JPS61195178A - Anisotropically conductive adhesive - Google Patents
Anisotropically conductive adhesiveInfo
- Publication number
- JPS61195178A JPS61195178A JP3577585A JP3577585A JPS61195178A JP S61195178 A JPS61195178 A JP S61195178A JP 3577585 A JP3577585 A JP 3577585A JP 3577585 A JP3577585 A JP 3577585A JP S61195178 A JPS61195178 A JP S61195178A
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- conductive powder
- resin
- adhesive
- dispersing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、液晶表示装置と駆動モジュールを電気的に接
続するなどの高密度な端子リードを有する２つの電気部
品どうしを電気的に接続する時に用いることのできる異
方導電性接着剤に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is used to electrically connect two electrical components having high-density terminal leads, such as electrically connecting a liquid crystal display device and a drive module. The present invention relates to an anisotropically conductive adhesive that can be used as an anisotropically conductive adhesive.
従来の技術
従来、複数個の回路基板相互において、対応する電極間
を電気的に接続する場合に、その手段としては、例えば
各対応する電極を同形状に形成し、かつ対向させ、両電
極間にいわゆるエラスティックコネクタを挾み、加圧し
て接続を得る方法がある。また、他の手段としては、金
属粉末、炭素粉末、炭素繊維などを接着剤中に含有する
異方導電性接着剤を用いる方法がある。2. Description of the Related Art Conventionally, when electrically connecting corresponding electrodes on a plurality of circuit boards, the means for doing so is, for example, forming the corresponding electrodes in the same shape and facing each other, and connecting the electrodes between the two electrodes. There is a method to make a connection by sandwiching a so-called elastic connector and applying pressure. Another method is to use an anisotropic conductive adhesive containing metal powder, carbon powder, carbon fiber, etc. in the adhesive.
第３図はこのような異方導電性接着剤を用いて回路基板
どうしを接続した時の断面図を示している。第３図にお
いて、１はガラスエポキシ基板、２はフレキシブル基板
、３および４は銅箔からなる電極、６は合成樹脂６中に
導電粉体７を分散させてなる異方導電性接着剤である。FIG. 3 shows a cross-sectional view when circuit boards are connected using such an anisotropic conductive adhesive. In FIG. 3, 1 is a glass epoxy substrate, 2 is a flexible substrate, 3 and 4 are electrodes made of copper foil, and 6 is an anisotropic conductive adhesive made by dispersing conductive powder 7 in synthetic resin 6. .
発明が解決しようとする問題点
しかし、このような従来の方法では、前者のエラスティ
ックコネクタを用いる場合には、常に加圧状態を必要と
することと、エラスティックコネクタ自体の寸法に限界
があるため、両回路基板の対向間隔が制限されるという
欠点を有していた０また、後者の異方導電性接着剤を用
いる方法は、合成樹脂中に導電粉体を分散させるだけで
容易に異方導電性接着剤を得ることができる利点を有し
ているが、導電粉体の分散状態が悪かったり、２次粒子
を作って導電粉体の粒径にばらつきが生じることがあり
、そのため熱圧着時に導通不良となりたり、端子リード
間が高密度になれば端子リード間にショートが生じるな
どの問題点を有していた。また、電気的接続は第３図に
示すように、合成樹脂６層の引張り応力による導電粉体
７の電極３．４上への圧接で得られているので、信頼性
が合成樹脂６層の信頼性に左右され、合成樹脂６層が劣
化すると直ちに導通不良を起すなどの欠点を有していた
。Problems to be Solved by the Invention However, in such conventional methods, when using the former elastic connector, a pressurized state is always required, and there are limits to the dimensions of the elastic connector itself. However, the latter method using an anisotropic conductive adhesive has the disadvantage that the distance between the two circuit boards facing each other is limited.0 In addition, the latter method using an anisotropic conductive adhesive can easily be used by simply dispersing conductive powder in a synthetic resin. However, the dispersion state of the conductive powder may be poor, or secondary particles may be formed, resulting in variations in the particle size of the conductive powder. There have been problems such as poor conductivity during crimping, and short circuits occurring between terminal leads when the terminal leads are densely spaced. In addition, as shown in Figure 3, the electrical connection is obtained by pressing the conductive powder 7 onto the electrode 3.4 due to the tensile stress of the six layers of synthetic resin, so the reliability is improved by the tensile stress of the six layers of synthetic resin. It was dependent on reliability, and had the disadvantage that poor conductivity would occur immediately if the six synthetic resin layers deteriorated.
