JPH08151428A - Epoxy resin composition and semiconductor sealing material - Google Patents
Epoxy resin composition and semiconductor sealing materialInfo
- Publication number
- JPH08151428A JPH08151428A JP29280094A JP29280094A JPH08151428A JP H08151428 A JPH08151428 A JP H08151428A JP 29280094 A JP29280094 A JP 29280094A JP 29280094 A JP29280094 A JP 29280094A JP H08151428 A JPH08151428 A JP H08151428A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- dihydroxynaphthalene
- compound
- resin composition
- hydrocarbon group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は新規な特に耐水性および
低内部応力性に著しく優れ、更に高温物性、流動性、成
形性、耐熱性にも優れるため、半導体封止材料、積層部
品材料、電気絶縁材料、繊維強化複合材料、塗装材料、
成型材料、接着材料などに極めて有用なエポキシ樹脂組
成物、並びに、耐水性および低内部応力性に著しく優れ
る点から耐ハンダクラック性が極めて良好な半導体封止
材料に関する。INDUSTRIAL APPLICABILITY The present invention is particularly excellent in water resistance and low internal stress resistance, and further excellent in high temperature physical properties, fluidity, moldability and heat resistance. Electrical insulation materials, fiber reinforced composite materials, coating materials,
The present invention relates to an epoxy resin composition that is extremely useful as a molding material, an adhesive material, and the like, and a semiconductor encapsulating material that has extremely excellent solder crack resistance because it is extremely excellent in water resistance and low internal stress resistance.
【０００２】[0002]
【従来の技術】エポキシ樹脂は、種々の硬化剤で硬化さ
せることにより、一般的に機械的性質、耐水性、耐薬品
性、耐熱性、電気的性質などの優れた硬化物となり、接
着剤、塗料、積層板、成型材料、注型材料等、幅広い分
野に使用されている。BACKGROUND OF THE INVENTION Epoxy resins, when cured with various curing agents, generally become cured products having excellent mechanical properties, water resistance, chemical resistance, heat resistance, electrical properties, etc. It is used in a wide range of fields such as paints, laminates, molding materials, and casting materials.
【０００３】また、特に半導体封止材料用途において
は、近年、高実装密度化に対応するため半導体のパッケ
ージが薄型化する傾向にあり、厚さが１ｍｍ以下のＴＳ
ＯＰ型パッケージも使用される様になった。従ってこれ
らに対応するため、低溶融粘度で流動性が高く、より耐
水性に優れた封止材料が求められている。Further, particularly in the use of semiconductor encapsulation materials, in recent years, there has been a tendency for semiconductor packages to become thinner in order to cope with higher packaging density, and a TS having a thickness of 1 mm or less is used.
OP type packages have also come to be used. Therefore, in order to meet these requirements, there is a demand for a sealing material having a low melt viscosity, high fluidity, and more excellent water resistance.
【０００４】従来より、この様な要求特性を満足するエ
ポキシ樹脂組成物として、例えば特開昭６１−２９３２
１９号公報には、フェノール類と不飽和脂環式化合物と
の重付加体のポリグリシジルエーテルであるジシクロペ
ンタジエン型エポキシ樹脂を用い、一方、硬化剤として
フェノールノボラック樹脂を用いた組成物が知られてい
る。Conventionally, as an epoxy resin composition satisfying such required characteristics, for example, JP-A-61-2932 is used.
No. 19 discloses a composition using a dicyclopentadiene type epoxy resin, which is a polyglycidyl ether of a polyaddition product of a phenol and an unsaturated alicyclic compound, while using a phenol novolac resin as a curing agent. Has been.
【０００５】[0005]
【解決しようとする課題】しかし、上記特開昭６１−２
９３２１９号公報に記載された半導体封止材料は、耐水
性は良好であるものの、現在求められている耐水性の水
準には及ばず、また、動的弾性率が高く、線膨張係数も
高いため、高温条件下或いはヒートサイクル時における
内部応力が高くて靱性に劣るという課題を有していた。
特に、半導体封止材料として、前記耐水性に劣り、動的
弾性率が低い点から耐ハンダクラック性に劣るという課
題を有していた。[Problems to be Solved] However, the above-mentioned JP-A-61-2
Although the semiconductor encapsulating material described in Japanese Patent No. 93219 has good water resistance, it does not reach the level of water resistance currently required, and has a high dynamic elastic modulus and a high linear expansion coefficient. However, there is a problem that the internal stress is high under high temperature conditions or during heat cycle and the toughness is poor.
In particular, as a semiconductor encapsulating material, there is a problem that it is inferior in water resistance and inferior in solder crack resistance because of its low dynamic elastic modulus.
【０００６】本発明が解決しようとする課題は、耐水性
に優れ、しかも高温条件下或いはヒートサイクル時にお
ける内部応力が低くて、靱性に優れるエポキシ樹脂組成
物、および、耐ハンダクラック性に優れる半導体封止材
料を提供することにある。The problem to be solved by the present invention is to provide an epoxy resin composition having excellent water resistance, low internal stress under high temperature conditions or heat cycles, and excellent toughness, and a semiconductor having excellent solder crack resistance. To provide a sealing material.
【０００７】[0007]
【課題を解決するための手段】本発明者等は鋭意検討し
た結果、環状脂肪族炭化水素基を結接基としてヒドロキ
シル芳香族化合物と結合した化合物のポリグリシジルエ
ーテル（Ａ）と、１分子あたり水酸基を２個以上有する
縮合多環式化合物（Ｂ）を必須成分とすることを特徴と
するエポキシ樹脂組成物が、耐水性、高温物性、靱性が
著しく良好となり、上記課題を解決できることを見いだ
し、本発明を完成するに至った。Means for Solving the Problems As a result of intensive investigations by the present inventors, polyglycidyl ether (A) of a compound in which a cycloaliphatic hydrocarbon group is bonded to a hydroxyl aromatic compound as a linking group and It was found that an epoxy resin composition comprising a condensed polycyclic compound (B) having two or more hydroxyl groups as an essential component has remarkably good water resistance, high temperature physical properties, and toughness, and can solve the above problems. The present invention has been completed.
