JPS61164234A - Die-bonding device - Google Patents

Die-bonding device

Info

Publication number
JPS61164234A
JPS61164234A JP502285A JP502285A JPS61164234A JP S61164234 A JPS61164234 A JP S61164234A JP 502285 A JP502285 A JP 502285A JP 502285 A JP502285 A JP 502285A JP S61164234 A JPS61164234 A JP S61164234A
Authority
JP
Japan
Prior art keywords
die
resin
spreading
substrate
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP502285A
Other languages
Japanese (ja)
Inventor
Takao Kazama
風間　孝雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP502285A priority Critical patent/JPS61164234A/en
Publication of JPS61164234A publication Critical patent/JPS61164234A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To uniformalize resinous volume between die substrates and to obtain level and favorable die-bonding property by a method wherein a spreading resin unit is provided between a vomitting resin unit and a die-bonding unit. CONSTITUTION:A stamp 10 for spreading, which has the same form as a die 6 bonding area (e.g. 3mmX4mm) and is made of Teflon, is furnished to a tip of a spring member's cantilever as a component of a spreading resin unit 9 and a resin 4 is to pressed down to the substrate 5 by means that the stamp 10 for spreading is cooperated by moving up and down the another edge of cantilever. Another edge of cantilever is driven by a cam device synchronized to sequence of a die-bonding device, and as the result, the stamp for spreading 10 is moved vertically synchronizing to the substrate 5 transferred.

Description

【発明の詳細な説明】 （産業上の利用分野） この発明は、半導体のダイボンディング装置、特に樹脂
に、Ｌリダイを基板−Ｌにボンディングするダイボッデ
ィング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a semiconductor die bonding device, and particularly to a die bonding device for bonding an L re-die to a substrate-L to resin.

（従来の技術） ウェハー＝から切り出されたダイを基板（リードフレー
１、など）に搭載するダイボンディング工程は、電子月
利別冊「超ＬＳＩ製造・試験装置ガイドブックＪ　　（
１９８３）Ｐｉ５８−１．６０に示されるように、ダイ
と基板の接合方式から、（ｉ）Ａｕ−８ｉ共共晶台、（
ｉｉｌ　Ａ　ｇペースト接合、（ｉｉｉｌｉポキシ樹脂
接合などに分けられ、（ｉｉｉ）のエポキシ樹脂接合は
信頼性をあまり必要と（７ないＩＣでは、安価という点
から採用される場合が多い。(Prior art) The die bonding process, in which a die cut out from a wafer is mounted on a substrate (lead frame 1, etc.), is described in the electronic Monthly Special Edition "Ultra LSI Manufacturing and Testing Equipment Guidebook J (
1983) Pi58-1.60, from the bonding method of die and substrate, (i) Au-8i eutectic stand, (
It is divided into (iii) paste bonding, (iii) poxy resin bonding, etc., and (iii) epoxy resin bonding is often used in ICs that do not require much reliability due to its low cost.

従来のエポキシ樹脂を用いｔこダイボンデイン装置を第
２図に示す。この装置は、樹脂吐出部１と、ダイボンデ
ィング部２とからなり、樹脂吐出部１では、搬送路７上
の基板５上にエポキシ樹脂４を塗布するためにディスペ
ンサー３が備わっている。A conventional die bonding device using epoxy resin is shown in FIG. This device consists of a resin discharge section 1 and a die bonding section 2. The resin discharge section 1 is equipped with a dispenser 3 for applying epoxy resin 4 onto a substrate 5 on a conveyance path 7.

ダイボンディング部２では、樹脂吐出部１によりエポキ
シ樹脂４が塗布された基板５が搬送され、その上に、ボ
ンディング・＼ラド８によりダイ６が押し付けられ、結
合する。In the die bonding section 2, a substrate 5 coated with an epoxy resin 4 is conveyed by the resin discharging section 1, and a die 6 is pressed onto it by a bonding pad 8 to bond it.

（発明が解決しようとする問題点） しかしながら、上記の構成の装置では、ダイ６にダメー
ジを１ｊえないようにするため、ダイ６を上方から基板
５に押し付けるコレラ１−にはあまり大きな力を加えら
れなかった。したがって、エポキシ樹脂４は、ダイ６と
基板５の間に均一に拡がらず、第３図のようにダイ６が
傾いてボンディングされ、次工程のワイヤーボンディン
グ時にワイヤーボンドできないという不良を出す原因と
なっていた。□ （問題点を解決するための手段） そこで、この発明では、樹脂使用のダイボンディング装
置において、樹脂吐出部とダイボンディング部の間に、
樹脂を平坦化するため、樹脂を拡げる手段を設ける。(Problems to be Solved by the Invention) However, in the device having the above configuration, in order to prevent damage to the die 6, too much force is not applied to the cholera 1- that presses the die 6 against the substrate 5 from above. Could not be added. Therefore, the epoxy resin 4 does not spread uniformly between the die 6 and the substrate 5, causing the die 6 to be bonded at an angle as shown in FIG. It had become. □ (Means for solving the problem) Therefore, in the present invention, in a die bonding device using resin, between the resin discharge part and the die bonding part,
In order to flatten the resin, a means for spreading the resin is provided.

