JPS61152367A - Laser dressing device for cbn grindstone - Google Patents
Laser dressing device for cbn grindstoneInfo
- Publication number
- JPS61152367A JPS61152367A JP27576884A JP27576884A JPS61152367A JP S61152367 A JPS61152367 A JP S61152367A JP 27576884 A JP27576884 A JP 27576884A JP 27576884 A JP27576884 A JP 27576884A JP S61152367 A JPS61152367 A JP S61152367A
- Authority
- JP
- Japan
- Prior art keywords
- grindstone
- laser
- grinding wheel
- laser beam
- cbn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
【発明の詳細な説明】
(イ)発明の目的
[産業上の利用分野]
この発明は、レーザドレッシング装置に関し、詳しくは
、機械加工の一種である研削加工で用いるCBN砥石等
の砥粒層に目づまりした金属を、レーザ光を照射して溶
融除去するための装置に関するものである。Detailed Description of the Invention (a) Purpose of the Invention [Industrial Field of Application] The present invention relates to a laser dressing device, and more specifically, to a laser dressing device that is applied to an abrasive layer of a CBN grindstone or the like used in grinding, which is a type of machining. This invention relates to a device for melting and removing clogged metal by irradiating laser light.
[従来の技術1
硬質材料、例えば焼入れ鋼等の研削加工にCBN研削砥
石が用いられていることは公知である。第3図に示すよ
うに、CBN研削砥石10は円盤型をなし、回転軸2の
一端にナツト3で回転可能に固定されている。回転軸2
には駆動モータ5、ベルト19及び砥石回転機構4を介
して回転が伝達される。CBN研削砥石10の外周部は
砥粒層6であり、この部分は第2図に示すようにCBN
(立方晶窒化ホウ素)の微小砥粒7と金属結合剤8と
を混合し焼結により固めたものである。[Prior Art 1] It is well known that CBN grinding wheels are used for grinding hard materials such as hardened steel. As shown in FIG. 3, the CBN grinding wheel 10 has a disk shape and is rotatably fixed to one end of the rotating shaft 2 with a nut 3. Rotating axis 2
Rotation is transmitted to the drive motor 5, the belt 19, and the grindstone rotation mechanism 4. The outer peripheral part of the CBN grinding wheel 10 is an abrasive grain layer 6, and this part is made of CBN as shown in FIG.
(cubic boron nitride) micro abrasive grains 7 and a metal binder 8 are mixed and solidified by sintering.
研削加工は、CBN研削砥石10を高速回転させ、その
外周部である砥粒層6を、センタ11を介して低速で回
転する工作物12の表面と接触させて行う。Grinding is performed by rotating the CBN grinding wheel 10 at high speed and bringing the abrasive grain layer 6, which is the outer periphery thereof, into contact with the surface of the workpiece 12 rotating at low speed via the center 11.
研削加工を連続すると砥粒16の表層部分に、次第に切
りくずによる目づまり層9が形成されて研削性能が劣化
するため目づまり層9を除去するためのドレッシングが
必要になる。If the grinding process is continued, a layer 9 clogged with chips is gradually formed on the surface layer of the abrasive grains 16, and the grinding performance deteriorates, so dressing is required to remove the layer 9 clogged.
従来、CBN研削砥石のドレッシングには主として電解
加工法が用いられていた。電解加工法は電極と電解液を
使用して目づまり層9を溶解除去する方法であるが、C
BN研削砥石10を回転軸2から取りはずさねばならな
い等操作が面倒であり、かつ、電気化学的に溶解するた
め目づまり層の深部までとかすのに時間がかかる。従っ
てドレッシングに要する時間が長くなり、加工能率が低
下するという問題がある。Conventionally, electrolytic processing has been mainly used for dressing CBN grinding wheels. The electrolytic processing method uses an electrode and an electrolytic solution to dissolve and remove the clogging layer 9, but C
The operation is troublesome, such as having to remove the BN grinding wheel 10 from the rotating shaft 2, and since it is electrochemically dissolved, it takes time to comb the clogged layer deep. Therefore, there is a problem that the time required for dressing becomes longer and processing efficiency decreases.