【０００８】即ち、本発明は環状脂肪族炭化水素基を結
接基としてヒドロキシル芳香族化合物と結合した化合物
のポリグリシジルエーテル（Ａ）と、水酸基を１分子あ
たり２個以上有する縮合多環式化合物（Ｂ）を必須成分
とすることを特徴とするエポキシ樹脂組成物、および、
環状脂肪族炭化水素基を結接基としてヒドロキシル芳香
族化合物と結合した化合物のポリグリシジルエーテル
（Ａ）と、水酸基を１分子あたり２個以上有する縮合多
環式化合物（Ｂ）と、無機充填剤（Ｃ）とを必須成分と
することを特徴とする半導体封止材料に関する。That is, the present invention relates to a polyglycidyl ether (A) which is a compound in which a cycloaliphatic hydrocarbon group is bonded to a hydroxyl aromatic compound as a binding group, and a condensed polycyclic compound having two or more hydroxyl groups per molecule. An epoxy resin composition comprising (B) as an essential component, and
Polyglycidyl ether (A), which is a compound in which a cycloaliphatic hydrocarbon group is bound to a hydroxyl aromatic compound, a condensed polycyclic compound (B) having two or more hydroxyl groups per molecule, and an inorganic filler (C) An essential component relates to a semiconductor encapsulating material.
【０００９】本発明で用いるポリグリシジルエーテル
（Ａ）を構成する環状脂肪族炭化水素基としては特に限
定されるものではないが、中でもその骨格中にシクロヘ
キサン環或いはシクロヘキセン環を有するものが硬化物
の耐水性向上効果に優れる点から好ましい。それらの中
でも特にこの効果が顕著である点から、具体的にはジシ
クロペンタジエン、リモネン、または３ａ，４，７，７
ａ−テトラヒドロインデンの分子骨格中の不飽和結合に
基づく２価の炭化水素基が好ましい。これらの炭化水素
基は１種のみで構成していてもよく、また、１分子あた
り２種類以上で構成していても良い。The cycloaliphatic hydrocarbon group constituting the polyglycidyl ether (A) used in the present invention is not particularly limited, but among them, those having a cyclohexane ring or a cyclohexene ring in the skeleton thereof are cured products. It is preferable because it has an excellent effect of improving water resistance. Among these, since this effect is particularly remarkable, specifically, dicyclopentadiene, limonene, or 3a, 4, 7, 7
A divalent hydrocarbon group based on an unsaturated bond in the molecular skeleton of a-tetrahydroindene is preferred. These hydrocarbon groups may be composed of only one kind, or may be composed of two or more kinds per molecule.
【００１０】更に、これらの中でも硬化物の耐熱性及び
吸水率を一層向上させることができる点からジシクロペ
ンタジエンの分子骨格中の不飽和結合に基づく２価の炭
化水素基が好ましい。Further, among these, a divalent hydrocarbon group based on an unsaturated bond in the molecular skeleton of dicyclopentadiene is preferable because the heat resistance and water absorption of the cured product can be further improved.
【００１１】上記ポリグリシジルエーテル（Ａ）を構成
するヒドロキシ芳香族化合物は、水酸基が１個或いは２
個以上置換したベンゼン環、ナフタレン環或いはアント
ラセン環を示したものであり、特に限定されるものでは
ないが、例えばフェノール又は、ビスフェノールＡ、ビ
スフェノールＦ等のビスフェノール類、クレゾール、ｐ
−ターシャリーブチルフェノールのごときアルキル置換
フェノール類、レゾルシン等のフェノール性水酸基を２
個以上含有する芳香族炭化水素、１−ナフトール、２−
ナフトール、１，６−ジヒドロキシナフタレン、２，７
−ジヒドロキシナフタレン等のナフトール類、１−ヒド
ロキシアントラセン、２−ヒドロキシアントラセン等の
ヒドロキシアントラセン類が挙げられ、特にポリグリシ
ジルエーテルの溶融粘度が低く、流動性が優れる点から
具体的にはフェノール或いはクレゾールが好ましく挙げ
られる。The hydroxyaromatic compound constituting the polyglycidyl ether (A) has one or two hydroxyl groups.
It represents a benzene ring, a naphthalene ring or an anthracene ring substituted by at least one, and is not particularly limited, and examples thereof include phenol or bisphenols such as bisphenol A and bisphenol F, cresol, p.
-The amount of phenolic hydroxyl groups such as alkyl-substituted phenols such as tertiary butylphenol and resorcin is 2
Aromatic hydrocarbons containing 1 or more, 1-naphthol, 2-
Naphthol, 1,6-dihydroxynaphthalene, 2,7
-Naphthols such as dihydroxynaphthalene, and hydroxyanthracenes such as 1-hydroxyanthracene and 2-hydroxyanthracene. Particularly, melt viscosity of polyglycidyl ether is low, and specifically phenol or cresol is preferable from the viewpoint of excellent fluidity. Preferred examples include:
【００１２】本発明で用いるポリグリシジルエーテル
（Ａ）は、環状脂肪族炭化水素基を結接基としてヒドロ
キシ芳香族化合物と結合した化合物のフェノール性水酸
基を、下記に詳述するエピハロヒドリンで変性した構造
を有するポリグリシジルエーテルであるが、封止材料に
した場合の流動性やフィラーの充填可能量を鑑み、その
溶融粘度が１５０℃において０．１〜１０ポイズが好ま
しく、中でもこの効果が顕著になる点から０．１〜２．
０ポイズとなる範囲が好ましい。The polyglycidyl ether (A) used in the present invention has a structure in which the phenolic hydroxyl group of a compound in which a cycloaliphatic hydrocarbon group is bonded to a hydroxy aromatic compound is modified with epihalohydrin as described in detail below. Although it is a polyglycidyl ether having, the melt viscosity at 150 ° C. is preferably 0.1 to 10 poises in view of the fluidity when used as a sealing material and the fillable amount of the filler, and among others, this effect becomes remarkable. 0.1 to 2 from the point.
The range of 0 poise is preferable.
【００１３】このポリグリシジルエーテル（Ａ）は、特
にその製造方法が制限されるものではないが、例えば、
ヒドロキシル芳香族化合物と、ジシクロペンタジエン、
リモネンおよび３ａ，４，７，７ａ−テトラヒドロイン
デンに代表される脂環式不飽和炭化水素とを触媒を用い
て重合してフェノール性水酸基含有の重合体を得（第１
工程）、次いで該重合体をエピクロルヒドリンによりグ
リシジル化する（第２工程）ことによりポリグリシジル
エーテル（Ａ）を得る方法が挙げられる。The polyglycidyl ether (A) is not particularly limited in its production method.
