GB2564660A - Providing illumination in potentially explosive atmospheres - Google Patents

Providing illumination in potentially explosive atmospheres Download PDF

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Publication number
GB2564660A
GB2564660A GB1711502.3A GB201711502A GB2564660A GB 2564660 A GB2564660 A GB 2564660A GB 201711502 A GB201711502 A GB 201711502A GB 2564660 A GB2564660 A GB 2564660A
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GB
United Kingdom
Prior art keywords
substrate
support portion
lens portion
encapsulating material
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB1711502.3A
Other versions
GB2564660B (en
GB2564660A8 (en
GB201711502D0 (en
GB2564660B8 (en
Inventor
Charles Morley Michael
Wilkes Ian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolf Safety Lamp Co Ltd
Original Assignee
Wolf Safety Lamp Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolf Safety Lamp Co Ltd filed Critical Wolf Safety Lamp Co Ltd
Priority to GB1711502.3A priority Critical patent/GB2564660B8/en
Publication of GB201711502D0 publication Critical patent/GB201711502D0/en
Publication of GB2564660A publication Critical patent/GB2564660A/en
Publication of GB2564660B publication Critical patent/GB2564660B/en
Application granted granted Critical
Publication of GB2564660A8 publication Critical patent/GB2564660A8/en
Publication of GB2564660B8 publication Critical patent/GB2564660B8/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00—Safety devices structurally associated with lighting devices
    • F21V25/12—Flameproof or explosion-proof arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0054—Processes for devices with an active region comprising only group IV elements
    • H01L33/0058—Processes for devices with an active region comprising only group IV elements comprising amorphous semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

Light emitting diodes 402 are mounted on substrate 403, which may be a metal clad circuit board. Above each LED 402 is a collimating device 401, including a solid lens 404 portion, to direct light by total internal reflection, and a support 405 portion, attached to substrate 403 (optionally using lugs). The support 405 surrounds the lens 404, with an air gap 406 between. An encapsulating material contacts an outer surface 409 of the support 405 (figure 8). The apparatus may be used in an explosive atmosphere; the encapsulant isolating the LED, a possible ignition source. A sealing gasket 417 may be between the support 405 and substrate 403. The air gap 406 prevents encapsulating material contacting the lens 404; reducing light absorption, and increasing light output. The lens may be parabolic, and the support cylindrical. The substrate edges may be folded, forming a tray to receive the encapsulating material.

