JPS6119157A - Lead frame and semiconductor device using same - Google Patents
Lead frame and semiconductor device using sameInfo
- Publication number
- JPS6119157A JPS6119157A JP14002584A JP14002584A JPS6119157A JP S6119157 A JPS6119157 A JP S6119157A JP 14002584 A JP14002584 A JP 14002584A JP 14002584 A JP14002584 A JP 14002584A JP S6119157 A JPS6119157 A JP S6119157A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- resin
- island
- semiconductor device
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はリードフレーム及びそれを用いた半導体装置に
関し、特に樹脂封止後の仕上工程、選別工程、検査工程
に好適なリードフレーム及びそれを用いた半導体装置に
関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a lead frame and a semiconductor device using the same, and particularly to a lead frame suitable for a finishing process, a sorting process, and an inspection process after resin sealing, and a lead frame using the same. The present invention relates to the semiconductor device used.
（従来技術）
従来、樹脂封止形半導体装置は樹脂封止後、種種の仕上
げ工程を経て、選別、検査工程を経た後、製品として完
成したものになるが、これらの工程中で最初はリードフ
レームと呼ばれる金属板上に複数個の集合体として組込
まれた半導体装置も選別、検査工程では個々の半導体装
置として切り離された状態で処理されるため、その取り
扱いが難かしく工程中でリード変形等の問題を生じてい
る。(Prior art) Conventionally, a resin-encapsulated semiconductor device is completed as a product after being encapsulated with resin, going through various finishing processes, sorting, and inspection processes. Semiconductor devices assembled as a group of multiple devices on a metal plate called a frame are also separated and processed as individual semiconductor devices during the sorting and inspection process, making them difficult to handle and causing lead deformation during the process. This is causing problems.
第３図は従来から広く使われているリードフレームを備
えた半導体装置の組立平面図である。第３図において、
１はフレーム、２は封止樹脂、３はリード、４は半導体
素子を固定するアイランド、５は半導体素子、６はアイ
ランドをフレーム上に支えるつり端子、７は封止樹脂の
流出を防止するタイバーである。従来の樹脂制止形半導
体装置では組立工程終了後、第３図で斜線を付した部分
を打ち抜き、半導体装置をフレームから切り離し、選別
、検査工程へ送っていた。FIG. 3 is an assembled plan view of a semiconductor device equipped with a conventionally widely used lead frame. In Figure 3,
1 is a frame, 2 is a sealing resin, 3 is a lead, 4 is an island that fixes a semiconductor element, 5 is a semiconductor element, 6 is a hanging terminal that supports the island on the frame, and 7 is a tie bar that prevents the sealing resin from flowing out. It is. In conventional resin-retained semiconductor devices, after the assembly process is completed, the shaded area in FIG. 3 is punched out, the semiconductor device is separated from the frame, and the semiconductor device is sent to the sorting and inspection process.
この従来の方法では半導体装置は個別に切り離された状
態で、しかも細い外部リードをその周囲に持った状態で
扱われる為に、工程中に測定器へのひっかかり、リード
変形等の問題を生じ選別、検査に困難を生ずると共に出
荷前に整形という問題が生じていた。In this conventional method, semiconductor devices are handled individually and with thin external leads around them, which can lead to problems such as getting caught on measuring instruments or deforming the leads during the process. , which caused difficulties in inspection and the problem of shaping before shipping.
（発明の目的）
本発明の目的は、半導体装置の製造工程、特に選別検査
工程中の不具合発生を減少させ、自動化に適したリード
フレーム及びそれを用いた半導体装置を提供することに
ある。(Objective of the Invention) An object of the present invention is to reduce the occurrence of defects during the manufacturing process of semiconductor devices, particularly during the selection and inspection process, and to provide a lead frame suitable for automation and a semiconductor device using the lead frame.
（発明の構成）
本発明の第１の発明のリードフレームは、アイランド、
つり端子、リード、タイバー及びこれらを支えるフレー
ムを有する樹脂封止型半導体装置のリードフレームに於
て、前記フレームよりその先端が樹脂封止領域まで延び
る金属片を有し、該金属片は前記樹脂封止領域内でリー
ド、つり端子、アイランドと電気的に接続していないこ
とを特徴として構成される。(Structure of the Invention) The lead frame of the first invention of the present invention includes an island,
A lead frame of a resin-sealed semiconductor device having a hanging terminal, a lead, a tie bar, and a frame supporting these has a metal piece whose tip extends from the frame to the resin-sealed area, and the metal piece is attached to the resin-sealed area. The structure is characterized in that it is not electrically connected to leads, hanging terminals, or islands within the sealed area.
