JPS61177391A - Annular part plating apparatus - Google Patents
Annular part plating apparatusInfo
- Publication number
- JPS61177391A JPS61177391A JP1739585A JP1739585A JPS61177391A JP S61177391 A JPS61177391 A JP S61177391A JP 1739585 A JP1739585 A JP 1739585A JP 1739585 A JP1739585 A JP 1739585A JP S61177391 A JPS61177391 A JP S61177391A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- mask
- lead frame
- annular
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発°明は環状に部分メッキするための装置に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to an apparatus for annular partial plating.
（従来の技術）
従来のリードフレームの部分メッキにおいては、第５図
に示すリードフレームのインナリードａの先端部す及び
アイランド部ＣにＡｕ、 Ａｇ等のメッキを行っていた
。(Prior Art) In the conventional partial plating of a lead frame, the tip portion and island portion C of the inner lead a of the lead frame shown in FIG. 5 were plated with Au, Ag, or the like.
このようなリードフレームの部分メッキ装置としては、
第６図に示すように、第５図のリードフレームのインナ
リードａの先端部すとアイランド部Ｃを含む大ささの開
孔部２１ｍを有するマスク部材２１をマスク支持部材２
２の穴２２ｍに合わせて配置し、そしてリードフレーム
２３をマスク部材２１の上に前記開孔部２１ｍと対応す
る位置に載置し、下からポンプで圧送されたメッキ液を
ノズル２４から噴射させる等の方法でメッキを行ってい
た。なお、リードフレーム２３は板ゴム２５を介して押
板２６によシ押し付けらｎる。また２７はメッキ液を被
メッキ体に均一に供給するための圧力容器である。そし
て図には示さ彦いがメッキ液には陽極が、またリードフ
レーム（被、メッキ体）２３には陰極が接続さｎる。As a lead frame partial plating equipment,
As shown in FIG. 6, a mask member 21 having an opening 21m having a size that includes the island portion C at the tip end of the inner lead a of the lead frame shown in FIG.
2, and the lead frame 23 is placed on the mask member 21 at a position corresponding to the opening 21m, and the plating liquid pumped from below is sprayed from the nozzle 24. Plating was performed using methods such as Note that the lead frame 23 is pressed against a push plate 26 via a rubber plate 25. Further, 27 is a pressure vessel for uniformly supplying the plating solution to the object to be plated. As shown in the figure, an anode is connected to the plating solution, and a cathode is connected to the lead frame (plated body) 23.
（発明が解決しようとする問題点）
しかしながら、ＩＣ素子を接着剤で接合する形式のリー
ドフレームでは第５図のアイランド部Ｃのメッキは不要
で、アイランド部Ｃの外周で環状部を形成する部分、即
ちワイヤボンディングに必要なインナリードａの先端部
すのみにメッキ被覆を形成するようにすればよい。とこ
ろで、このようなリードフレームを従来の第６図の装置
で行なう場合、ＩＣ素子搭載のアイランド部Ｃをマスキ
ングしてメッキすればよいが、非常に困難であり、特に
量産化に難点があった。その上、近年省Ａｕ、Ａｇ化を
計る目的で、先端部のみの環状部分メッキの要望が強く
なっている。したがつて、この発明の目的はその事情に
鑑みてなセ扛たもので、この環状部分メッキを自動メッ
キ装置に組込んで量産に適した環状部分メッキ装置を提
供することである。(Problem to be Solved by the Invention) However, in a lead frame in which IC elements are bonded with adhesive, plating is not required on the island portion C in FIG. In other words, the plating coating may be formed only on the tip of the inner lead a necessary for wire bonding. By the way, when manufacturing such a lead frame using the conventional equipment shown in Fig. 6, the island portion C on which the IC element is mounted can be masked and plated, but this is extremely difficult and has been especially difficult for mass production. . Moreover, in recent years, there has been a strong demand for annular partial plating only at the tip for the purpose of saving Au and Ag. Therefore, an object of the present invention has been made in view of the above circumstances, and is to provide an annular partial plating apparatus suitable for mass production by incorporating this annular partial plating into an automatic plating apparatus.