Description

Providing Illumination in Potentially Explosive Atmospheres
The present invention relates to an apparatus for providing illumination in a potentially explosive atmosphere. The present invention also relates to a method of fabricating an apparatus for illuminating spaces having 5 potentially explosive atmospheres.
Apparatus for illuminating work areas in potentially explosive atmospheres are known. A potentially explosive atmosphere may be created by the presence of gases, vapours, mists or dusts; and reference to potentially explosive atmospheres as used herein refers to the presence of 10 any of these substances, in any possible combination.
To avoid ignition, any potential ignition source must be contained and protected from the potentially explosive atmosphere in the work area.
Recently, there has been a trend towards using light emitting diodes and it is known to arrange a plurality of such diodes in an array, each with a 15 collimating lens. However, a problem has been identified when using devices of this type in that optical properties of the lenses can be altered by the presence of an encapsulant.
According to a first aspect of the present invention, there is provided an apparatus for providing illumination in a potentially explosive atmosphere, 20 comprising: a plurality of light emitting diodes mounted on a substrate for connection to a power supply; a collimating device located above each said light emitting diode and secured to said substrate; and an encapsulating material, wherein each said collimating device includes: a solid internal lens portion configured to collimate incident light from a respective light emitting 25 diode by total internal reflection; and an external support portion attached to said substrate and configured to support said solid internal lens portion, wherein: said support portion surrounds said solid internal lens portion and defines an air-gap between an outer surface of said solid internal lens portion and an inner surface of said support portion; and said encapsulating 30 material contacts an outer surface of said support portion.
In an embodiment, the lens portion and the support portion are defined by a unified moulding. An optical material used for the unified moulding may be non-exclusively selected from a list of materials including polycarbonates and poly(methyl methacrylate).
In an embodiment, the outer surface of the solid internal lens portion is substantially parabolic. Furthermore, in an embodiment, the support portion may be substantially cylindrical, although other shapes may be deployed.
In an embodiment, a base portion extends from the bottom of the support portion and one or more lugs extend from the support portion to engage with respective holes in the substrate. Furthermore, in an embodiment, a gasket may be provided between the bottom of the support portion and the substrate.
According to a second aspect of the present invention, there is provided a method of fabricating an apparatus for illuminating spaces having potentially explosive atmospheres, comprising the steps of: mounting a plurality of light emitting diodes onto a substrate that includes a circuit board; locating a collimating device above each said light emitting diode, in which each said collimating device has a solid internal lens portion configured to collimate incident light from a respective light emitting diode by total internal reflection, and an external support portion configured to support said internal lens portion and surround said internal lens portion, such that an air-gap is defined between an outer surface of said solid internal lens portion and an inner surface of said support portion; and encapsulating said collimating devices by applying encapsulating material that contacts outer surfaces of said external support portions.
In an embodiment, the method further comprises the step of folding edges of the substrate to define an enclosed tray for receiving said encapsulating material. To achieve this, the substrate may be constructed 30 from a metal-clad circuit board to retain a folded shape during the introduction of the encapsulating material. In an embodiment, the encapsulating material is non-exclusively selected from a list of materials including silicone based materials, epoxy-resin based materials and polyurethane based materials.
The invention will now be described by way of example only, with reference to the accompanying drawings, of which:
Figure 1 shows an example of a light emitting diode mounted on a substrate;
Figure 2 shows the light emitting diode of Figure 1 with a collimating lens;
Figure 3 shows the collimating lens of Figure 2 surrounded by an encapsulating material;
Figure 4 shows a collimating device embodying the present invention; Figure 5 shows a plurality of light emitting diodes mounted on a substrate;
Figure 6 shows electrical connections for the light emitting diodes shown in Figure 5;
Figure 7 shows a collimating device being located on a substrate; Figure 8 shows a cross-section of the devices after the introduction of an encapsulant;
Figure 9 shows a top view of an array of encapsulated devices; and
Figure 10 shows a mounting of the array of Figure 9 in an enclosure to provide an apparatus for providing illumination in potentially explosive atmospheres.