Hydroxyl aromatic compound, dicyclopentadiene,
Limonene and alicyclic unsaturated hydrocarbon represented by 3a, 4,7,7a-tetrahydroindene are polymerized using a catalyst to obtain a polymer containing a phenolic hydroxyl group (first
Step), and then the polymer is subjected to glycidylation with epichlorohydrin (second step) to obtain the polyglycidyl ether (A).
【００１４】第１工程で用いることのできる触媒として
は、例えば、ＡｌＣｌ3、ＢＦ3、ＺｎＣｌ2、Ｈ2Ｓ
Ｏ4、ＴｉＣｌ4、Ｈ3ＰＯ4等のルイス酸が挙げられる。
第１工程の具体的な方法としては例えば、ヒドロキシル
芳香族化合物を加熱溶融させ、そこへ触媒を添加し均一
に溶解した後、５０〜１８０℃、好ましくは８０〜１５
０℃で脂環式不飽和炭化水素を滴下する。各原料の使用
割合としては、特に制限されないが、脂環式不飽和炭化
水素１モルに対して、触媒が０．００１〜０．１モル、
好ましくは０．００５〜０．１０モルであって、ヒドロ
キシル芳香族化合物が０．１〜１０．０モル、好ましく
は０．３〜４モルである。また、この第１工程において
は、脂環式不飽和炭化水素と触媒とを溶融混合したとこ
ろに、ヒドロキシル芳香族化合物を添加してもよい。The catalyst that can be used in the first step is, for example, AlCl 3 , BF 3 , ZnCl 2 , H 2 S.
Lewis acids such as O 4 , TiCl 4 and H 3 PO 4 can be mentioned.
As a specific method of the first step, for example, a hydroxyl aromatic compound is heated and melted, a catalyst is added thereto and uniformly dissolved, and then 50 to 180 ° C., preferably 80 to 15 ° C.
Alicyclic unsaturated hydrocarbons are added dropwise at 0 ° C. The use ratio of each raw material is not particularly limited, but 0.001 to 0.1 mol of the catalyst relative to 1 mol of the alicyclic unsaturated hydrocarbon,
It is preferably 0.005 to 0.10 mol, and the hydroxyl aromatic compound is 0.1 to 10.0 mol, preferably 0.3 to 4 mol. Further, in the first step, the hydroxyl aromatic compound may be added to the place where the alicyclic unsaturated hydrocarbon and the catalyst are melt-mixed.
【００１５】次いで、第２工程としては、例えば第１工
程で得られた重合体を、該重合体の水酸基に対して１〜
２０倍当量、好ましくは２〜１０倍当量のエピハロヒド
リンに溶解し、１０〜１２０℃、好ましくは５０〜９０
℃の温度条件で、アルカリ金属水酸化物を用いて反応す
る方法が挙げられる。ここでエピハロヒドリンとして
は、エピクロルヒドリンが一般的であるが、他にもエピ
ヨードヒドリン、エピブロモヒドリン、β−メチルエピ
クロルヒドリン等も用いることができる。また、アルカ
リ金属水酸化物としては、特に限定されないが、水酸化
ナトリウム、水酸化カリウムが挙げられる。アルカリ金
属水酸化物の使用量としては、第１工程で得られた重合
体の水酸基に対して、０．８〜１．２倍当量であること
が好ましい。Next, in the second step, for example, the polymer obtained in the first step is added in an amount of 1 to 1 with respect to the hydroxyl group of the polymer.
It is dissolved in 20 times equivalent, preferably 2 to 10 times equivalent of epihalohydrin, and 10 to 120 ° C., preferably 50 to 90.
A method of reacting with an alkali metal hydroxide under a temperature condition of ° C can be mentioned. Here, epichlorohydrin is generally used as epihalohydrin, but epiiodohydrin, epibromohydrin, β-methylepichlorohydrin and the like can also be used. In addition, the alkali metal hydroxide is not particularly limited, but examples thereof include sodium hydroxide and potassium hydroxide. The amount of the alkali metal hydroxide used is preferably 0.8 to 1.2 times the equivalent of the hydroxyl group of the polymer obtained in the first step.
【００１６】以上の第１工程及び第２工程を経て目的と
するポリグリシジルエーテル（Ａ）が得られる。The desired polyglycidyl ether (A) is obtained through the above first and second steps.
【００１７】本発明で用いる水酸基含有縮合多環式化合
物（Ｂ）は、少なくとも１分子中に（ａ）１つのナフタ
レン骨格、アントラセン骨格、またはピレン骨格と
（ｂ）２個以上の水酸基を含有する化合物を指すもので
あり、特に限定されるものではないが、なかでもジヒド
ロキシナフタンが耐水性および耐熱性向上の効果が良好
であり好ましい。さらに詳述すれば、代表的な化合物と
してジヒドロキシナフタレンの１０種類の異性体、つま
り１，２−ナフタレン、１，３−ナフタレン、１，４−
ナフタレン、１，５−ナフタレン、１，６−ナフタレ
ン、１，７−ナフタレン、１，８−ナフタレン、２，３
−ナフタレン、２，６−ナフタレン、２，７−ジヒドロ
キシナフタレンが挙げられる。The hydroxyl group-containing condensed polycyclic compound (B) used in the present invention contains (a) one naphthalene skeleton, anthracene skeleton or pyrene skeleton and (b) two or more hydroxyl groups in at least one molecule. The compound refers to a compound and is not particularly limited, but among them, dihydroxynaphthan is preferable because it has good effects of improving water resistance and heat resistance. More specifically, ten typical isomers of dihydroxynaphthalene, namely 1,2-naphthalene, 1,3-naphthalene and 1,4-
Naphthalene, 1,5-naphthalene, 1,6-naphthalene, 1,7-naphthalene, 1,8-naphthalene, 2,3
-Naphthalene, 2,6-naphthalene, and 2,7-dihydroxynaphthalene.
【００１８】これらのジヒドロキシナフタレンな何れも
高融点の結晶であるため、封止材料の製造時の作業性が
優れる。またこれらを用いた封止材料は、耐水性並びに
靱性のみならず、溶融粘度が低く、成型時の流動性が優
れ、それがため薄型パッケージ、或いは微細構造のチッ
プの成形性が優れる。さらには硬化後の耐熱性と耐水性
とのバランスも良好となる。さらには既述の通り、実装
時の耐ハンダクラック性が飛躍的に優れる。また溶融粘
度が低いため、８０〜９５％もの無機充填材を配合して
も、流動性、成形性を悪化させることなく、一層の低吸
水率化と低線膨張係数化、耐ハンダクラック性向上を果
たせる。Since all of these dihydroxynaphthalene are crystals having a high melting point, the workability during the production of the sealing material is excellent. In addition, the sealing materials using them have not only water resistance and toughness but also low melt viscosity and excellent fluidity at the time of molding, which is excellent in moldability of a thin package or a finely structured chip. Furthermore, the balance between heat resistance and water resistance after curing becomes good. Furthermore, as described above, the solder crack resistance during mounting is dramatically improved. In addition, since the melt viscosity is low, even if 80 to 95% of an inorganic filler is blended, flowability and moldability are not deteriorated, and water absorption and linear expansion coefficient are further reduced, and solder crack resistance is improved. Can fulfill.
