JPS61146378A - Solvent washer - Google Patents
Solvent washerInfo
- Publication number
- JPS61146378A JPS61146378A JP26741984A JP26741984A JPS61146378A JP S61146378 A JPS61146378 A JP S61146378A JP 26741984 A JP26741984 A JP 26741984A JP 26741984 A JP26741984 A JP 26741984A JP S61146378 A JPS61146378 A JP S61146378A
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- tank
- main storage
- cleaning
- storage part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
の
この発明は、シリコンウェーハ等の被洗浄物から不純物
質を洗浄するのに用いて最適な溶剤洗浄槽に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a solvent cleaning tank that is most suitable for use in cleaning impurities from objects to be cleaned such as silicon wafers.
更り久ｌま
たとえばシリコンウェーハ等は、一般にミラーボリシン
グ後に、表面に付着している有機物やダスト等の不純物
質をとり除くために溶剤を用いて洗浄する必要がある。For example, silicon wafers and the like generally need to be cleaned using a solvent to remove impurities such as organic matter and dust adhering to the surface after mirror boring.
従来、ウェーハの溶剤による洗浄では、ウェーハをバッ
チ式で一定時間または一定数量洗浄処理した後に、洗浄
槽内の不純物質で汚れた溶剤を全量新液と交換していた
。Conventionally, when cleaning wafers with a solvent, after wafers are cleaned in a batch manner for a certain amount of time or a certain number of wafers, the entire amount of the solvent contaminated with impurities in the cleaning tank is replaced with fresh solution.
が ′ しよ と る
このような従来の溶剤洗浄槽は、溶剤中に溶解性、不溶
性の不純物質が蓄積するため、頻繁に溶剤を交換しない
と、所定の洗浄効果を維持できず、洗浄後のウェー八品
質の低下および溶剤の使用量が多いことから価値分析（
Ｖａｌｕｅ Ａｎａｌｙｓｉｓ ）上の問題がアった
。However, in conventional solvent cleaning tanks, soluble and insoluble impurities accumulate in the solvent, and the desired cleaning effect cannot be maintained unless the solvent is replaced frequently. Value analysis (
I have a problem with Value Analysis).
発」ＬΔｎ
この発明は、上述した問題点を解決するためになされた
ものであり、所定の洗浄効果を高いレベルで維持しなが
ら、被洗浄物を洗浄できるとともに、溶剤の使用量を大
幅に減少できる溶剤洗浄槽を提供することを目的として
いる。This invention was made in order to solve the above-mentioned problems, and it is possible to clean the object to be cleaned while maintaining a predetermined cleaning effect at a high level, and it also significantly reduces the amount of solvent used. The purpose is to provide a solvent cleaning tank that can
ユ」しλＪＬＬ
したがって、この目的を達成するためにこの発明は、被
洗浄物を溶剤で洗浄する溶剤洗浄装置において、複数個
の溶剤洗浄槽が配列され、後段の溶剤洗浄槽の主収容部
に供給された溶剤が四方面にあふれ出て補助収容部を経
て順次前段の溶剤洗浄槽の主収容部の底部から供給され
て前段の溶剤供給槽の主収容部を満たす構成の溶剤洗浄
槽群と、あふれ出た溶剤を一時収容する前記各補助収容
部の底部から対応する各溶剤洗浄槽の主収容部の底部に
溶剤を循環して不純物質をろ過する循環ろ過機構と、を
備えたことを特徴とする溶剤洗浄装置を要旨としている
。Therefore, in order to achieve this object, the present invention provides a solvent cleaning device for cleaning objects to be cleaned with a solvent, in which a plurality of solvent cleaning tanks are arranged and a main storage part of a subsequent solvent cleaning tank is provided. A group of solvent cleaning tanks configured such that the supplied solvent overflows in all directions, passes through an auxiliary storage part, is sequentially supplied from the bottom of the main storage part of the preceding solvent cleaning tank, and fills the main storage part of the preceding solvent supply tank. , a circulation filtration mechanism that circulates the solvent from the bottom of each of the auxiliary storage parts that temporarily stores overflowing solvent to the bottom of the main storage part of each corresponding solvent cleaning tank to filter impurities. The main points are the characteristic solvent cleaning equipment.
