JPS61243821A - Epoxy resin composition for sealing semiconductor - Google Patents
Epoxy resin composition for sealing semiconductorInfo
- Publication number
- JPS61243821A JPS61243821A JP8720985A JP8720985A JPS61243821A JP S61243821 A JPS61243821 A JP S61243821A JP 8720985 A JP8720985 A JP 8720985A JP 8720985 A JP8720985 A JP 8720985A JP S61243821 A JPS61243821 A JP S61243821A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- parts
- phenyl
- dihydroxymethylimidazole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はトランジスタ、ICおよびLSIなどのいわゆ
る半導体素子類をトランスファ成形法によシ封止する友
めに使用するエポキシ樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an epoxy resin composition used for sealing so-called semiconductor elements such as transistors, ICs, and LSIs by transfer molding.
トランジスタ、IC%LSIなどの半導体素子の封止は
その経済性の点からエポキシ樹脂によるトランスファ成
形が一般的であり、中でもノボラック型エポキシ樹脂と
硬化剤としてノボラック型フェノール樹脂を使用する糸
が耐湿性の点で優れているため現在主流となっている。Transfer molding using epoxy resin is common for encapsulating semiconductor elements such as transistors and IC% LSIs due to its economic efficiency.Among them, threads using novolac type epoxy resin and novolac type phenol resin as a hardening agent are moisture resistant. It is currently the mainstream because it is superior in this respect.
一方ff形工程においては生産性の向上を図るため成形
の高サイクル化が行なわれつつあるが。On the other hand, in the FF type process, higher molding cycles are being implemented in order to improve productivity.
成形時間が短縮化するにつれ、成形直後の硬化物が柔軟
にな9.成形作業性に劣るとい5問題が発生する。9. As the molding time is shortened, the cured product immediately after molding becomes more flexible. 5 problems arise when molding workability is poor.
単に、成形直後の硬化物の硬さを増すだけであれば、従
来知られている通常の硬化促進剤を多量に樹脂組成物に
配合すれば良いが、樹脂組成物の脈動性が悪くなり、さ
らにポットライフが短かくなるという問題が新7’(f
c発生する。If you simply want to increase the hardness of the cured product immediately after molding, you can add a large amount of a conventionally known curing accelerator to the resin composition, but this will worsen the pulsation of the resin composition, Furthermore, the problem of shorter pot life is the new 7' (f
c occurs.
この発明は上記観点から硬化性の良好な成形作業性に優
れるエポキシ樹脂組成物を得ようとするものである。In view of the above, the present invention aims to provide an epoxy resin composition that has good curability and excellent molding workability.
本発明者らは、上記問題点を解決すべく、鋭意検討を行
なった結果1%定のイミダゾール酵導体を硬化促進剤に
使用することによp問題点を解決できることを見い出し
、この発明を完成するに至った。In order to solve the above problems, the present inventors conducted intensive studies and found that the p problem could be solved by using 1% imidazole enzyme conductor as a curing accelerator, and completed this invention. I ended up doing it.
すなわち本発明は、ノボラック型フェノール樹脂を硬化
剤とするエポキシ樹脂組成物に硬化促進剤として、2−
フェニル−4,5−ジヒドロキシメチルイミダゾールを
用いることt−特徴とするものである。That is, the present invention provides 2-
The use of phenyl-4,5-dihydroxymethylimidazole is a t-characteristic.
本発明で用いられるエポキシ樹脂はフェノール、クレゾ
ール、ビスフェノールAなどとホルムアルデヒドなどを
酸性触媒で縄付させて得られる樹脂を原料としてエピク
ロルヒドリンでグリシジルエーテル化するなどしてエポ
キシ化したもので、エポキシ当量が170〜300.好
ましくはエポキシ当量180〜200のものが硬化性の
点で最も優れている。The epoxy resin used in the present invention is made by epoxidizing a resin obtained by binding phenol, cresol, bisphenol A, etc. with formaldehyde, etc. using an acidic catalyst as a raw material, and converting it into glycidyl ether with epichlorohydrin. 170-300. Preferably, those having an epoxy equivalent of 180 to 200 are most excellent in terms of curability.
硬化剤としてのノボラック型フェノール樹脂ハ、フェノ
ール、クレゾール、ビスフェノールAなどとホルムアル
デヒドなどを酸性触媒で締付させて得られる樹脂で69
1エポキシ樹脂中に含まれるエポキシ41個当たジフェ
ノール性水酸基が05〜2.0個、望ましくはa8〜1
.2個となるような割合で用いる。Novolak type phenolic resin as a hardening agent is a resin obtained by tightening phenol, cresol, bisphenol A, etc. and formaldehyde etc. with an acidic catalyst.69
The number of diphenolic hydroxyl groups per 41 epoxy groups contained in one epoxy resin is 05 to 2.0, preferably a8 to 1.
