a particle size of 1 μm or less An epoxy resin composition for semiconductor encapsulation, comprising 1 to 80 parts by weight of fine quartz powder and 100 to 500 parts by weight of a quartz filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9645085A JPS61254619A (en) | 1985-05-07 | 1985-05-07 | Epoxy resin composition for encapsulation of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9645085A JPS61254619A (en) | 1985-05-07 | 1985-05-07 | Epoxy resin composition for encapsulation of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61254619A true JPS61254619A (en) | 1986-11-12 |
| JPS6326128B2 JPS6326128B2 (en) | 1988-05-28 |
Family
ID=14165354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9645085A Granted JPS61254619A (en) | 1985-05-07 | 1985-05-07 | Epoxy resin composition for encapsulation of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61254619A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61268750A (en) * | 1985-05-22 | 1986-11-28 | Shin Etsu Chem Co Ltd | Epoxy resin composition for semiconductor sealing use |
| JPS6440518A (en) * | 1987-08-07 | 1989-02-10 | Nitto Denko Corp | Semiconductor device |
| JPS6465116A (en) * | 1987-09-04 | 1989-03-10 | Toray Industries | Resin composition for semiconductor sealing |
| JPH01263131A (en) * | 1988-04-15 | 1989-10-19 | Nippon Steel Chem Co Ltd | Silica for filling sealing resin |
| JPH01294765A (en) * | 1988-05-20 | 1989-11-28 | Nippon Retsuku Kk | Epoxy resin composition |
| JPH02228354A (en) * | 1989-03-01 | 1990-09-11 | Shin Etsu Chem Co Ltd | Epoxy resin composition for semiconductor sealing and cured product thereof |
| JPH08259671A (en) * | 1996-01-29 | 1996-10-08 | Nitto Denko Corp | Semiconductor device |
| EP0716118A3 (en) * | 1994-08-05 | 1997-04-09 | Sasib Spa | Filled epoxy resin composition and process for moulding static components for machines therefrom |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53102361A (en) * | 1977-02-18 | 1978-09-06 | Toray Silicone Co Ltd | Thermosetting resin composition |
| JPS5443021A (en) * | 1977-09-12 | 1979-04-05 | Minolta Camera Co Ltd | F/stop digital value display device of cameras |
| JPS56122145A (en) * | 1980-02-29 | 1981-09-25 | Shin Etsu Chem Co Ltd | Resin composition for sealing semiconductor device |
| JPS57195117A (en) * | 1981-05-27 | 1982-11-30 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and its preparation |
| JPS58138740A (en) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | Resin composition |
| JPS59108026A (en) * | 1982-12-10 | 1984-06-22 | Toshiba Chem Corp | Epoxy resin composition for sealing |
| JPS59204633A (en) * | 1983-05-06 | 1984-11-20 | Denki Kagaku Kogyo Kk | Resin composition with low radioactivity |
| JPS6051613A (en) * | 1983-07-26 | 1985-03-23 | チバ−ガイギ− アクチエンゲゼルシヤフト | Spherical fused silica and use as filler and resin composition |
-
1985
- 1985-05-07 JP JP9645085A patent/JPS61254619A/en active Granted
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53102361A (en) * | 1977-02-18 | 1978-09-06 | Toray Silicone Co Ltd | Thermosetting resin composition |
| JPS5443021A (en) * | 1977-09-12 | 1979-04-05 | Minolta Camera Co Ltd | F/stop digital value display device of cameras |
| JPS56122145A (en) * | 1980-02-29 | 1981-09-25 | Shin Etsu Chem Co Ltd | Resin composition for sealing semiconductor device |
| JPS57195117A (en) * | 1981-05-27 | 1982-11-30 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and its preparation |
| JPS58138740A (en) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | Resin composition |
| JPS59108026A (en) * | 1982-12-10 | 1984-06-22 | Toshiba Chem Corp | Epoxy resin composition for sealing |
| JPS59204633A (en) * | 1983-05-06 | 1984-11-20 | Denki Kagaku Kogyo Kk | Resin composition with low radioactivity |
| JPS6051613A (en) * | 1983-07-26 | 1985-03-23 | チバ−ガイギ− アクチエンゲゼルシヤフト | Spherical fused silica and use as filler and resin composition |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61268750A (en) * | 1985-05-22 | 1986-11-28 | Shin Etsu Chem Co Ltd | Epoxy resin composition for semiconductor sealing use |
| JPH0329259B2 (en) * | 1985-05-22 | 1991-04-23 | Shinetsu Chem Ind Co | |
| JPS6440518A (en) * | 1987-08-07 | 1989-02-10 | Nitto Denko Corp | Semiconductor device |
| JPS6465116A (en) * | 1987-09-04 | 1989-03-10 | Toray Industries | Resin composition for semiconductor sealing |
| JPH01263131A (en) * | 1988-04-15 | 1989-10-19 | Nippon Steel Chem Co Ltd | Silica for filling sealing resin |
| JPH01294765A (en) * | 1988-05-20 | 1989-11-28 | Nippon Retsuku Kk | Epoxy resin composition |
| JPH02228354A (en) * | 1989-03-01 | 1990-09-11 | Shin Etsu Chem Co Ltd | Epoxy resin composition for semiconductor sealing and cured product thereof |
| EP0716118A3 (en) * | 1994-08-05 | 1997-04-09 | Sasib Spa | Filled epoxy resin composition and process for moulding static components for machines therefrom |
| JPH08259671A (en) * | 1996-01-29 | 1996-10-08 | Nitto Denko Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6326128B2 (en) | 1988-05-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |