JPS61147587A - Light-emitting diode - Google Patents
Light-emitting diodeInfo
- Publication number
- JPS61147587A JPS61147587A JP59270373A JP27037384A JPS61147587A JP S61147587 A JPS61147587 A JP S61147587A JP 59270373 A JP59270373 A JP 59270373A JP 27037384 A JP27037384 A JP 27037384A JP S61147587 A JPS61147587 A JP S61147587A
- Authority
- JP
- Japan
- Prior art keywords
- light
- convex lens
- emitting element
- light emitting
- curved surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 230000004907 flux Effects 0.000 claims abstract description 6
- 238000000605 extraction Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 abstract description 6
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は信号灯、車輌用灯具、表示灯、光通信装置及び
各種センナ等の光源として使用される可視光又は赤外線
を放射する発光ダイオードに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a light emitting diode that emits visible light or infrared rays and is used as a light source for signal lights, vehicle lights, indicator lights, optical communication devices, various sensors, etc. It is.
一、般にこの種の光源用発光ダイオードとしては、第３
図に示した構造のものが公知である。この公知の発光ダ
イオードにおいて、１はＧａＰ系又はＧａＡｓＰ系の発
光素子であり、該発光素子は一方のリードフレーム２の
凹部２ａ内にマウントされ、他方のリードフレーム３と
の間においてワイヤ４がボンディングされ、これらが一
体向に樹脂モールドされると共に凸状のレンズ部５が形
成されたものである。このレンズ部５の前端側、即ち光
束が照射される側の端部５ａは、光線を光軸Ｘに沿って
平行光線にすべく球面形状に形成されている。Generally speaking, this kind of light emitting diode for light source is
The structure shown in the figure is known. In this known light emitting diode, 1 is a GaP-based or GaAsP-based light emitting element, and the light emitting element is mounted in a recess 2a of one lead frame 2, and a wire 4 is bonded between it and the other lead frame 3. These are integrally molded with resin, and a convex lens portion 5 is formed. The front end side of the lens portion 5, that is, the end portion 5a on the side where the light beam is irradiated is formed into a spherical shape so as to make the light beam parallel to the optical axis X.
このような構成の発光ダイオードにおいて、）光素子１
から放射される光線の内、球面状の端部５ａで平行光線
になる範囲は角度θ１ （約６０°）である。又、リー
ドフレーム２に設けた凹部２ａはその内部が光沢メツ−
１されており、発光素子１から側面方向に出る光を前面
側に反射させているが、この反射光において、第４図に
示したように、実線の矢印が発光素子１の中心から放射
された光で、点線の矢印が素子端面から放射された光で
あって、これら光線の自前面側に反射されて有効光線と
なるのはθ２ （約２０°）の範囲である。従って、全
体として見た時に前面側に向う有効光線の角度範囲はθ
＋２０２であり、その他の角度範囲θ３ （約４０°
）が有効光線として全く利用されない範囲になる。尚、
前記したＧａＰ系及びＧａＡｓＰ系の発光素子の発光指
向特性は第５図のグラフ中で曲線６で示した通りである
。In the light emitting diode having such a configuration, the optical element 1
Among the light rays emitted from the spherical end portion 5a, the range in which the light rays become parallel is an angle θ1 (approximately 60°). Moreover, the inside of the recess 2a provided in the lead frame 2 is made of glossy metal.
1, and the light emitted from the light emitting element 1 in the side direction is reflected toward the front side. In this reflected light, as shown in FIG. The dotted arrow indicates the light emitted from the element end face, and these light rays are reflected to the self-front side and become effective light rays within the range of θ2 (approximately 20°). Therefore, when viewed as a whole, the angular range of the effective ray toward the front side is θ
+202, and the other angle range θ3 (approximately 40°
) is not used as an effective ray at all. still,
The light emission directivity characteristics of the GaP-based and GaAsP-based light emitting elements described above are as shown by curve 6 in the graph of FIG.
