JPS61183567U - - Google Patents
Info
- Publication number
- JPS61183567U JPS61183567U JP6826485U JP6826485U JPS61183567U JP S61183567 U JPS61183567 U JP S61183567U JP 6826485 U JP6826485 U JP 6826485U JP 6826485 U JP6826485 U JP 6826485U JP S61183567 U JPS61183567 U JP S61183567U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminals
- electronic component
- row
- package body
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図aは本考案の一実施例の側面図、同図b
は正面図、第2図は第1図の電子部品パツケージ
をプリント基板に挿入した状態を示す斜視図、第
3図aは従来の電子部品パツケージの側面図、同
図bは正面図である。
1,6……パツケージ本体、2……両端のリー
ド端子、3……残りのリード端子、2a,3a…
…太い部分、2b,3b……細い部分、4……プ
リント基板、5……導電ランド、7……従来のリ
ード端子。
Figure 1a is a side view of an embodiment of the present invention, Figure 1b is a side view of an embodiment of the present invention.
2 is a front view, FIG. 2 is a perspective view showing the electronic component package of FIG. 1 inserted into a printed circuit board, FIG. 3a is a side view of the conventional electronic component package, and FIG. 3b is a front view. 1, 6...Package body, 2...Lead terminals at both ends, 3...Remaining lead terminals, 2a, 3a...
... Thick part, 2b, 3b... Thin part, 4... Printed circuit board, 5... Conductive land, 7... Conventional lead terminal.
Claims (1)
い部分は太く、その先が途中から細くなつた形状
の複数のリード端子が一列または複数列に並んで
引出されているICなどの電子部品パツケージに
おいて、前記リード端子のうち、各列の両端を除
いたリード端子の形状を、両端のリード端子と比
べて太い部分を短くし、その分細い部分を長くし
たことを特徴とする電子部品パツケージ。 In an electronic component package such as an IC, in which a plurality of lead terminals are drawn out in a row or in multiple rows from the package body, the part close to the package body is thick and the tip tapers in the middle. An electronic component package characterized in that the shape of the lead terminals of each row excluding both ends is such that the thicker part is shorter than the lead terminals at both ends, and the thinner part is lengthened accordingly.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6826485U JPS61183567U (en) | 1985-05-09 | 1985-05-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6826485U JPS61183567U (en) | 1985-05-09 | 1985-05-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61183567U true JPS61183567U (en) | 1986-11-15 |
Family
ID=30602857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6826485U Pending JPS61183567U (en) | 1985-05-09 | 1985-05-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61183567U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101015461B1 (en) * | 2008-07-07 | 2011-02-22 | 미쓰비시덴키 가부시키가이샤 | Semiconductor package and semiconductor device |
-
1985
- 1985-05-09 JP JP6826485U patent/JPS61183567U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101015461B1 (en) * | 2008-07-07 | 2011-02-22 | 미쓰비시덴키 가부시키가이샤 | Semiconductor package and semiconductor device |
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