本発明はこのような問題点を解決するもので、高密度な
端子リード間でも電気的接続が確実に行え、信頼性を向
上させることのできる異方導電性接着剤を提供すること
を目的とするものである。The present invention solves these problems, and aims to provide an anisotropic conductive adhesive that can ensure electrical connection even between high-density terminal leads and improve reliability. It is something to do.
問題点を解決するための手段
この問題点を解決するために本発明の異方導電性接着剤
は、熱可塑性樹脂中または熱可塑性樹脂と熱硬化性樹脂
の混合物中に、１つ以上の鋭角を有し、粒径が１〜６０
μｍである焼結カーボンの粉砕物を導電粉体として分散
させた構成としたものである。Means for Solving the Problem In order to solve this problem, the anisotropically conductive adhesive of the present invention has one or more acute angles in the thermoplastic resin or in the mixture of the thermoplastic resin and the thermosetting resin. with a particle size of 1 to 60
It has a structure in which pulverized sintered carbon having a diameter of μm is dispersed as conductive powder.
作 用
この構成により、１つ以上の鋭角を有する導電粉体を用
いているため、接続時の圧力により被接続電極に導電粉
体の鋭角部分がくい込み、安定した接続が得られること
となる。Function: With this configuration, since the conductive powder having one or more acute angles is used, the acute angle portion of the conductive powder digs into the electrode to be connected due to the pressure during connection, resulting in a stable connection.
ここで、導電粉体の粒径が１μｍ未満では、導電粉体の
粒径が小さすぎて導通不良となり、一方５０μｍより粒
径が大きいと配線間でのショートが発生し、使用不可能
となる。また、導電粉体の添加量が樹脂１００重量部に
対して０．５重量部未満では導通不良を発生し易く、ま
た同じく１０重量部を超えると等方性の導電性を示し易
くなるなど、実用上問題を生じる恐れがある。Here, if the particle size of the conductive powder is less than 1 μm, the particle size of the conductive powder is too small, resulting in poor conduction, while if the particle size is larger than 50 μm, a short circuit will occur between the wiring, making it unusable. . Furthermore, if the amount of conductive powder added is less than 0.5 parts by weight per 100 parts by weight of the resin, poor conductivity tends to occur, and if it exceeds 10 parts by weight, it tends to exhibit isotropic conductivity. This may cause practical problems.
実施例
以下、本発明の一実施例について第１図、第２図と共に
説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2.
まず、１つ以上の鋭角をもつ導電粉体として、フェノー
ル樹脂〔松下電工（株）製〕を窒素雰囲気中でもって約
１２００℃で焼結し、１０〜２０μｍまで粉砕したもの
を用いた。こうして粉砕されたカーボン粒子には少なく
とも１つ以上の鋭角を有していることを顕微鏡で確認し
た。この場合、使用する樹脂は焼結可能な合成樹脂であ
ればよい。First, as a conductive powder having one or more acute angles, a phenolic resin (manufactured by Matsushita Electric Works, Ltd.) was sintered in a nitrogen atmosphere at about 1200° C. and ground to 10 to 20 μm. It was confirmed using a microscope that the carbon particles thus pulverized had at least one acute angle. In this case, the resin used may be any synthetic resin that can be sintered.
そして、上記の焼結カーボンの粉砕物からなる導電粉体
を、熱可塑性高分子量ポリエステル〔日本合成ゴム工業
（株）製〕のメチルエチルケトン溶液（固形公約３０％
）に、樹脂分１００重量部に対し５重量部加え分散させ
、６０μｍ厚のシート状に形成し、第２図に示すような
異方導電性接着剤を作成した。第２図において、８は熱
可塑性樹脂、９はその樹脂８中に分散された上記導電粉
体で、これらより異方導電性接着剤１Ｑが構成されてい
る。また、１１は接着剤１０の一方の面に貼り合わされ
た離型紙である。Then, a conductive powder made of the pulverized sintered carbon described above was mixed with a methyl ethyl ketone solution (about 30% solids) of thermoplastic high molecular weight polyester (manufactured by Japan Synthetic Rubber Industry Co., Ltd.).