Figure 1
An example of a light emitting diode 101 mounted on a substrate 102 is shown in Figure 1. To energise the diode 101, it is connected to a power supply as is known in the art.
In the configuration shown in Figure 1, the light emitting diode 101 will radiate light in virtually all directions above the plane of the substrate 102, as 30 illustrated by semi-sphere 103. Examples of light rays are indicated at 104, 105, 106, 107 and 108.
In an application for providing illumination in potentially explosive atmospheres, it is often desirable for the light to be directed towards a specific area, possibly representing a work area where operatives require illumination. Thus, it is preferable for a significant amount of the light emitted 5 by the diode 101 to propagate substantially in the direction of arrow 106, representing a more concentrated beam rather than a wide-angle dispersion, as illustrated in Figure 1.
Figure 2
Light emitting diode 101 is again shown in Figure 2, mounted to 10 substrate 102. A solid collimating lens 201 has been deployed above the diode 101 such that, by a process of total internal reflection, light rays 104, 105, 107 and 108 are refracted so as to be emitted in a direction substantially parallel with ray 106. To achieve this, an internal surface 202 of the lens 201 is substantially parabolic.
Figure 3
The device of Figure 2 is required to provide illumination in a potentially explosive atmosphere. Thus, to avoid ignition, potential ignition sources must be isolated from the potentially explosive atmosphere and an option for achieving this is illustrated in Figure 3. In this example, the light 20 emitting diode 101 has been isolated from a potentially explosive atmosphere 301 by the presence of an encapsulant 302 arranged to surround the lens 201.
In the configuration of Figure 3, light ray 106 continues to be emitted in a fashion substantially similar to that illustrated in Figure 2. However, the 25 presence of the encapsulant 302 results in a degree of light absorption, such that the intensity of rays 104, 105,107 and 108 are diminished significantly.
Figure 4
A collimating device 401 embodying the present invention is illustrated in Figure 4, located above a light emitting diode 402 and mounted on a 30 substrate 403. In an embodiment, the substrate 403 is a metal-clad circuit board arranged to provide electrical power to the light emitting diode 402.
The collimating device 401 includes a solid internal lens portion 404, substantially similar to lens 201 shown in Figure 2. Thus, the solid lens portion 404 is configured to collimate incident light from the light emitting 5 diode 402 by total internal reflection.
The configuration of Figure 2 has been modified to provide an external support portion 405 attached to substrate 403 and thereby configured to support the solid internal lens portion 404.
To overcome the problem identified and described with reference to 10 Figure 3, the support portion 405 surrounds the solid internal lens portion 404 and defines an air gap 406 between an outer surface 407 of the solid internal lens portion 404 and an inner surface 408 of the support portion 405. In this way, it is possible for an encapsulating material to be introduced that contacts an outer surface 409 of the support portion 405. Thus, with a 15 plurality of light emitting diodes configured with a collimating device of the type shown in Figure 4, it is possible to provide an apparatus that produces an acceptable level of light output while being capable of operating in a potentially explosive atmosphere.
In the embodiment shown in Figure 4, the lens portion 404 and the 20 support portion 405 are defined by a unified moulding. The lens portion 404 and the support portion 405 are moulded in an optical material, such as a polycarbonate or poly(methyl methacrylate) often identified as PMMA.
In this embodiment, an inner surface of the solid internal lens portion 404 is substantially parabolic. This is surrounded by the support portion 405 25 which, in an embodiment, may be substantially cylindrical, although other configurations, such as substantially square-shaped configurations, may be adopted.
In this embodiment, a first base portion 410 extends from the bottom 411 of the support portion 405. Similarly, a second base portion 412 extends 30 from the bottom of the support portion 405. A first lug 413 extends from the first base portion 410 to engage within a hole 414 within substrate 403. Similarly, a second lug 415 extends from base portion 412 to engage within a second hole 416 within the substrate 403.
To improve the seal between an outside atmosphere and the light 5 emitting diode 402, a gasket 417 is provided between the bottom of the support portion 405 and the substrate 403.
Figure 5
The present invention provides a method of fabricating an apparatus for illuminating spaces in potentially explosive atmospheres. A plurality of 10 light emitting diodes 501 to 518 are mounted on a substrate 519 that includes a circuit board. In an embodiment, the substrate 519 is fabricated as a metal-clad circuit board to facilitate the transfer of heat away from diodes 501 to 518. As is known in the art, electrical contacts are electrically isolated from the metal cladding. Electrically insulating components may be placed in 15 contact with the cladding to facilitate the transfer of heat away from the devices; the cladding thereby providing a heat-sink.
