JPS61171783A - High-frequency heating adhesive - Google Patents
High-frequency heating adhesiveInfo
- Publication number
- JPS61171783A JPS61171783A JP846786A JP846786A JPS61171783A JP S61171783 A JPS61171783 A JP S61171783A JP 846786 A JP846786 A JP 846786A JP 846786 A JP846786 A JP 846786A JP S61171783 A JPS61171783 A JP S61171783A
- Authority
- JP
- Japan
- Prior art keywords
- frequency
- electromagnetic field
- adhesive
- hysteresis loss
- frequency electromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
大発明は高周波電磁界に感応して発熱するホットメルト
型の加熱接着剤に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hot-melt heating adhesive that generates heat in response to a high-frequency electromagnetic field.
ホットメルト型接着剤は１００％同形分であり有機溶剤
等の溶媒を含まないので無毒性である。Hot-melt adhesives are 100% isomorphic and do not contain solvents such as organic solvents, so they are non-toxic.
引火性がほとんどない、取扱いが簡単である等の特徴を
有し、さらに溶融接着後放置するとすぐに固化するので
自動化による高速大量加工処理に最も適した接着剤とし
て工業的に広く使用されてき、ている。It has characteristics such as almost no flammability and is easy to handle, and furthermore, it solidifies immediately if left unattended after melt bonding, so it has been widely used industrially as the most suitable adhesive for high-speed, high-volume processing through automation. ing.
しかしながらホットメルト型接着剤を用いるには、予め
ホットメルト型接着剤を加熱溶融して被着体に塗布する
必要がありアプリケーターを使用しなければならない。However, in order to use a hot melt adhesive, it is necessary to heat and melt the adhesive beforehand and apply it to an adherend, and an applicator must be used.
又冬期ＫＦｉ、接着剤の冷却が早く、接着剤の溶融温度
を高くするとか、被着体をある程度加熱しておかねばな
らない等の欠点があった。Additionally, KFi in winter has disadvantages such as the adhesive cooling quickly, requiring a high melting temperature of the adhesive, and the need to heat the adherend to a certain degree.
上記ホットメルト型接着剤の長所を有しかつ上記の如き
欠点を解消せんとして高周波加熱接着方法が８１！供さ
れている。高周波加熱接着とはホットメルト型接着剤を
被着体間に介在させておき高周波電磁界を印加すること
により接着剤を加熱して接着する方法であり、アプリケ
ーター等を使用する必要がなく好便な方法である。そし
てそのホットメルト型接着剤について特公毛４８−８７
３１号公報、特公昭４８−１４１７５号公報等多くの報
告がなされてｈるが、発熱までの時間が長く、瞬間的に
接着するのに好適な接着剤はいまだにない。81! is a high-frequency heating bonding method that has the advantages of the above-mentioned hot-melt adhesives and eliminates the above-mentioned disadvantages. It is provided. High-frequency heat bonding is a method of heating and bonding hot-melt adhesive between adherends by applying a high-frequency electromagnetic field, and is convenient as there is no need to use an applicator. This is a great method. Regarding the hot melt adhesive, Tokukomo 48-87
Although many reports have been made, such as in Japanese Patent Publication No. 31 and Japanese Patent Publication No. 48-14175, there is still no adhesive suitable for instantaneous bonding because it takes a long time to generate heat.
未発明の目的は高周波加熱接着に使用するのに好適な発
熱効率の高り接着剤を提供するととｋある。The object of the present invention is to provide an adhesive with high heat generation efficiency suitable for use in high frequency heat bonding.
未発明で使用石れる熱可塑性樹脂は熱可塑性を有し強誘
電体、強磁性体等を結着しかつフィルム、成形体等の形
成能を有していればよく、たとえばポリエチレン、ポリ
プロピレン、ポリ塩化ビニル、ポリ酢酸ビニル、エチレ
ン−酢酸ビニル共重合体、ナイロン、ゴム等があげられ
、被着体の種類により任意に使いわけられる。Thermoplastic resins that can be used without invention need only have thermoplasticity, bind ferroelectric materials, ferromagnetic materials, etc., and have the ability to form films, molded objects, etc., such as polyethylene, polypropylene, polyethylene, etc. Examples include vinyl chloride, polyvinyl acetate, ethylene-vinyl acetate copolymer, nylon, rubber, etc., and can be used as desired depending on the type of adherend.
