JPS61147596A - Manufacture of double side through hole printed circuit board - Google Patents
Manufacture of double side through hole printed circuit boardInfo
- Publication number
- JPS61147596A JPS61147596A JP26969384A JP26969384A JPS61147596A JP S61147596 A JPS61147596 A JP S61147596A JP 26969384 A JP26969384 A JP 26969384A JP 26969384 A JP26969384 A JP 26969384A JP S61147596 A JPS61147596 A JP S61147596A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- sided
- double
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
Landscapes
- ing And Chemical Polishing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、絶縁基板の両面に形成された回路幅約１５０
μｍ以下の導体回路の所要個所を絶縁基板を貫通して形
成された孔の内面に被着せしめられた導電層をもって電
気的に接続した印刷回路基板の製法に関し、電子計算機
や通信機器等のいわゆる産業機械用途、即ち高密度実装
用の両面スルーホール印刷回路基板を製造するのに有用
である。Detailed Description of the Invention [Field of Application of the Invention] The present invention relates to a circuit having a width of about 150 mm formed on both sides of an insulating substrate.
This method relates to a method for manufacturing printed circuit boards in which required portions of conductor circuits with a diameter of less than μm are electrically connected by a conductive layer deposited on the inner surface of a hole formed by penetrating an insulating substrate. It is useful for manufacturing double-sided through-hole printed circuit boards for industrial machinery applications, ie, high density packaging.
従来、スルーホール印刷回路基板を製造する方法とじて
は、ホールの内面に無電解及び／又は電解メッキ手段を
用いて、導体メッキ層を形成した後に、ホール内部をエ
ツチングレジスト性を有す今物賞（孔埋め材）をもって
充填し、絶縁基板両面のレジストパターンが形成されて
いる導体層を工、チングして、導体回路を形成し、孔埋
め材により保護されているホール内部の導体メッキ層と
導通させる方法、あるいは導体層が形成されている絶縁
基板両面に、メンキレジストで導体回路のネガパターン
を形成した後に孔内面の導体層及び基板両面のメッキレ
ジストで被覆されて・いない部分を、エツチングレジス
ト性を有する金属でメッキし、次にメッキレジストを剥
離して露出した導体層をエツチングして絶縁基板両面に
導体回路を形成すると同時に、ホール周辺部の導体層と
導通させる方法などが知られている。Conventionally, the method for manufacturing through-hole printed circuit boards is to form a conductive plating layer on the inner surface of the hole using electroless and/or electrolytic plating means, and then to etch the inside of the hole using a modern material with etching resist properties. The conductor layer with the resist pattern on both sides of the insulating substrate is filled with a hole filler and a conductor circuit is formed, and the conductor plating layer inside the hole is protected by the hole filler. Or, after forming a negative pattern of the conductor circuit with Menki resist on both sides of the insulating board where the conductor layer is formed, etching the conductor layer on the inner surface of the hole and the parts of both sides of the board that are not covered with the plating resist. Known methods include plating with a metal that has resist properties, then peeling off the plating resist and etching the exposed conductor layer to form a conductor circuit on both sides of the insulating substrate and at the same time making it conductive with the conductor layer around the hole. ing.
しかし、前者の方法では充填剤の硬化の際の体積収縮を
さけがたく、その為ホール周辺部に於いては、両面の導
体回路との導通が一般に難しく、この欠陥をさけんとす
ればスクリーン印刷又はドライフィルム法により膜厚を
比較的厚くしたレジストパターンを形成する必要がある
。そうした場合、回路幅約１５０μｍ以下の微細導体回
路を絶縁基板の両面に形成することは、スクリーン印刷
に於いては凡そ不可能であり、またドライフィルム法で
も効率よ（行うことは難しい、又後者の方法でもネガパ
ターンに回路線幅約１５０μｍ以下のメンキレジストパ
ターンを形成する□即ち１５０μｍ以下の線幅でインキ
ののらない部分を形成する−ことはスクリーン印刷法、
ドライフィルム法のいずれにしても難しく、またエツチ
ングレジスト性を有する金属のメッキ工程に於いて、オ
ーバーハング現象をさけがたいことなどから、やはり回
路幅約１５０μｍ以下の微細導体回路を有するスルーホ
ール印刷回路基板の形成は困難である。他にドライフィ
ルム法で膜厚５０μｍ程度のレジストバターニングを行
い、ホールをレジスト膜で直接覆ってしまうテンティン
グ法なる方法もあるが、通常のドライフィルム法以上に
線幅約１５０μｍ以下の微細パターニングには不適であ
る。However, in the former method, it is difficult to avoid volume shrinkage when the filler hardens, and therefore it is generally difficult to conduct with the conductor circuits on both sides around the hole. Alternatively, it is necessary to form a resist pattern with a relatively thick film thickness using a dry film method. In such cases, it is almost impossible to form fine conductor circuits with a circuit width of approximately 150 μm or less on both sides of an insulating substrate using screen printing, and it is difficult to do so efficiently even with dry film methods (and the latter is difficult to perform). The method also forms a Menki resist pattern with a circuit line width of about 150 μm or less on a negative pattern, that is, a part where no ink is applied with a line width of 150 μm or less.
