JPS6115773A - Coating apparatus - Google Patents
Coating apparatusInfo
- Publication number
- JPS6115773A JPS6115773A JP13514684A JP13514684A JPS6115773A JP S6115773 A JPS6115773 A JP S6115773A JP 13514684 A JP13514684 A JP 13514684A JP 13514684 A JP13514684 A JP 13514684A JP S6115773 A JPS6115773 A JP S6115773A
- Authority
- JP
- Japan
- Prior art keywords
- coating
- coating nozzle
- coated
- spin chuck
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は溶剤を被塗布物に滴下し、被塗布物を回転させ
て溶剤を回転塗布する塗布装置をこ関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a coating device that drips a solvent onto an object to be coated and rotates the object to apply the solvent by rotation.
従来、塗布方法には第１図に示す静止塗布方法と第２図
番こ示す回転塗布方法が知られている。Conventionally, known coating methods include a static coating method shown in FIG. 1 and a rotational coating method shown in FIG.
第１図に示す静止塗布方法は、まず同図ｆａ）に示すよ
うに、半導体基板などの被塗布物１を吸着保持するスピ
ンチャック２が静止中に塗布ノズル３よりホトレジスト
、８０Ｇなどの溶剤４を滴下し、欠番こ同図（ｂｌに示
すようにスピンチャック２を一定時間低速回転させ、そ
の後スピンチャック２を高速回転させて塗布膜の形成を
行なう。In the stationary coating method shown in FIG. 1, first, as shown in FIG. The spin chuck 2 is rotated at a low speed for a certain period of time as shown in the blank number (bl), and then the spin chuck 2 is rotated at a high speed to form a coating film.
第２図に示す回転塗布方法は、スピンチャック２を低速
回転させながら塗布ノズル３より溶剤４を滴下し、その
後スピンチャック２を高速回転させて塗布膜の形成を行
なう。In the spin coating method shown in FIG. 2, a solvent 4 is dropped from a coating nozzle 3 while rotating a spin chuck 2 at a low speed, and then a coating film is formed by rotating the spin chuck 2 at a high speed.
ところで、最近、半導体の高集積化に伴ない、ホトレジ
スト膜などの膜厚の高精度化が要求されている。しかし
ながら、前記した従来の方法では、膜厚のばらつきが太
きい。特暑こ被塗布物１の中心部で膜厚が厚くなる。前
記２つの方法を比較した場合、回転塗布方法が静止塗布
方法に比べ膜厚のばらつきは小さいが、それでも高精度
化の要求を十分満足させることはできない。Recently, as semiconductors have become more highly integrated, there has been a demand for higher precision in the thickness of photoresist films and the like. However, in the conventional method described above, variations in film thickness are large. The film thickness becomes thicker at the center of the coated object 1 in particularly hot weather. When comparing the above two methods, although the rotational coating method has smaller variations in film thickness than the static coating method, it still cannot fully satisfy the demand for high precision.
本発明の目的は、高精度な塗布膜を得ることができる塗
布装置を提供することにある。An object of the present invention is to provide a coating device that can obtain a highly accurate coating film.
本発明は上記目的を達成するために、被塗布物を回転さ
せながら塗布ノズルより溶剤を被塗布物に滴下して被塗
布物に溶剤を回転塗布する塗布装置において、前記塗布
ノズルを前記被塗布物の半径方向に移動させる塗布ノズ
ル駆動手段と、前記被塗布物の回転に併せて前記塗布ノ
ズル駆動手段による塗布ノズルの速度制御を行なう塗布
ノズル速度制御手段々を備えたことを特徴とする。In order to achieve the above object, the present invention provides a coating apparatus that drips a solvent onto an object to be coated from a coating nozzle while rotating the object to be coated, and rotates the solvent to the object to be coated. The present invention is characterized by comprising a coating nozzle drive means for moving the object in the radial direction, and a coating nozzle speed control means for controlling the speed of the coating nozzle by the coating nozzle drive means in conjunction with the rotation of the object to be coated.
以下、本発明の一実施例を第３図により説明する。半導
体基板などの被塗布？＋１０を吸着保持するスピンチャ
ック１１は、スピンチャック駆動用モータ１２により回
転させられる。スピンチャック１１の上方にはホトレジ
ストなどのイ容剤の滴下を制御する溶剤制御系１３を備
えた塗布ノズル１４が配設され一〇おり、塗布ノズル１
４は塗布ノズル駆動用モータ１５（こよつＣがイド１６
に沿って水平移動できるようＩこ構成されている。塗布
ノズル駆動用モータ１５はスピンチャック駆動用モータ
１２の回転に併せて塗布ノズル速度制御手段１７によっ
て回転が制御される。An embodiment of the present invention will be described below with reference to FIG. Is it being coated on semiconductor substrates, etc.? The spin chuck 11 that attracts and holds +10 is rotated by a spin chuck drive motor 12. A coating nozzle 14 equipped with a solvent control system 13 for controlling the dropping of a coating agent such as photoresist is disposed above the spin chuck 11.