′ た の
複数個の溶剤洗浄槽２．３．４のうち、後段の溶剤洗浄
槽の主収容部に供給された溶剤を四方面にオーバフロー
して前段の溶剤洗浄槽の主収容部の底部から供給して満
たすとともに、あふれ出た溶剤を一時収容する補助収容
部１７．２６ａ、４０の底部から溶剤洗浄槽２．３．４
の主収容部１０．２６．３５の底部に対して循環ろ過機
構１９．３２．４２□により不純物質をろ過しながら溶
剤５をもどす構成である。' Among the plurality of solvent cleaning tanks 2.3.4, the solvent supplied to the main storage part of the latter solvent washing tank overflows in all directions and flows from the bottom of the main storage part of the previous solvent washing tank. The solvent cleaning tank 2.3.4 is supplied from the bottom of the auxiliary storage section 17.26a, 40 which temporarily stores the overflowing solvent.
The solvent 5 is returned to the bottom of the main storage part 10.26.35 while filtering impurities by a circulating filtration mechanism 19.32.42□.
各溶剤洗浄槽３．４の主収容部２６．３５内の溶剤５を
四方面にオーバフローさせて前段の溶剤洗浄槽２．３の
主収容部１０．２６の底部より供給し、しかも各溶剤洗
浄槽２．３．４の主収容部１０．２６．３５内の溶剤５
は、循環ろ過機構１９．３２．４２によりろ過されるの
で、不純物質が溶剤洗浄槽２．３．４に滞留せず、しか
も溶剤５の使用量を節減できる。The solvent 5 in the main storage section 26.35 of each solvent cleaning tank 3.4 is caused to overflow in all directions and is supplied from the bottom of the main storage section 10.26 of the preceding solvent cleaning tank 2.3. Solvent 5 in main container 10.26.35 of tank 2.3.4
is filtered by the circulation filtration mechanism 19.32.42, so that impurities do not remain in the solvent cleaning tank 2.3.4, and the amount of solvent 5 used can be reduced.
以下、図示の実施例によりこの発明を説明する。The present invention will be explained below with reference to illustrated embodiments.
第１図と第２図は、この発明の溶剤洗浄装置の好適な実
施例１を示している。外槽１内には複数の溶剤洗浄槽２
．３．４からなる溶剤洗浄槽群Ｇが配設しである。この
実施例では、溶剤洗浄槽群Ｇは前段、中段、後段の溶剤
洗浄槽を３個を有しているが、それより多くても少なく
てもよい。1 and 2 show a preferred embodiment 1 of the solvent cleaning device of the present invention. There are multiple solvent cleaning tanks 2 inside the outer tank 1.
．． A solvent cleaning tank group G consisting of 3.3 and 4 tanks is provided. In this embodiment, the solvent cleaning tank group G has three solvent cleaning tanks at the front stage, middle stage, and rear stage, but it may be more or less than that.
溶剤５が供給される溶剤洗浄槽２．３．４は、被洗浄物
であるウェーハＷの洗浄順方向（溶剤に浸す順序、第１
図矢印Ａで示す）に沿って順次配設されている。The solvent cleaning tank 2.3.4 to which the solvent 5 is supplied is used to clean the wafers W, which are the objects to be cleaned, in the forward cleaning direction (order of immersion in the solvent, first
(indicated by arrow A in the figure).
最も前段の溶剤洗浄槽２は、四方を囲む槽壁６と、区画
壁７．８．９を有している。The foremost solvent cleaning tank 2 has tank walls 6 surrounding it on all sides and partition walls 7.8.9.
槽！６で囲まれる主収容部１０および区画壁９と外槽１
で囲まれる導入部１１は、底部側の開口部１２によりつ
ながっている。Tank! The main storage part 10 surrounded by 6, the partition wall 9 and the outer tank 1
The introduction part 11 surrounded by is connected by an opening 12 on the bottom side.