【００１９】ここでジヒドロキシナフタレンとしては上
述の種々異性体が使用できるが、硬化性、耐熱性が優れ
る点から、対称性の良い１，５−ナフタレン、１，６−
ナフタレン、２，７−ジヒドロキシナフタレンが好まし
い。As the dihydroxynaphthalene, the above-mentioned various isomers can be used, but 1,5-naphthalene and 1,6-naphthalene having good symmetry are preferred because of their excellent curability and heat resistance.
Naphthalene and 2,7-dihydroxynaphthalene are preferred.
【００２０】これらの縮合多環式化合物（Ｂ）の使用量
は、エポキシ樹脂（Ａ）を硬化せしめる量であれば何れ
でもよく、特に限定されないが、好ましくは用いるエポ
キシ樹脂（Ａ）の一分子中に含まれるエポキシ基の数
と、縮合多環式化合物（Ｂ）に存在する水酸基の活性水
素の数とが当量付近となる量である。The amount of the condensed polycyclic compound (B) used may be any amount as long as it cures the epoxy resin (A) and is not particularly limited, but preferably one molecule of the epoxy resin (A) used. The number of epoxy groups contained therein and the number of active hydrogens of the hydroxyl groups present in the condensed polycyclic compound (B) are such that the equivalents are reached.
【００２１】本発明のエポキシ樹脂組成物は、上述の環
状脂肪族炭化水素基を結接基としてヒドロキシル芳香族
化合物と結合した化合物のポリグリシジルエーテル
（Ａ）と、水酸基を１分子あたり２個以上有する縮合多
環式化合物（Ｂ）を必須成分とするものであるが、その
他のエポキシ樹脂及び硬化剤を任意の割合で併用しても
構わない。それらの使用割合としては上述の本発明の効
果の程度を鑑みると、エポキシ樹脂と硬化剤の合計重量
に対して、５０重量％以下でその他のエポキシ樹脂及び
硬化剤を併用することが好ましい。The epoxy resin composition of the present invention comprises a polyglycidyl ether (A) of a compound in which the above-mentioned cyclic aliphatic hydrocarbon group is bonded to a hydroxyl aromatic compound as a binding group, and two or more hydroxyl groups per molecule. Although the condensed polycyclic compound (B) is contained as an essential component, other epoxy resin and curing agent may be used in an optional ratio. Considering the degree of the effect of the present invention described above, it is preferable to use the other epoxy resin and the curing agent together in an amount of 50% by weight or less based on the total weight of the epoxy resin and the curing agent.
【００２２】併用し得るエポキシ樹脂としても特に限定
されないが、その他のエポキシ樹脂としては、例えば、
ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型
エポキシ樹脂、フェノールノボラック型エポキシ樹脂、
クレゾールノボラック型エポキシ樹脂、ＢＰＡノボラッ
ク型エポキシ樹脂、ナフトールノボラック型エポキシ樹
脂、ビフェノール型エポキシ樹脂、臭素化フェノールノ
ボラック型エポキシ樹脂、臭素化ＢＰＡ型エポキシ樹
脂、クレゾール−ナフトール共縮ノボラック型エポキシ
樹脂、ジヒドロキシナフタレン型エポキシ樹脂、グリシ
ジルアミン型４官能エポキシ樹脂等を挙げることができ
る。The epoxy resin that can be used in combination is not particularly limited, but other epoxy resins include, for example,
Bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin,
Cresol novolac type epoxy resin, BPA novolac type epoxy resin, naphthol novolac type epoxy resin, biphenol type epoxy resin, brominated phenol novolac type epoxy resin, brominated BPA type epoxy resin, cresol-naphthol co-compressed novolac type epoxy resin, dihydroxynaphthalene Type epoxy resin, glycidyl amine type tetrafunctional epoxy resin and the like.
【００２３】同様に併用し得る硬化剤として、フェノー
ルノボラック樹脂、アルキルフェノールノボラック樹
脂、ジヒドロキシナフタレン等のポリフェノール系化合
物、ザイロック型フェノール樹脂、ジエチレントリアミ
ン、トリエチレンテトラアミンなどの脂肪族アミン類、
ジアミノジフェニルアミン、ジアミノジフェニルスルフ
ォンなどの芳香族アミン類、ポリアミド樹脂およびその
変性物、無水マレイン酸、無水フタル酸、無水ヘキサヒ
ドロフタル酸、無水ピロペリット酸などの酸無水物系硬
化剤、ジシアンジアミド、イミダゾール、ＢＦ3錯体、
グアニジン誘導体等の潜在性硬化剤等が挙げられる。こ
れらの硬化剤は単独でも２種類以上の併用でもよい。As curing agents which can be used in the same manner, phenol novolac resins, alkylphenol novolac resins, polyphenol compounds such as dihydroxynaphthalene, zyloc-type phenol resins, aliphatic amines such as diethylenetriamine and triethylenetetraamine,
Aromatic amines such as diaminodiphenylamine and diaminodiphenylsulfone, polyamide resins and modified products thereof, maleic anhydride, phthalic anhydride, hexahydrophthalic anhydride, acid anhydride hardeners such as pyroperitic anhydride, dicyandiamide, imidazole, BF3 complex,
Examples include latent curing agents such as guanidine derivatives. These curing agents may be used alone or in combination of two or more.