未発明において使用される高周波電磁界＃Ｃシいて誘電
的ヒステリシス損失を有する強誘電体とけ高周波電磁界
において電圧の変化に従って、該強誘電体の有する自発
分極が反転し、その反転により生ずるヒステリシス損失
を熱エネルギーとして外部に出す性質を有するものであ
って、＆と、ｔばロッシェル塩、重水素ロッシェル塩等
のロッシェル塩類、リン酸二水素カリクム等のリン酸二
水素アルカリ買、チタン陵バリウム、チタン酸鉛、ニオ
ブ酸カリクム等の酸素八面体類、硫酸グアエジンアルミ
ニクム等のグアニジン類、硫酸トリグリシン等のグリシ
ン類、ヨク化硫化アンチモン等があげられる。そして誘
発的ヒステリシス損失がＩ ＭＨｚの高周波電磁界にお
いて１ Ｇ−２以上であシキューリ一点が常温より高り
ものが好ましく酸素八面体類、グアニジン類及びグリシ
ン類が好適に使用され、より好ましくはチタン陵バリウ
ムである。A ferroelectric material having a dielectric hysteresis loss in a high-frequency electromagnetic field #C used in the uninvention, the spontaneous polarization of the ferroelectric material is reversed as the voltage changes in the high-frequency electromagnetic field, and hysteresis loss occurs due to the reversal. It has the property of emitting heat energy to the outside, and includes Rochelle salts such as Rochelle salt and deuterium Rochelle salt, alkali dihydrogen phosphate such as potassium dihydrogen phosphate, barium titanium, Examples include oxygen octahedrons such as lead titanate and potassium niobate, guanidines such as guaedine aluminum sulfate, glycines such as triglycine sulfate, and antimony iodine sulfide. Oxygen octahedra, guanidines and glycines are preferably used, and titanium is more preferably used. It is a barium.
未発明で使用される高周波電磁界において磁気的ヒステ
リシス損失を育する強磁性体とは高周波電１界ｔｃｓｐ
″″ｃ＊ｓｔｖ変０′従″該強１性 １体の有する
自発磁化が反転し、その反転により生ずるヒステリシス
損失を熱エネルギーとして外部に出す性質を有するもの
であって、良さえば鉄、二、クル、コバルト等の金属粉
末、鉄−ケイ素合金、鉄−ニッケル合金、鉄−コバルト
合金、鉄−フパルトーニッケル合金、ニッケルーフパル
ト合金、センダスト等の鉄、コバルト又はニッケルを含
む合金、ホイスツー合金等の銅とマンガンを主体とする
合金、ガン賃−酸化鉄等のマグネタイト類、マンガン−
亜鉛フェライト、銅−亜鉛フェライト、銅−マンガンフ
ェライト、ニッケルー亜鉛フェライト、マグネシクムー
亜鉛フェライト、マグネシクムー！ンガンフエライト等
のフェライト類、カーボニル鉄粉、パーマロイ圧粉、イ
ルメナイト、！グネトプランバイト、フェロクス・フレ
ーナー等カアげられる。そして磁気的ヒステリシス損失
系数がＩＭＨｚの高周波電磁界において１０−”以上の
ものが好ましく、とシぐにガンマ−酸化鉄が好適に使用
される。What is a ferromagnetic material that develops magnetic hysteresis loss in a high-frequency electromagnetic field used in an uninvented manner?High-frequency electric field TCSP
""c*stv change 0'follow" this strong 1 property It has the property of reversing the spontaneous magnetization of one body and emitting the hysteresis loss caused by the reversal to the outside as thermal energy. , metal powders such as copper, cobalt, iron-silicon alloys, iron-nickel alloys, iron-cobalt alloys, iron-fuparto-nickel alloys, nickel-fuparto alloys, alloys containing iron, cobalt or nickel such as sendust, whistling Alloys mainly composed of copper and manganese, etc. - Magnetites such as iron oxide, manganese -
Zinc ferrite, copper-zinc ferrite, copper-manganese ferrite, nickel-zinc ferrite, magnesikumu zinc ferrite, magnesikumu! Ferrites such as nganferrite, carbonyl iron powder, permalloy powder, ilmenite,! Gnetoplanbite, Ferox Fleenor, etc. are included. Preferably, the magnetic hysteresis loss coefficient is 10-'' or more in a high-frequency electromagnetic field of IMHz, and gamma-iron oxide is preferably used.
