JPS61196501U - - Google Patents
Info
- Publication number
- JPS61196501U JPS61196501U JP7997185U JP7997185U JPS61196501U JP S61196501 U JPS61196501 U JP S61196501U JP 7997185 U JP7997185 U JP 7997185U JP 7997185 U JP7997185 U JP 7997185U JP S61196501 U JPS61196501 U JP S61196501U
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- fiber film
- alumina fiber
- insulating substrate
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- 239000000835 fiber Substances 0.000 claims 3
- 238000000605 extraction Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Description
第１図〜第３図は本考案の一実施例に係り、第
１図はチツプ抵抗器の斜視図、第２図は製造工程
途中における絶縁基板の斜視図、第３図は第２図
のＡ―Ａ線に沿う断面図、第４図および第５図は
従来例に係り、第４図はチツプ抵抗器の断面図、
第５図ａ，ｂ，ｃ，ｄはチツプ抵抗器の製造工程
の概略を示す説明図である。
４…絶縁基板、５…電極、６…抵抗体。
1 to 3 relate to one embodiment of the present invention, in which FIG. 1 is a perspective view of a chip resistor, FIG. 2 is a perspective view of an insulating substrate in the middle of the manufacturing process, and FIG. A cross-sectional view taken along the line A-A, FIGS. 4 and 5 relate to a conventional example, and FIG. 4 is a cross-sectional view of a chip resistor.
FIGS. 5a, b, c, and d are explanatory diagrams showing an outline of the manufacturing process of a chip resistor. 4... Insulating substrate, 5... Electrode, 6... Resistor.
Claims (1)
備えたチツプ抵抗器において、前記絶縁基板とし
て多孔質のアルミナ繊維フイルムを用い、該アル
ミナ繊維フイルムの両端部に導電性インクを含浸
させて前記電極を形成し、かつ、これら電極間の
前記アルミナ繊維フイルムに抵抗インクを含浸さ
せて前記抵抗体を形成するように構成したことを
特徴とするチツプ抵抗器。 In a chip resistor comprising an insulating substrate, a resistor, and an electrode for external extraction, a porous alumina fiber film is used as the insulating substrate, and both ends of the alumina fiber film are impregnated with conductive ink. A chip resistor characterized in that the resistor is formed by forming the electrodes and impregnating the alumina fiber film between these electrodes with a resistance ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7997185U JPS61196501U (en) | 1985-05-30 | 1985-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7997185U JPS61196501U (en) | 1985-05-30 | 1985-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61196501U true JPS61196501U (en) | 1986-12-08 |
Family
ID=30625380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7997185U Pending JPS61196501U (en) | 1985-05-30 | 1985-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61196501U (en) |
-
1985
- 1985-05-30 JP JP7997185U patent/JPS61196501U/ja active Pending
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