) was added and dispersed in 5 parts by weight based on 100 parts by weight of the resin, and formed into a sheet having a thickness of 60 μm to produce an anisotropically conductive adhesive as shown in FIG. In FIG. 2, 8 is a thermoplastic resin, 9 is the above-mentioned conductive powder dispersed in the resin 8, and the anisotropically conductive adhesive 1Q is constituted by these. Further, 11 is a release paper bonded to one side of the adhesive 10.
このように構成された異方導電性接着剤１０は、第１の
被接着回路基板の接続すべき電極上にそれを固定し、第
２の被接着回路基板上の被接続電極を上記第１の基板上
の被接続電極と対向して整合させた後、熱を加えながら
加圧し、次いで減圧。The anisotropic conductive adhesive 10 configured in this manner is fixed onto the electrode to be connected on the first circuit board to be bonded, and the electrode to be connected on the second circuit board to be bonded is fixed to the electrode to be connected on the second circuit board to be bonded. After aligning the electrodes facing the connected electrodes on the substrate, pressure is applied while applying heat, and then pressure is reduced.
冷却されることにより、硬化した上記樹脂８によって導
電粉体９は一対の被接続電極間に固定され、電気的接続
が得られることとなる。By cooling, the conductive powder 9 is fixed between the pair of electrodes to be connected by the hardened resin 8, and an electrical connection is obtained.
次に、上記のようにして作成された異方導電性接着剤１
ｏを用いて２枚の基板を接続する具体例を説明する。こ
こで、テスト用基板として、３６μｍ厚の銅箔を上面に
設けた１、６調厚のガラスエポキシ基板と、３６μｍ厚
ポリエステルペース上に市販導電ペーストを印刷形成し
たフレキシブル基板を使用した。そして、フレキシブル
基板に第２図に示す上記シート状の異方導電性接着剤１
゜を１１０’Ｃ，６Ｋｆ／ｃｊ、５秒で仮固定し、上記
離型紙１１をはがしてから、その７レキシプル基板を対
向する電極どうしを整合するようにガラスエポキシ基板
と重ねた後、１５０℃、３０初／ｅ−ｄ。Next, anisotropic conductive adhesive 1 created as described above
A specific example of connecting two boards using o will be described. Here, as test substrates, a glass epoxy substrate with a thickness of 1 and 6 with a 36 μm thick copper foil provided on its upper surface, and a flexible substrate with a commercially available conductive paste printed on a 36 μm thick polyester paste were used. Then, the sheet-shaped anisotropic conductive adhesive 1 shown in FIG. 2 is attached to the flexible substrate.
Temporarily fixed at 110'C, 6Kf/cj for 5 seconds, peeled off the release paper 11, stacked the 7 lexiple substrate on a glass epoxy substrate so that the opposing electrodes were aligned, and then heated to 150°C. , 30 first/ed.
３０秒で本圧着を行った。第１図は本圧着後の状態を示
している。第１図において、１２はガラスエポキシ基板
、１３は銅箔からなる電極、１４はフレキシブル基板、
１５は導電ペーストからなる電極である。第１図に示す
ように、本発明では導電粉体９の一部が電極１３．１５
に圧着時にくい込んだ形で両基板１２．１４の電極１３
．１５間が異方導電性接着剤１ｏで電気的に接続されて
いる。Main crimping was performed in 30 seconds. FIG. 1 shows the state after the final crimping. In FIG. 1, 12 is a glass epoxy board, 13 is an electrode made of copper foil, 14 is a flexible board,
15 is an electrode made of conductive paste. As shown in FIG. 1, in the present invention, a part of the conductive powder 9 is
The electrodes 13 of both substrates 12 and 14 are recessed when crimped into the
．． 15 are electrically connected with an anisotropically conductive adhesive 1o.