第１図に示すように、区画壁９の上端は、区画壁８の上
端より所定高さｈｌだけ高く、槽壁６の上端は、区画壁
８の上端より所定高さｈ２だけ低くなっている。また、
区画壁７の上端は、槽壁６の上端より所定高さｈ３だけ
低くなっている。この所定高さｈｌ、ｈ２、ｈ３は、実
際には、たとえば５１Ｉｌｌ程度である。As shown in FIG. 1, the upper end of the partition wall 9 is higher than the upper end of the partition wall 8 by a predetermined height hl, and the upper end of the tank wall 6 is lower than the upper end of the partition wall 8 by a predetermined height h2. . Also,
The upper end of the partition wall 7 is lower than the upper end of the tank wall 6 by a predetermined height h3. The predetermined heights hl, h2, and h3 are actually about 51 Ill, for example.
槽壁６で囲まれる主収容部１０は、その槽底部に溶剤注
入口１３および溶剤排出口１４が設けである。この溶剤
排出口１４は、主収容部１０内にあるウェーハＷを洗浄
して汚れた溶剤５を、溶剤再生装置１５にもどしたり、
もしくは廃液処理槽１６に排出するためのものである。The main storage part 10 surrounded by the tank wall 6 is provided with a solvent inlet 13 and a solvent outlet 14 at the bottom of the tank. This solvent discharge port 14 is used to return the solvent 5 contaminated by cleaning the wafer W in the main storage part 10 to the solvent regenerating device 15,
Alternatively, it is for discharging into the waste liquid treatment tank 16.
この溶剤再生装置１５は、使用済みの溶剤５中に含まれ
る溶解性の不純物質をたとえば蒸留操作などにより除去
して溶剤５を新しく再生液にできる機能を有する。This solvent regenerating device 15 has a function of removing soluble impurities contained in the used solvent 5 by, for example, distillation, and making the solvent 5 a new regenerated liquid.
槽壁６、区画壁７．８および外槽１で囲まれる補助収容
部１７は、その槽底部に溶剤出口１８．１８が設けであ
る。この溶剤出口１８．１８は、循環ろ過機構１９を介
して溶剤注入口１３に接続しである。この循環ろ過機構
１９は、ポンプ２０ａとフィルタ２０ｂからなる。The auxiliary container 17, which is surrounded by the tank wall 6, the partition wall 7.8 and the outer tank 1, is provided with a solvent outlet 18.18 at the bottom of the tank. This solvent outlet 18.18 is connected to the solvent inlet 13 via a circulation filtration mechanism 19. This circulation filtration mechanism 19 consists of a pump 20a and a filter 20b.
また、区画壁７と外槽１とで囲まれる排出部２１には、
その槽底部に排出口２．２が設けである。この排出口２
２は、溶剤再生装置１５に接続しである。In addition, in the discharge section 21 surrounded by the partition wall 7 and the outer tank 1,
An outlet 2.2 is provided at the bottom of the tank. This outlet 2
2 is connected to the solvent regeneration device 15.
次に、中段である溶剤洗浄槽３は、四方を囲む槽壁２３
と、区画壁２４．２５を有している。Next, the solvent cleaning tank 3, which is the middle stage, has tank walls 23 surrounding it on all sides.
and partition walls 24 and 25.
槽壁２３で囲まれる主収容部２６および区画壁２４．２
５と外槽１で囲まれる導入部２７は、底部側の開口部２
８によりつながっている。Main storage part 26 and partition wall 24.2 surrounded by tank wall 23
5 and the outer tank 1, the introduction part 27 is surrounded by the opening 2 on the bottom side.
Connected by 8.
第１図に示すように、区画壁２５の上端は、区画壁２４
の上端より所定高さｈ４だけ高く、槽壁２３の上端は区
画！！２４の上端より所定高さｈ５だけ低くなっている
。また、槽壁２３の上端は、前記区画壁９の上端より所
定高さｈ６だけ高くなっている。この所定高さｈ４、ｈ
５、ｈ６はたとえば５■−に設定しである。As shown in FIG. 1, the upper end of the partition wall 25 is connected to the partition wall 24
Higher than the upper end by a predetermined height h4, the upper end of the tank wall 23 is partitioned! ! 24 by a predetermined height h5. Further, the upper end of the tank wall 23 is higher than the upper end of the partition wall 9 by a predetermined height h6. This predetermined height h4, h
5, h6 is set to 5■-, for example.
