JPS61170031A - Wafer paralleling device - Google Patents
Wafer paralleling deviceInfo
- Publication number
- JPS61170031A JPS61170031A JP60009891A JP989185A JPS61170031A JP S61170031 A JPS61170031 A JP S61170031A JP 60009891 A JP60009891 A JP 60009891A JP 989185 A JP989185 A JP 989185A JP S61170031 A JPS61170031 A JP S61170031A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holding table
- contact
- holder
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 abstract description 61
- 238000000034 method Methods 0.000 abstract description 4
- 238000006073 displacement reaction Methods 0.000 abstract description 2
- 230000000717 retained effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の利用分野］
本発明は、露光装置などの半導体製造装置におけるウェ
ハステージ上のウェハを基準面に対して平行出しする装
置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to an apparatus for aligning a wafer on a wafer stage parallel to a reference plane in a semiconductor manufacturing apparatus such as an exposure apparatus.
〔従来技術１
従来のウェハステージ上でのウェハの平行出しは、基準
面に対してウェハ上面を押し当てることにより行なって
いた。すなわち第３図はこの様子を模式的に示す従来例
の構成図で、マスクホルダ１１が載置されるホルダ取付
台１２の下部に進退可能な基準面部材１０は、その下面
がマスクホルダ１１のマスク載置面と精密に平行になさ
れた基準面となっている。一方、ウェハステージ１５は
その上に球面座支承１３を介してウェハ保持台１４を全
方向傾動可能に備えており、この支承１３はフリクショ
ンにより保持台１４を任意の傾動姿勢に保つものである
。[Prior Art 1] Conventionally, parallel alignment of a wafer on a wafer stage was performed by pressing the top surface of the wafer against a reference surface. That is, FIG. 3 is a configuration diagram of a conventional example that schematically shows this situation, and the reference surface member 10 that can move forward and backward into the lower part of the holder mounting base 12 on which the mask holder 11 is placed has its lower surface aligned with the mask holder 11. This is a reference plane that is precisely parallel to the mask placement surface. On the other hand, the wafer stage 15 is provided with a wafer holding table 14 tiltable in all directions via a spherical seat support 13, and this support 13 maintains the holding table 14 in an arbitrary tilted posture by friction.
この従来の装置では、ウェハステージ１５の下降状態に
おいて基準面部材１０がホルダ１１の直下に進入し、次
いでウェハＷを保持台１４の上面に装着したウェハステ
ージ１５が上昇してウェハＷの上面周縁部を基準面部材
１０の下面、すなわち基準面に押し当て、これによって
球面座支承１３のフリクションに抗してウェハ保持台１
４をウェハＷの上面が基準面に合致するような姿勢にし
、その後、ウェハステージ１５の下降と基準面部材１０
の退避との後に、ウェハステージ１５を再び上界させて
ウェハＷをマスクＭに所定間隙距離まで近接させ、露光
行程に入るものである。In this conventional apparatus, when the wafer stage 15 is in a lowered state, the reference surface member 10 enters directly under the holder 11, and then the wafer stage 15 with the wafer W mounted on the upper surface of the holding table 14 ascends to form a rim around the upper surface of the wafer W. is pressed against the lower surface of the reference surface member 10, that is, the reference surface, and thereby the wafer holder 1 is pressed against the friction of the spherical seat support 13.
4 in a posture such that the upper surface of the wafer W matches the reference surface, and then the wafer stage 15 is lowered and the reference surface member 10 is lowered.
After the evacuation, the wafer stage 15 is raised again to bring the wafer W close to the mask M to a predetermined gap distance, and the exposure process begins.
しかしながらこのような従来のウェハ平行出しの方式で
は、基準面部材１０の基準面自体の平行精度が問題にな
るだけでなく、基準面に対するウェハＷの押し当て時の
荷重による基準面部材１ｏやウェハ保持台１４のたわみ
等が誤差要因となり、精密なパターン転写の解像度を低
下させる原因となっており、ざらにウェハ上面に接触に
よる損傷を生じることも多かった。However, in such a conventional wafer parallelization method, not only the parallelism accuracy of the reference surface of the reference surface member 10 itself is a problem, but also the reference surface member 1o and the wafer due to the load when the wafer W is pressed against the reference surface. Deflection of the holding table 14 is a cause of errors and causes a reduction in the resolution of precise pattern transfer, and often causes damage to the upper surface of the wafer due to rough contact.
〔発明の目的と概要］
本発明は前述の従来技術の諸問題点を解決して、ウェハ
表面に対して非接触で、歪による影響なしに高精度の平
行出しを行なうことのできるウェハ平行出し装置を提供
しようとするものである。[Objective and Summary of the Invention] The present invention solves the problems of the prior art described above, and provides a wafer parallelization that can perform highly accurate parallelization without contacting the wafer surface and without being affected by distortion. The aim is to provide equipment.