Before the application of collimating devices, the substrate 519 is scored along a first line 521, along a second line 522, along a third line 523 and along a fourth line 524. Corner portions 525, 526, 527 and 528 are then 20 removed, thereby allowing the resulting edges to be folded to define an enclosed tray, as illustrated in Figure 8.
In this embodiment, a circuit board contains a total of eighteen light emitting diodes 501 to 518 configured to receive electrical power from a power supply.
The method of fabrication continues by locating a respective collimating device 401 above each light emitting diode, of the type described with reference to Figure 4. In an embodiment, each collimating device 401 includes a base portion 402 from which extends a first lug (as shown in Figure 4) configured to engage with a first hole, along with a second lug 30 configured to engage with a second hole.
In an embodiment, central securing holes 531, 532, 533 and 534 are provided for securing the circuit board within an enclosure, as illustrated in Figure 10.
Figure 6
As illustrated in Figure 6, in an embodiment, a group of light emitting diodes are electrically connected in series with a balance resistor and a plurality of these series connected groups are connected in parallel. In an embodiment, a first group 601 is defined, along with a second group 602 and a third group 603. Each group includes six light emitting diodes connected in 10 series. Each series connection includes a balance resistor 604 and a fuse 605. In an embodiment, sixteen point five volts are applied across each group and fuse 605 is rated at six hundred and thirty milliamps.
Figure 7
In order to fabricate an apparatus for illuminating spaces having 15 potentially explosive atmospheres, light emitting diodes 501-518 have been mounted onto the substrate 519. A collimating device 701 is located above each light emitting diode, in which each collimating device has a solid internal lens portion configured to collimate incident light from a respective light emitting diode by total internal reflection and an external support portion 20 configured to support the internal lens portion and surround the internal lens portion, such that an air-gap is defined between an outer surface of the solid internal lens portion and an inner surface of the support portion.
In this embodiment, the circuit board substrate 519 is printed to show indications 702 as to where the collimating devices, such as device 701, are 25 to be located. Furthermore, when locating the collimating devices, a first lug is located in a first hole 703 and second lug is located in a second hole 704.
To secure the substrate 519 within an enclosure, holes 531 to 534 are surrounded by bushes 705 to 708, thereby allowing bolts to be inserted through the encapsulating material.
Figure 8
After a collimating device has been located above each light emitting device attached to the substrate 519, edges of the substrate (including a first edge 801 and a second edge 802) are folded to define an enclosed tray 803 for receiving the encapsulating material. An enclosed tray of this type is shown in cross-section in Figure 8. In an embodiment, the substrate is constructed from a metal-clad circuit board that retains a folded shape during the introduction of the encapsulating material. As is known in the art, many types of encapsulating material may be deployed, such as a silicone based 10 material, an epoxy-resin based material or a polyurethane based material.
In Figure 8, three collimating devices 804, 805 and 806 are shown in cross-section. These include a cylindrical support portion 405, an internal lens portion 404 and an air-gap 408 between the two. In this way, the • · • · · · • · · • · encapsulating material 807 contacts an outer surface of the support portion that is provided primarily to support the internal lens portion at a correct position with respect to the light emitting device. However, in this application, the support portion also ensures that the encapsulating material, while providing the required level of encapsulation, is isolated from the internal lens portion 404.
Figure 9
A top view of the apparatus for providing illumination in a potentially explosive atmosphere is illustrated in Figure 9 after the introduction of encapsulating material 807. This shows an array of encapsulated collimating devices, including devices 701, 804, 805 and 806. Each of these devices is surrounded by the encapsulating material 901 but, as previously described; the encapsulating material 807 does not contact the internal lens portion 404 directly.
Bushes 705-708 maintain the integrity of holes 531 to 534, thereby facilitating the further construction of the array of Figure 9 within a protective carrying frame, as illustrated in Figure 10.
Figure 10
Two illuminating arrays 1001 A, 1001B are shown in Figure 10, each of the type illustrated in Figure 9. The arrays are mounted within an enclosure 1002 that is configured to receive energising power from a power cable 5 1003. To provide further protection and to assist with transportation, the enclosure 1002 is restrained within a protective carrying frame 1004.