し発明が解決しようとする問題点]
この発明は上記の如き事情に鑑みてなされたものであっ
て、取扱いが簡単で砥石を研削盤の回転軸から取りはず
さずに、オンマシンで、しかも短時間にドレッシングが
可能であり、加工能率を向上させることが可能なドレッ
シング装置を提供することを目的としている。[Problems to be Solved by the Invention] This invention was made in view of the above-mentioned circumstances, and it is easy to handle and can be carried out on-machine and in a short time without removing the grinding wheel from the rotating shaft of the grinding machine. The purpose of the present invention is to provide a dressing device that can improve processing efficiency.
(ロ)発明の構成
[問題を解決するための手段]
この目的に対応して、CBN研削砥石のレーザドレッシ
ング装置は、レーザ光を出力するレーザ発振器と、前記
レーザ光をCBN研削砥石の目づまり層の集光点に集光
する光学装置と、前記集光点を前記CBN研削砥石の幅
に亙っで走査し得る走査機構と、前記CBN研削砥石の
目づまり層の前記レーザ光が集光している部分に活性ガ
スを供給し得るガス供給装置とを備えることを特徴とし
ている。(B) Structure of the Invention [Means for Solving the Problem] Corresponding to this purpose, a laser dressing device for a CBN grinding wheel includes a laser oscillator that outputs a laser beam, and a laser dressing device that uses the laser beam to prevent clogging of the CBN grinding wheel. an optical device that focuses light on a focal point of the layer; a scanning mechanism capable of scanning the focal point across the width of the CBN grinding wheel; The invention is characterized by comprising a gas supply device capable of supplying active gas to the active parts.
以下、この発明の詳細を一実施例を示す図面について説
明する。Hereinafter, details of the present invention will be explained with reference to the drawings showing one embodiment.
第1図において1はレーザドレッシング装置であり、レ
ーザドレッシング装ali1はレーザ光源であるレーザ
発振器14と、光学装置17とを有し、両者は導管18
で結ばれている。光学装置17はレーザ発振器14から
出力されたレーザ光13を反射鏡15で反射した後、K
CIあるいはln 3e製レンズ16でCBN研削砥石
10の砥粒層6の表面に集光しつつ集光点AをCBN研
削砥石10の幅Wに厘って走査し得る走査機構(図示せ
ず)を備えている。In FIG. 1, 1 is a laser dressing device, and the laser dressing device ali1 has a laser oscillator 14 as a laser light source and an optical device 17, both of which are connected to a conduit 18.
are tied together. The optical device 17 reflects the laser beam 13 output from the laser oscillator 14 with a reflecting mirror 15, and then
A scanning mechanism (not shown) that can focus light on the surface of the abrasive grain layer 6 of the CBN grinding wheel 10 with a CI or ln 3e lens 16 and scan the focused point A over the width W of the CBN grinding wheel 10. It is equipped with
レーザドレッシング装置1はまた、砥粒層6上のレーザ
光の集光点Aの部分に、酸素のような活性ガスを供給し
得るガス供給装置21を有し、ガス供給装置21につな
がる噴射ノズル22が集光点Aの近傍に開口している。The laser dressing device 1 also includes a gas supply device 21 capable of supplying an active gas such as oxygen to the convergence point A of the laser beam on the abrasive grain layer 6, and an injection nozzle connected to the gas supply device 21. 22 opens near the condensing point A.