主収容部２６は、その槽底部に溶剤注入口２９および溶
剤排出口３０が設けである。この溶剤注入口２９は、主
収容部２６内にある汚れた溶剤５を溶剤再生装置１５に
もどしたり、もしくは廃液処理槽１６に排出するための
ものである。The main storage portion 26 is provided with a solvent inlet 29 and a solvent outlet 30 at the bottom of the tank. This solvent inlet 29 is for returning the dirty solvent 5 in the main storage portion 26 to the solvent regenerating device 15 or discharging it to the waste liquid treatment tank 16.
槽壁２３、区画壁９．２４および外槽１で囲まれる補助
収容部２６ａは、その槽底部に循環用の溶剤出口３１．
３１が設けである。The auxiliary storage part 26a surrounded by the tank wall 23, the partition wall 9.24 and the outer tank 1 has a solvent outlet 31. for circulation at the bottom of the tank.
31 is provided.
この溶剤出口３１，３１は、循環ろ過機構３２を構成す
る溶剤循環用のポンプ３３ａとフィルタ３３ｂを介して
溶剤注入口２９に接続されている。The solvent outlets 31, 31 are connected to the solvent inlet 29 via a solvent circulation pump 33a and a filter 33b that constitute a circulation filtration mechanism 32.
溶剤排出口３０は、汚れた溶剤５を溶剤再生装置１５に
もどしたり、もしくは直接廃液処理槽１６に溶剤５排出
するためのものである。The solvent discharge port 30 is for returning the dirty solvent 5 to the solvent regeneration device 15 or for discharging the solvent 5 directly to the waste liquid treatment tank 16.
次に最後段の溶剤洗浄槽４は、四方の槽壁３４を有して
おり、槽壁３４で囲まれた主収容部３５は、その槽底部
に溶剤注入口３６、溶剤供給口３７および溶剤排出口３
８が設けである。Next, the last stage solvent cleaning tank 4 has four tank walls 34, and a main storage part 35 surrounded by the tank walls 34 has a solvent inlet 36, a solvent supply port 37 and a solvent inlet at the bottom of the tank. Outlet 3
8 is a provision.
溶剤排出口３８は、溶剤排出口３０と同様に、汚れた溶
剤５を溶剤再生装置１５にもどしたり、もしくは直接廃
液処理槽１６に排出するためのものである。Like the solvent outlet 30, the solvent outlet 38 is for returning the dirty solvent 5 to the solvent regenerating device 15 or directly discharging it to the waste liquid treatment tank 16.
溶剤供給口３７は、溶剤の新液が収容された溶剤供給タ
ンク３９と、好ましくは再生液が収容された溶剤再生装
置１５に接続されて゛いる。すなわち、溶剤供給口３７
は、新液の溶剤５あるいは、蒸留再生された再生液の溶
剤５を供給するためにある。The solvent supply port 37 is connected to a solvent supply tank 39 containing fresh solvent and preferably to a solvent regenerating device 15 containing a regenerated liquid. That is, the solvent supply port 37
is provided to supply a new solvent 5 or a regenerated solvent 5 that has been regenerated by distillation.
槽壁３４、区画壁２５および外槽１とで囲まれた補助収
容部４０は、その槽底部に溶剤出口４１．４１が設けで
ある。この溶剤出口４１．４１は、循環ろ過機構４２を
構成するポンプ４３８とフィルタ４３ｂを介して溶剤注
入口３６に接続されている。The auxiliary storage part 40 surrounded by the tank wall 34, the partition wall 25 and the outer tank 1 is provided with a solvent outlet 41, 41 at the bottom of the tank. This solvent outlet 41.41 is connected to the solvent inlet 36 via a pump 438 and a filter 43b that constitute the circulation filtration mechanism 42.