【００２４】さらに必要に応じて硬化促進剤を用いても
よいが、本発明の場合も公知のエポキシ樹脂用硬化促進
剤を用いることができ、例えば第三級ホスフィン類、イ
ミダゾール類、第三級アミン類等を用いることができ
る。具体的には、前記第三級ホスフィン類としては、例
えばトリエチルホスフィン、トリブチルホスフィン、ト
リフェニルホスフィン等を好ましく挙げることができ
る。また前記第三級アミン類としては、例えばジメチル
エタノールアミン、ジメチルベンジルアミン、２，４，
６−トリス（ジメチルアミノ）フェノール、１，８ジア
ザビシクロ〔５，４，０〕ウンデセンなどを好ましく挙
げることができる。イミダゾ−ル類としては、例えば２
−エチル−４−メチルイミダゾール、２，４−ジメチル
イミダゾ−ル、２−メチルイミダゾール、２−ウンデシ
ルイミダゾール、２−ヘプタデシルイミダゾール、１−
ビニル−２−メチルイミダゾール、１−プロピル−２−
メチルイミダゾール、２−イソプロピルイミダゾール、
１−シアノエチル−２−エチルイミダゾール、１−シア
ノエチル−２−エチル−４−メチルイミダゾール、１−
シアノエチル−２−ウンデシルイミダゾール、１−シア
ノエチル−２−フェニルイミダゾール、２−フェニルイ
ミゾール、１−ベンジル−２−メチルイミダゾール、２
−フェニル−４−メチルイミダゾール、２−フェニル−
４，５−ジヒドロキシメチルイミダゾール、２−フェニ
ル−４−メチル−５−ヒドロキシメチルイミダゾールな
どを挙げることができる。これらの中でも耐熱性、耐水
性、電気特性、耐湿信頼性等に優れ、また、半導体封止
材料用途において安定性に優れる点から２−メチル−４
−イミダゾール、ジアザビシクロウンデセン（ＤＢ
Ｕ）、トリフェニルホスフィンやジメチルベンジルアミ
ンおよびこれらの混合物が好ましい。Further, if necessary, a curing accelerator may be used, but in the case of the present invention, known curing accelerators for epoxy resins can be used, and examples thereof include tertiary phosphines, imidazoles and tertiary. Amines and the like can be used. Specifically, examples of the tertiary phosphines preferably include triethylphosphine, tributylphosphine, triphenylphosphine, and the like. Examples of the tertiary amines include dimethylethanolamine, dimethylbenzylamine, 2,4,
Preferable examples include 6-tris (dimethylamino) phenol and 1,8 diazabicyclo [5,4,0] undecene. Examples of imidazoles include 2
-Ethyl-4-methylimidazole, 2,4-dimethylimidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1-
Vinyl-2-methylimidazole, 1-propyl-2-
Methylimidazole, 2-isopropylimidazole,
1-cyanoethyl-2-ethylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-
Cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 2
-Phenyl-4-methylimidazole, 2-phenyl-
Examples include 4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole. Among these, 2-methyl-4 is excellent in heat resistance, water resistance, electrical characteristics, moisture resistance reliability and the like, and is also excellent in stability in semiconductor encapsulating material applications.
-Imidazole, diazabicycloundecene (DB
U), triphenylphosphine, dimethylbenzylamine and mixtures thereof are preferred.
【００２５】本発明のエポキシ樹脂組成物は、上記エポ
キシ樹脂、硬化剤、無機充填剤を必須成分とし、無機充
填剤としては、溶融或いは結晶シリカ粉末、ガラス繊
維、炭素繊維、炭酸カルシウム、石英、酸化アルミニウ
ム、酸化マグネシウム、水酸化アルミニウム、水酸化マ
グネシウム、珪藻土、焼成クレイ、カリオン、マイカ、
アスベスト、パルプ、木粉等が挙げられる。The epoxy resin composition of the present invention contains the above-mentioned epoxy resin, curing agent and inorganic filler as essential components, and as the inorganic filler, fused or crystalline silica powder, glass fiber, carbon fiber, calcium carbonate, quartz, Aluminum oxide, magnesium oxide, aluminum hydroxide, magnesium hydroxide, diatomaceous earth, calcined clay, carion, mica,
Examples include asbestos, pulp, wood flour and the like.
【００２６】さらに必要に応じて三酸化アンチモン、ヘ
キサブロモベンゼン等の難燃剤、カ−ボンブラック、ベ
ンガラ等の着色剤、天然ワックス、合成ワックス等の離
型剤及びシリコンオイル、ゴム等の低応力添加剤等の種
々の添加剤等を配合適宜配合して得られる。Further, if necessary, flame retardants such as antimony trioxide and hexabromobenzene, coloring agents such as carbon black and red iron oxide, mold release agents such as natural wax and synthetic wax, and low stress such as silicone oil and rubber. It can be obtained by appropriately mixing various additives such as additives.
【００２７】また、本発明のエポキシ樹脂組成物から成
型材料を調製するには、エポキシ樹脂、硬化剤、硬化促
進剤、その他の添加剤をミキサー等によって十分に均一
に混合した後、更に熱ロールまたはニーダ−等で溶融混
練し、トランスファー成形或いは射出成形するなどして
得ることができる。In order to prepare a molding material from the epoxy resin composition of the present invention, the epoxy resin, the curing agent, the curing accelerator, and other additives are sufficiently and uniformly mixed with a mixer or the like, and then a heat roll is further added. Alternatively, it can be obtained by melt-kneading with a kneader or the like and performing transfer molding or injection molding.
【００２８】本発明の半導体封止材料は、上述したエポ
キシ樹脂、硬化剤を必須成分とする本発明のエポキシ樹
脂組成物に、更に無機充填材を必須成分として含有する
こものである。また同様に前述で例示された様な他のエ
ポキシ樹脂、硬化剤を任意の割合で併用してもよく、さ
らに同様に必要に応じて前述で例示された様な他の硬化
促進剤、添加剤を用いても構わない。The semiconductor encapsulating material of the present invention is the epoxy resin composition of the present invention containing the above-mentioned epoxy resin and curing agent as essential components, and further containing an inorganic filler as an essential component. Similarly, the other epoxy resin as exemplified above and the curing agent may be used together in an arbitrary ratio, and similarly, if necessary, other curing accelerators and additives as exemplified above. May be used.
【００２９】本発明の半導体封止材料で用いる無機充填
材としては前述のものが使用できるが一般に結晶或いは
溶融型シリカ粉末充填剤等を好ましく用いることができ
る。本発明の封止材用エポキシ樹脂組成物に使用する無
機充填剤の配合割合は、半導体封止材料全体に対して、
通常５０〜９５重量％であり、中でも７５〜９０重量％
の範囲が好ましい。As the inorganic filler used in the semiconductor encapsulating material of the present invention, the above-mentioned ones can be used, but generally, crystalline or fused silica powder filler and the like can be preferably used. The compounding ratio of the inorganic filler used in the epoxy resin composition for encapsulant of the present invention is based on the whole semiconductor encapsulating material.