（問題点を解決するための手段）
この発明は、上記目的を達成するため、圧送ポンプで導
かれたメッキ液を被メッキ体に均一に供給するための圧
力容器と、開孔部を有する支持部材と、この開孔部にメ
ッキ液吹き上げの均一性を保つためのバッフル板と、こ
の支持部材の上に載置されたメッキ液を導入する供給孔
と、メッキ液を外部へ導出する排出孔及び被メッキ体の
メッキ部分に対応して不溶性陽極線を格子状に設置でき
る溝を有する上部部材と、この上部部材の上に載置され
た環状に配列したスリット状メッキ液噴射孔及びメッキ
液を噴射孔の側方へ流通する溝及びメッキ液を外部へ導
出する流出孔を有するマスク支持部材と、このマスク支
持部材の上にメッキ不要部の環状外形をマスクするマス
ク部材と環状内形をマスクするマスク部材を設けるよう
にしたものである。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a pressure vessel for uniformly supplying a plating solution guided by a pressure pump to an object to be plated, and a support having an opening. A baffle plate for maintaining uniformity of the plating solution sprayed into the opening, a supply hole placed on the support member for introducing the plating solution, and a discharge hole for introducing the plating solution to the outside. and an upper member having grooves in which insoluble anode wires can be installed in a grid pattern corresponding to the plating portions of the object to be plated, and annularly arranged slit-shaped plating solution injection holes and a plating solution placed on the upper member. A mask support member having a groove that flows to the side of the injection hole and an outflow hole that leads the plating solution to the outside, a mask member that masks the annular outer shape of the part not required to be plated, and an annular inner shape on the mask support member. A mask member for masking is provided.
（作 用）
このように、リードフレームを外形マスク部材と円形マ
スク部材の上に位置合せして載せ、下にゴムを張シ付け
た押圧板でリードフレームを外形マスク部材、円形マス
ク部材に押し付け、ポンプによタメツキ液を供給孔に送
シ込むと同時にリードフレームを陰極として陽極との間
に通電すｎばよ〈、いちいちＩＣ素子搭載のためのアイ
ランド部にマスキングする必要がないので、環状部分メ
ッキの量産が可能になる。その上メッキ液はリードフレ
ームに衝突した後、溝、流出孔、排出孔を通ってメッキ
液供給タンクへ返送さｎる。(Function) In this way, the lead frame is aligned and placed on the outer mask member and the circular mask member, and the lead frame is pressed against the outer mask member and the circular mask member using a pressure plate with rubber stretched underneath. , At the same time as the pump pumps the tamping liquid into the supply hole, current is applied between the lead frame as the cathode and the anode. Mass production of partial plating becomes possible. Moreover, after the plating solution impinges on the lead frame, it is returned to the plating solution supply tank through the groove, outflow hole, and discharge hole.
（実施例）
第１図は本発明塊状部分メッキ装置の一実施例を示す主
要部の斜視図、第２図は同じくその一部切欠平面図、第
３図は第２図のＸ−Ｘ断面図である。図において、外形
マスク部材１は強化芯１１（第１図参照）内包のシリコ
ンゴムで構成さｎている。内形マスク部材２は第４図に
示すように強化芯２□内包のシリコンゴムで構成さ才し
、位置決めビン２□と強化芯２□には内形マスク部材２
をマスク支持部材３に固定する九めのねじ孔２３が設け
られている。また位置決め孔４（第２図参照）に対応す
るようになっている。そして外形マスク部材１と内形マ
スク部材２との間には、第５図に示すリードフレームの
メッキ被膜すに対応する位置に環状の開孔２′が形成さ
ｎるようになっている。この外形マスク部材１と内形マ
スク部材２の下にはマスク支持部材３が配置さｎ、この
支持部材３には前記開孔２′に沿って環状に配列したス
リット状のメッキ液噴射孔５とメッキ液をこの噴射孔５
の側方へ流通する＃６（第２図参照）及びメッキ液を流
出する流出ロアが形成されている。また、内形マスク部
材２を位置決めする位置決め孔４とねじ固定孔８が設け
らｎている。次に、マスク支持部材３の下には上部部材
９が配置さ１、この上部部材９には前記メッキ液噴射孔
５ヘメツキ液を導入する供給孔１０及び前記流出孔７か
らメッキ液を外部へ導出する排出孔１１が形成されてい
る。(Example) Fig. 1 is a perspective view of the main part showing an embodiment of the bulk partial plating apparatus of the present invention, Fig. 2 is a partially cutaway plan view thereof, and Fig. 3 is a cross section taken along line XX in Fig. 2. It is a diagram. In the figure, an external mask member 1 is made of silicone rubber containing a reinforcing core 11 (see FIG. 1). As shown in FIG. 4, the inner mask member 2 is made of silicone rubber with a reinforced core 2 □, and the inner mask member 2 is attached to the positioning bottle 2 □ and the reinforced core 2 □.