.. Use in such a proportion that there will be 2 pieces.
本発明においてはさらに硬化促進剤として2−フェニル
−4,5−ジヒドロキシメチルイミダゾールを用いるが
配合量としてはエポキシ樹脂100!量部に対し1〜5
重量部好ましくは3〜4重量部である。かへる硬化促進
剤は単独もしくは特性を損わない範囲で他の硬化促進剤
と併用することも可能である。In the present invention, 2-phenyl-4,5-dihydroxymethylimidazole is further used as a curing accelerator, and the blending amount is 100% of the epoxy resin! 1 to 5 parts
Parts by weight are preferably 3 to 4 parts by weight. The curing accelerator can be used alone or in combination with other curing accelerators as long as the properties are not impaired.
本発明に係る組成物には更に充填材を含む。The composition according to the invention further includes a filler.
充填材として#′i、シリカ、カラス、ケイソウ土、タ
ルク、マイカ、アスベスト、炭酸カルシウム、アルミナ
、硫酸バリウムなどを用いることができるがシリカおよ
びガラスが電気特性の点で優れている。充填材の便用意
は、上記エポキシ樹脂100重量部に対し100〜50
0重量部の範囲が好ましく100重量部以下では耐湿性
に劣り、また500重量部を越えると流動性が失われ好
ましくない。#'i, silica, glass, diatomaceous earth, talc, mica, asbestos, calcium carbonate, alumina, barium sulfate, etc. can be used as the filler, but silica and glass are superior in terms of electrical properties. The preparation of the filler is 100 to 50 parts by weight for 100 parts by weight of the above epoxy resin.
It is preferably in the range of 0 parts by weight; if it is less than 100 parts by weight, moisture resistance is poor, and if it exceeds 500 parts by weight, fluidity is lost, which is not preferred.
この組成物には必要に応じてwsm剤、!色剤、難燃剤
、難燃助剤、カップリング剤などを使用することもでき
る。特にカップリング剤は充填材の効果を有効に発揮さ
せるために1賛でToシ。This composition optionally includes a wsm agent,! Colorants, flame retardants, flame retardant aids, coupling agents, etc. can also be used. In particular, the coupling agent is used in order to effectively demonstrate the effect of the filler.
例えばr−グリシドキシプロビルトリメトキシシラン、
β−(3,4−エポキシシクロヘキシル)−エチルトリ
メトキシシランなどがある。For example, r-glycidoxyprobyltrimethoxysilane,
Examples include β-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane.
エポキシ樹脂組成物の製造方法は、上記のエポキシ樹脂
、硬化剤、硬化促進剤、充填材、カップリング剤などを
ミキシングロールで加熱しながら混練する方法により製
造できる。The epoxy resin composition can be produced by kneading the above-mentioned epoxy resin, curing agent, curing accelerator, filler, coupling agent, etc. while heating with a mixing roll.
次にこの発明を実施例によシさらに具体的に説明する。Next, the present invention will be explained in more detail with reference to examples.
〔実施例1〕
クレゾールノボラック型エポキシ樹脂(エポキシ当量1
90)100m11部、ノボラック型フェノール樹脂5
0重量部、シリカ粉末550重量部、2−フェニル−4
,5−ジヒドロキシメチルイミダゾール4嵐量部、T−
グリシドキシゾロビルトリメトキシシラン2重量部、カ
ーボンブラックinn部、カルナバワックス21黛部を
直径10インチのミキシングロールにて前ロール80℃
、後ロール30℃、前ロール22rplhlka−ル1
8rpmの条件で常法に従い6分間混練した。得られた
シート状組成物を粉砕して。[Example 1] Cresol novolac type epoxy resin (epoxy equivalent: 1
90) 100m 11 parts, novolac type phenolic resin 5
0 parts by weight, 550 parts by weight of silica powder, 2-phenyl-4
, 4 parts of 5-dihydroxymethylimidazole, T-
2 parts by weight of glycidoxysolobyl trimethoxysilane, 2 parts of carbon black, and 21 parts of carnauba wax were rolled at 80°C on a mixing roll with a diameter of 10 inches.
, rear roll 30℃, front roll 22rplhlka-ru 1
The mixture was kneaded for 6 minutes at 8 rpm according to a conventional method. The obtained sheet-like composition is crushed.
半導体封止用エポキシ樹脂組成物を得た。An epoxy resin composition for semiconductor encapsulation was obtained.