Both dry film methods are difficult, and overhang phenomena are unavoidable in the plating process for metals that have etching resist properties, so through-hole printing has a fine conductor circuit with a circuit width of approximately 150 μm or less. Forming circuit boards is difficult. Another method is the tenting method, which uses a dry film method to perform resist patterning to a film thickness of about 50 μm and directly covers the holes with a resist film, but it is more fine patterning with a line width of about 150 μm or less than the normal dry film method. It is unsuitable for
又、高密度両面スルーホール印刷回路基板の製造法とし
て次の様な方法もある。Ｉ！ｌＩち、両面銅張り積層板
上にドライフィルム法あるいはスクリーン印刷法により
、導体回路を形成後、ランド部を通じて所定の位置に孔
あけを行い、塩化第一スズ、塩化パラジウム等の無電解
メッキ用活性荊に浸漬、乾燥し、続いて所定のハンダ付
予定部以外にスクリーン印刷にて耐メンキレジストを印
刷し、無電解鋼メッキを行ってスルーホールを形成して
製造する方法、あるいは上記の方法で両面に導体回路を
形成後、ハンダ付予定部内の所定の位置に孔あけし、次
いで非ハンダ部に樹脂層を一度形成した後、無電解メッ
キ用活性剤に浸漬、乾燥し、続いて所定のハンダ付予定
部以外にスクリーン印刷にて耐メンキソルダーレジスト
を印刷し、無電解銅メッキを行ってスルーホールを形成
して製造する方法などである。There are also the following methods for manufacturing high-density double-sided through-hole printed circuit boards. I! After forming a conductor circuit on a double-sided copper-clad laminate using the dry film method or screen printing method, holes are drilled at predetermined positions through the land portions for electroless plating of stannous chloride, palladium chloride, etc. It is manufactured by dipping it in activated rhizomes and drying it, then printing an anti-friction resist by screen printing on areas other than the designated areas to be soldered, and then applying electroless steel plating to form through holes, or by the method described above. After forming conductor circuits on both sides, holes are drilled at predetermined positions in the areas to be soldered, and then a resin layer is formed once on the non-solder areas, then immersed in an activator for electroless plating, dried, and then placed in a predetermined position. There is a manufacturing method in which a solder-resistant resist is printed by screen printing in areas other than the areas to be soldered, and through-holes are formed by electroless copper plating.
しかしながら、これらいずれの方法でもまず第一に両面
への回路形式を！Ｉ！１５０μｍ以下にすることは不適
当である。スクリーン印刷法では、はるかにその限界を
越えており、ドライフィルム法でも生産性が極端に悪（
なる、今日、要望されるような高密度パターンの形成に
応えられなくなりつつあるのが現状である。However, in any of these methods, first of all, the circuit format for both sides is required! I! It is inappropriate to make the thickness less than 150 μm. The screen printing method far exceeds its limits, and even the dry film method has extremely low productivity (
The current situation is that it is becoming impossible to meet the demands for high-density pattern formation today.
第二にハンダ付予定部の内側にホール形成後、樹脂層乃
至はハンダメッキ層をスクリーン印刷する方式では、そ
の印刷膜厚みが比較的厚いこと、あるいはスクリーン印
刷によく発生する汚れなどからホール内部へのインキの
流出が起こることがある。−変性じたホール内部の汚れ
は除去し難（、その為その後のホール内銅メッキが完全
に為されなかったりする等の欠点を存する。Secondly, in the method of screen printing a resin layer or a solder plating layer after forming a hole inside the area to be soldered, the thickness of the printed film is relatively thick, or the dirt inside the hole often occurs during screen printing. Ink leakage may occur. - It is difficult to remove the dirt inside the denatured hole (therefore, there are drawbacks such as the subsequent copper plating inside the hole may not be completed completely).
