JPS6119578U - Flat package integrated circuit case - Google Patents
Flat package integrated circuit caseInfo
- Publication number
- JPS6119578U JPS6119578U JP10324984U JP10324984U JPS6119578U JP S6119578 U JPS6119578 U JP S6119578U JP 10324984 U JP10324984 U JP 10324984U JP 10324984 U JP10324984 U JP 10324984U JP S6119578 U JPS6119578 U JP S6119578U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- flat package
- package integrated
- circuit case
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】
第1図a, bは本考案フラットパッケージ型集積回路
用ケースの一実施例を示し、aはその平面図、bはa図
のA−A’断面図、第2図a, bはフラットパッケー
ジ型集積回路の一例で、aはその平面図、bは正面図、
第3図a,bは従来のケースで、aはその平面図、bは
a図のB−B’断面図である。
1・・・ケース本体、2・・・外辺、3・・・段部、4
・・・中空部分、5・・・溝、11・・・プラスチック
樹脂、12・・・リード。[Brief Description of the Drawings] Figures 1a and 1b show an embodiment of the flat package integrated circuit case of the present invention, in which a is a plan view thereof, b is a sectional view taken along line A-A' in figure a, Figures a and b are examples of flat package integrated circuits, where a is a plan view, b is a front view,
Figures 3a and 3b show the conventional case, where a is a plan view thereof and b is a sectional view taken along line BB' in figure a. 1...Case body, 2...Outside edge, 3...Step part, 4
...Hollow part, 5...Groove, 11...Plastic resin, 12...Lead.
Claims (1)
空部と該集積回路のリードを乗せる段部と、複数のケー
スを嵌合して積重ねるた吟の段部とを具備するフラット
パッケージ型集積回路用ケースにおいて、前記集積回路
のリードを乗せる段部には、それぞれリードに嵌合する
溝を設けたことを特徴とするフラットパッケージ型集積
回路用ケース。For flat package integrated circuits, comprising a hollow part for storing the resin part of the flat package integrated circuit, a step part for placing the leads of the integrated circuit, and a step part for fitting and stacking a plurality of cases. 1. A case for a flat package integrated circuit, characterized in that the stepped portions on which the leads of the integrated circuit are placed are provided with grooves that fit the leads, respectively.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10324984U JPS6119578U (en) | 1984-07-10 | 1984-07-10 | Flat package integrated circuit case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10324984U JPS6119578U (en) | 1984-07-10 | 1984-07-10 | Flat package integrated circuit case |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6119578U true JPS6119578U (en) | 1986-02-04 |
Family
ID=30662643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10324984U Pending JPS6119578U (en) | 1984-07-10 | 1984-07-10 | Flat package integrated circuit case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6119578U (en) |
-
1984
- 1984-07-10 JP JP10324984U patent/JPS6119578U/en active Pending
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