Usually 50 to 95% by weight, especially 75 to 90% by weight
Is preferred.
【００３０】本発明の半導体封止材料を用いて成型材料
を調製するには、エポキシ樹脂、フェノール樹脂、硬化
促進剤、無機充填材、その他の添加剤をミキサー等によ
って十分に均一に混合した後、更に熱ロールまたはニー
ダ−等で溶融混練し、低圧トランスファー成形あるいは
射出成形するなどして得ることができる。To prepare a molding material using the semiconductor encapsulating material of the present invention, an epoxy resin, a phenol resin, a curing accelerator, an inorganic filler, and other additives are sufficiently uniformly mixed with a mixer or the like. Alternatively, it can be obtained by melt-kneading with a hot roll or a kneader and performing low-pressure transfer molding or injection molding.
【００３１】[0031]
【実施例】以下に具体例により本発明を詳細に説明する
が、本発明はこれらに限定されるものではない。The present invention will be described in detail below with reference to specific examples, but the present invention is not limited thereto.
【００３２】実施例１ ジシクロペンタジエン−フェノール重付加物型エポキシ樹脂（Ｅ１）（エポキ シ当量２６３g/eq、軟化点６５℃、１５０℃の溶融粘度０．８ポイズ：大日本イ ンキ化学工業（株）製、ＥＰＩＣＬＯＮ ＥＸＡ−７２００）） ７７重量部 １，６−ジヒドロキシナフタレン（Ｈ１）（水酸基当量８０g/eq） ２３重量部 トリフェニルフォスフィン ０．８重量部 を溶融混合し、脱泡した後、１７５℃で５時間硬化して
注型板を作成し、耐熱性と耐水性の評価を下記の評価方
法に従って行った。結果を第１表の１に示す。Example 1 Dicyclopentadiene-phenol polyadduct type epoxy resin (E1) (epoxy equivalent 263 g / eq, softening point 65 ° C., melt viscosity at 150 ° C. 0.8 poise: Dainippon Ink and Chemicals ( Ltd., EPICLON EXA-7200)) 77 parts by weight 1,6-dihydroxynaphthalene (H1) (hydroxyl equivalent 80 g / eq) 23 parts by weight 0.8 parts by weight of triphenylphosphine are melt mixed and defoamed. A casting plate was prepared by curing at 175 ° C. for 5 hours, and heat resistance and water resistance were evaluated according to the following evaluation methods. The results are shown in Table 1-1.
【００３３】［評価方法］ ガラス転移温度：粘弾性測定装置（ＤＭＡ）で測定。 吸水率：８５℃・８５％ＲＨの条件下で３００時間処理
した後重量増加率から計算。[Evaluation Method] Glass transition temperature: Measured with a viscoelasticity measuring device (DMA). Water absorption rate: Calculated from the weight increase rate after treatment for 300 hours under the conditions of 85 ° C. and 85% RH.
【００３４】線膨張係数：熱分析装置（ＴＭＡ）で測定Linear expansion coefficient: Measured with a thermal analyzer (TMA)
【００３５】実施例２ エポキシ樹脂及び硬化剤を以下のものに代えた以外は実
施例１と同様にして評価した。結果を第１表の１に示
す。Example 2 Evaluation was made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-1.
【００３６】 エポキシ樹脂（Ｅ１） ７７重量部 ２，７−ジヒドロキシナフタレン（Ｈ２）（水酸基当量８０g/eq） ２３重量部 トリフェニルフォスフィン ０．８重量部Epoxy resin (E1) 77 parts by weight 2,7-dihydroxynaphthalene (H2) (hydroxyl equivalent 80 g / eq) 23 parts by weight Triphenylphosphine 0.8 parts by weight
【００３７】実施例３ エポキシ樹脂及び硬化剤を以下のものに代えた以外は実
施例１と同様にして評価した。結果を第１表の１に示
す。Example 3 Evaluations were made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-1.
【００３８】 エポキシ樹脂（Ｅ１） ７７重量部 １，５−ジヒドロキシナフタレン（Ｈ３） ２３重量部 トリフェニルフォスフィン ０．８重量部Epoxy resin (E1) 77 parts by weight 1,5-dihydroxynaphthalene (H3) 23 parts by weight Triphenylphosphine 0.8 parts by weight
【００３９】実施例４ エポキシ樹脂及び硬化剤を以下のものに代えた以外は実
施例１と同様にして評価した。結果を第１表の１に示
す。Example 4 Evaluations were made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-1.
【００４０】 エポキシ樹脂（Ｅ１） ７４重量部 １，６−ジヒドロキシナフタレン（Ｈ１） １３重量部 フェノールノボラック樹脂（Ｈ４）（水酸基当量１０４g/eq、軟化点８０℃、 １５０℃における溶融粘度１．８ポイズ） １３重量部 トリフェニルフォスフィン ０．７重量部Epoxy resin (E1) 74 parts by weight 1,6-dihydroxynaphthalene (H1) 13 parts by weight Phenol novolac resin (H4) (hydroxyl group equivalent 104 g / eq, softening point 80 ° C., melt viscosity at 150 ° C. 1.8 poises) ) 13 parts by weight Triphenylphosphine 0.7 parts by weight
【００４１】実施例５ エポキシ樹脂及び硬化剤を以下のものに代えた以外は実
施例１と同様にして評価した。結果を第１表の１に示
す。Example 5 Evaluation was made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-1.
【００４２】 ジシクロペンタジエン−クレゾール重付加物型エポキシ樹脂（Ｅ２）（エポキ シ当量２８０g/eq、軟化点５８℃、１５０℃の溶融粘度０．７ポイズ） ７８重量部 １，６−ジヒドロキシナフタレン（Ｈ１） ２２重量部 トリフェニルフォスフィン ０．８重量部Dicyclopentadiene-cresol polyaddition type epoxy resin (E2) (epoxy equivalent 280 g / eq, softening point 58 ° C., melt viscosity 0.7 poise at 150 ° C.) 78 parts by weight 1,6-dihydroxynaphthalene ( H1) 22 parts by weight Triphenylphosphine 0.8 parts by weight
【００４３】実施例６ エポキシ樹脂及び硬化剤を以下のものに代えた以外は実
施例１と同様にして評価した。結果を第１表の１に示
す。Example 6 Evaluations were made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-1.