〔本発明が解決しようとしている問題点〕本発明はこう
した回路線幅１５０μｍ以下の微細導体回路を有する両
面スルーホール印刷回路基板の製法に関する上述の従来
の欠点を改良し、今後その需要が急増すると予想される
微細パターンを有する高密度実装用途両面スルーホール
印刷回路基板の製法を提供することにある。[Problems to be Solved by the Present Invention] The present invention improves the above-mentioned conventional drawbacks regarding the manufacturing method of double-sided through-hole printed circuit boards having fine conductor circuits with a circuit line width of 150 μm or less, and solves the problem that the demand for the same will rapidly increase in the future. The object of the present invention is to provide a method for manufacturing a double-sided through-hole printed circuit board for high-density packaging applications having an expected fine pattern.
本発明は、第一に両面銅張り積層板上への導体回路の形
成をオフセット印刷法により行うこと、第二に両面に導
体回路を形成し、ハンダ付予定部を残して絶縁性樹脂層
を形成した後に、ハンダ付予定部内にホールを形成する
ことにより、その後のホール内の無電解網メッキを完全
に行い得て、微細導体回路を有する両面スルーホール印
刷回路基板を得ることができた。The present invention involves firstly forming a conductor circuit on a double-sided copper-clad laminate using an offset printing method, and secondly forming a conductor circuit on both sides and depositing an insulating resin layer on both sides, leaving the areas to be soldered. After forming, by forming holes in the areas to be soldered, subsequent electroless mesh plating in the holes could be completely performed, and a double-sided through-hole printed circuit board having fine conductor circuits could be obtained.
本発明は下記ａ）乃至ｆ）の工程よりなることを特徴と
する両面スルーホール印刷回路基板の製造方法に関する
ものである。The present invention relates to a method for manufacturing a double-sided through-hole printed circuit board characterized by comprising the following steps a) to f).
ａ）両面に導電層を有する′ｅＡ縁基縁上板上フセント
印刷によりエツチングレジストパターンを形成した後、
電解研磨又はエツチング等により非パターン部の導電層
を腐蝕し、導体回路を形成せしめ、次いでエツチングレ
ジスト皮膜をＩＡｇＩする工程。a) After forming an etching resist pattern by cent printing on the top plate of the ``eA edge base edge having conductive layers on both sides,
A process of etching the conductive layer in non-patterned areas by electrolytic polishing or etching to form a conductor circuit, and then applying IAgI to the etching resist film.
ｂ）上記ａ）工程により形成された回路のうちハンダ付
予定部を除いた他の部分を絶縁性樹脂層で被覆する工程
。b) A step of covering the circuit formed in step a) above with an insulating resin layer except for the portion to be soldered.
Ｃ）ハンダ付予定部の所定個所に孔あけ加工を施す工程
。C) Process of drilling holes at predetermined locations in the area to be soldered.
ｄ）基板全体に化学銅メッキのための前処理をする工程
。d) A step of pre-treating the entire board for chemical copper plating.
ｅ）前記ｂ）工程により形成された樹脂層面に耐メンキ
レジスト層を被覆する工程。e) A step of coating the surface of the resin layer formed in step b) with a scratch-resistant resist layer.
ｆ）孔内壁及びハンダ付予定部の導体上に化学銅メッキ
を施す工程。f) A step of applying chemical copper plating to the inner wall of the hole and the conductor in the area to be soldered.
なお、上記ａ’）工程のレジストパターンのオフセット
印刷方法としては同一パターンを重ね刷りして、ピンホ
ール、アイホールをなくすることが好ましい。In addition, in the offset printing method of the resist pattern in step a'), it is preferable to overprint the same pattern to eliminate pinholes and eyeholes.
更に重ね刷りする際には、最初の印刷の印刷皮膜を硬化
処理した後、後の印刷をすることが、印刷皮膜を犀＜・
する効果、品質の安定、作業性の向上等において好まし
い。Furthermore, when overprinting, it is important to harden the printed film of the first printing and then perform the subsequent printing to harden the printed film.