このグラフに基いて前記した有効光線となる範囲を見る
と、発光素子１から放射される光の内、前面側θ１の角
度範囲と側面側の限られた角度範囲〇 が利用されるこ
とになるが、角°度範囲θ２の輝度は極めて少なくこれ
らの範囲が利用されたにしても大１】な照度アップは望
めない。特に第４図における凹部２ａでの反射を詳細に
考えると、四部２ａの開口部の直径は発光素子１の外形
寸法の約３〜５倍であり、発光素子１は一般に素子全体
で発光するため、点光源とみなすことができず、実際の
凹部２ａでの反射光はほとんどが無効な方向に反射され
ることが多い。従って、凹部２ａによる反射面があった
にしても発光素子１から放射される輝度の高い角度範囲
θ３が全く利用されず、しかも反射面からの光も一部し
か利用できないので発光ダイオード全体としての照度ア
ップは期待できない。Looking at the range of effective light rays mentioned above based on this graph, of the light emitted from the light emitting element 1, the angular range θ1 on the front side and the limited angular range 〇 on the side side are utilized. However, the luminance in the angular range θ2 is extremely low, and even if these ranges are utilized, a significant increase in illuminance cannot be expected. In particular, if we consider in detail the reflection at the concave part 2a in FIG. , cannot be regarded as a point light source, and most of the light actually reflected by the recess 2a is often reflected in an invalid direction. Therefore, even if there is a reflective surface due to the recess 2a, the angular range θ3 in which the luminance is high emitted from the light emitting element 1 is not utilized at all, and only a part of the light from the reflective surface can be used, so that the light emitting diode as a whole You can't expect an increase in illumination.
本発明は、従来例における発光素子から放射された光の
利用度の悪い問題点を解決しようとするものである。The present invention aims to solve the problem of poor utilization of light emitted from light emitting elements in conventional examples.
本発明は前記した問題点を解決するための具体的手段と
して、発光素子をリードフレーム、ステム又は基板上に
マウントすると共に、ワイヤーボンディングし、これら
部分を光透過性の樹脂によりモールドし、該樹脂モール
ドの上部中央部に凸レンズ部を形成し、該凸レンズ部を
囲うようにして平行光線取出部を一体に形成し、該平行
光線取出部の側面外周を前記発光素子から放射される側
面方向の光束を企及ｇＡ−１する放物曲面に形成したこ
とを特徴とする発光ダイオードを提供するものであって
、凸レンズ部を囲うようにして平行光線取出部を設けた
ことで発光素子からの側面方向の放射光を全部前面側に
平行光線として反射し、これら反射光が全て有効光線と
して利用できるので発光ダイオードの輝度を大巾にアッ
プさせることができる。The present invention, as a specific means for solving the above-mentioned problems, mounts a light emitting element on a lead frame, stem, or substrate, performs wire bonding, and molds these parts with a light-transmitting resin. A convex lens part is formed in the upper central part of the mold, a parallel light extraction part is integrally formed so as to surround the convex lens part, and the side surface outer periphery of the parallel light extraction part is used to direct the light beam in the side direction emitted from the light emitting element. The present invention provides a light emitting diode characterized in that it is formed into a parabolic curved surface having the following characteristics, and a parallel light extraction section is provided so as to surround a convex lens section, thereby reducing light emitted from the light emitting element in the lateral direction. All of the emitted light is reflected to the front side as parallel rays, and all of this reflected light can be used as effective rays, so the brightness of the light emitting diode can be greatly increased.
次に本弁明を図示の実施例に基き更に詳しく説明すると
、１１はＧａＰ系及びＧａＡＳＰ系の発光素子であり、
該発光素子は一方のリードフレーム１２の旧都にマウン
１−されると共に他方のリードフレーム１３との間にお
いてワイＡ７−１４がボンディングされ電気的に接続さ
れている。このように接続された発光素子１１と両リー
ドフレーム１２．１３の上端部分を光透過性の樹脂によ
りモールドして凸レンズ部１５を形成し、該凸レンズ部
の光束が照射される側の端部１５ａは球面形状に形成さ
れている。Next, to explain the present invention in more detail based on the illustrated embodiment, 11 is a GaP-based and GaASP-based light emitting element,
The light emitting element is mounted on the old part of one lead frame 12 and is electrically connected to the other lead frame 13 by bonding wires A7-14. The upper end portions of the light emitting element 11 and both lead frames 12.13 connected in this way are molded with a light-transmitting resin to form a convex lens portion 15, and the end portion 15a on the side to which the light beam of the convex lens portion is irradiated is formed. is formed into a spherical shape.
前記凸レンズ１５を取囲むようにして平行光線取出部１
６を一体に形成し、該平行光線取出部はその全体形状を
椀形に形成し、上面１６ａを平坦にすると共に外周面１
６ｂが曲面に形成されている。この曲面は前記発光素子
１１を焦点とする放物曲面に形成されており、発光素子
１１から放射される光線の内、凸レンズ部１５の端部１
５ａに至らない側面方向の光線全部を１１４而側に光軸
Ｘと平行になるように反射させるものである。The parallel light extraction section 1 surrounds the convex lens 15.