〔実施例2〕
フェノールノボラック型エポキシ樹脂100重量部(エ
ポキシ当量180)、ノボラック型エポキシ樹脂551
M量s、2−フェニル−4,5−ジヒドロキシメチルイ
ミダゾール4mF−1fR$t−用いる以外は実施例1
と同様の方法により半導体封止用エポキシ樹脂組成物を
得た。[Example 2] 100 parts by weight of phenol novolac type epoxy resin (epoxy equivalent: 180), novolac type epoxy resin 551 parts by weight
Example 1 except that M amount s and 2-phenyl-4,5-dihydroxymethylimidazole 4mF-1fR$t- were used.
An epoxy resin composition for semiconductor encapsulation was obtained in the same manner as above.
〔比較例1〕
硬化促進剤に2.4.6− )メスジメチルアミノメチ
ルフェノール1重量部を用いる以外は実施例1と同様の
方法により半導体封止用エポキシ樹脂組成物を得た。[Comparative Example 1] An epoxy resin composition for semiconductor encapsulation was obtained in the same manner as in Example 1 except that 1 part by weight of 2.4.6-) female dimethylaminomethylphenol was used as a curing accelerator.
〔比較例2〕
硬化促進剤に2メチルイミダゾ一ル1重重部を用いる以
外は実施ガ1と同様の方法により半導体封止用エポキシ
樹脂組成物を得た。[Comparative Example 2] An epoxy resin composition for semiconductor encapsulation was obtained in the same manner as in Example 1 except that 1 part by weight of 2-methylimidazole was used as the curing accelerator.
〔比較例3〕
硬化促進剤に1.8−ジアザービシク’ (5,’LO
)ウンデセン−72重量部を用いる以外は実施例1と同
様の方法により半導体封止用エポキシ樹脂組成物を得た
。[Comparative Example 3] 1,8-diazarbisic'(5,'LO
) An epoxy resin composition for semiconductor encapsulation was obtained in the same manner as in Example 1 except that 72 parts by weight of undecene was used.
〔比較例4〕
硬化促進剤に2−フェニル−イミダゾール1゜2重量部
を用いる以外は実施例2と同様の方法により半導体封止
用エポキシ樹脂組成物を得た。[Comparative Example 4] An epoxy resin composition for semiconductor encapsulation was obtained in the same manner as in Example 2, except that 1.2 parts by weight of 2-phenyl-imidazole was used as a curing accelerator.
以上の各組成物の樹脂特性について表IK示す。ここで
スパイラル20−、ゲル化時間は180℃での測定値で
めり、硬度については、g形温度180℃、成形圧カフ
0kg/コ、成形時間90秒の条件でトランスファプレ
ス、DILP金型にて成形した直後の熱時シ璽アD硬度
である。Table IK shows the resin properties of each of the above compositions. Here, spiral 20-, gelation time is determined by the measured value at 180℃, hardness is determined by transfer press, DILP mold under the conditions of g-type temperature 180℃, molding pressure cuff 0 kg/piece, molding time 90 seconds. This is the hardness of the seal when heated immediately after molding.
表1
表1から明らかなよう[硬化促進剤に2−フェニル、4
,5−ジヒドロキシメチルイミダゾールを用いた組成物
は硬度が高く流動性、硬化性に優れていることがわかる
。Table 1 As is clear from Table 1, [2-phenyl, 4
, 5-dihydroxymethylimidazole has high hardness and excellent fluidity and curability.
以上の説明した通9本発明によれば硬化促進剤として特
足されたイミダゾール化合物を用いることによシ成形作
業性が著るしく改善された。As explained above, according to the present invention, the molding workability is significantly improved by using an imidazole compound which is particularly featured as a curing accelerator.
Claims (1)
シ樹脂組成物において、硬化促進剤として2−フェニル
−4、5−ジヒドロキシメチルイミダゾールを配合した
ことを特徴とする半導体封止用エポキシ樹脂組成物。1. An epoxy resin composition for semiconductor encapsulation, comprising an epoxy resin composition containing a novolak type phenol resin as a curing agent, and containing 2-phenyl-4,5-dihydroxymethylimidazole as a curing accelerator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8720985A JPS61243821A (en) | 1985-04-23 | 1985-04-23 | Epoxy resin composition for sealing semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8720985A JPS61243821A (en) | 1985-04-23 | 1985-04-23 | Epoxy resin composition for sealing semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61243821A true JPS61243821A (en) | 1986-10-30 |
Family
ID=13908554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8720985A Pending JPS61243821A (en) | 1985-04-23 | 1985-04-23 | Epoxy resin composition for sealing semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61243821A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1091452C (en) * | 1999-11-26 | 2002-09-25 | 巴陵石化岳阳石油化工总厂 | Preparation method of phenolic epoxy resin curing agent |
-
1985
- 1985-04-23 JP JP8720985A patent/JPS61243821A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1091452C (en) * | 1999-11-26 | 2002-09-25 | 巴陵石化岳阳石油化工总厂 | Preparation method of phenolic epoxy resin curing agent |
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