また、槽壁５の上端は、区画壁２５の上端より所定高さ
ｈ７だけ高くなっており、所定高さｈ７はたとえば５１
程度である。Further, the upper end of the tank wall 5 is higher than the upper end of the partition wall 25 by a predetermined height h7, and the predetermined height h7 is, for example, 51 cm.
That's about it.
溶剤洗浄槽２．３．４の主収容部１０，２６．３５は、
第１図に示すように、キャリアＣを揺動する揺動装ＭＳ
が取付けられるようになっている（図では簡単化のため
に溶剤槽４にのみ揺動装置Ｓが描いである）。このキャ
リアＣにはウェーハＷが多数枚並べて配置しである。The main storage part 10, 26.35 of the solvent cleaning tank 2.3.4 is
As shown in FIG. 1, the swinging device MS swings the carrier C.
(In the figure, the swinging device S is shown only on the solvent tank 4 for the sake of simplicity). On this carrier C, a large number of wafers W are arranged side by side.
また、各溶剤洗浄槽２．３．４には、超音波洗浄装置、
溶剤の定量センサ、下限センサ、加熱防止および温度調
節用センサ、ざらにはフィルタのエア抜き用パイプやス
チームの出入管などが付設しであるが、図面の簡単化の
ために省略しである。In addition, each solvent cleaning tank 2.3.4 is equipped with an ultrasonic cleaning device,
A quantitative sensor for the solvent, a lower limit sensor, a sensor for preventing heating and controlling the temperature, a pipe for removing air from the filter, a pipe for steam in and out, etc. are included, but these have been omitted to simplify the drawing.
次に、上述した構成における作用を説明する。Next, the operation of the above-mentioned configuration will be explained.
まず、ウェーハＷの洗浄作業中の溶剤５の流れについて
説明する。First, the flow of the solvent 5 during the cleaning operation of the wafer W will be explained.
溶剤供給タンク３９から新液の溶剤５を、溶剤供給口３
７から最後段の溶剤洗浄槽４の主収容部３５に供給する
。この時、必要に応じて溶剤再生装置１５からも溶解性
の不純物質を除いた再生液（溶剤５）を供給する。供給
された溶剤５は、主収容部３５を満たして槽壁３４から
補助収容部４０側に四方面にあふれ出る（第１図と第２
図の矢印Ｂ方向）。Add new solvent 5 from the solvent supply tank 39 to the solvent supply port 3.
7 to the main storage section 35 of the last stage solvent cleaning tank 4. At this time, a regenerating liquid (solvent 5) from which soluble impurities have been removed is also supplied from the solvent regenerating device 15 as required. The supplied solvent 5 fills the main storage section 35 and overflows from the tank wall 34 to the auxiliary storage section 40 in all directions (see Figures 1 and 2).
(in the direction of arrow B in the figure).
主収容部３５からオーバフローして一時補助収容部４０
内に収容された溶剤５は、導入部２７側にあふれ出る。Overflows from the main storage section 35 and temporarily auxiliary storage section 40
The solvent 5 contained therein overflows to the introduction part 27 side.
補助収容部４０の溶剤５は、その底部側の分が溶剤出口
４１からポンプ４３ａとフィルタ４３ｂを介して溶剤注
入口３６より収容部３５内に゛もどされる。The bottom portion of the solvent 5 in the auxiliary storage section 40 is returned from the solvent outlet 41 into the storage section 35 through the solvent inlet 36 via the pump 43a and the filter 43b.
この時、常時溶剤５は、フィルタ４３ｂによりその不溶
性の不純物質が除去される。At this time, insoluble impurities are removed from the solvent 5 by the filter 43b.
一方、補助収容部４０からあふれ出た溶剤５は、溶剤洗
浄槽３の導入部２７側に移って開口部２８を介して主収
容部２６の底部より入って主収容部２６を満たす。主収
容部２６から四方面（第２図矢印（Ｄ）方向）にあふ□
れた溶剤５は、補助収容部２６ａを満たす。On the other hand, the solvent 5 overflowing from the auxiliary storage section 40 moves to the introduction section 27 side of the solvent cleaning tank 3 and enters from the bottom of the main storage section 26 through the opening 28 to fill the main storage section 26 . From the main storage part 26 in all directions (direction of arrow (D) in Figure 2)
The collected solvent 5 fills the auxiliary storage portion 26a.
