JPS61245544A - Tool for gang bonding - Google Patents

Tool for gang bonding

Info

Publication number
JPS61245544A
JPS61245544A JP8703085A JP8703085A JPS61245544A JP S61245544 A JPS61245544 A JP S61245544A JP 8703085 A JP8703085 A JP 8703085A JP 8703085 A JP8703085 A JP 8703085A JP S61245544 A JPS61245544 A JP S61245544A
Authority
JP
Japan
Prior art keywords
tool
semiconductor
bonding
gang bonding
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8703085A
Other languages
Japanese (ja)
Inventor
Kiyoyuki Shibata
柴田　清幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP8703085A priority Critical patent/JPS61245544A/en
Publication of JPS61245544A publication Critical patent/JPS61245544A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent damage at the surface of semiconductor by projecting only the part being in contact with semiconductor electrode of a gang bonding tool. CONSTITUTION:Only a part where a tool is in contact with semiconductor electrode is projected. Even if there is foreign matters on a semiconductor surface, it is not pressed owing to an interval and any damage is not generated.

Description

【発明の詳細な説明】 「産業上の利用分野」 本発明はギヤングボンディング用ツールの構造に関する
。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to the structure of a gigantic bonding tool.

「発明の概要」 本発明はギヤングボンディング用ツールにおいて、半導
体の電極と接する部分のみを突出させたことにより、ボ
ンディング時に半導体表面圧キズがつかないようにした
ものである。"Summary of the Invention" The present invention provides a gigantic bonding tool in which only the portion of the semiconductor in contact with the electrode is protruded, thereby preventing semiconductor surface pressure scratches during bonding.

「従来の技術」 従来のボンディング用ツールの構造は、第２図の様にボ
ンディング部が平面であった。"Prior Art" In the structure of a conventional bonding tool, the bonding part was flat as shown in FIG.

「発明が解決しようとする問題点及び目的」しかし、前
述の従来技術ではボンディング時に半導体表面とツール
との間隔が狭い為、半導体表面にキズをつけるという問
題点を有する。"Problems and Objects to be Solved by the Invention" However, the above-mentioned prior art has the problem of scratching the semiconductor surface because the distance between the semiconductor surface and the tool is narrow during bonding.

そこで本発明はこのような問題点を解決するもので、そ
の目的とするところは半導体表面にキズをつけないボン
ディング用ツールを提供するところにある。The present invention is intended to solve these problems, and its purpose is to provide a bonding tool that does not damage the semiconductor surface.

「問題点を解決するための手段」 本発明のギヤングボンディング用ツールは、半導体の電
極と接する部分のみ全突出させたことを特徴とする。"Means for Solving the Problems" The gigantic bonding tool of the present invention is characterized in that only the portion that contacts the semiconductor electrode is fully protruded.

「実施例」 第１図は本発明の実施例におけるギヤングボンディング
用ツールの断面図であって、半導体の電極と接する部分
のみを突出させたことにより、半導体表面とツールのボ
ンディング面との間隔が広くなり、半導体表面に異物が
あってもボンディング時に押しつけてキズをつけること
がなくなる。Embodiment FIG. 1 is a cross-sectional view of a gigantic bonding tool according to an embodiment of the present invention, and by protruding only the part that contacts the semiconductor electrode, the distance between the semiconductor surface and the bonding surface of the tool is increased. This makes it possible to prevent foreign objects from pressing against the surface of the semiconductor and causing scratches during bonding.

「発明の効果」 以上述べたように発明によれはギヤングボンディング用
ツールを半導体の電極と接する部分のみを突出させるこ
とにより、ボンディング時に半導体表面にキズがっかな
いという効果を有する。"Effects of the Invention" As described above, the present invention has the effect that the semiconductor surface is not scratched during bonding by protruding only the portion of the gigantic bonding tool that contacts the semiconductor electrode.

【図面の簡単な説明】[Brief explanation of the drawing]

第１因は本発明のギヤングボンディング用ツールの一実
施例を示す主要断面図。 第２図は従来のギヤングボンディング用ツールを示す主
要断面図。 第６図は第１図の平面図。 １・・・・・・突出部 以上The first factor is a main sectional view showing an embodiment of the gigantic bonding tool of the present invention. FIG. 2 is a main sectional view showing a conventional gigantic bonding tool. FIG. 6 is a plan view of FIG. 1. 1... More than the protruding part

Claims (1)

【特許請求の範囲】[Claims] 半導体の電極と接する部分のみを突出させた事を特徴と
するギャングボンディング用ツール。A gang bonding tool characterized by protruding only the part that contacts the semiconductor electrode.
JP8703085A 1985-04-23 1985-04-23 Tool for gang bonding Pending JPS61245544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8703085A JPS61245544A (en) 1985-04-23 1985-04-23 Tool for gang bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8703085A JPS61245544A (en) 1985-04-23 1985-04-23 Tool for gang bonding

Publications (1)

Publication Number Publication Date
JPS61245544A true JPS61245544A (en) 1986-10-31

Family

ID=13903552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8703085A Pending JPS61245544A (en) 1985-04-23 1985-04-23 Tool for gang bonding

Country Status (1)

Country Link
JP (1) JPS61245544A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349317A (en) * 1992-04-03 1994-09-20 Mitsubishi Denki Kabushiki Kaisha High frequency signal transmission tape

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349317A (en) * 1992-04-03 1994-09-20 Mitsubishi Denki Kabushiki Kaisha High frequency signal transmission tape

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