[作用]
このように構成されたレーザドレッシング装置1におい
ては、レーザ発振器14から出力されたレーザ光13は
、導管18を通って光学装置17に入り、反射@15に
より光路が変更され、レンズ16によってCBN研削砥
石10の砥粒116上の目づまり層9の1点Aに集光さ
れる。このため集光点Aには高密度のエネルギが集中さ
れる。同時に集光点Aには噴射ノズル22から、ガス供
給装置21により供給される酸素等の活性ガスが噴射さ
れるから、集光点Aの目づまり層を形成する金属は溶融
されやすくなり、溶融された金属は砥粒層6の表面から
ガス流により吹きとばされて除去される。[Function] In the laser dressing device 1 configured as described above, the laser beam 13 output from the laser oscillator 14 enters the optical device 17 through the conduit 18, the optical path is changed by reflection @15, and the laser beam 13 is outputted from the laser oscillator 14. The light is focused on one point A on the clogging layer 9 on the abrasive grains 116 of the CBN grinding wheel 10. Therefore, high-density energy is concentrated at the focal point A. At the same time, active gas such as oxygen supplied by the gas supply device 21 is injected from the injection nozzle 22 to the condensing point A, so the metal forming the clogging layer at the converging point A is easily melted. The removed metal is blown off and removed from the surface of the abrasive grain layer 6 by the gas flow.
[実施例]
■実験
下記(A>の条件のCBN研削砥石を(B)の条件のド
レッシング装置によりレーザドレッシングした場合、所
要時間は■に示すように4分強であった。[Example] ■Experiment When a CBN grinding wheel under conditions (A> below) was laser dressed using a dressing device under conditions (B), the required time was a little over 4 minutes as shown in ■.
■レーザドレッシング所要時間の計算
レーザ光が相対的にCBN研削砥石の外周を一周するの
に要する時間は
400− yr (mm> / 100111+11/
秒)=12.6(秒)
砥石の全幅2Qmmの走査に要する時間は、砥石1回転
毎にレーザ光の集光点が幅方向へ1m111移動すると
して、
12.6(秒) X (20(mn+) /1 (mm
) )−4分12秒
同じ(A>の条件のCBN研削砥石を従来の電解加工法
によりドレッシングした場合の所要時間は15分である
から、処理時間だけを比較しても1/3以下になる。■ Calculating the time required for laser dressing The time required for the laser light to go around the outer circumference of the CBN grinding wheel is 400-yr (mm> / 100111+11/
seconds) = 12.6 (seconds) The time required to scan the entire width of the grinding wheel 2Qmm is 12.6 (seconds) x (20( mn+) /1 (mm
) - 4 minutes 12 seconds Same (A>) The time required to dress a CBN grinding wheel using the conventional electrolytic processing method is 15 minutes, so even if you compare only the processing time, it is less than 1/3 Become.
尚、レーザ光走査速度は、レーザ光出力の大きさや目づ
まり層の深さにより調整する必要があるが、目づまりし
ている材質即ち工作物の材質には影響をうけない。目づ
まり層の深さは通常0.51111以下であり、この場
合レーザの出力0.5〜1、OKW、CBN研削砥石回
転速度300 mai/秒にすると、ドレッシングは約
1.5分で終了する。Note that the laser beam scanning speed needs to be adjusted depending on the magnitude of the laser beam output and the depth of the clogged layer, but it is not affected by the material of the clog, that is, the material of the workpiece. The depth of the clogged layer is usually 0.51111 or less, and in this case, if the laser output is 0.5 to 1 and the OKW, CBN grinding wheel rotation speed is 300 mai/sec, dressing will be completed in about 1.5 minutes. .
(ハ)発明の効果
以上の説明から明らかな通り、この発明によれば、取り
あつかいが簡単で、CBN研削砥石を研削盤から取りは
ずさずに、オンマシンで、しかも短時間にドレッシング
が可能で、加工能率を向上させることができるドレツシ
グ装置を得ることができる。(c) Effects of the Invention As is clear from the above explanation, the present invention is easy to handle and can be dressed on-machine in a short time without removing the CBN grinding wheel from the grinding machine. A dressing device that can improve processing efficiency can be obtained.