主収容部２６からオーバフローした溶剤５は、溶剤出口
３１から出てポンプ３３ａとフィルタ３３ｂを介して不
溶性の不純物質を除去したのち、溶剤注入口２９より主
収容部２６内にもどされる。The solvent 5 that has overflowed from the main storage section 26 exits from the solvent outlet 31 and removes insoluble impurities via the pump 33a and filter 33b, and then is returned into the main storage section 26 through the solvent inlet 29.
さらに、補助収容部２６ａをあふれた溶剤５は、導入部
１１に移って開口部１２を通り主収容部１０を満たす。Further, the solvent 5 overflowing the auxiliary storage section 26a moves to the introduction section 11, passes through the opening 12, and fills the main storage section 10.
主収容部１０から四方面にあふれ出た（第２図矢印（Ｅ
）方向）溶剤５は、補助収容部１７に移る。一時補助収
容部１７内に収容された溶剤５は、溶剤出口１８から出
てポンプ２０ａとフィルタ２０ｂを経て清浄化されたの
ち、溶剤注入口１３から主収容部１０にもどされる。It overflowed from the main storage part 10 in all directions (arrow (E) in Figure 2).
) direction) The solvent 5 moves to the auxiliary storage section 17 . The solvent 5 temporarily accommodated in the auxiliary storage section 17 exits from the solvent outlet 18, passes through the pump 20a and the filter 20b, is purified, and then is returned to the main storage section 10 through the solvent inlet 13.
さらに、補助収容部１７からあふれた溶剤５は、排出部
２１に移り、排出口２２より溶剤再生装＠１５に使用済
溶剤としてもどされる。Further, the solvent 5 overflowing from the auxiliary storage section 17 moves to the discharge section 21 and is returned to the solvent recycling device @15 through the discharge port 22 as a used solvent.
ところで、溶剤再生装置１５で蒸溜等により溶解性の不
純物を取り除いて清浄化した溶剤は、再生液として溶剤
洗浄槽４の溶剤供給口３７から供給できる。Incidentally, the solvent purified by removing soluble impurities by distillation or the like in the solvent regenerating device 15 can be supplied from the solvent supply port 37 of the solvent cleaning tank 4 as a regenerating liquid.
上述したような溶剤５の流れにおける、ウェーハＷの溶
剤洗浄作業を説明する。The solvent cleaning operation of the wafer W in the flow of the solvent 5 as described above will be explained.
最初に多数のウェーハＷが載置されたキャリアＣは、溶
剤洗浄槽２の主収容部１０内の揺動装ｆｉｓ（簡単化の
ために図示せず）に載せられて、溶剤５に浸される。First, the carrier C on which a large number of wafers W are placed is placed on a swinging device fis (not shown for simplicity) in the main housing part 10 of the solvent cleaning tank 2, and is immersed in the solvent 5. Ru.
ウェーハＷは、揺動しかつ超音波を照射されながら溶剤
５により洗浄されて不溶性と溶解性の不純物質が脱落す
る。このうち、不溶性の不純物質は循環ろ過機構１９の
フィルタ２０ｂにより除去できる。The wafer W is cleaned by the solvent 5 while being rocked and irradiated with ultrasonic waves, and insoluble and soluble impurities are removed. Among these, insoluble impurities can be removed by the filter 20b of the circulation filtration mechanism 19.
次に上記キャリアＣは、引上げられて中間槽である溶剤
洗浄槽３の主収容部２６内の揺動装置Ｓ（簡単化のため
に図示せず）に載せられて、溶剤５に浸される。Next, the carrier C is pulled up and placed on a swinging device S (not shown for simplicity) in the main storage part 26 of the solvent cleaning tank 3, which is an intermediate tank, and is immersed in the solvent 5. .