It is preferable for its effectiveness, stable quality, improved workability, etc.
又、印刷皮膜の硬化処理方法としては加熱による硬化、
活性エネルギー線、例えば紫外線、電子線等の照射等に
より行うことができる。In addition, as a curing treatment method for the printed film, curing by heating,
This can be carried out by irradiation with active energy rays such as ultraviolet rays and electron beams.
工程ｂ）の絶縁性樹脂層及びｅ）工程の耐メンキレジス
ト層を設ける工程は、シルクスクリーン印刷法であうで
も、或いはオフセット印刷法であってもよい、オフセッ
ト印刷による場合には上記回路レジストパターンの印刷
と同様に重ね刷り及び硬化方法を採用することができる
。モしてｅ）工程の場合には重ね刷りすることが好まし
い。The step of providing the insulating resin layer in step b) and the scratch-resistant resist layer in step e) may be performed by a silk screen printing method or an offset printing method, and if offset printing is performed, the above-mentioned circuit resist pattern is printed. Similar overprinting and curing methods can be employed. In the case of step e), it is preferable to perform overprinting.
次に本発明の一実施例を図に従って説明する。 Next, one embodiment of the present invention will be described with reference to the drawings.
ａ）第１図に示すガラス・エポキシ樹脂積層板（１）の
両面に厚さ３５μｍの銅ｆｆ３（２）を接着した絶縁基
板の両面に、第２図に示す如くにオフセット印刷により
アルカリ可溶型エツチングレジストインキ（３）で所望
の導体回路パターン（４）、（４′）を形成する・
本実施例において使用した、オフセント印刷に適したレ
ジストインキは次の組成である。a) As shown in Fig. 2, on both sides of an insulating substrate with copper FF3 (2) with a thickness of 35 μm adhered to both sides of the glass-epoxy resin laminate (1) shown in Fig. Form the desired conductor circuit patterns (4), (4') with the etching resist ink (3). The resist ink suitable for offset printing used in this example has the following composition.
べ７コゾール１３４３ （大日本インキ化学工業■製ア
ルキフド樹脂） ６７重量部トリメチロールプロ
パン
トリアクリレート １５ ′ディン
クライトＵＥ−８２００
（大日本インキ化学工業特製
エポキシアクリレート） １０ ｌジメトキシフ
ェニルアセトフェノン ５１ｐ−ｔａｒｔ−ブチ
ルハイドロキノン １ ＃フタロシアニンブル
ー顔料 ２ ＃上記配合物を３本ロール
で十分に練肉して製造した。Be7cosol 1343 (Alkifde resin manufactured by Dainippon Ink Chemical Co., Ltd.) 67 parts by weight Trimethylolpropane triacrylate 15' Dinklite UE-8200 (Dinkullite UE-8200 (Epoxy acrylate specially manufactured by Dainippon Ink Chemical Co., Ltd.) 10 l Dimethoxyphenylacetophenone 51p-tart-butyl Hydroquinone 1 #Phthalocyanine Blue Pigment 2 #The above blend was thoroughly kneaded using three rolls.
オフセット印刷により形成したレジストパターンを紫外
線照射して硬化した後、塩化第２鉄溶液により、回路部
（４）及びハンダ付予定部（４′）を残して他をエツチ
ング除去する（第３図）。After the resist pattern formed by offset printing is cured by irradiation with ultraviolet rays, the circuit area (4) and the area to be soldered (4') are etched away using a ferric chloride solution (Figure 3). .
ｂ）上記工程で得た基板を３％水酸化ナトリウム溶液に
浸清し、回路部（４）及びハンダ付予定部（４′）の上
面のエツチングレジスト（３）を除去する（第４図）。b) Immerse the board obtained in the above step in a 3% sodium hydroxide solution to remove the etching resist (3) on the top surface of the circuit part (4) and the part to be soldered (4') (Fig. 4) .
Ｃ）：６板のハンダ付予定部（４′）以外に絶縁性樹脂
としてのソルダーレジスト（５）をスクリーン印刷法に
より被覆形成し、１３０℃、３０分間の硬化条件にて加
熱硬化させる（第５図）。C): A solder resist (5) as an insulating resin is coated on the parts other than the parts (4') to be soldered on the 6 boards by screen printing, and cured by heating at 130°C for 30 minutes. Figure 5).