第1図はCBN研削砥石のレーザドレッシング装置の構
成説明図、第2図はCBN研削砥石の砥粒層の断面図及
び第3図はCBN研削砥石の使用様態を示す説明図であ
る。
1・・・レーザドレッシング装置 2・・・回転軸3
・・・ナツト 4・・・砥石回転機構 5・・・駆
動モータ 6・・・砥粒層 7・・・CBN砥粒
8・・・金属結合剤 9・・・目づまり層 10
・・・CBN研削砥石 11・・・センタ 12・
・・工作物13・・・レーザ光 14・・・レーザ発
振器 15・・・反射鏡 16・・・レンズ 1
7・・・光学装置18・・・導管 19・・・ベルト
21・・・ガス供給装置 22・・・噴射ノズル
第1図
+7 13 18 14 1第2図FIG. 1 is an explanatory diagram of the configuration of a laser dressing device for a CBN grinding wheel, FIG. 2 is a sectional view of an abrasive grain layer of the CBN grinding wheel, and FIG. 3 is an explanatory diagram showing how the CBN grinding wheel is used. 1... Laser dressing device 2... Rotating shaft 3
... Nut 4 ... Grinding wheel rotation mechanism 5 ... Drive motor 6 ... Abrasive grain layer 7 ... CBN abrasive grain
8... Metallic binder 9... Clogging layer 10
... CBN grinding wheel 11... Center 12.
...Workpiece 13...Laser beam 14...Laser oscillator 15...Reflector 16...Lens 1
7... Optical device 18... Conduit 19... Belt 21... Gas supply device 22... Injection nozzle Fig. 1 + 7 13 18 14 1 Fig. 2
Claims (1)
タルボンドCBN研削磁石の砥粒層の表面の集光点に集
光しつつ前記集光点を前記CBN研削砥石の幅に亙って
走査し得る光学装置と、前記CBN研削砥石の砥粒層の
前記レーザ光が集光している部分に活性ガスを供給し得
るガス供給装置とを備えることを特徴とするCBN研削
砥石のレーザドレッシング装置。a laser oscillator that outputs a laser beam; and a laser oscillator that focuses the laser beam on a focal point on the surface of an abrasive layer of a metal bonded CBN grinding magnet and scans the focal point over the width of the CBN grinding wheel. 1. A laser dressing device for a CBN grinding wheel, comprising: an optical device for obtaining the laser beam, and a gas supply device capable of supplying an active gas to a portion of the abrasive grain layer of the CBN grinding wheel where the laser beam is focused.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27576884A JPS61152367A (en) | 1984-12-27 | 1984-12-27 | Laser dressing device for cbn grindstone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27576884A JPS61152367A (en) | 1984-12-27 | 1984-12-27 | Laser dressing device for cbn grindstone |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61152367A true JPS61152367A (en) | 1986-07-11 |
Family
ID=17560119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27576884A Pending JPS61152367A (en) | 1984-12-27 | 1984-12-27 | Laser dressing device for cbn grindstone |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61152367A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999012705A1 (en) * | 1997-09-08 | 1999-03-18 | The Institute Of Physical And Chemical Research | Optical dressing method, machining device based on this method, grindstone and polishing cloth |
US6458291B2 (en) * | 1999-06-17 | 2002-10-01 | National Semiconductor Corporation | Light sensitive chemical-mechanical polishing aggregate |
US6672945B1 (en) * | 1999-08-20 | 2004-01-06 | Ebara Corporation | Polishing apparatus and dressing method |
US6793562B2 (en) * | 2001-04-23 | 2004-09-21 | Mitsubishi Denki Kabushiki Kaisha | Grinder and method of and apparatus for non-contact conditioning of tool |
US7121919B2 (en) * | 2001-08-30 | 2006-10-17 | Micron Technology, Inc. | Chemical mechanical polishing system and process |
DE102004011985B4 (en) * | 2003-03-13 | 2013-12-12 | Denso Corporation | Method and apparatus for conditioning a surface form of a grindstone and a grinder |
JP2015160251A (en) * | 2014-02-26 | 2015-09-07 | 株式会社ディスコ | Processing device |
CN108555780A (en) * | 2018-05-31 | 2018-09-21 | 华辰精密装备(昆山)股份有限公司 | Grinding wheel laser reconditioning system |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5546827A (en) * | 1978-09-28 | 1980-04-02 | Kanegafuchi Chemical Ind | Leakage checker |
-
1984