各ウェーハＷは、溶剤洗浄槽３内においても溶剤洗浄槽
２内における場合と同様に、揺動しかつ超音波を照射さ
れながら溶剤５により洗浄されて、不溶性と溶解性の不
純物質が脱落する。このうち不溶性の不純物質はフィル
タ３３ｂにより除去できる。In the solvent cleaning tank 3, each wafer W is cleaned with the solvent 5 while being oscillated and irradiated with ultrasonic waves, in the same way as in the solvent cleaning tank 2, and insoluble and soluble impurities are removed. . Among these, insoluble impurities can be removed by the filter 33b.
さらに、キャリアＣは溶剤洗浄槽４の主収容部３５内の
揺動装置Ｓに移されて、溶剤５に浸される。各ウェーハ
Ｗは、溶剤供給タンク３９や溶剤再生装置１５から送ら
れてくる最も清浄な溶剤５（新液または再生液）により
最終洗浄され、わずかに残っていた不溶性と溶解性の不
純物質が洗浄される。Further, the carrier C is transferred to the swinging device S in the main storage portion 35 of the solvent cleaning tank 4 and immersed in the solvent 5. Each wafer W is finally cleaned with the cleanest solvent 5 (new solution or recycled solution) sent from the solvent supply tank 39 or the solvent regeneration device 15, and the slight remaining insoluble and soluble impurities are removed. be done.
このうち不溶性の不純物質は、フィルタ４３ｂにより除
去される。Among these, insoluble impurities are removed by the filter 43b.
このようにウェーハＷは、第１図矢印Ａで示す方向に沿
って、すなわち溶剤５の流れ方向と逆方向である溶剤槽
２．３．４の順に浸されて、効率よく不溶性と溶解性の
不純物質が洗浄される。そして、溶剤５は、ウェーハＷ
の洗浄順方向とは逆方向に段階的に（カスケード式）連
続して流れる。このうち、溶剤５に含まれる不溶性の不
純物質は、上述したように各フィルタ２０ｂ １３３ｂ
１４３ｂにより除去される。In this way, the wafer W is immersed in the solvent baths 2, 3, and 4 in the direction indicated by arrow A in FIG. Impurities are washed away. Then, the solvent 5 is applied to the wafer W.
Flows continuously in stages (cascade style) in the opposite direction to the forward cleaning direction. Among these, insoluble impurities contained in the solvent 5 are contained in each filter 20b 133b as described above.
143b.
また、溶剤５に含まれる溶解性の不純物質は、溶剤排出
口２２をへて溶剤再生装置１５により蒸留除去されて清
浄化される。Further, soluble impurities contained in the solvent 5 are distilled off and purified by the solvent regenerating device 15 through the solvent outlet 22.
溶剤槽２の最も汚れた溶剤５は、排出口２２により溶剤
再生装置１５により清浄化される。The dirtiest solvent 5 in the solvent tank 2 is cleaned by the solvent regenerating device 15 through the outlet 22 .
ところで、開口部１２．２８は、各溶剤洗浄槽２．３．
４の底部に大きく開口しているので、各溶剤洗浄槽２．
３．４の主収容部１０１２６．３５の底部に不溶性と溶
解性の不純物質が底部に蓄積することはない。By the way, the opening 12.28 is connected to each solvent cleaning tank 2.3.
4 has a large opening at the bottom, so each solvent cleaning tank 2.
Insoluble and soluble impurities do not accumulate at the bottom of the main container 10126.35 of 3.4.
また、この発明の溶剤洗浄装置は、各溶剤槽２．３．４
は、常に新液または溶剤再生装置１５により再生された
再生液を循環して流し、その流れにより不純物質の滞留
を防ぐようにしである。Further, the solvent cleaning device of the present invention has each solvent tank 2.3.4.
The new liquid or the regenerated liquid regenerated by the solvent regenerating device 15 is always circulated, and this flow prevents impurities from staying.
溶剤再生装置は、溶剤洗浄装置とは別個であってもよい
し、上述の実施例のように溶剤洗浄槽に直結してあって
もよく、この発明の溶剤洗浄装置の循環サイクル中に入
れれば、溶剤使用量の節減効果が大である。The solvent regeneration device may be separate from the solvent cleaning device, or may be directly connected to the solvent cleaning tank as in the above embodiment, and if it is included in the circulation cycle of the solvent cleaning device of the present invention. , the effect of reducing the amount of solvent used is significant.