また、本発明の第２の発明の半導体装置は、半導体素子
を封止している樹脂中に前記半導体素子に電気的に接続
することなく金属片が埋込まれ、かつ該金属片の先端が
前記樹脂から露出することにより構成される。Further, in the semiconductor device of the second aspect of the present invention, a metal piece is embedded in the resin sealing the semiconductor element without being electrically connected to the semiconductor element, and the tip of the metal piece is embedded in the resin sealing the semiconductor element. It is configured by being exposed from the resin.
（実施例）
以下、本発明の実施例について、図面を参照して説明す
る。(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図は本発明の第１の実施例のリードフレームを備え
た半導体装置の組立平面図である。FIG. 1 is an assembled plan view of a semiconductor device equipped with a lead frame according to a first embodiment of the present invention.
第１図に示すように、本実施例のリードフレームは、半
導体素子５を搭載するアイランド４と、アイランドをフ
レーム１に支えるつり端子６と、リード３と樹脂封止に
あたり樹脂の流出防止をリード保持の役目を果すタイバ
ーより構成される樹脂封止用のリードフレームにおいて
、フレーム１よりその先端が樹脂封止領域２までのびる
金属片８を有しており、金属片８は樹脂封止領域内では
アイランドやリードと離れて存在し電気的に接続しない
ように設けられていることをｔ￥ｊ徴としている。As shown in FIG. 1, the lead frame of this embodiment includes an island 4 on which a semiconductor element 5 is mounted, a hanging terminal 6 that supports the island on the frame 1, and a lead 3 that is sealed with resin to prevent resin from flowing out. A lead frame for resin sealing consisting of tie bars that serves as a retainer has a metal piece 8 whose tip extends from the frame 1 to the resin sealing area 2, and the metal piece 8 is located within the resin sealing area. In this case, the t\j characteristic is that it is provided separately from the island or lead and is not electrically connected to it.
なお本実施例の金属片８はつり端子と独立して設けられ
ている。Note that the metal piece 8 of this embodiment is provided independently of the hanging terminal.
次に、本リードフレームを使用した半導体装置は、アイ
ランド４に半導体素子５がマウントされ、素子とリード
が金属細線で結線された後、封止樹脂２により封止され
組立工程が完了する。その後第１図の斜線部を打ち抜く
。従来のリードフレームでは、この打ち抜きにより半導
体装置は箇々に分離されるが、本実施例では金属片８が
設けられているため金属片の先端は封止樹脂により封入
され、金属片８の黒ぬり部を切断しない限り、金属片８
はリードやつり端子（すなわちアイランド）と電気的接
読されることなしに樹脂封止された半導体装置をフレー
ムに支持することとなる。Next, in the semiconductor device using this lead frame, the semiconductor element 5 is mounted on the island 4, the element and the leads are connected with thin metal wires, and then sealed with the sealing resin 2 to complete the assembly process. Then punch out the shaded area in Figure 1. In a conventional lead frame, the semiconductor device is separated into parts by this punching, but in this embodiment, since the metal piece 8 is provided, the tip of the metal piece is sealed with sealing resin, and the black color of the metal piece 8 is sealed. Metal piece 8 unless the part is cut.
In this case, a resin-sealed semiconductor device is supported on a frame without being electrically connected to leads or hanging terminals (i.e., islands).
従って、この状態のままで、その後の選別、ＢＴ等の′
Ｉｋ気的気性特性検査工程すことが出来る為、工程中で
の取扱いが容易となり、自動化にも適して居り、又、こ
の半導体装置は周辺が金属フレームで囲まれている為に
、工程中でのひっかかりとそれに伴うリード変形、破損
等の不具合を減らすことができる。Therefore, in this state, subsequent sorting, BT, etc.
Since the Ik temperature characteristic testing process can be carried out, it is easy to handle during the process and is suitable for automation.Also, since this semiconductor device is surrounded by a metal frame, it can be easily handled during the process. It is possible to reduce problems such as lead snagging and associated lead deformation and breakage.
本発明による半導体装置は製造工程の最後で半導体装置
を支える金属片を打ち抜き、リードを所期の形状に整形
されることで従来の半導体装置と外形上差のないものと
することができる。The semiconductor device according to the present invention can be made to have the same external shape as a conventional semiconductor device by punching out a metal piece supporting the semiconductor device and shaping the leads into a desired shape at the end of the manufacturing process.
第２図は本発明の第２の実施例のリードフレーム及びこ
れを用いた半導体装置を説明するための組立平面図であ
る。FIG. 2 is an assembled plan view for explaining a lead frame according to a second embodiment of the present invention and a semiconductor device using the lead frame.