A ninth screw hole 23 for fixing the mask support member 3 to the mask support member 3 is provided. It also corresponds to the positioning hole 4 (see FIG. 2). An annular opening 2' is formed between the outer mask member 1 and the inner mask member 2 at a position corresponding to the plating coating of the lead frame shown in FIG. A mask support member 3 is arranged below the outer mask member 1 and the inner mask member 2, and the support member 3 has slit-shaped plating solution injection holes 5 arranged in an annular shape along the opening 2'. and plating liquid through this injection hole 5.
#6 (see Fig. 2) that flows laterally and an outflow lower that flows out the plating solution are formed. Further, a positioning hole 4 for positioning the internal mask member 2 and a screw fixing hole 8 are provided. Next, an upper member 9 is disposed under the mask support member 3, and this upper member 9 includes a supply hole 10 for introducing the plating solution into the plating solution injection hole 5, and a plating solution from the outflow hole 7 to the outside. A discharge hole 11 is formed to lead out.
また、上部部材９には更に被メッキ体（リードフレーム
）のメッキする部分に対応して、例えば白金線のような
不溶性陽極線１２（第２図参照）が前記メッキ液噴射孔
５の下方に位置するように溝１３内に格子状に埋め込ま
れている。なお、不溶性陽極線１２をメッキ液噴射孔全
てに対応するように設けるのは環状メッキ被膜の厚さを
均一に保つためである。Furthermore, in the upper member 9, an insoluble anode wire 12 (see FIG. 2), such as a platinum wire, is placed below the plating solution injection hole 5, corresponding to the part to be plated on the body to be plated (lead frame). They are embedded in the groove 13 in a lattice pattern so as to be located at the same positions. The reason why the insoluble anode wires 12 are provided so as to correspond to all the plating solution injection holes is to keep the thickness of the annular plating film uniform.
次に、支持部材１４にはメッキ液を噴射孔５に供給する
開孔部１５とメッキ液吹き上げの均一性を保つバッフル
板１６を有する。ま九、支持部材１４の下には圧送ポン
プで導かｎたメッキ液を被メッキ体に均一圧力で供給す
るための圧力容器１７が設けらｎている。Next, the support member 14 has an aperture 15 for supplying the plating solution to the injection hole 5 and a baffle plate 16 for maintaining uniformity in blowing up the plating solution. Furthermore, a pressure vessel 17 is provided below the support member 14 for supplying the plating liquid introduced by a pressure pump to the object to be plated at a uniform pressure.
次にこのような装置な用いてメッキを行なうには、第３
図に示すように、リードフレーム１８を外形マスク部材
１及び内形１７４部材２の上に位置合せして載せ、下に
板ゴム１９を張り付けた抑圧板２ｏで、このリードフレ
ーム１８を外形マスク部材１と内形マスク部材２に押し
付け、ポンプにょシメッキ液を供給孔１０に送り込むと
同時て陽極線１３を陽極とし、リードフレーム１８を陰
極として通電すｊＬばよい。その場合、メッキ液はリー
ドフレーム１８に衝突した後、溝６、流出孔７、排出孔
１１を通って図示しないメッキ液供給タンクへ返送さ１
しる。Next, in order to perform plating using such a device, the third
As shown in the figure, the lead frame 18 is positioned and placed on the outer mask member 1 and the inner shape 174 member 2, and the lead frame 18 is placed on the outer mask member 1 with a suppressing plate 2o to which a rubber plate 19 is attached. 1 and the internal mask member 2, and at the same time as pumping the plating solution into the supply hole 10, the anode wire 13 is used as an anode and the lead frame 18 is used as a cathode and current is applied. In that case, after colliding with the lead frame 18, the plating solution is returned to the plating solution supply tank (not shown) through the groove 6, the outflow hole 7, and the discharge hole 11.
Sign.
このようにするといちいちＩＣ素子搭載の友めのアイラ
ンド部にマスキングする必要がなく、メッキを行うこと
ができる。In this way, it is not necessary to mask each island portion on which an IC element is mounted, and plating can be performed.
（発明の効果）
以上詳１１１に説明し友ように、本発明によればメッキ
不要部の環状外形をマスクするマスク部材と環状内形を
マスクするマスク部材を設けたので、環状部分メッキが
自動メッキ装置に組込むことができ、貴意化に大きな効
果がある。(Effects of the Invention) As explained above in detail 111, according to the present invention, a mask member for masking the annular outer shape and a mask member for masking the annular inner shape of the unnecessary part are provided, so that the annular partial plating is automatically performed. It can be incorporated into plating equipment and has a great effect on improving its value.