- 1984-12-27 JP JP27576884A patent/JPS61152367A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5546827A (en) * | 1978-09-28 | 1980-04-02 | Kanegafuchi Chemical Ind | Leakage checker |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999012705A1 (en) * | 1997-09-08 | 1999-03-18 | The Institute Of Physical And Chemical Research | Optical dressing method, machining device based on this method, grindstone and polishing cloth |
US6126523A (en) * | 1997-09-08 | 2000-10-03 | The Institute Of Physical And Chemical Research | Optical dressing method, machining device based on this method, grindstone and polishing cloth |
US6458291B2 (en) * | 1999-06-17 | 2002-10-01 | National Semiconductor Corporation | Light sensitive chemical-mechanical polishing aggregate |
US6458704B2 (en) * | 1999-06-17 | 2002-10-01 | National Semiconductor Corporation | Light sensitive chemical-mechanical polishing method |
US6672945B1 (en) * | 1999-08-20 | 2004-01-06 | Ebara Corporation | Polishing apparatus and dressing method |
US6793562B2 (en) * | 2001-04-23 | 2004-09-21 | Mitsubishi Denki Kabushiki Kaisha | Grinder and method of and apparatus for non-contact conditioning of tool |
US7121919B2 (en) * | 2001-08-30 | 2006-10-17 | Micron Technology, Inc. | Chemical mechanical polishing system and process |
DE102004011985B4 (en) * | 2003-03-13 | 2013-12-12 | Denso Corporation | Method and apparatus for conditioning a surface form of a grindstone and a grinder |
JP2015160251A (en) * | 2014-02-26 | 2015-09-07 | 株式会社ディスコ | Processing device |
CN108555780A (en) * | 2018-05-31 | 2018-09-21 | 华辰精密装备(昆山)股份有限公司 | Grinding wheel laser reconditioning system |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6257224B1 (en) | Process for working a preform made of an oxide single crystal, and a process for producing functional devices | |
JP2004111606A (en) | Method of processing wafer | |
JP2001071256A (en) | Method and device for grooving polishing pad, and polishing pad | |
EP0191203A2 (en) | Cutting tool structures, apparatus and method for making same | |
JPS61152367A (en) | Laser dressing device for cbn grindstone | |
JP3096943B2 (en) | Laser polishing method and apparatus for diamond and diamond product using the same | |
Rabiey et al. | Dressing of hybrid bond CBN wheels using short-pulse fiber laser | |
CN110293482A (en) | A kind of dressing method of arc-shaped skive | |
US6126523A (en) | Optical dressing method, machining device based on this method, grindstone and polishing cloth | |
JP4186658B2 (en) | Grinding wheel surface shape adjusting method and apparatus, grinding machine | |
JPS61152345A (en) | Machining method in combine use with laser beam | |
JP2002192464A (en) | Dressing method for metal bond grinding wheel | |
JPS61103776A (en) | Dressing method of grindstone | |
CN114290241A (en) | Ultrafast laser grinding wheel dressing device and method based on Bessel beam | |
JPH03121717A (en) | Method and device for saw-tooth setting | |
JP3128164B2 (en) | Grinding wheel for electrolytic dressing with mechanochemical action | |
JPH11285971A (en) | Non-contact dressing truing method and apparatus for grinding wheel | |
JP2009255280A (en) | Grinding wheel machining apparatus and machining method | |
JP4417053B2 (en) | Laser high-concentration forming method and system | |
JPH1158211A (en) | Groove machining method of multi-grooves roller | |
RU2005588C1 (en) | Method of abrasive working | |
CN112658968B (en) | Wafer grinding device based on laser in-situ assistance | |
JPH0673811B2 (en) | Forming method of grindstone | |
JPH05138539A (en) | Abrasion resistant road cutting blade | |
RU1787102C (en) | Method of abrasive machining |