JPS61203565U - - Google Patents
Info
- Publication number
- JPS61203565U JPS61203565U JP1985087215U JP8721585U JPS61203565U JP S61203565 U JPS61203565 U JP S61203565U JP 1985087215 U JP1985087215 U JP 1985087215U JP 8721585 U JP8721585 U JP 8721585U JP S61203565 U JPS61203565 U JP S61203565U
- Authority
- JP
- Japan
- Prior art keywords
- legs
- fixed
- substrate
- connecting conductor
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第1図は本考案の一実施例の要部側面図、第2
図は従来の半導体装置の一例の外観斜視図、第3
図は従来の絶縁板端子間の二つの接続法を示す側
面図である。 1:熱良導性基板、3:蓋体、4:外部導出端
子導体、6:絶縁板、7:接続導体片、8:半導
体素子。
図は従来の半導体装置の一例の外観斜視図、第3
図は従来の絶縁板端子間の二つの接続法を示す側
面図である。 1:熱良導性基板、3:蓋体、4:外部導出端
子導体、6:絶縁板、7:接続導体片、8:半導
体素子。
Claims (1)
- 熱良導性材料からなる基板と主として絶縁性材
料からなる側壁および蓋体とによつて構成される
容器の基板上に複数の絶縁板を介してそれぞれ半
導体素子が固定され、外部導出端子導体が蓋体を
貫通するものにおいて、蓋体に端子導体および二
つの脚部を有する接続導体片が固定され、該端子
導体および接続導体片脚部の先端がそれぞれ半導
体素子の電極を接続された絶縁板上の端子に接続
され、その場合一つの接続導体片の両脚部の先端
が異なる絶縁板上の端子に接続されたことを特徴
とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985087215U JPS61203565U (ja) | 1985-06-10 | 1985-06-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985087215U JPS61203565U (ja) | 1985-06-10 | 1985-06-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61203565U true JPS61203565U (ja) | 1986-12-22 |
Family
ID=30639231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985087215U Pending JPS61203565U (ja) | 1985-06-10 | 1985-06-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61203565U (ja) |
-
1985
- 1985-06-10 JP JP1985087215U patent/JPS61203565U/ja active Pending