第２図に示すように、本実施例では、本発明の％ｌであ
る半導体装置を支える金属片８ｂはアイランド４を支え
るつり端子６から分岐したもので先端が２つに分岐して
いるので半導体装置の支持はより確実に行うことができ
る。なおこの場合もつり端子の斜線部の除去によりアイ
ランドとの絶縁をすることができる。As shown in FIG. 2, in this embodiment, the metal piece 8b that supports the semiconductor device, which is the component of the present invention, is branched from the hanging terminal 6 that supports the island 4, and its tip is branched into two. The semiconductor device can be supported more reliably. In this case as well, insulation from the island can be achieved by removing the hatched portion of the hanging terminal.
なお、以上の実施例から明らかなように金属片は１箇所
で支えても複数箇所で支えてもまたフレームから独立し
た金属片を複数菌膜けてもよい。As is clear from the above embodiments, the metal piece may be supported at one place or at multiple places, or a plurality of metal pieces independent from the frame may be coated.
なお、本発明は細いリードを持つ樹脂封止形半導体装置
や小型で取り扱いの難しい樹脂封止、形半導体装置、多
数のリードを持つ半導体装置に特に有効である。The present invention is particularly effective for resin-sealed semiconductor devices with thin leads, resin-sealed and shaped semiconductor devices that are small and difficult to handle, and semiconductor devices that have a large number of leads.
（発明の効果）
以上説明したとおり、本発明によれば半導体装置の製造
工程、特に選別、検査工程中に於ける不具合特にリード
の変形等を減少させることができ、また製造工程の自動
化に対しても大きな効果を発揮することができる。(Effects of the Invention) As explained above, according to the present invention, it is possible to reduce defects such as deformation of leads, etc. in the manufacturing process of semiconductor devices, especially during the sorting and inspection process, and it is also possible to reduce the occurrence of defects such as deformation of leads, etc. However, it can have a great effect.
第１図は本発明の第１の実施例を説明するための半導体
装置の組立平面図、第２図は本発明の第２の実施例を説
明するための半導体装置の組立平面図、第３図は従来の
樹脂封止形の半導体装置の組立平面図である。
１・・・・・・フレーム、２・・・・−・封止樹脂、３
・・・・・・リード、４・・・・−・アイランド、５・
・・・・・半導体素子、６・・・・・一つり端子、７・
・・・・・タイバー、８・・・・・・金属片。
７．７図
笥？図FIG. 1 is an assembled plan view of a semiconductor device for explaining a first embodiment of the present invention, FIG. 2 is an assembled plan view of a semiconductor device for explaining a second embodiment of the present invention, and FIG. The figure is an assembled plan view of a conventional resin-sealed semiconductor device. 1... Frame, 2... Sealing resin, 3
・・・・Lead, 4・・−・Island, 5・
...Semiconductor element, 6...Single terminal, 7.
...Tie bar, 8...Metal piece. 7.7 drawing board? figure
Claims (2)
れらを支えるフレームを有するリードフレームに於て、
前記フレームよりその先端が樹脂封止領域まで延びる金
属片を有し、該金属片は前記樹脂封止領域内でリード、
つり端子、アイランドと電気的に接続していないことを
特徴とする半導体装置の組立に用いるリードフレーム。(1) In a lead frame that has an island, a hanging terminal, a lead, a tie bar, and a frame that supports these,
The tip of the metal piece extends from the frame to the resin-sealed area, and the metal piece has a lead within the resin-sealed area.
A lead frame used for assembling semiconductor devices that is characterized by not being electrically connected to hanging terminals or islands.
子に電気的に接続することなく金属片が埋込まれ、かつ
該金属片の先端が前記樹脂から露出していることを特徴
とする半導体装置。(2) A metal piece is embedded in the resin sealing the semiconductor element without being electrically connected to the semiconductor element, and the tip of the metal piece is exposed from the resin. semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14002584A JPS6119157A (en) | 1984-07-06 | 1984-07-06 | Lead frame and semiconductor device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14002584A JPS6119157A (en) | 1984-07-06 | 1984-07-06 | Lead frame and semiconductor device using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6119157A true JPS6119157A (en) | 1986-01-28 |
Family
ID=15259193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14002584A Pending JPS6119157A (en) | 1984-07-06 | 1984-07-06 | Lead frame and semiconductor device using same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6119157A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03184356A (en) * | 1989-12-13 | 1991-08-12 | Mitsubishi Electric Corp | Lead frame |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
-
1984
- 1984-07-06 JP JP14002584A patent/JPS6119157A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03184356A (en) * | 1989-12-13 | 1991-08-12 | Mitsubishi Electric Corp | Lead frame |
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