（作　用） このようにすると、ダイと基板間の樹Ｈｈの量は均一化
され、ダイは、傾くことなく、基板上に良好にボノケイ
ノグさｔする。(Function) In this way, the amount of wood Hh between the die and the substrate is made uniform, and the die is placed well on the substrate without tilting.

（実施例） 第１図はこの発明の一実施例を示す図である３゜この発
明の一実施例においては、樹１指１１１出部１とダイボ
ンディング部２が設けらオ］、さらにこオ］ら（θ・１
脂吐出部１とダイン１ミンディング部２の間に樹脂拡げ
部９が設（Ｊら〕Ｉる。樹脂吐出部１とダイボンディン
グ部２の詳細は第２図の従来と同一であり、同一部分に
第２図と同一符号を付してその説明は省略する１、４ｆ
ｊ４脂拡げ部９には、ダイ６の接合１ｒＪｉ積（例えば
３ｍｍ　Ｘ　４　ｍｍ　ｌと同一・の形状を持つテフロ
ン製のＪ）にげ用スタンプＩＯが、図示しないバネ材の
片持梁の先端に取イ・］けて設けられており、片持梁の
他端が上下に動作することにより拡げ用スタン−／１０
が連動して樹脂４を基板５に押し付ける、ｌうになって
いる。なお、片持梁の他端は、ダイス；Ｉ！ノデイング
装置のシーケンスに同期したカム装置に、Ｊ・２で駆動
さ第１、その結果として拡げ用ス、り：、／　−、＋　
＋　０１Ｊ、１１４＞送さ第１る基板５１ｃ同期して北
上する。(Embodiment) FIG. 1 is a diagram showing an embodiment of the present invention. In an embodiment of the present invention, a tree 1 finger 111 protruding portion 1 and a die bonding portion 2 are provided. O] et al (θ・1
A resin expanding section 9 is provided between the fat discharging section 1 and the die bonding section 2.The details of the resin discharging section 1 and the die bonding section 2 are the same as the conventional one shown in FIG. Parts 1 and 4f are given the same reference numerals as in Figure 2 and their explanations are omitted.
In the j4 fat expansion part 9, a stamp IO for bonding the die 6 (for example, a J made of Teflon having the same shape as 3 mm x 4 mm l) is attached to the tip of a cantilever of a spring material (not shown). The other end of the cantilever beam moves up and down to expand the expansion stand.
The resin 4 is pressed against the substrate 5 in conjunction with each other. Note that the other end of the cantilever is a die; I! A cam device synchronized with the sequence of the noding device is driven by J.
+ 01J, 114> The first board 51c sent goes north in synchronization.

このような一実施例においては、まず、樹脂吐出部１て
ディスペン−ＩＪ−３により基板５上にエポキシ樹脂４
　（例えばＮＰＯ−０１京セラ社製）約１×１０−’ｃ
ｃが塗布される。この状態では、エポキシ樹脂４は、粘
性と表面張力のためドーム形に盛り上っている。樹脂吐
出部１で樹脂４が塗布された基板５は、搬送略７上を樹
脂拡げ部９にはこばれる。ここにおいて、樹脂４は、搬
送される基板５に同期して上下する拡げ用スタンプ１０
によって基板５上に押し付けられ、拡がり、ダイ６の接
合形状と同一の平坦な樹脂４′となる。この時、拡げ用
スタンプ１０はテフロン製なので、樹脂４との親和力が
弱く、押しつけ離脱時に、糸引きによる盛上りは生じな
い。更に押し拡げられた樹脂４′の付いた基板５は搬送
され、ダイボンディング部２でボンディングｌ＼ツド８
によりダイ６が樹脂４′に押し付けられ、ダイ６が樹脂
４′により接合される。ここにおいて、エポキシ樹脂４
′はすでにダイ６の形状と同一にかつ平坦に拡げられて
いるので、良好なダイボンディング性を得ることができ
る。In such an embodiment, first, the epoxy resin 4 is applied onto the substrate 5 by the resin discharging unit 1 and the dispenser IJ-3.
(For example, NPO-01 manufactured by Kyocera) approximately 1 x 10-'c
c is applied. In this state, the epoxy resin 4 rises up into a dome shape due to its viscosity and surface tension. The substrate 5 coated with the resin 4 in the resin discharging section 1 is spread on the conveyance section 7 to the resin spreading section 9 . Here, the resin 4 is spread by a spreading stamp 10 that moves up and down in synchronization with the substrate 5 being transported.
The resin 4' is pressed onto the substrate 5 and spreads, forming a flat resin 4' having the same shape as the bonding shape of the die 6. At this time, since the expanding stamp 10 is made of Teflon, it has a weak affinity with the resin 4, and when it is pressed and released, no swelling due to stringing occurs. The substrate 5 with the expanded resin 4' is further transported and bonded at the die bonding section 2.
The die 6 is pressed against the resin 4', and the die 6 is joined by the resin 4'. Here, epoxy resin 4
' has already been expanded flat and in the same shape as the die 6, so that good die bonding properties can be obtained.