すなわち前述の目的を達成するために本発明のウェハ平
行出し装置は、上面側にウェハ装着部を有し下面側の中
心部にて球面座支承を介してウェハステージ上に全方向
傾動可能に支持されたウェハ保持台に加えて、このウェ
ハ保持台を周方向に例えば９０”の角度間隔で隔った二
位置にて上下方向に強制駆動してウェハの平行出しのた
めの微小傾動を行なう微小量駆動手段をウェハステージ
に設けてなるものであり、これにより従来のような基準
面部材にウェハ上面を押し当てることなく、既知の非接
触距離測定手段によるウェハ上面の各点レベルの測定デ
ータによる微小山駆動手段の制御を可能とし、ウェハ上
面に非接触で高精度の平行出しを果し得るようにしたも
のである。That is, in order to achieve the above-mentioned object, the wafer parallelization apparatus of the present invention has a wafer mounting part on the upper surface side, and is supported so as to be tiltable in all directions on a wafer stage via a spherical seat support at the center of the lower surface side. In addition to the wafer holder, the wafer holder is forcibly driven vertically at two positions separated by an angular interval of, for example, 90 inches in the circumferential direction to perform minute tilting for parallelizing the wafer. The wafer stage is equipped with a distance driving means, which allows the measurement data to be measured at each point level on the wafer top surface using known non-contact distance measuring means, without pressing the top surface of the wafer against a reference surface member like in the past. This makes it possible to control the minute mountain driving means and achieve highly accurate parallel alignment without contacting the upper surface of the wafer.
本発明の好ましい実施態様によれば、球面座支承は少な
くとも微小量駆動手段の作動中にエアー ′ベアリン
グをその支承面間に形成する構造を有しており、これに
よって支承面間の７リクシヨンに基づくスティックスリ
ップを除去し、より高精度の平行出しを達成可能である
。According to a preferred embodiment of the invention, the spherical seat bearing has a structure that forms an air bearing between its bearing surfaces at least during operation of the micro-drive means, so that the It is possible to eliminate stick-slip and achieve more accurate parallel alignment.
また前記球面座支承の支承面の一方または双方をセラミ
ックス材料で形成することは好ましいことである。Further, it is preferable that one or both of the bearing surfaces of the spherical seat bearing are formed of a ceramic material.
本発明における微小量駆動手段としては、周知の送りネ
ジ装置をはじめ、ピエゾ圧電素子や流体圧作動装置など
、各種のリニアアクチュエータを用いることができ、そ
の駆動制御に用いるウェハ表面レベルの検知情報は、エ
アマイクロメータやレーザ干渉計など、独立した計測手
段または露光装置等の装置本体に備わっている計測手段
から与えればよい。In the present invention, various linear actuators such as a well-known feed screw device, a piezoelectric element, and a fluid pressure actuator can be used as the minute amount driving means, and the detection information at the wafer surface level used for drive control can be used. , an independent measuring means such as an air micrometer or a laser interferometer, or a measuring means provided in the main body of the apparatus such as an exposure apparatus.
［実施例］ 第１図および第２図に本発明の実施例を示す。[Example] Embodiments of the present invention are shown in FIGS. 1 and 2. FIG.
第１図において、マスクホルダ１を載置したホルダ取付
台２の下方でマスク直下に対面されているウェハＷは、
ウェハステージ５上に球面座支承３によりその下面中心
部で全方向傾動可能に支持されたウェハ保持台４の上面
装着部に保持されている。ウェハステージ５にはまた９
０°の角度間隔で隔った二位置においてウェハ保持台４
０周縁近くを下面から押し上げ可能に一対の微小量駆動
装置６ａ、 ６ｂが設けられ、各駆動装置の当接位置の
各々の支承３の中心に関する対称位置にはバイアス用の
スプリング７ａ、 ７ｂが配設されている。In FIG. 1, the wafer W facing directly below the mask is below the holder mounting base 2 on which the mask holder 1 is placed.
The wafer holder 4 is supported on the wafer stage 5 by a spherical seat support 3 at the center of its lower surface so as to be tiltable in all directions. There is also 9 on wafer stage 5.
The wafer holding table 4 is placed at two positions separated by an angular interval of 0°.
A pair of minute drive devices 6a and 6b are provided to be able to push up the vicinity of the 0 periphery from the bottom surface, and bias springs 7a and 7b are arranged at symmetrical positions with respect to the center of each support 3 at the abutting position of each drive device. It is set up.
このように本発明に従って構成されたウェハ保持台４は
、駆動装ｆｉ６ａ、 ６ｂの上下変位に応じて任意の方
向および傾き角での傾動姿勢をとることができ、従って
ウェハＷの上面の複数の点でのレベル検出を例えばエア
ーマイクロメータなどの非接触測定手段によって行なっ
てウェハ上面の傾きの情報を検出し、これを補正するよ
うに駆動装置６ａ。The wafer holding table 4 constructed in accordance with the present invention can assume a tilting posture in any direction and at an arbitrary tilt angle according to the vertical displacement of the driving devices fi6a, 6b, and therefore can hold a plurality of positions on the upper surface of the wafer W. The driving device 6a detects the level at a point using a non-contact measurement means such as an air micrometer, detects information on the tilt of the upper surface of the wafer, and corrects this information.
