JPS61160255A - Circuit base for thermal head - Google Patents

Abstract

PURPOSE:To supply plural picture signal inputs, in parallel manner, to a thermal head, by arranging the conductor on a base to the upper layer or the lower layer of recording current earthing conductor forming region via an insulator layer. CONSTITUTION:A picture signal input conductor Sp is formed on a base by printing method, vapor deposition method, etc. The insulator layer C like the spattering film or the glaze printing film and others of silicon dioxide or the like are formed on its upper layer. Further, the conductor film forming individ ual conductor are each terminal is formed on the upper layer thereof. Herein, a picture input signal Tp1 is connected to the picture signal input conductor Sp through the contact hole H provided to the insulator layer. The thermal head can, in parallel manner, drive plural lines of picture signal by the struc ture like this.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 に高解像虻でかつ印字記録すべき画像信号が複数である
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] There are a plurality of high-resolution image signals to be printed and recorded.

昭５９−１３２３６９号にある如く、サーマルヘッド駆
動用ＩＣを複数個基板上に搭載し、隣接した搭載ＩＣの
間隙の中央部に記録電流を接地するだめの導電体を設け
、この記録電流接地導電体を２分割して、その中央部に
第２の画像信号入力導電体を配し、あるいは記録電流接
地や導電体と搭載ＩＣへ接続すべき、基板上のボンディ
ング端子との間隙に前記第２の画像信号入力導電体を配
する構造となっていた。As described in No. 59-132369, a plurality of thermal head driving ICs are mounted on a substrate, and a conductor for grounding the recording current is provided in the center of the gap between adjacent mounted ICs, and this recording current grounding conductor is provided. The body is divided into two parts, and a second image signal input conductor is arranged in the center, or the second image signal input conductor is placed in the gap between the recording current ground and the bonding terminal on the substrate to be connected to the conductor and the mounted IC. It had a structure in which image signal input conductors were arranged.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来のサーマルヘッドは、隣接した搭載ＩＣ間
の間隙部に記録電流を接地するための導電体と画像信号
を入力すべき導電体との双方が配置されているので、サ
ーマルヘッドの解像匿が高くなって搭載ＩＣ間の距離が
短かくなシ、前記間隙が狭くなると、実際上前記画像信
号入力導電体は前記間隙部内に配置することができなく
なるという欠点がある。例えば、単一のドライバＩＣが
駆動でさる発熱抵抗体本数を６４本とし、このＩＣの横
幅を２龍とし、縦方向の長さを６〜３ｍｍとすると、サ
ーマルヘッドの解像劇が８本／朋と１６本／朋の場合に
は、前記ＩＣは各々８ＩｌＩｍピッチ及び４韻ピツチの
距離で基板上に配置されることになる。ここでＩＣの長
片方向の端部から基板上のボンディング端子までの距離
を実用上適当な０、５　ｍｍとすると、記録電流接地導
電体や画像信号入力４電体を配置すべき、前記間隙幅は
、サーマルヘッドの解像度が各々８本／■と１６本／酩
の場合には各々８−（２＋０．５ｘ２）＝５正と４−（
２＋０．５ｘ２）＝１ｍｍとなる。即ち解像度が２倍に
なると、間隙幅は１１５になる。従って、このような狭
い間隙幅には、事実上、記録電流接地導電体と画像信号
入力導電体との双方を設けることは困難となる。In the conventional thermal head described above, both the conductor for grounding the recording current and the conductor for inputting the image signal are placed in the gap between adjacent mounted ICs, so the resolution of the thermal head is low. If the distance between the mounted ICs becomes high and the gap becomes narrow, there is a drawback that the image signal input conductor cannot actually be placed within the gap. For example, if the number of heating resistors driven by a single driver IC is 64, the width of this IC is 2mm, and the vertical length is 6 to 3mm, the resolution of the thermal head is 8. /I and 16 I/I, the ICs would each be placed on the board at a distance of 8IlIm pitch and 4 rhyme pitch. Here, assuming that the distance from the long end of the IC to the bonding terminal on the substrate is 0.5 mm, which is appropriate for practical use, the above-mentioned gap is where the recording current grounding conductor and the image signal input four electric bodies should be placed. The width is 8-(2+0.5x2)=5 positive and 4-( if the resolution of the thermal head is 8 lines/■ and 16 lines/black, respectively.
2+0.5x2)=1mm. That is, when the resolution is doubled, the gap width becomes 115. Therefore, it is practically difficult to provide both a recording current ground conductor and an image signal input conductor in such a narrow gap width.