（発明の効果） 以−１−説明したように、この発明の装置によオ］ば、
樹脂吐出部どダイボンディング部の間に樹脂拡げ部を設
けたので、ダイと基板間の樹脂の量を均一化でき、傾き
のない良好なダイボンディング性を得ることができる。(Effects of the Invention) As explained below-1-, the device of the present invention provides
Since the resin spreading portion is provided between the die bonding portion such as the resin discharge portion, the amount of resin between the die and the substrate can be made uniform, and good die bonding performance without inclination can be obtained.

したがって、次のワイヤーボンディング工程で、１ツイ
ヤ−ボンドできないという不良が発生する乙ともなくな
る。Therefore, in the next wire bonding process, there is no possibility of a defect in which one wire cannot be bonded.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明のダイボンディング装置の一実施例を
示す構成図、第２図は従来の装置を示す構成図、第３図
は従来の装置による問題点を説明するための図である。 １・・樹脂吐出部、２・ダイボンディング部、４．４′
　　エポキシ樹脂、５・・基板、６・・ダイ、９・・・
樹脂拡げ部、１０・・拡げ用スタンプ。FIG. 1 is a block diagram showing an embodiment of the die bonding device of the present invention, FIG. 2 is a block diagram showing a conventional device, and FIG. 3 is a diagram for explaining problems caused by the conventional device. 1.Resin discharge part, 2.Die bonding part, 4.4'
Epoxy resin, 5...Substrate, 6...Die, 9...
Resin expansion part, 10... Stamp for expansion.

Claims (3)

【特許請求の範囲】[Claims] （１）ディスペンサーにより基板上に樹脂を吐出する樹
脂吐出部と、この樹脂吐出部により基板上に吐出された
樹脂を平坦化する樹脂拡げ部と、この樹脂拡げ部により
平坦化された樹脂にダイを押し付けて、ダイを基板に接
合させるダイボンディング部とを具備してなるダイボン
ディング装置。(1) A resin discharge part that discharges resin onto the substrate by a dispenser, a resin spreading part that flattens the resin discharged onto the substrate by this resin discharge part, and a die on the flattened resin by this resin spreading part. A die bonding device comprising: a die bonding unit for bonding a die to a substrate by pressing the die to the substrate; （２）樹脂拡げ部は、搬送される基板と同期して上下す
る樹脂拡げ用スタンプを持つことを特徴とする特許請求
の範囲第１項記載のダイボンディング装置。(2) The die bonding apparatus according to claim 1, wherein the resin spreading section has a resin spreading stamp that moves up and down in synchronization with the substrate being transported. （３）樹脂拡げ用スタンプは、ダイ接合形状と同一形状
を持つ樹脂拡げ用スタンプであることを特徴とする特許
請求の範囲第２項記載のダイボディング装置。(3) The die-boarding device according to claim 2, wherein the resin-spreading stamp is a resin-spreading stamp having the same shape as the die bonding shape.
JP502285A 1985-01-17 1985-01-17 Die-bonding device Pending JPS61164234A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP502285A JPS61164234A (en) 1985-01-17 1985-01-17 Die-bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP502285A JPS61164234A (en) 1985-01-17 1985-01-17 Die-bonding device

Publications (1)

Publication Number Publication Date
JPS61164234A true JPS61164234A (en) 1986-07-24

Family

ID=11599880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP502285A Pending JPS61164234A (en) 1985-01-17 1985-01-17 Die-bonding device

Country Status (1)

Country Link
JP (1) JPS61164234A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4942999A (en) * 1987-08-31 1990-07-24 Ngk Insulators, Inc. Metal-ceramic joined composite bodies and joining process therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4942999A (en) * 1987-08-31 1990-07-24 Ngk Insulators, Inc. Metal-ceramic joined composite bodies and joining process therefor

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