4 is a coating nozzle drive motor 15 (the motor 16 is
It is configured so that it can move horizontally along the The rotation of the coating nozzle drive motor 15 is controlled by the coating nozzle speed control means 17 in conjunction with the rotation of the spin chuck drive motor 12.
次に作用について説明する。スピンチャック１１上に吸
着保持された被塗布物１０は、スピンチャック駆動用モ
ータ１２によって低速回転させられる。このスピンチャ
ック駆動用モータ１２の回転に併せて塗布ノズル速度制
御手段１７は第３図の上方に示すノズル駆動速度信号１
８を塗布ノズル駆動用モー・夕１５に出力する。これに
より、塗布ノズル１４は被塗布物１０の外周部では遅い
速度で、中心部では早い速度で移動する。また塗布ノズ
ル１４が移動中に溶剤制御系１３により溶剤を塗布ノズ
ル１４を通して被塗布物１０上（こ滴下する。Next, the effect will be explained. The object to be coated 10 held by suction on the spin chuck 11 is rotated at low speed by the spin chuck driving motor 12 . In conjunction with the rotation of the spin chuck drive motor 12, the coating nozzle speed control means 17 generates a nozzle drive speed signal 1 shown in the upper part of FIG.
8 is output to the coating nozzle drive motor 15. As a result, the coating nozzle 14 moves at a slow speed at the outer periphery of the object 10 to be coated, and at a fast speed at the center. Further, while the coating nozzle 14 is moving, the solvent control system 13 causes the solvent to drop onto the object 10 through the coating nozzle 14.
このように、塗布ノズル１４を移動させながら溶剤を被
塗布物１０上（こ滴下するので、塗布ノズル１４の移動
速度を制御することにより、被塗布物１０上をこ溶剤の
粘度が変化しない内に均一にしかも早く滴下でき、また
最適な滴下量を無、駄なく滴下でき、高精度な塗布膜が
得られる。In this way, the solvent is dripped onto the object 10 while moving the coating nozzle 14, so by controlling the moving speed of the coating nozzle 14, the solvent can be spread over the object 10 without changing the viscosity of the solvent. It can be applied uniformly and quickly, and the optimal amount of drops can be applied without wasting anything, resulting in a highly accurate coating film.
以上の説明から明らかなように、氷見明番こよれば、被
塗布物を回転させながら塗布ノズルより溶剤を被塗布物
に滴下して被塗布物に溶剤を回転塗布する塗布装置ｔこ
おいて、前記塗布ノズルを前記被塗布物の半径方向に移
動させる塗布ノズル駆動手段と、前記被塗布物の回転に
併せて前記塗布ノズル駆動手段による塗布ノズルの速度
制御を行なう塗布ノズル速度制御手段きを備えているの
で、被塗布物上に溶剤の粘度が変化しない内に均一にし
かも早く滴下でき、高精度な塗布膜が得られる。As is clear from the above explanation, Akira Himi uses a coating device that rotates and applies a solvent to an object by dropping the solvent onto the object from a coating nozzle while rotating the object. , a coating nozzle driving means for moving the coating nozzle in the radial direction of the object to be coated, and a coating nozzle speed control means for controlling the speed of the coating nozzle by the coating nozzle driving means in accordance with the rotation of the object to be coated. Because of this, the solvent can be dropped uniformly and quickly onto the object to be coated without changing its viscosity, and a highly accurate coating film can be obtained.
これによって、半導体高集積製品にも対応でき、歩留り
が向上する。This makes it possible to handle highly integrated semiconductor products and improve yields.
第１図ｆａｌｆｂ）及び第２図は従来の塗布方法の説明
図、第３図は本発明になる塗布装置の一実施例を示す基
本構成図である。
１０・・・被塗布物、１１・・・スピンチャック、１２
・・・スピンチャック駆動用モータ、 １３・・・
溶剤制御系、 １４・・・塗布ノズル、１５・・・
塗布ノズル駆動用モータ、１６・・・ガイド、＝ ５−
１７・・・塗布ノズル速度制御手段。
＝６一FIG. 1 (falfb) and FIG. 2 are explanatory diagrams of a conventional coating method, and FIG. 3 is a basic configuration diagram showing an embodiment of a coating apparatus according to the present invention. 10...Object to be coated, 11...Spin chuck, 12
...Spin chuck drive motor, 13...