第１図は本発明環状部分メッキ装置の一実施例を示す主
要部の斜視図、第２図は同じくその一部切欠平面図、第
３図は第２図のＸ−Ｘ断面図、第４図（至）は内形＝ス
フ部材の正面図、■はそのＹ−Ｙ！ｌｆｒ面図、第５図
はリードフレームの構成図、第６図は従来のこの種メッ
キ装置の断面図である。
１・・・外形マスク部材、２・・・内形マスク部材、３
・・・マスク支持部材、５・・・メッキ液噴射孔、６・
・・溝、７・・・流出口、９・・・上部部材、１０・・
・供給孔、１１・・・排出孔、１２・・・不溶性陽極線
、１４・・・支持部材、１５・・・開孔部、１６・・・
バッフル板、１７・・・圧力容器。
特許出願人 住友金属鉱山株式会社
代 理 人 押 １） 良 久 ）第３図Fig. 1 is a perspective view of the main part showing an embodiment of the annular partial plating apparatus of the present invention, Fig. 2 is a partially cutaway plan view thereof, Fig. 3 is a sectional view taken along the line The figure (to) is the front view of the internal shape = frame member, and ■ is its Y-Y! FIG. 5 is a configuration diagram of a lead frame, and FIG. 6 is a sectional view of a conventional plating apparatus of this type. 1... Outer mask member, 2... Inner mask member, 3
...Mask support member, 5...Plating liquid injection hole, 6.
... Groove, 7... Outlet, 9... Upper member, 10...
- Supply hole, 11... Discharge hole, 12... Insoluble anode wire, 14... Support member, 15... Opening part, 16...
Baffle plate, 17...pressure vessel. Patent applicant Sumitomo Metal Mining Co., Ltd. Agent 1) Yoshihisa) Figure 3
Claims (1)
する支持部材と、この開孔部にメッキ液吹き上げの均一
性を保つためのバッフル板と、この支持部材の上に載置
されたメッキ液を導入する供給孔と、メッキ液を外部へ
導出する排出孔及び被メッキ体のメッキ部分に対応して
不溶性陽極線を格子状に配置できる溝を有する上部部材
と、この上部部材の上に載置された環状に配列したスリ
ット状メッキ液噴射孔及びメッキ液を噴射孔の側方へ流
通する溝及びメッキ液を外部へ導出する流出孔を有する
マスク支持部材と、このマスク支持部材の上にメッキ不
要部の環状外形マスクを有するマスク部材と、環状内形
をマスクするマスク部材を具備したことを特徴とする環
状部分メッキ装置。[Claims] A pressure vessel for uniformly supplying a plating solution guided by a pressure pump to an object to be plated, a support member having an opening for the pressure vessel, and a support member for uniformly blowing up the plating solution into the opening. a baffle plate placed on this support member to introduce the plating solution, a discharge hole to lead the plating solution to the outside, and an insoluble anode wire corresponding to the plated part of the object to be plated. an upper member having grooves that can be arranged in a grid pattern, slit-shaped plating liquid injection holes arranged in an annular manner placed on the upper member, grooves for distributing the plating liquid to the sides of the injection holes, and a groove for distributing the plating liquid to the sides of the injection holes. An annular mask comprising: a mask support member having an outflow hole leading to the outside; a mask member having an annular outer shape mask of a portion not requiring plating on the mask support member; and a mask member masking the annular inner shape. Partial plating equipment.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1739585A JPS61177391A (en) | 1985-01-31 | 1985-01-31 | Annular part plating apparatus |
| GB08601963A GB2170513B (en) | 1985-01-31 | 1986-01-28 | Selectively plating apparatus for forming an annular coated area |
| US06/823,630 US4675093A (en) | 1985-01-31 | 1986-01-29 | Selectively plating apparatus for forming an annular coated area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1739585A JPS61177391A (en) | 1985-01-31 | 1985-01-31 | Annular part plating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61177391A true JPS61177391A (en) | 1986-08-09 |
Family
ID=11942808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1739585A Pending JPS61177391A (en) | 1985-01-31 | 1985-01-31 | Annular part plating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61177391A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6656275B2 (en) | 2000-04-27 | 2003-12-02 | Shinko Electric Industries Co., Ltd. | Partial plating system |
-
1985
- 1985-01-31 JP JP1739585A patent/JPS61177391A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6656275B2 (en) | 2000-04-27 | 2003-12-02 | Shinko Electric Industries Co., Ltd. | Partial plating system |
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