【００４４】 ３ａ，４，７，７ａ−テトラヒドロインデン−フェノール重付加物型エポキシ 樹脂（Ｅ３）（エポキシ当量２７５g/eq、軟化点６０℃、１５０℃の溶融粘度０ ．５ポイズ：大日本インキ化学工業（株）製、ＥＰＩＣＬＯＮ ＥＸＡ−７８６ １Ｌ） ７８重量部 ２，７−ジヒドロキシナフタレン（Ｈ２） ２２重量部 トリフェニルフォスフィン ０．８重量部3a, 4,7,7a-Tetrahydroindene-phenol polyadduct type epoxy resin (E3) (epoxy equivalent 275 g / eq, softening point 60 ° C., melt viscosity at 150 ° C. 0.5 poise: Dainippon Ink and Chemicals Industrial Co., Ltd., EPICLON EXA-786 1L) 78 parts by weight 2,7-dihydroxynaphthalene (H2) 22 parts by weight Triphenylphosphine 0.8 parts by weight
【００４５】実施例７ エポキシ樹脂及び硬化剤を以下のものに代えた以外は実
施例１と同様にして評価した。結果を第１表の１に示
す。Example 7 Evaluations were made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-1.
【００４６】 リモネン−フェノール重付加物型エポキシ樹脂（Ｅ４）（エポキシ当量２５０ g/eq、軟化点５６℃、１５０℃の溶融粘度０．４ポイズ） ７６重量部 １，６−ジヒドロキシナフタレン（Ｈ１） ２４重量部 トリフェニルフォスフィン ０．８重量部Limonene-phenol polyaddition type epoxy resin (E4) (epoxy equivalent of 250 g / eq, softening point 56 ° C., melt viscosity at 150 ° C. 0.4 poise) 76 parts by weight 1,6-dihydroxynaphthalene (H1) 24 parts by weight Triphenylphosphine 0.8 parts by weight
【００４７】比較例１ エポキシ樹脂及び硬化剤を以下のものに代えた以外は実
施例１と同様にして評価した。結果を第１表の２に示
す。Comparative Example 1 Evaluations were made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-2.
【００４８】 オルソクレゾールノボラック型エポキシ樹脂（Ｅ５）（エポキシ当量２０８g/ eq、軟化点６７℃、１５０℃の溶融粘度３．０ポイズ：大日本インキ化学工業（ 株）製 ＥＰＩＣＬＯＮ Ｎ−６６５） ６４重量部 １，６−ジヒドロキシナフタレン（Ｈ１） ３７重量部 トリフェニルフォスフィン ０．６重量部Orthocresol novolac type epoxy resin (E5) (epoxy equivalent 208 g / eq, softening point 67 ° C., melt viscosity at 150 ° C. 3.0 poise: EPICLON N-665 manufactured by Dainippon Ink and Chemicals, Inc.) 64 wt. Parts 1,6-dihydroxynaphthalene (H1) 37 parts by weight triphenylphosphine 0.6 parts by weight
【００４９】比較例２ エポキシ樹脂及び硬化剤を以下のものに代えた以外は実
施例１と同様にして評価した。結果を第１表の２に示
す。Comparative Example 2 Evaluation was made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-2.
【００５０】 エポキシ樹脂（Ｅ１） ６７重量部 フェノールノボラック樹脂（Ｈ１） ３３重量部 トリフェニルフォスフィン ０．７重量部Epoxy resin (E1) 67 parts by weight Phenol novolac resin (H1) 33 parts by weight Triphenylphosphine 0.7 parts by weight
【００５１】[0051]
【表１】 （表中、配合量は重量基準である） [Table 1] (In the table, the blending amount is based on weight)
【００５２】[0052]
【表２】 （表中、配合量は重量基準である） 溶融粘度は配合時の１５０℃におけるＩＣＩコーンプレ
ート型粘度計で測定した粘度である。Ｔｇは粘弾性測定
器（ＤＭＡ）、吸水率は８５℃・８５％ＲＨの条件下で
３００時間後の重量増加率で測定した。また動的弾性率
はＤＭＡで２５０℃での弾性率である。線膨張係数は熱
物性装置（ＴＭＡ）で測定した５０℃の値である。[Table 2] (In the table, the blending amount is on a weight basis) The melt viscosity is a viscosity measured at 150 ° C. at the time of blending with an ICI cone plate viscometer. Tg was measured by a viscoelasticity measuring device (DMA), and water absorption was measured by a weight increase rate after 300 hours under conditions of 85 ° C. and 85% RH. The dynamic elastic modulus is the elastic modulus at 250 ° C. in DMA. The linear expansion coefficient is a value at 50 ° C. measured by a thermophysical property apparatus (TMA).
【００５３】実施例８〜１４、比較例３〜４の試験結果
を表２に示す。次に表２の配合に従い、ミキサーで常温
で混合し、７０〜１００℃で２軸ロールにより混練し、
冷却後粉砕し成形材料とした。得られた成形材料をタブ
レット化し、低圧トランスファー成形機にて１７５℃、
７０kg/cm2、１２０秒の条件でハンダクラック試験用の
６ｍｍ×６ｍｍのチップを１６ｐＳＯＰパッケージに封
止した。封止したテスト用素子について下記の耐熱性評
価、耐水性評価、流動性評価、並びにハンダクラック試
験及びハンダ耐湿試験を行った。Table 2 shows the test results of Examples 8-14 and Comparative Examples 3-4. Next, according to the composition of Table 2, they are mixed at room temperature with a mixer and kneaded at 70 to 100 ° C. with a biaxial roll,
After cooling, it was ground and used as a molding material. The obtained molding material is made into a tablet, which is then 175 ° C. on a low pressure transfer molding machine.
A 6 mm × 6 mm chip for a solder crack test was sealed in a 16 pSOP package under the conditions of 70 kg / cm 2 and 120 seconds. The sealed test element was subjected to the following heat resistance evaluation, water resistance evaluation, fluidity evaluation, and solder crack test and solder moisture resistance test.
【００５４】ハンダクラック試験：封止したテスト用素
子を８５℃・８５％ＲＨの環境下で７２時間処置し、そ
の後２４０℃のハンダ槽に１０秒間浸せきした後顕微鏡
で外部クラックを観察した。Solder crack test: The sealed test element was treated for 72 hours in an environment of 85 ° C. and 85% RH, then immersed in a solder bath at 240 ° C. for 10 seconds, and external cracks were observed with a microscope.