上記強誘電体及び強磁性体の形状、粒径はなんら限定さ
れるものではないが、その形状は粒状、針状、偏平状の
ものが好ましく又その粒径はα０１〜１０μのものが好
ましく、よシ好ましくＦｉＱｏ ５〜２μである。The shape and particle size of the ferroelectric and ferromagnetic substances are not limited in any way, but the shape is preferably granular, acicular, or flat, and the particle size is preferably α01 to 10μ, More preferably, FiQo is 5 to 2μ.
未発明においては上記強誘電体と強磁性体が熱可塑性樹
脂に添加されて高周波加熱接着剤となされるのであり、
その添加量は特に限定されるものではないが、添加量が
少量であると発熱量が少なく熱可塑性樹脂を溶融できな
かったり、できても高周波電磁界の印加時間が長く必要
になり逆に多量であると熱可塑性樹脂の接着力が低下す
るので、熱可塑性樹脂１００重量部に対し５〜３００重
量部添加されるのが好ましく、より好ましくは１ＯＮ１
５０重量部である。又強誘電体と強磁性体の比率は特に
限定されるものではないが、各々の成分が総添加量の１
０重量９６以上であるのが好ましい。In the uninvention, the above-mentioned ferroelectric and ferromagnetic substances are added to a thermoplastic resin to form a high-frequency heating adhesive.
The amount added is not particularly limited, but if the amount added is small, the heat generation value is low and it may not be possible to melt the thermoplastic resin, or even if it is possible, the high frequency electromagnetic field will need to be applied for a long time, and conversely, if the amount added is too small, the thermoplastic resin may not be melted. If so, the adhesive strength of the thermoplastic resin decreases, so it is preferably added in an amount of 5 to 300 parts by weight per 100 parts by weight of the thermoplastic resin, more preferably 1ON1.
It is 50 parts by weight. The ratio of ferroelectric material to ferromagnetic material is not particularly limited, but each component accounts for 1% of the total amount added.
0 weight is preferably 96 or more.
未発明の高周波加熱接着剤は、前記熱可塑性樹脂忙前記
強誘電体及び強磁性体が添加されたものであるが、その
形状はシート状、棒状、粒状等使用する際に好適に使用
できるよう任意の形状でよく、又その成形方法も押出成
形、カレングー成形、プレス成形、インジェクション成
形、キャスティング成形等公知の任意の成形方法が採用
されてよい。The uninvented high-frequency heating adhesive is made of the thermoplastic resin to which the ferroelectric and ferromagnetic substances are added, and its shape is such that it can be used suitably in the form of a sheet, rod, or granule. Any shape may be used, and any known molding method such as extrusion molding, calender molding, press molding, injection molding, or casting molding may be employed.