6 are integrally formed, and the parallel light extraction section has a bowl-shaped overall shape, with a flat upper surface 16a and a flat outer peripheral surface 1.
6b is formed into a curved surface. This curved surface is formed into a parabolic curved surface with the light emitting element 11 as the focal point, and among the light rays emitted from the light emitting element 11, the end portion of the convex lens portion 15
All light rays in the side direction that do not reach 5a are reflected to the 114 side so as to be parallel to the optical axis X.
このようにして形成された発光ダイオードから有効な平
行光線を取出すための設計は、光透過性樹脂の屈折率を
ｎとした場合、中央部に設けた凸レンズ部１５の形状及
び大きさは、長径を２ｎＤとし短径を２ｆ１ｆ１−＝］
−りの回転楕円形とする。１但し、発光素子１１の発光
部中心と凸レンズ１５の頂点までの距離を（ｎ＋１）Ｄ
とする。そして、平行光線取出部１６の外周面１６ａは
、発光素子１１の発光部中心を焦点とする回転放物面に
形成する。The design for extracting effective parallel light from the light emitting diode formed in this way is such that, when the refractive index of the light-transmitting resin is n, the shape and size of the convex lens portion 15 provided in the center are is 2nD and the minor axis is 2f1f1−=]
- It is a spheroidal shape. 1 However, the distance between the center of the light emitting part of the light emitting element 11 and the apex of the convex lens 15 is (n+1)D
shall be. The outer circumferential surface 16a of the parallel light extraction section 16 is formed into a paraboloid of revolution having a focal point at the center of the light emitting section of the light emitting element 11.
いづれにしても、平行光線取出部１６の外周面の曲面１
６ｂが放物曲面に形成されているので発光素子１１から
横方向に出る光線を全部有効光線となるように前部側に
反射させるものである。尚、実施例において発光素子を
リードフレームに取付（）た場合について述べたが、ス
テム又は基板上にマウントした場合でも同じぐある。In any case, the curved surface 1 of the outer peripheral surface of the parallel ray extraction part 16
Since the light emitting element 6b is formed into a parabolic curved surface, all of the light rays emitted from the light emitting element 11 in the lateral direction are reflected toward the front side so as to become effective light rays. Incidentally, in the embodiment, the case where the light emitting element is attached to a lead frame has been described, but the same applies when the light emitting element is mounted on a stem or a substrate.
以上説明したように本発明に係る発光ダイオードは、中
央部に凸レンズ部を形成し、該凸レンズ部を取囲むよう
にして平行光線取出部を一体に形成し、該平行光線取出
部の側面外周発光素子を焦点とする放物曲面に形成され
ており、発光素子からｌｌ１ｔ）Ｊされる光束の内、前
記凸レンズ部の上部曲面（レンズ面）から平行光線が取
出せることは勿論であり、凸レンズ部から外れた全ての
光束をも放物曲面により前面側に光軸と略平行に反射さ
せて導出することができ、有効光束が増大して発光ダイ
オードの照度を大巾にアップさせることができるといい
う優れた効果を奏する。As explained above, the light emitting diode according to the present invention has a convex lens part formed in the center, a parallel light extraction part integrally formed to surround the convex lens part, and a light emitting element on the side surface of the parallel light extraction part. It is formed into a parabolic curved surface that serves as a focal point, and of the light beam emitted from the light emitting element, it goes without saying that parallel rays can be extracted from the upper curved surface (lens surface) of the convex lens section, and parallel rays can be extracted from the upper curved surface (lens surface) of the convex lens section. The parabolic curved surface allows all the luminous flux to be reflected to the front side approximately parallel to the optical axis and guided out, increasing the effective luminous flux and greatly increasing the illuminance of the light emitting diode. It has a great effect.