このように本発明の異方導電性接着剤を用いて圧着した
試料を、例えば湿中放置、高温放置、ヒートサイクルな
どの各環境試験にかけたところ、接続抵抗の変化は見ら
れず、安定した性能を示した。ここで、上記ガラスエポ
キシ基板、フレキシブル基板の代りに、透明導電膜パタ
ーン付きガラス、ポリイミドペースの３６μｍ厚銅箔基
板を用いても接続は安定していることを確認した。When samples crimped using the anisotropic conductive adhesive of the present invention were subjected to various environmental tests such as being left in humidity, being left at high temperatures, and heat cycling, no change in connection resistance was observed, and a stable result was obtained. demonstrated its performance. Here, it was confirmed that the connection was stable even when a glass with a transparent conductive film pattern or a 36 μm thick copper foil substrate with a polyimide paste was used instead of the glass epoxy substrate or flexible substrate.
また、上記の実施例においては、焼結カーボンの粉砕物
からなる導電粉体を熱可塑性樹脂中に分散させてなるも
のについて説明したが、これは熱可塑性樹脂と熱硬化性
樹脂の混合物中に上記導電粉体を分散させて異方導電性
接着剤を構成してもよいものである。Furthermore, in the above example, a conductive powder made of pulverized sintered carbon was dispersed in a thermoplastic resin. The anisotropically conductive adhesive may be constructed by dispersing the conductive powder described above.
発明の効果
以上のように本発明の異方導電性接着剤は、１つ以上の
鋭角をもつ導電粉体を合成樹脂中に分散させており、高
密度な端子リード間であっても電気的な接続が確実に行
えることとなる。また、導電粉体が鋭角を有しているた
め、導電粉体が被接続電極にくい込んだ状態で接続され
ることとなり、分散させである合成樹脂が吸湿し膨潤し
ても直ちに導通不良を起すことはなく、信頼性の向上を
図ることができる。さらに、導電粉体の鋭角が導体パタ
ーンにくい込むため、貴金属メッキを施している導体パ
ターンをハンダメッキまたは銅箔むき出しの導体パター
ンとしても信頼性の高い接続が得られる。Effects of the Invention As described above, the anisotropically conductive adhesive of the present invention has conductive powder with one or more acute angles dispersed in the synthetic resin, so that electrical conductivity is maintained even between high-density terminal leads. This will ensure a secure connection. In addition, because the conductive powder has an acute angle, the conductive powder is embedded in the electrode to be connected, and even if the synthetic resin used to disperse it absorbs moisture and swells, it immediately causes poor continuity. Therefore, reliability can be improved. Furthermore, since the acute angles of the conductive powder penetrate into the conductor pattern, a highly reliable connection can be obtained even if the conductor pattern is plated with a precious metal and is solder-plated or the conductor pattern is exposed with copper foil.
このように本発明の異方導電性接着剤は種々の利点をも
つものであり、液晶表示装置と駆動モジュールとの接続
だけでなく、高密度な配線ピッチをもつ回路基板どうし
の接続にも用いることができるなど、企業的価値の大な
るものである。As described above, the anisotropic conductive adhesive of the present invention has various advantages and can be used not only for connecting liquid crystal display devices and drive modules, but also for connecting circuit boards with high-density wiring pitches. It has great corporate value, such as the ability to
第１図は本発明の異方導電性接着剤を用いて回路基板ど
うしを接続した状態を示す要部断面図、第２図は本発明
の異方導電性接着剤の一実施例を示す断面図、第３図は
従来の異方導電性接着剤を用いて回路基板どうしを接続
した状態を示す要部断面図である。
８・・・・・・熱可塑性樹脂、９・・・・・・導電粉体
、１ｏ・・・・・・異方導電性接着剤、１２・・・・・
・ガラスエポキシ基板、１３・１６・・・・・・電極、
１４・・・・・・フレキシブル基板。
代理人の氏名 弁理士 申越 敏 男 ほか１名８−一
一煕町ｖＬ性７週呵゛月旨
１４−一一フレキシフル羞４鳳
グ
第２図FIG. 1 is a cross-sectional view of main parts showing a state in which circuit boards are connected using the anisotropically conductive adhesive of the present invention, and FIG. 2 is a cross-sectional view showing an example of the anisotropically conductive adhesive of the present invention. FIG. 3 is a sectional view of a main part showing a state in which circuit boards are connected to each other using a conventional anisotropic conductive adhesive. 8... Thermoplastic resin, 9... Conductive powder, 1o... Anisotropic conductive adhesive, 12...
