JPS5899843U - hybrid integrated circuit - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は混成集積回路の従来例で、第１図ａはその樹脂
竺覆前の斜視図、第１図すは樹脂被覆径樹脂の一部を除
去して示す正面−、第２図は本考案の一実施例で、第２
図ａはその樹脂被覆前の斜視図、第２図すは樹脂被覆径
樹脂の一部を除去し　　　　　゛て示す正面図、第３図
は別の実施例で、第３図ａはその轡脂被覆前の斜視図、
第３図すは同じく側面図、第３図Ｃは樹脂被覆後の断面
図である。 ２：回路部品チップ、４：被覆樹脂、５．６二基板、７
：回路部品個別素子。Figure 1 shows a conventional example of a hybrid integrated circuit. Figure 1a is a perspective view of the circuit before it is covered with resin, Figure 1 is a front view with part of the resin coating removed, and Figure 2 is a In one embodiment of the present invention, the second
Figure a is a perspective view before the resin coating, Figure 2 is a front view with part of the resin coating removed, Figure 3 is another embodiment, and Figure 3a is the resin coating. Perspective view before coating,
FIG. 3 is a side view, and FIG. 3C is a sectional view after resin coating. 2: Circuit component chip, 4: Coating resin, 5.6 Two substrates, 7
: Circuit component individual element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 配線導体を備えた基板上に回路部品を装着し、基板およ
び回路部品が樹脂によって被覆されるものにおいて、基
板が角を落した形状を有することを特徴とする混成集積
回路。1. A hybrid integrated circuit in which circuit components are mounted on a substrate provided with wiring conductors, and the substrate and circuit components are covered with resin, wherein the substrate has a rounded corner shape.