Solvent control system, 14... Application nozzle, 15...
Coating nozzle driving motor, 16... Guide, = 5-17... Coating nozzle speed control means. =61
Claims (1)
物に滴下して被塗布物に溶剤を回転塗布する塗布装置に
おいて、前記塗布ノズルを前記被塗布物の半径方向に移
動させる塗布ノズル駆動手段と、前記被塗布物の回転に
併せて前記塗布ノズル駆動手段による塗布ノズルの速度
制御を行なう塗布ノズル速度制御手段とを備えた塗布装
置。In a coating apparatus that rotates the coating material and drips the solvent onto the coating material from a coating nozzle while rotating the coating material, a coating nozzle driving means for moving the coating nozzle in the radial direction of the coating material. and a coating nozzle speed control means for controlling the speed of the coating nozzle by the coating nozzle driving means in accordance with the rotation of the object to be coated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13514684A JPS6115773A (en) | 1984-07-02 | 1984-07-02 | Coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13514684A JPS6115773A (en) | 1984-07-02 | 1984-07-02 | Coating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6115773A true JPS6115773A (en) | 1986-01-23 |
Family
ID=15144881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13514684A Pending JPS6115773A (en) | 1984-07-02 | 1984-07-02 | Coating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6115773A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137314A (en) * | 1988-11-18 | 1990-05-25 | Tokyo Electron Ltd | Method and apparatus for coating with resist |
| US6033728A (en) * | 1993-05-13 | 2000-03-07 | Fujitsu Limited | Apparatus for spin coating, a method for spin coating and a method for manufacturing semiconductor device |
| JP2005019560A (en) * | 2003-06-24 | 2005-01-20 | D S Giken:Kk | Coating device |
| JP2008016708A (en) * | 2006-07-07 | 2008-01-24 | Victor Co Of Japan Ltd | Treatment coater |
-
1984
- 1984-07-02 JP JP13514684A patent/JPS6115773A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137314A (en) * | 1988-11-18 | 1990-05-25 | Tokyo Electron Ltd | Method and apparatus for coating with resist |
| US6033728A (en) * | 1993-05-13 | 2000-03-07 | Fujitsu Limited | Apparatus for spin coating, a method for spin coating and a method for manufacturing semiconductor device |
| JP2005019560A (en) * | 2003-06-24 | 2005-01-20 | D S Giken:Kk | Coating device |
| JP2008016708A (en) * | 2006-07-07 | 2008-01-24 | Victor Co Of Japan Ltd | Treatment coater |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5094884A (en) | Method and apparatus for applying a layer of a fluid material on a semiconductor wafer | |
| US4822639A (en) | Spin coating method and device | |
| JPS6053675B2 (en) | Spin coating method | |
| US5798140A (en) | Oscillatory chuck method and apparatus for coating flat substrates | |
| JPS63301520A (en) | Photoresist coating device | |
| JPS6115773A (en) | Coating apparatus | |
| JP2001176775A (en) | Method for forming coating film on semiconductor wafer | |
| JPS62185322A (en) | Applicator for photo-resist | |
| JPS61238050A (en) | Coating method | |
| JPH05259063A (en) | Semiconductor substrate spin coating method | |
| JPH01159080A (en) | Rotary coating device | |
| JPH05259050A (en) | Spin coating on semiconductor substrate and device | |
| JPH05259049A (en) | Spin coating on semiconductor substrate | |
| JPS62190838A (en) | Resist coating method | |
| JPS60217627A (en) | Formation of thin film and forming device thereof | |
| JPH05123632A (en) | Method for applying liquid coating material | |
| JP2840182B2 (en) | Rotary coating method for substrate and rotary coating apparatus for substrate | |
| JPH08330206A (en) | Photoresist application method, method for manufacturing semiconductor integrated circuit device using it, and photoresist application device | |
| JPS6251221A (en) | Coating device | |
| JPH0330874A (en) | Method and apparatus for applying thin film to base plate for plane display | |
| JPH0985155A (en) | Spin coating device and spin coating method | |
| JPS614573A (en) | Coating apparatus | |
| JP2003093955A (en) | Method and device for coating thin film | |
| JPH04188611A (en) | Semiconductor manufacturing device | |
| JPH05259052A (en) | Spin coating on semiconductor substrate and device |