６ｂを制御して、平行姿勢にロックすることにより、非
接触での高精度のウェハ平行出しが果せるものである。By controlling the wafer 6b and locking it in the parallel position, highly accurate parallel alignment of the wafer can be achieved in a non-contact manner.
この場合、駆動装置６ａ、 ６ｂの動作中に球面座支承
の支承面間隙に加圧エアーを導入してこれをエアーベア
リングにすることにより、スティックスリップのない円
滑な傾動動作が行なえ、極微小傾角の調整が容易にでき
るようになるので極めて精密な平行出しが可能となるも
のである。In this case, by introducing pressurized air into the gap between the bearing surfaces of the spherical seat bearings during the operation of the drive devices 6a and 6b and using this as an air bearing, smooth tilting operation without stick-slip can be performed, and extremely small tilting angles can be achieved. Since the adjustment can be easily performed, extremely precise parallel alignment is possible.
［発明の効果］
以上に述べたように、本発明によれば、ウエハ上面の平
行度の補正を機械的な接触を伴う圧接方式によらずにウ
ェハ保持台の下面側での傾動操作により行なうので、ウ
ェハには全く非接触で精密な平行出しが行なえ、各部の
歪みによる誤差も発生せず、従って露光装置に用いて集
積度の高い微細パターンの転写解像度を向上し、ウェハ
の歩留りを向上することが可能である。[Effects of the Invention] As described above, according to the present invention, the parallelism of the upper surface of the wafer is corrected by a tilting operation on the lower surface side of the wafer holding table, without using a pressure contact method that involves mechanical contact. Therefore, precise parallel alignment can be performed without any contact with the wafer, and no errors occur due to distortion of each part. Therefore, it can be used in exposure equipment to improve the transfer resolution of highly integrated fine patterns and improve the yield of wafers. It is possible to do so.
第１図は本発明の実施例を示す縦断面図、第２図はウェ
ハ保持台の平面図、第３図は従来例を模式的に示す縦断
面構成図である。
Ｗ：ウェハ、３：球面座支承、４：ウェハ保持。
台、５：ウェハステージ、６ａ、６ｂ：微小量駆動装置
、７ａ、 ７ｂ：バイアススプリング。FIG. 1 is a vertical sectional view showing an embodiment of the present invention, FIG. 2 is a plan view of a wafer holding table, and FIG. 3 is a vertical sectional configuration diagram schematically showing a conventional example. W: Wafer, 3: Spherical seat support, 4: Wafer holding. Table, 5: Wafer stage, 6a, 6b: Microscopic drive device, 7a, 7b: Bias spring.
Claims (1)
面座支承を介してウェハステージ上に全方向傾動可能に
支持されたウェハ保持台と、ウェハステージに設けられ
、ウェハ保持台を周方向に隔つた二位置にて上下方向に
強制駆動して平行出しのための微小傾動を行なう微小量
駆動手段とを備えたことを特徴とするウェハ平行出し装
置。 ２、球面座支承がその支承面間にエアーベアリングを形
成している特許請求の範囲第１項に記載のウェハ平行出
し装置。 ３、微小量駆動手段がウェハ保持台の周方向に９０°隔
つた二位置を上下駆動する特許請求の範囲第１項に記載
のウェハ平行出し装置。[Scope of Claims] 1. A wafer holder having a wafer mounting portion on the upper surface side and supported on the wafer stage so as to be tiltable in all directions via a spherical seat support at the center of the lower surface side; 1. A wafer paralleling device, comprising: minute amount driving means for forcibly driving a wafer holding table vertically at two circumferentially separated positions to perform minute tilting for parallelizing the wafer. 2. The wafer paralleling device according to claim 1, wherein the spherical seat support forms an air bearing between its bearing surfaces. 3. The wafer paralleling device according to claim 1, wherein the minute amount driving means vertically drives two positions separated by 90 degrees in the circumferential direction of the wafer holding table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60009891A JPS61170031A (en) | 1985-01-24 | 1985-01-24 | Wafer paralleling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60009891A JPS61170031A (en) | 1985-01-24 | 1985-01-24 | Wafer paralleling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61170031A true JPS61170031A (en) | 1986-07-31 |
Family
ID=11732754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60009891A Pending JPS61170031A (en) | 1985-01-24 | 1985-01-24 | Wafer paralleling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61170031A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270486A (en) * | 2001-03-09 | 2002-09-20 | Orc Mfg Co Ltd | Substrate exposure apparatus and method of using the same |
-
1985
- 1985-01-24 JP JP60009891A patent/JPS61170031A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270486A (en) * | 2001-03-09 | 2002-09-20 | Orc Mfg Co Ltd | Substrate exposure apparatus and method of using the same |
| JP4594541B2 (en) * | 2001-03-09 | 2010-12-08 | 株式会社オーク製作所 | Substrate exposure apparatus and method of using the same |
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