Claims (20)

1. An apparatus for providing illumination in a potentially explosive atmosphere, comprising:
a plurality of light emitting diodes mounted on a substrate for
5 connection to a power supply;
a collimating device located above each said light emitting diode and secured to said substrate; and an encapsulating material, wherein each said collimating device includes:
10 a solid internal lens portion configured to collimate incident light from a respective light emitting diode by total internal reflection; and *··· an external support portion attached to said substrate and configured ”*· to support said solid internal lens portion, wherein:
. said support portion surrounds said solid internal lens portion and ···
15 defines an air-gap between an outer surface of said solid internal lens portion and an inner surface of said support portion; and said encapsulating material contacts an outer surface of said support • Z portion.
20
2. The apparatus of claim 1, wherein said lens portion and said support portion are defined by a unified moulding.
3. The apparatus of claim 2, wherein said lens portion and said support portion are moulded in an optical material non-exclusively selected
25 from a list of materials including polycarbonates and poly(methyl methacrylate).
4. The apparatus of any of claims 1 to 3, wherein an inner surface of said solid internal lens portion is substantially parabolic.
5. The apparatus of any of claims 1 to 4, wherein said support ··· portion is substantially cylindrical.
6. The apparatus of any of claims 1 to 5, wherein:
a base portion extends from the bottom of said support portion; and
5 one or more lugs extend from said support portion to engage with respective holes in said substrate.
7. The apparatus of any of claims 1 to 6, including a gasket located between bottoms of said support portion and said substrate.
8. The apparatus of any of claims 1 to 7, wherein edges of said • · • ··· substrate are folded to define an enclosed tray for receiving said • · encapsulating material.
• · • · • ··· ,:. 15
9. The apparatus of claim 8, wherein said substrate is constructed from a metal-clad circuit board that retains a folded shape during the *· *” J introduction of said encapsulating material.
10. The apparatus of any of claims 1 to 8, wherein said 20 encapsulating material is non-exclusively selected from a list of materials including silicone based materials, epoxy-resin based materials and polyurethane based materials.
11. A method of fabricating an apparatus for illuminating spaces 25 having potentially explosive atmospheres, comprising the steps of:
mounting a plurality of light emitting diodes onto a substrate that includes a circuit board;
locating a collimating device above each said light emitting diode, in which each said collimating device has a solid internal lens portion 30 configured to collimate incident light from a respective light emitting diode by total internal reflection, and an external support portion configured to support said internal lens portion and surround said internal lens portion, such that a gap is defined between an outer surface of said solid internal lens portion and an inner surface of said support portion; and encapsulating said collimating devices by applying encapsulating 5 material that contacts an outer surface of said external support portion.
12. The method of claim 11, further comprising the step of performing a moulding operation to define said solid internal lens portion and said external support portion.
• · • · • ··♦ f· • · • · • ···
13. The method of claim 12, wherein said collimating devices are moulded in a material non-exclusively selected from a list of materials including polycarbonates and poly(methyl methacrylate).
14. The method of any of claims 11 to 13, wherein an inner surface of said solid internal lens portion is substantially parabolic.
15. The method of any of claims 11 to 14, wherein said support portion is substantially cylindrical.
16. The method of any of claims 11 to 15, further comprising the step of locating each collimating device on said substrate by means of one or more lugs that extend from a base portion at the bottom of each said external support portion.
17. The method of any of claims 11 to 16, further comprising the step of deploying a gasket between the bottom of each external support portion to said substrate.
18. The method of any of claims 11 to 17, further comprising the step of folding edges of said substrate to define an enclosed tray for receiving said encapsulating material.
19. The method of claim 18, wherein said substrate is constructed from a metal-clad circuit board, to retain said folded shape during the
5 introduction of said encapsulating material.
20. The method of any of claims 11 to 19, wherein said encapsulating material is non-exclusively selected from a list of materials including silicone based materials, epoxy-resin based materials and
10 polyurethane based materials.
GB1711502.3A 2017-07-14 2017-07-14 Providing illumination in potentially explosive atmospheres Active GB2564660B8 (en)

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GB201711502D0 GB201711502D0 (en) 2017-08-30
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GB2564660B GB2564660B (en) 2020-09-09
GB2564660A8 GB2564660A8 (en) 2020-09-23
GB2564660B8 GB2564660B8 (en) 2020-09-23

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117606A1 (en) * 1983-01-28 1984-09-05 Xerox Corporation Collector for a LED array
JPS61147587A (en) * 1984-12-21 1986-07-05 Stanley Electric Co Ltd Light-emitting diode
WO2003048637A1 (en) * 2001-12-06 2003-06-12 Fraen Corporation S.R.L. High-heat-dissipation lighting module
GB2458345A (en) * 2008-03-12 2009-09-23 Dialight Lumidrives Ltd Sealed lighting unit having array of LEDs
DE102012101411A1 (en) * 2012-02-22 2013-08-22 R.Stahl Schaltgeräte GmbH Explosion-proof luminaire with cast-in optics
US20170175992A1 (en) * 2015-12-16 2017-06-22 Sieled Underwater lighting device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090009905A (en) * 2006-04-25 2009-01-23 코닌클리즈케 필립스 일렉트로닉스 엔.브이. Immersed leds

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117606A1 (en) * 1983-01-28 1984-09-05 Xerox Corporation Collector for a LED array
JPS61147587A (en) * 1984-12-21 1986-07-05 Stanley Electric Co Ltd Light-emitting diode
WO2003048637A1 (en) * 2001-12-06 2003-06-12 Fraen Corporation S.R.L. High-heat-dissipation lighting module
GB2458345A (en) * 2008-03-12 2009-09-23 Dialight Lumidrives Ltd Sealed lighting unit having array of LEDs
DE102012101411A1 (en) * 2012-02-22 2013-08-22 R.Stahl Schaltgeräte GmbH Explosion-proof luminaire with cast-in optics
US20170175992A1 (en) * 2015-12-16 2017-06-22 Sieled Underwater lighting device

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Publication number Publication date
GB2564660B (en) 2020-09-09
GB2564660A8 (en) 2020-09-23
GB201711502D0 (en) 2017-08-30
GB2564660B8 (en) 2020-09-23

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