板上に搭載された駆動ＩＣの所望とする画像信号入力電
極に接続されるべき基板上の導電体を絶縁体層を介して
、記録電流接地導電体形成領域の上ノーあるいは、下層
に配することによシ、複数の画像信号入力を並列にサー
マルヘッドへ供給するものである。The conductor on the substrate to be connected to the desired image signal input electrode of the drive IC mounted on the board is placed above or below the recording current grounding conductor forming area via an insulating layer. In particular, a plurality of image signal inputs are supplied to the thermal head in parallel.

〔実施例〕〔Example〕

第１図は本発明の一実施例の要部を示す模式的平面図で
あシ、第２図は第１図のＡ−Ａ’部の模式的断面図であ
る。基板上の発熱抵抗体列の一端は共通電極から短冊形
に分岐した導電体に接続される。抵抗体の他端はｍ本毎
に各々個別導電体Ｌ１〜Ｌｍに接続される。個別導電体
Ｌ１〜ＬｍはＩＣへのボンディング端子Ｔ、〜Ｔｍまで
延長して形成される。端子Ｔ１〜Ｔｍは第１図に示すよ
うに、異なるＩＣ毎に、記録電流接地導電体ＰＧ及び端
子ＴＧによって分離配置される。８１〜ＳｋはＩＣを駆
動するだめの信号線である。ここでサーマルヘッド基板
上に搭載されたＩＣはワイヤボンディング法、ＴＡＢ法
等によシ基板上の端子と電気的に接続される。この搭載
・接続された複数個のＩＣにおいて、並列に画像信号を
入力すべき工Ｃには、次に記述する方法によシ画像信号
が供給される。即ち、基板上にはまず、画像信号入力導
電体Ｓｐが、印刷法、蒸着法等で形成され、次にこの上
層へ、二ば化シリコン等のスパッタ膜あるいはグレーズ
印刷膜などの絶縁体ＪＷＩＣが形成される。さらに、個
別４電体及び各端子を形成する導電体膜が、この上ノー
に形成゛される。ここで、画像１ば号入力端子Ｔｐｔは
絶縁体層に設けられたコンタクトホールＨ全通して、画
像信号入力導電体８ｐへ接続される。このような構成に
よってサーマルヘッドは被数本の画像信号を並列に駆動
できるようになる。FIG. 1 is a schematic plan view showing essential parts of an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view taken along the line AA' in FIG. One end of the heating resistor array on the substrate is connected to a conductor branched into a rectangular shape from a common electrode. The other ends of the resistors are connected to individual conductors L1 to Lm every m resistors. Individual conductors L1-Lm are formed extending to bonding terminals T, -Tm to the IC. As shown in FIG. 1, the terminals T1 to Tm are arranged separately for each different IC by a recording current grounding conductor PG and a terminal TG. 81 to Sk are signal lines for driving the IC. Here, the IC mounted on the thermal head substrate is electrically connected to terminals on the substrate by a wire bonding method, a TAB method, or the like. In the plurality of ICs mounted and connected, the image signal is supplied to the circuit C to which the image signal is input in parallel by the method described below. That is, first, an image signal input conductor Sp is formed on the substrate by a printing method, a vapor deposition method, etc., and then an insulator JWIC such as a sputtered film of silicon divanide or a glaze printed film is formed on top of this. It is formed. Further, a conductor film forming the individual four conductors and each terminal is formed on top of this. Here, the image No. 1 input terminal Tpt is connected to the image signal input conductor 8p through the entire contact hole H provided in the insulating layer. With this configuration, the thermal head can drive multiple image signals in parallel.