未発明の高周波加熱接着剤はヒ述の如く熱可塑性樹脂に
高周波電磁界において誘電的ヒステリシス損失を有する
強誘電体と高周波電磁界において磁気的ヒステリシス損
失を有する強磁性体が添加されたものであるから、常温
においては固形であり、加熱すると溶融する性質を有し
ており、上記強誘電体は高周波電磁界忙おいて誘電的ヒ
ステリシス損失を有し、又と配装磁性体は高周波電磁界
におｈて磁気的とステリシスを有しているので、高周波
電磁界が印加されるとそれぞれ多量の熱をすみやかに発
生するので高周波接着用の接着剤として好適に使用でき
る。As mentioned above, the uninvented high-frequency heating adhesive is made by adding a ferroelectric material that has a dielectric hysteresis loss in a high-frequency electromagnetic field and a ferromagnetic material that has a magnetic hysteresis loss in a high-frequency electromagnetic field to a thermoplastic resin. Therefore, it is solid at room temperature and melts when heated, and the ferroelectric material has dielectric hysteresis loss when exposed to high frequency electromagnetic fields. Since it has magnetic steresis, it quickly generates a large amount of heat when a high frequency electromagnetic field is applied, so it can be suitably used as an adhesive for high frequency bonding.
従って未発明の高周波加熱接着剤をフィルム状、棒状等
の形状に成形しておき被着体間にはさんで高周波電磁界
を印加することにより容易かつ短時間で溶融接着するこ
とができる。Therefore, by forming an uninvented high-frequency heating adhesive into a film shape, rod shape, or the like, sandwiching it between adherends, and applying a high-frequency electromagnetic field, it is possible to melt and bond them easily and in a short time.
又未発明の高周波加熱接着剤は発熱量が大なので従来高
周波接着に使用されていたポリ塩化ビニル、ナイロン、
ゴム等の樹脂に限定されず、より広範囲の熱可塑性樹脂
が使用可能である。Furthermore, since the uninvented high-frequency heating adhesive generates a large amount of heat, it is difficult to use polyvinyl chloride, nylon,
It is not limited to resins such as rubber, and a wider range of thermoplastic resins can be used.
ざら忙高周波で加熱するのであるから外部加熱のできな
い厚材、凹凸部分、複雑形状部分においても容易に接着
することができ高速大量加工処理にも適してｈるのであ
る。Since heating is performed using high frequency waves, it is possible to easily bond thick materials, uneven parts, and parts with complex shapes that cannot be heated externally, making it suitable for high-speed mass processing.
次に未発明の実施例を説明する。なお単に「部」とある
のけ「重量部」を意味する。Next, an uninvented embodiment will be described. Note that "parts" simply means "parts by weight."
実施例１．２ 比較例１．２
エチレン−酢酸ビニル共重合体（酢酸ビニル成分１０％
、東洋曹達社製、商品名クルトラセン５４１）、アタッ
クチックポリプロピレン（千葉ファインクミカル社製、
商品名ビスタック）、ガンマ酸化鉄（針状、短径α０５
ψ１′μ、長径Ｑ７μ）、チタン酸バリウム（富
士チタン社製、商品名高純度チタン酸バリウム）を第１
表に示す所定量均一に混合し、得られた混合物を９８℃
（実施例２では１１０℃）のミキシングロールで混練し
て厚さ約１ｓｗのシートを得た。Example 1.2 Comparative Example 1.2 Ethylene-vinyl acetate copolymer (vinyl acetate component 10%
, manufactured by Toyo Soda Co., Ltd., product name Kultracene 541), Attack Tic Polypropylene (manufactured by Chiba Fine Chemical Co., Ltd.,
Product name: Vistac), gamma iron oxide (needle-like, short diameter α05
ψ1'μ, major axis Q7μ), barium titanate (manufactured by Fuji Titanium Co., Ltd., trade name: high-purity barium titanate) was used as the first
Mix the predetermined amounts shown in the table uniformly, and heat the resulting mixture at 98°C.
The mixture was kneaded with a mixing roll (110° C. in Example 2) to obtain a sheet with a thickness of about 1 sw.