本実施例に用いたソルダーレジストインキは、株式会社
タムラ製作所製の５Ｒ−６０Ｇ−５である。The solder resist ink used in this example is 5R-60G-5 manufactured by Tamura Seisakusho Co., Ltd.
ｄ）基板のハンダ付予定部の所定位置に、両面導通用の
孔（６）をプレスまたはドリルにより孔あけ加工をする
（第６図）。d) Drill a hole (6) for double-sided conduction at a predetermined position of the portion of the board to be soldered using a press or drill (FIG. 6).
ｅ）化学銅メッキを施すための一瓜的な前処理を施し、
基板全面に触媒（７）を付着させた後、８０℃で１０分
間乾燥させる（第７図）。e) Perform a uniform pretreatment for chemical copper plating,
After the catalyst (7) was deposited on the entire surface of the substrate, it was dried at 80° C. for 10 minutes (FIG. 7).
ｆ）前記ハンダ付予定部以外に付着した両面の触媒（７
）をマスクするために核部をオフセット印刷により、耐
メツキ液性に優れたソルダーレジスト（８）層を形成し
た後、加速電圧１７５ＫＶ、電流値１０ｍＡのエレクト
ロカーラン方式電子線照射装置で５メガラドの線量をも
って硬化させた。f) Double-sided catalyst (7
) To mask the core part, a solder resist (8) layer with excellent plating liquid resistance was formed by offset printing, and then the solder resist (8) layer with an accelerating voltage of 175 KV and a current value of 10 mA was used with an electrocurrency electron beam irradiation device of 5 megarads. Cured with a dose.
上記ソルダーレジストインキは次の組成である。The solder resist ink has the following composition.
スチレゾール ４２５０変性物 ７０重量部（
日立化成工業特製
スチレン化アルキド樹脂）
トリメチロールプロパン
トリアクリレート １２ ＃ディフ
クライトＵＥ−８２００１５＃
ｐ−ｔｅｒｔ−ブチルハイドロキノン ｌ ＃
フタロシアニンブルー顔料 ２ ＃ｇ）
基板を化学網メッキ液に浸漬し、ハンダ付予定部及び孔
内壁に銅メッキ層（９）を約３０μｍ析出せしめた。Styresol 4250 modified product 70 parts by weight (
Hitachi Chemical special styrenated alkyd resin) Trimethylolpropane triacrylate 12 # Difukurite UE-820015 # p-tert-butylhydroquinone l #
Phthalocyanine blue pigment 2 #g)
The board was immersed in a chemical mesh plating solution, and a copper plating layer (9) of about 30 μm was deposited on the area to be soldered and on the inner wall of the hole.
上記銅の析出は、ハンダ付予定部及び孔（６）の内壁に
のみ選択的に形成され、線幅１５０μｍ以下の細線から
成る、標準格子２．５４℃ｍ間隔に５本以上の導体回路
を存する両面スルーホール基板を得ることができる。The above-mentioned copper deposition is selectively formed only on the planned soldering area and the inner wall of the hole (6), and consists of a standard grid of 5 or more conductor circuits at 2.54°C m intervals, consisting of thin wires with a line width of 150 μm or less. A double-sided through-hole substrate can be obtained.
なお、上記実施例で、Ｃ）工程に使用した株式会社 タ
ムラ製作所製のソルダーレジストインキ、５Ｒ−６０Ｇ
−５の代わりに■アサヒ化学研究所製のソルダーレジス
トＦＯＲ１００を使用することができる。In the above examples, solder resist ink 5R-60G manufactured by Tamura Seisakusho Co., Ltd. was used in step C).
In place of -5, solder resist FOR100 manufactured by Asahi Chemical Research Institute can be used.
また、エツチングする銅箔の厚みが薄い場合には、ソマ
ール工業■製の紫外線硬化型ソルダーレジス）ＳＬＤ−
１５００Ｇをシルクスクリーン印刷に代えてオフセット
印刷することができる。In addition, if the thickness of the copper foil to be etched is thin, use an ultraviolet curing solder resist (SLD-) manufactured by Somar Kogyo.
1500G can be printed by offset printing instead of silk screen printing.