・Glass epoxy substrate, 13, 16... Electrode,
14...Flexible board. Name of agent: Patent attorney Toshio Shinkoshi and one other person
Claims (1)
合物中に、１つ以上の鋭角を有し、粒径が１〜５０μｍ
である焼結カーボンの粉砕物を導電粉体として分散させ
たことを特徴とする異方導電性接着剤。In a thermoplastic resin or in a mixture of a thermoplastic resin and a thermosetting resin, the particles have one or more acute angles and have a particle size of 1 to 50 μm.
An anisotropic conductive adhesive characterized by dispersing pulverized sintered carbon as conductive powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3577585A JPS61195178A (en) | 1985-02-25 | 1985-02-25 | Anisotropically conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3577585A JPS61195178A (en) | 1985-02-25 | 1985-02-25 | Anisotropically conductive adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61195178A true JPS61195178A (en) | 1986-08-29 |
| JPH0521157B2 JPH0521157B2 (en) | 1993-03-23 |
Family
ID=12451257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3577585A Granted JPS61195178A (en) | 1985-02-25 | 1985-02-25 | Anisotropically conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195178A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61274394A (en) * | 1985-05-29 | 1986-12-04 | シャープ株式会社 | Connection of terminal |
| JPH01185380A (en) * | 1988-01-20 | 1989-07-24 | Shin Etsu Polymer Co Ltd | Anisotropically conductive adhesive |
| JPH057078A (en) * | 1991-06-27 | 1993-01-14 | Shin Etsu Polymer Co Ltd | Anisotropically conductive bonding agent |
| JPH0845337A (en) * | 1994-07-29 | 1996-02-16 | Shin Etsu Polymer Co Ltd | Anisotropic conductive adhesive |
| JPH11123246A (en) * | 1997-07-30 | 1999-05-11 | Becton Dickinson & Co | Binding agent, and binding of electrode to printed conductive wiring |
| US7184116B2 (en) * | 2000-07-28 | 2007-02-27 | Au Optronics Corporation | LCD having an alignment film comprising sintered carbon |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60199062A (en) * | 1984-03-22 | 1985-10-08 | Nippon Oil & Fats Co Ltd | Antistatic conductive resin composition |
-
1985
- 1985-02-25 JP JP3577585A patent/JPS61195178A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60199062A (en) * | 1984-03-22 | 1985-10-08 | Nippon Oil & Fats Co Ltd | Antistatic conductive resin composition |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61274394A (en) * | 1985-05-29 | 1986-12-04 | シャープ株式会社 | Connection of terminal |
| JPH0334240B2 (en) * | 1985-05-29 | 1991-05-21 | Sharp Kk | |
| JPH01185380A (en) * | 1988-01-20 | 1989-07-24 | Shin Etsu Polymer Co Ltd | Anisotropically conductive adhesive |
| JPH057078A (en) * | 1991-06-27 | 1993-01-14 | Shin Etsu Polymer Co Ltd | Anisotropically conductive bonding agent |
| JPH0845337A (en) * | 1994-07-29 | 1996-02-16 | Shin Etsu Polymer Co Ltd | Anisotropic conductive adhesive |
| JPH11123246A (en) * | 1997-07-30 | 1999-05-11 | Becton Dickinson & Co | Binding agent, and binding of electrode to printed conductive wiring |
| US7184116B2 (en) * | 2000-07-28 | 2007-02-27 | Au Optronics Corporation | LCD having an alignment film comprising sintered carbon |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521157B2 (en) | 1993-03-23 |
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