【００５５】耐熱性試験、耐水性試験：上記組成物と同
じ 流動性試験：ＥＭＭＩ規格に準じた金型を使用して１７
５℃、７０kg/cm2の条件でスパイラルフローを測定し
た。Heat resistance test, water resistance test: same as the above composition Flowability test: 17 using a mold according to EMMI standard
The spiral flow was measured under the conditions of 5 ° C. and 70 kg / cm 2 .
【００５６】[0056]
【表３】 [Table 3]
【００５７】[0057]
【表４】 [Table 4]
【００５８】[0058]
【発明の効果】本発明によれば、耐水性に優れ、しかも
高温条件下或いはヒートサイクル時における内部応力が
低くて、靱性に優れるエポキシ樹脂組成物、および、こ
れらの特性を兼備するために耐ハンダクラック性が極め
て良好な半導体封止材料を提供できる。EFFECTS OF THE INVENTION According to the present invention, an epoxy resin composition having excellent water resistance, low internal stress under high temperature conditions or heat cycles, and excellent toughness, as well as having an excellent resistance to these properties, It is possible to provide a semiconductor encapsulating material having extremely good solder cracking properties.
Claims (10)
ドロキシル芳香族化合物と結合した化合物のポリグリシ
ジルエーテル（Ａ）と、水酸基を１分子あたり２個以上
有する縮合多環式化合物（Ｂ）を必須成分とすることを
特徴とするエポキシ樹脂組成物。1. A polyglycidyl ether (A), which is a compound in which a cyclic aliphatic hydrocarbon group is bonded to a hydroxyl aromatic compound as a binding group, and a condensed polycyclic compound (B) having two or more hydroxyl groups per molecule. An epoxy resin composition comprising:
℃における溶融粘度が０．１〜２．０ポイズの範囲であ
る請求項１記載のエポキシ樹脂組成物。2. A polyglycidyl ether (A) of 150.
The epoxy resin composition according to claim 1, which has a melt viscosity in the range of 0.1 to 2.0 poise at ° C.
タジエン、リモネン、または３ａ，４，７，７ａ−テト
ラヒドロインデンの分子骨格中の不飽和結合に基づく２
価の炭化水素基である請求項１または２に記載のエポキ
シ樹脂組成物。3. A cycloaliphatic hydrocarbon group based on an unsaturated bond in the molecular skeleton of dicyclopentadiene, limonene, or 3a, 4,7,7a-tetrahydroindene.
The epoxy resin composition according to claim 1, which is a valent hydrocarbon group.
ジヒドロキシナフタレンである請求項１〜３に記載のエ
ポキシ樹脂組成物。4. The hydroxyl group-containing condensed polycyclic compound (B) is
The epoxy resin composition according to claim 1, which is dihydroxynaphthalene.
ヒドロキシナフタレン、２，７−ジヒドロキシナフタレ
ン、或いは、１，５−ジヒドロキシナフタレンである請
求項４記載のエポキシ樹脂組成物。5. The epoxy resin composition according to claim 4, wherein the dihydroxynaphthalene is 1,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, or 1,5-dihydroxynaphthalene.
ドロキシル芳香族化合物と結合した化合物のポリグリシ
ジルエーテル（Ａ）と、水酸基を１分子あたり２個以上
有する縮合多環式化合物（Ｂ）と、無機充填剤（Ｃ）と
を必須成分とすることを特徴とする半導体封止材料。6. A polyglycidyl ether (A), which is a compound in which a cycloaliphatic hydrocarbon group is bound to a hydroxyl aromatic compound, and a condensed polycyclic compound (B) having two or more hydroxyl groups per molecule. And an inorganic filler (C) as essential components.
℃における溶融粘度が０．１〜２．０ポイズの範囲であ
る請求項６に記載の半導体封止材料。7. A polyglycidyl ether (A) of 150.
The semiconductor encapsulating material according to claim 6, which has a melt viscosity in the range of 0.1 to 2.0 poise at ° C.
タジエン、リモネン、または３ａ，４，７，７ａ−テト
ラヒドロインデンの分子骨格中の不飽和結合に基づく２
価の炭化水素基である請求項６〜７に記載の半導体封止
材料。8. A cycloaliphatic hydrocarbon group based on an unsaturated bond in the molecular skeleton of dicyclopentadiene, limonene, or 3a, 4,7,7a-tetrahydroindene.
The semiconductor encapsulating material according to claim 6, which is a valent hydrocarbon group.
シナフタレンである請求項６〜８に記載の半導体封止材
料。9. The semiconductor encapsulating material according to claim 6, wherein the condensed polycyclic compound (B) is dihydroxynaphthalene.
ジヒドロキシナフタレン、２，７−ジヒドロキシナフタ
レン、或いは、１，５−ジヒドロキシナフタレンである
請求項９記載の半導体封止材料。10. Dihydroxynaphthalene is 1,6-
The semiconductor encapsulating material according to claim 9, which is dihydroxynaphthalene, 2,7-dihydroxynaphthalene, or 1,5-dihydroxynaphthalene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29280094A JP3509236B2 (en) | 1994-11-28 | 1994-11-28 | Epoxy resin composition and semiconductor encapsulating material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29280094A JP3509236B2 (en) | 1994-11-28 | 1994-11-28 | Epoxy resin composition and semiconductor encapsulating material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08151428A true JPH08151428A (en) | 1996-06-11 |
| JP3509236B2 JP3509236B2 (en) | 2004-03-22 |
Family
ID=17786514
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29280094A Expired - Lifetime JP3509236B2 (en) | 1994-11-28 | 1994-11-28 | Epoxy resin composition and semiconductor encapsulating material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3509236B2 (en) |
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|---|---|---|---|---|
| JP2009013255A (en) * | 2007-07-03 | 2009-01-22 | Mitsubishi Rayon Co Ltd | Resin composition for fiber-reinforced composite materials and method for producing the same and composite material intermediate |
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1994
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|---|---|---|---|---|
| JP2009013255A (en) * | 2007-07-03 | 2009-01-22 | Mitsubishi Rayon Co Ltd | Resin composition for fiber-reinforced composite materials and method for producing the same and composite material intermediate |
| JP2009096886A (en) * | 2007-10-17 | 2009-05-07 | Hitachi Chem Co Ltd | Liquid sealing resin composition and manufacturing method of semiconductor device using it |
| JP2013529226A (en) * | 2010-04-16 | 2013-07-18 | ヴァルスパー・ソーシング・インコーポレーテッド | COATING COMPOSITION FOR PACKAGE ARTICLE AND COATING METHOD |
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|---|---|
| JP3509236B2 (en) | 2004-03-22 |
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