第１図は本発明に係る発光ダイオードの断面図、第２図
は同発光ダイオードの斜視図、第３図は従来例の発光ダ
イオードの断面図、第４図は同発光ダイオードの要部の
みを拡大して示した略図、第５図は発光素子の発光指向
特性のグラフである。
１１・・・発光素ｒ−１２，１３・・・リードフレーム
１４・・・ワイヤー １５・・・凸レンズ部１６・・・
平行光線取出部 １６ｂ・・・放物曲面１７・・・中空
部 １８・・・間隙
１９・・・光透過性の樹脂
特許出願人 スタンレー電気株式会社第３図
第４図
手龜たン市−正古
昭和６０年３り？日
１、事件の表示
昭和５９年 特 許 願 第２７０３７３号２゜発明の
名称
発光ダイオード
３、補正をする者
事件との関係 出 願 人
名 称 （２３０）スタンレー電気株式会社（
発送日）昭和 年 月 日
７、補正の内容
（１）本願明細書中、特許請求の範囲の欄を別紙の通り
訂正づる。
（２）同書中、下記頁及び行に該当する「平行光線」を
「略平行光線」と訂正する。
記
夏 Ｕ
２ １５、１９
（３）同書中、下記頁及び行に該当する「放物曲面」を
「略放物曲面」と訂正する。
夏 行
６ ８〜９
７ ４．１５
（４）同書中、第６頁、第１２行目の「平行」を「略平
行」と訂正する。
（５）同書中、第８頁、第１２〜１３行目の「１７・・
・・・・中空部・・・・・・・・・・・・の樹脂］を削
除する。
（１）発光素子をリードフレーム、ステム又は基板上に
マウントづると共に、ワイヤーボンディングし、これつ
音光透過性の樹脂によりモールドし、該樹脂モールドの
上部中央部に凸レンズ部を形成し、該凸レンズ部を囲う
ようにして平行光線取出部を一体に形成し、該平行光線
取出部の側面外周を前記発光素子から放射される側面方
向の光束を全反射する略放物曲面に形成したことを特徴
とする発光ダイオード。
（２） ＋１ｉｊ記凸レンズ部は回転楕円形状であり、
前記略放物曲面は発光素子を焦点とする回転放物面であ
ることを特徴とする前記１項記載の発光ダイオード。Fig. 1 is a sectional view of a light emitting diode according to the present invention, Fig. 2 is a perspective view of the same light emitting diode, Fig. 3 is a sectional view of a conventional light emitting diode, and Fig. 4 shows only the main parts of the same light emitting diode. The enlarged schematic diagram, FIG. 5, is a graph of the light emission directional characteristics of the light emitting element. 11... Light emitting element r-12, 13... Lead frame 14... Wire 15... Convex lens portion 16...
Parallel ray extraction part 16b... Parabolic curved surface 17... Hollow part 18... Gap 19... Light transmitting resin Patent applicant Stanley Electric Co., Ltd. Figure 3 Figure 4 Tekatsun City - 3rd year of 1985? Day 1, Indication of the case 1982 Patent Application No. 270373 2゜Name of the invention Light-emitting diode 3, Person making the amendment Relationship to the case Applicant name (230) Stanley Electric Co., Ltd. (
Date of dispatch) Month, Day 7, 1939 Contents of amendment (1) The scope of claims column in the specification of the present application is corrected as shown in the attached sheet. (2) In the same book, "parallel rays" corresponding to the following page and line are corrected to "substantially parallel rays." Chika U 2 15, 19 (3) In the same book, "parabolic curved surface" corresponding to the following page and line is corrected to "substantially parabolic curved surface". Summer Line 6 8-9 7 4.15 (4) In the same book, on page 6, line 12, "parallel" is corrected to "substantially parallel." (5) In the same book, page 8, lines 12-13, “17...
・・・・・・Hollow part ・・・・・・・・・Resin] is deleted. (1) Mount the light emitting element on a lead frame, stem, or substrate, wire bond it, mold it with a sound-light transparent resin, form a convex lens part in the upper center of the resin mold, and form the convex lens part on the upper center of the resin mold. A parallel light extraction part is integrally formed so as to surround the parallel light extraction part, and the side surface outer periphery of the parallel light extraction part is formed into a substantially parabolic curved surface that totally reflects the luminous flux emitted from the light emitting element in the side direction. light emitting diode. (2) The +1ij convex lens portion has a spheroidal shape,
2. The light emitting diode according to item 1, wherein the substantially parabolic curved surface is a paraboloid of rotation with the light emitting element as a focal point.