本発明は第一に、導体回路形成のためのエツチングレジ
ストパターンをオフセント印刷により行うから、導体回
路幅１５０ｐｍ以下、３０μｍ程度までの細線回路を容
易に得ることができる。First, in the present invention, since the etching resist pattern for forming the conductor circuit is formed by offset printing, it is possible to easily obtain a thin line circuit having a conductor circuit width of 150 pm or less, up to about 30 μm.
第二に、ホールの導通に関し、両面にソルダーレジスト
形成後、孔あけ加工を行うものであるから、ソルダーレ
ジストの孔への流入がなく、又最後のメッキ触媒のマス
キングをオフセント印刷で行った場合にはインキの膜厚
カ薄く、該インキの孔への流入はなく、化学銅メッキを
必要部分全体に正確に行うことができ、導通の完全なス
ルーホールを形成することができる。Secondly, regarding the conduction of the holes, since the holes are drilled after forming the solder resist on both sides, there is no flow into the holes of the solder resist, and when the masking of the final plating catalyst is done by offset printing. Since the ink film is thin and the ink does not flow into the holes, chemical copper plating can be performed accurately over the entire required area, and a completely conductive through hole can be formed.
従って、本発明によれば、品質的にも、経済的にも優れ
た両面スルーホール印刷回路基板を製作することができ
る。Therefore, according to the present invention, it is possible to manufacture a double-sided through-hole printed circuit board that is excellent in quality and economy.
第１図乃至第９図は本発明に基づく両面スルーホール印
刷回路基板の製作を工程順に示す断面図で、第１図は両
面に銅箔が接着された絶縁基板、第２図は同上Ｓ板に回
路部及びハンダ付予定部にエツチングレジストインキに
よるパターンを形成した基板、第３図は同上基板をエツ
チングした基板、第４図は同上基板のレジスト層を除去
した基板、第５図は同上基板のハンダ付予定部を除く他
の部分を絶縁樹脂層で被覆した基板、第６図はハンダ付
予定部の所定位置にスルーホール用孔をあけた基板、第
７図は同上基板の全面にメッキ処理用の触媒を付着させ
た基板、第８図は同上基板のハンダ付予定部を残し他の
部分をソルダーレジストインキで被覆した基板、第９図
はハンダ付予定部を選択的に化学銅メッキして完成した
両面スルーホール印刷回路基板を示している。
図中、（２）はｌｑ箔、（３）はエツチングレジストイ
ンキ、（４）は回路部、（４′）はハンダ付予定部、（
５）は絶縁性樹脂、（６）は孔、（８）はソルダーレジ
ストインキ、（９）は銅メッキ層を夫々示している。Figures 1 to 9 are cross-sectional views showing the manufacturing process of a double-sided through-hole printed circuit board according to the present invention in the order of steps. Figure 3 shows a board with a pattern formed with etching resist ink on the circuit area and the area to be soldered, Figure 4 shows a board with the resist layer removed from the same board, Figure 5 shows a board with the resist layer removed. Figure 6 shows a board with through-holes drilled at the predetermined positions of the soldering parts, and Figure 7 shows the entire surface of the same board covered with an insulating resin layer. A board with a processing catalyst attached to it; Figure 8 shows a board with the parts to be soldered on the same board covered with solder resist ink; Figure 9 shows selective chemical copper plating in the parts to be soldered. The completed double-sided through-hole printed circuit board is shown. In the figure, (2) is lq foil, (3) is etching resist ink, (4) is the circuit part, (4') is the part to be soldered, (
5) indicates an insulating resin, (6) a hole, (8) a solder resist ink, and (9) a copper plating layer.