得られたシートをプレス成型機で温度１６０℃、圧力２
００ Ｋｆ／ａｄの条件でプレスし厚さＱ、６■の板状
体を得た。得られた板状体を厚さ約２鑓のベニヤ合板に
はさみ、ＩＱ／ｃｄの圧力で加圧した状態で、高周波ク
エルダ−（精電舎電子社製、商品名ＫＶ３０００ＴＡ）
で周波数４０．６８ＭＨｚ、出力ＩＫＷの高周波を５秒
間印加し高周波接着した後、剪断接着力を測定し結果を
第１表に示した。The obtained sheet was molded using a press molding machine at a temperature of 160°C and a pressure of 2
Pressing was carried out under the conditions of 0.00 Kf/ad to obtain a plate-shaped body having a thickness of Q and 6 mm. The obtained plate-like body was sandwiched between plywood sheets about 2 inches thick, and while pressurized at a pressure of IQ/cd, a high-frequency cuelder (manufactured by Seidensha Electronics Co., Ltd., product name KV3000TA) was applied.
A high frequency wave with a frequency of 40.68 MHz and an output of IKW was applied for 5 seconds to achieve high frequency bonding, and then the shear adhesive strength was measured and the results are shown in Table 1.
第１表Table 1
Claims (1)
テリシス損失を有する強誘電体と高周波電磁界において
磁気的ヒステリシス損失を有する強磁性体が添加された
ことを特徴とする高周波加熱接着剤。 ２、強誘電体がチタン酸バリウムである特許請求の範囲
第１項記載の高周波加熱接着剤。 ３、強磁性体がガンマ酸化鉄である特許請求の範囲第１
項記載の高周波加熱接着剤。[Scope of Claims] 1. A high frequency product characterized in that a ferroelectric material having a dielectric hysteresis loss in a high frequency electromagnetic field and a ferromagnetic material having a magnetic hysteresis loss in a high frequency electromagnetic field are added to a thermoplastic resin. heating adhesive. 2. The high-frequency heating adhesive according to claim 1, wherein the ferroelectric material is barium titanate. 3. Claim 1 in which the ferromagnetic material is gamma iron oxide
High-frequency heating adhesive described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP846786A JPS61171783A (en) | 1986-01-17 | 1986-01-17 | High-frequency heating adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP846786A JPS61171783A (en) | 1986-01-17 | 1986-01-17 | High-frequency heating adhesive |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7114178A Division JPS54161645A (en) | 1978-06-12 | 1978-06-12 | High-frequency heating adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61171783A true JPS61171783A (en) | 1986-08-02 |
| JPH0125518B2 JPH0125518B2 (en) | 1989-05-18 |
Family
ID=11693931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP846786A Granted JPS61171783A (en) | 1986-01-17 | 1986-01-17 | High-frequency heating adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61171783A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6462166A (en) * | 1987-08-31 | 1989-03-08 | Nippon Zeon Co | Vinyl chloride resin paste composition for medical use |
| EP0355423A2 (en) * | 1988-07-22 | 1990-02-28 | Heller, William C., Jr. | Integrated multiple particle agent for inductive heating and method of inductive heating therewith |
| US5254824A (en) * | 1989-04-07 | 1993-10-19 | Minnesota Mining And Manufacturing Company | Method and article for microwave bonding of polyethylene pipe |
| WO2009119885A1 (en) * | 2008-03-27 | 2009-10-01 | リンテック株式会社 | Adhesive composition, adhesive sheet, and adhesive molded product |
| WO2011030876A1 (en) * | 2009-09-14 | 2011-03-17 | リンテック株式会社 | Adhesive composition and adhesive sheet for slide rail, and method for fixing slide rail |
| CN106893547A (en) * | 2017-01-13 | 2017-06-27 | 山东凯恩新材料科技有限公司 | A kind of magnetic conductivity polyamide hot and preparation method thereof |
| WO2018147352A1 (en) * | 2017-02-09 | 2018-08-16 | リンテック株式会社 | Dielectric heating adhesive film and adhesion method using dielectric heating adhesive film |
| CN109890923A (en) * | 2016-10-27 | 2019-06-14 | 琳得科株式会社 | Dielectric heating adhesive film and the adhering method for having used dielectric heating adhesive film |