Claims (2)
マウントすると共に、ワイヤーボンディングし、これら
部分を光透過性の樹脂によりモールドし、該樹脂モール
ドの上部中央部に凸レンズ部を形成し、該凸レンズ部を
囲うようにして平行光線取出部を一体に形成し、該平行
光線取出部の側面外周を前記発光素子から放射される側
面方向の光束を全反射する放物曲面に形成したことを特
徴とする発光ダイオード。(1) Mount the light emitting element on a lead frame, stem, or substrate, wire bond it, mold these parts with a light-transmitting resin, form a convex lens part in the upper center of the resin mold, and form the convex lens part on the upper center of the resin mold. A parallel light extraction part is integrally formed so as to surround the parallel light extraction part, and the side surface outer periphery of the parallel light extraction part is formed into a parabolic curved surface that totally reflects the luminous flux emitted from the light emitting element in the side direction. light emitting diode.
曲面は発光素子を焦点とする回転放物面であることを特
徴とする前記１項記載の発光ダイオード。(2) The light emitting diode according to item 1, wherein the convex lens portion has a spheroidal shape, and the parabolic curved surface is a paraboloid of revolution with the light emitting element as a focal point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59270373A JPS61147587A (en) | 1984-12-21 | 1984-12-21 | Light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59270373A JPS61147587A (en) | 1984-12-21 | 1984-12-21 | Light-emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61147587A true JPS61147587A (en) | 1986-07-05 |
| JPH0422356B2 JPH0422356B2 (en) | 1992-04-16 |
Family
ID=17485353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59270373A Granted JPS61147587A (en) | 1984-12-21 | 1984-12-21 | Light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61147587A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003204083A (en) * | 2001-12-28 | 2003-07-18 | Toshiba Corp | Condensing lens, light emitting element incorporating lens, and lighting unit |
| JP2005142447A (en) * | 2003-11-07 | 2005-06-02 | Sharp Corp | Light emitting device, light receiving device, electronic apparatus, and manufacturing method of lens |
| US6940704B2 (en) | 2001-01-24 | 2005-09-06 | Gelcore, Llc | Semiconductor light emitting device |
| JP2007065425A (en) * | 2005-08-31 | 2007-03-15 | Sanyo Electric Co Ltd | Illuminating device and projection type video display device using same |
| JP2018152402A (en) * | 2017-03-10 | 2018-09-27 | シチズン電子株式会社 | Light-emitting device |
| GB2564660A (en) * | 2017-07-14 | 2019-01-23 | Wolf Safety Lamp Company Ltd The | Providing illumination in potentially explosive atmospheres |
| WO2020137636A1 (en) * | 2018-12-25 | 2020-07-02 | 株式会社小糸製作所 | Optical unit |
| EP1472712B1 (en) * | 2002-02-06 | 2020-08-26 | Gentex Corporation | Sensor configuration for substantial spacing from a small aperture |
-
1984
- 1984-12-21 JP JP59270373A patent/JPS61147587A/en active Granted
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6940704B2 (en) | 2001-01-24 | 2005-09-06 | Gelcore, Llc | Semiconductor light emitting device |
| JP2003204083A (en) * | 2001-12-28 | 2003-07-18 | Toshiba Corp | Condensing lens, light emitting element incorporating lens, and lighting unit |
| EP1472712B1 (en) * | 2002-02-06 | 2020-08-26 | Gentex Corporation | Sensor configuration for substantial spacing from a small aperture |
| JP2005142447A (en) * | 2003-11-07 | 2005-06-02 | Sharp Corp | Light emitting device, light receiving device, electronic apparatus, and manufacturing method of lens |
| JP2007065425A (en) * | 2005-08-31 | 2007-03-15 | Sanyo Electric Co Ltd | Illuminating device and projection type video display device using same |
| JP2018152402A (en) * | 2017-03-10 | 2018-09-27 | シチズン電子株式会社 | Light-emitting device |
| GB2564660A (en) * | 2017-07-14 | 2019-01-23 | Wolf Safety Lamp Company Ltd The | Providing illumination in potentially explosive atmospheres |
| GB2564660B (en) * | 2017-07-14 | 2020-09-09 | Wolf Safety Lamp Company Ltd (The) | Providing illumination in potentially explosive atmospheres |
| WO2020137636A1 (en) * | 2018-12-25 | 2020-07-02 | 株式会社小糸製作所 | Optical unit |
| US11441753B2 (en) | 2018-12-25 | 2022-09-13 | Koito Manufacturing Co., Ltd. | Optical unit |
| US11573000B2 (en) | 2018-12-25 | 2023-02-07 | Koito Manufacturing Co., Ltd. | Optical unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0422356B2 (en) | 1992-04-16 |
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