Claims (1)
印刷によりエッチングレジストパターンを形成した後、
電解研磨又はエッチング等により非パターン部の導電層
を腐蝕し、導体回路を形成せしめ、次いでエッチングレ
ジスト皮膜を剥離する工程。 ｂ）上記ａ）工程により形成された回路のうちハンダ付
予定部を除いた他の部分を絶縁性樹脂層で被覆する工程
。 ｃ）ハンダ付予定部の所定個所に孔あけ加工を施す工程
。 ｄ）基板全体に化学銅メッキのための前処理をする工程
。 ｅ）前記ｂ）工程により形成された樹脂層面に耐メッキ
レジスト層を被覆する工程。 ｆ）孔内壁及びハンダ付予定部の導体上に化学銅メッキ
を施す工程。 以上ａ）乃至ｆ）の工程よりなることを特徴とする両面
スルーホール印刷回路基板の製造方法。 ２、ａ）工程のレジストパターンのオフセット印刷が同
一パターンの重ね刷りであることを特徴とする特許請求
の範囲第１項に記載の両面スルーホール印刷回路基板の
製造方法。 ３、重ね刷りが印刷皮膜の硬化処理後に次の重ね刷りを
行うことを特徴とする特許請求の範囲第２項に記載の両
面スルーホール印刷回路基板の製造方法。 ４、印刷皮膜の硬化方法が印刷皮膜に対する加熱又は活
性エネルギー線の照射であることを特徴とする特許請求
の範囲第３項に記載の両面スルーホール印刷回路基板の
製造方法。[Claims] 1. a) After forming an etching resist pattern by offset printing on an insulating substrate having conductive layers on both sides,
A process of corroding the conductive layer in non-patterned areas by electrolytic polishing or etching to form a conductor circuit, and then peeling off the etching resist film. b) A step of covering the circuit formed in step a) above with an insulating resin layer except for the portion to be soldered. c) A step of drilling holes at predetermined locations in the area to be soldered. d) A step of pre-treating the entire board for chemical copper plating. e) A step of coating the surface of the resin layer formed in step b) with a plating-resistant resist layer. f) A step of applying chemical copper plating to the inner wall of the hole and the conductor in the area to be soldered. A method for manufacturing a double-sided through-hole printed circuit board, characterized by comprising the steps a) to f) above. 2. The method for manufacturing a double-sided through-hole printed circuit board according to claim 1, wherein the offset printing of the resist pattern in step a) is overprinting of the same pattern. 3. The method for manufacturing a double-sided through-hole printed circuit board according to claim 2, wherein the next overprinting is performed after the curing treatment of the printed film. 4. The method for manufacturing a double-sided through-hole printed circuit board according to claim 3, wherein the method for curing the printed film is heating the printed film or irradiating the printed film with active energy rays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26969384A JPS61147596A (en) | 1984-12-21 | 1984-12-21 | Manufacture of double side through hole printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26969384A JPS61147596A (en) | 1984-12-21 | 1984-12-21 | Manufacture of double side through hole printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61147596A true JPS61147596A (en) | 1986-07-05 |
Family
ID=17475871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26969384A Pending JPS61147596A (en) | 1984-12-21 | 1984-12-21 | Manufacture of double side through hole printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61147596A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01268882A (en) * | 1988-04-15 | 1989-10-26 | Showa Alum Corp | Surface treatment of resin coating on metallic material |
| JPH01268884A (en) * | 1988-04-15 | 1989-10-26 | Showa Alum Corp | Surface treatment of resin coating on metallic sliding member |
| JP2017202574A (en) * | 2016-05-09 | 2017-11-16 | Ｄｉｃグラフィックス株式会社 | Printed matter having matte feeling and manufacturing method therefor |
| JPWO2019171965A1 (en) * | 2018-03-09 | 2020-04-16 | Ｄｉｃグラフィックス株式会社 | Active energy ray curable ink, method for producing cured ink, and printed matter |
| JP2021038330A (en) * | 2019-09-04 | 2021-03-11 | Ｄｉｃグラフィックス株式会社 | Active energy ray-curable ink for lithographic offset printing, method for producing ink cured product, and printed matter |
-
1984
- 1984-12-21 JP JP26969384A patent/JPS61147596A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01268882A (en) * | 1988-04-15 | 1989-10-26 | Showa Alum Corp | Surface treatment of resin coating on metallic material |
| JPH01268884A (en) * | 1988-04-15 | 1989-10-26 | Showa Alum Corp | Surface treatment of resin coating on metallic sliding member |
| JP2017202574A (en) * | 2016-05-09 | 2017-11-16 | Ｄｉｃグラフィックス株式会社 | Printed matter having matte feeling and manufacturing method therefor |
| JPWO2019171965A1 (en) * | 2018-03-09 | 2020-04-16 | Ｄｉｃグラフィックス株式会社 | Active energy ray curable ink, method for producing cured ink, and printed matter |
| JP2021038330A (en) * | 2019-09-04 | 2021-03-11 | Ｄｉｃグラフィックス株式会社 | Active energy ray-curable ink for lithographic offset printing, method for producing ink cured product, and printed matter |
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