-
1986
- 1986-01-17 JP JP846786A patent/JPS61171783A/en active Granted
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6462166A (en) * | 1987-08-31 | 1989-03-08 | Nippon Zeon Co | Vinyl chloride resin paste composition for medical use |
| EP0355423A2 (en) * | 1988-07-22 | 1990-02-28 | Heller, William C., Jr. | Integrated multiple particle agent for inductive heating and method of inductive heating therewith |
| EP0355423A3 (en) * | 1988-07-22 | 1992-06-17 | Heller, William C., Jr. | Integrated multiple particle agent for inductive heating and method of inductive heating therewith |
| US5254824A (en) * | 1989-04-07 | 1993-10-19 | Minnesota Mining And Manufacturing Company | Method and article for microwave bonding of polyethylene pipe |
| WO2009119885A1 (en) * | 2008-03-27 | 2009-10-01 | リンテック株式会社 | Adhesive composition, adhesive sheet, and adhesive molded product |
| JP2011057915A (en) * | 2009-09-14 | 2011-03-24 | Lintec Corp | Adhesive composition for slide rail, adhesive sheet, and method for fixing slide rail |
| US9376601B2 (en) | 2009-09-14 | 2016-06-28 | Lintec Corporation | Adhesive composition and adhesive sheet for slide rail, and method for fixing slide rail |
| WO2011030876A1 (en) * | 2009-09-14 | 2011-03-17 | リンテック株式会社 | Adhesive composition and adhesive sheet for slide rail, and method for fixing slide rail |
| CN109890923B (en) * | 2016-10-27 | 2022-05-17 | 琳得科株式会社 | Dielectric heating adhesive film and adhesive method using dielectric heating adhesive film |
| US11673340B2 (en) | 2016-10-27 | 2023-06-13 | Lintec Corporation | Dielectric-heating bonding film and bonding method using dielectric-heating bonding film |
| CN109890923A (en) * | 2016-10-27 | 2019-06-14 | 琳得科株式会社 | Dielectric heating adhesive film and the adhering method for having used dielectric heating adhesive film |
| JPWO2018079356A1 (en) * | 2016-10-27 | 2019-09-12 | リンテック株式会社 | Dielectric heating adhesive film and bonding method using dielectric heating adhesive film |
| JPWO2018079355A1 (en) * | 2016-10-27 | 2019-09-12 | リンテック株式会社 | Dielectric heating adhesive film and bonding method using dielectric heating adhesive film |
| US11541607B2 (en) | 2016-10-27 | 2023-01-03 | Lintec Corporation | Dielectric-heating bonding film and bonding method using dielectric-heating bonding film |
| CN106893547A (en) * | 2017-01-13 | 2017-06-27 | 山东凯恩新材料科技有限公司 | A kind of magnetic conductivity polyamide hot and preparation method thereof |
| WO2018147351A1 (en) * | 2017-02-09 | 2018-08-16 | リンテック株式会社 | Dielectric heating adhesive film and adhesion method using dielectric heating adhesive film |
| JPWO2018147352A1 (en) * | 2017-02-09 | 2019-11-07 | リンテック株式会社 | Dielectric heating adhesive film and bonding method using dielectric heating adhesive film |
| JPWO2018147351A1 (en) * | 2017-02-09 | 2019-11-07 | リンテック株式会社 | Dielectric heating adhesive film and bonding method using dielectric heating adhesive film |
| CN110300782A (en) * | 2017-02-09 | 2019-10-01 | 琳得科株式会社 | Dielectric heating adhesive film and the adhering method for having used dielectric heating adhesive film |
| CN110291166A (en) * | 2017-02-09 | 2019-09-27 | 琳得科株式会社 | Dielectric heating adhesive film and the adhering method for having used dielectric heating adhesive film |
| WO2018147352A1 (en) * | 2017-02-09 | 2018-08-16 | リンテック株式会社 | Dielectric heating adhesive film and adhesion method using dielectric heating adhesive film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0125518B2 (en) | 1989-05-18 |
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