〔発明の効果〕〔Effect of the invention〕

以上貌明したように、本発明は、画像信号入力導電体を
絶縁体層を介して記録電流接地導電体形成領域を含む面
の下に設けることによシ、サーマルヘッド基板上に搭載
された駆動ＩＣへ並列に画像入力信号を供給し、並列に
入力された画像信号を任意の数量のＩＣ内を直列転送さ
せるものである。As described above, the present invention provides an image signal input conductor mounted on a thermal head substrate by providing an image signal input conductor under a surface including a recording current ground conductor forming area via an insulating layer. Image input signals are supplied in parallel to the drive IC, and the parallel input image signals are serially transferred within an arbitrary number of ICs.

従って、このような構成によれは、解像度が高くなって
隣接した駆動ＩＣの間隙が狭くなっても、本発明のサー
マルヘッドは小型で而も無理なく画像信号入力導電体を
複数本設けることができる効果がある。Therefore, with such a configuration, even if the resolution becomes higher and the gap between adjacent drive ICs becomes narrower, the thermal head of the present invention is small and can easily provide a plurality of image signal input conductors. There is an effect that can be achieved.

また、本実施例では、画像信号入力導電体を、記録電流
接地導電体の下層に設けた例を示したが、記録電流接地
導電体上に絶縁ペースト印刷等によシ絶縁体層を形成し
、さらに上層に、厚膜印刷法等によシ画像信号入力導電
体を形成しても、同様に効果があることは明らかであ夛
、どちらの構成によるかは、サーマルヘッドの構成や導
電体材料。Furthermore, in this embodiment, an example was shown in which the image signal input conductor was provided below the recording current grounding conductor, but an insulating layer may be formed on the recording current grounding conductor by printing an insulating paste or the like. It is clear that forming an image signal input conductor on the upper layer using a thick film printing method will have the same effect, but which structure to use depends on the structure of the thermal head and the conductor. material.

形状、配線等、あるいは、製造プロセスの容易さ。Shape, wiring, etc., or ease of manufacturing process.

低コスト化を考慮して選択すればよい。更にまた、本発
明の画像信号入力導電体や記録電流接地導電体等の形状
は特に限定されるべきものではなく、例えは画像信号入
力導電体は任意の位置から、前記記録電流接地導電体形
成領域を離れて基板端子電極へ接続され得るものである
。It may be selected by considering cost reduction. Furthermore, the shapes of the image signal input conductor, recording current ground conductor, etc. of the present invention are not particularly limited, and for example, the image signal input conductor can be formed from any position. It can be connected to the substrate terminal electrode apart from the area.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の要部を示す模式的平面図で
あり、第２図は、第１図のＡ−Ａ’部の模式的断面図で
ある。 Ｌｌ−Ｌｍ・・・・・・個別導電体、Ｔ１−Ｔｍ・・・
・・・個別導電体ボンディング端子、Ｐａ・−・・・・
記録電流接地専電体、ＴＧ・・・・・・記録電流接地ボ
ンディング端子、ＴＩ）ｔ・・・・・・画像信号入力端
子、Ｔｐ２・・・・・・画像信号出力端子、Ｓ！〜Ｓｋ
・・・・・・信号線、Ｃ・・・・・・絶縁体層、Ｈ・・
・・・・絶縁体層コンタクトホール、Ｓｐ・・・・・・
画像信号入力導電体。FIG. 1 is a schematic plan view showing a main part of an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view taken along the line AA' in FIG. Ll-Lm...Individual conductor, T1-Tm...
...Individual conductor bonding terminal, Pa...
Recording current grounding terminal, TG... Recording current grounding bonding terminal, TI)t... Image signal input terminal, Tp2... Image signal output terminal, S! ~Sk
...Signal line, C...Insulator layer, H...
...Insulator layer contact hole, Sp...
Image signal input conductor.

Claims (1)

【特許請求の範囲】[Claims] サーマルヘッド基板において、該基板上に搭載された駆
動ＩＣの所望とする画像信号入力電極に接続されるべき
基板上の導電体と、絶縁体層を介して記録電流接地導電
体形成領域の上層または下層に配したことを特徴とする
サーマルヘッド用回路基板。In a thermal head substrate, a conductor on the substrate to be connected to a desired image signal input electrode of a drive IC mounted on the substrate and an upper layer or A circuit board for a thermal head characterized by being arranged on the lower layer.