なお、この発明の溶剤洗浄装置は、ウェーハに限らず他
のものの洗浄に用いることができる。Note that the solvent cleaning apparatus of the present invention can be used to clean not only wafers but also other things.
友１」ＬＬ
上述した実施例１では、導入部１１と主収容部１０を開
口部１２で接続し、導入部２７と主収容部２６を開口部
２８で接続していた。Friend 1'' LL In the first embodiment described above, the introduction section 11 and the main accommodating section 10 were connected through the opening 12, and the introduction section 27 and the main accommodating section 26 were connected through the opening 28.
これに対して、第３図の実施例２は以下の点で実施例１
と相違する。すなわち、溶剤洗浄槽３の導入部１１と主
収容部１０の各底部を配管１００で接続するとともに、
溶剤洗浄槽４の導入部２７と主収容部２６の各底部を配
管１２０で接続した点である。On the other hand, the second embodiment shown in FIG. 3 has the following points.
It differs from That is, while connecting the introduction part 11 of the solvent cleaning tank 3 and each bottom part of the main storage part 10 with the piping 100,
This is the point where the introduction part 27 of the solvent cleaning tank 4 and each bottom part of the main storage part 26 are connected by a pipe 120.
以上説明したように、この発明によれば、溶剤を各溶剤
洗浄槽の主収容部からオーバフローさせて前段の溶剤洗
浄槽の主収容部底部より供給し、しかも常時あふれ出た
溶剤を補助収容部の底部から出して不純物質を除去後に
溶剤洗浄槽の主収容部の底部に循環してもどすようにし
たので、溶剤の汚れ分の滞留がなくなり洗浄効果が向上
するばかりでなく、溶剤を再生して循環再利用するので
溶剤の使用量を大幅に節減できる効果がある。As explained above, according to the present invention, the solvent is caused to overflow from the main storage part of each solvent cleaning tank and is supplied from the bottom of the main storage part of the preceding solvent cleaning tank, and the overflowing solvent is always transferred to the auxiliary storage part. After removing impurities from the bottom of the solvent cleaning tank, the solvent is circulated back to the bottom of the main storage area of the solvent cleaning tank, which not only eliminates the retention of solvent dirt and improves the cleaning effect, but also regenerates the solvent. Because it is recycled and reused, it has the effect of significantly reducing the amount of solvent used.
第１図はこの発明の溶剤洗浄装置の実施例１を示す断面
図、第２図は実施例１の平面図、第３図はこの発明の実
施例２を示す断面図である。
Ｇ・・・溶剤洗浄槽群
２．３．４・・・溶剤洗浄槽
５・・・溶剤
１０．２６．３５・・・主収容部
１５・・・溶剤再生装置FIG. 1 is a sectional view showing a first embodiment of the solvent cleaning apparatus of the present invention, FIG. 2 is a plan view of the first embodiment, and FIG. 3 is a sectional view showing a second embodiment of the present invention. G...Solvent cleaning tank group 2.3.4...Solvent cleaning tank 5...Solvent 10.26.35...Main storage section 15...Solvent regeneration device
Claims (1)
浄槽の主収容部に供給された溶剤が四方面にあふれ出て
補助収容部を経て順次前段の溶剤洗浄槽の主収容部の底
部から供給されて前段の溶剤供給槽の主収容部を満たす
構成の溶剤洗浄槽群と、あふれ出た溶剤を一時収容する
前記各補助収容部の底部から対応する各溶剤洗浄槽の主
収容部の底部に溶剤を循環して不純物質をろ過する循環
ろ過機構と、を備えたことを特徴とする溶剤洗浄装置。[Claims] In a solvent cleaning device for cleaning objects to be cleaned with a solvent, a plurality of solvent cleaning tanks are arranged, and the solvent supplied to the main storage part of the subsequent solvent cleaning tank overflows in all directions. A group of solvent cleaning tanks configured to be supplied from the bottom of the main storage part of the solvent cleaning tank in the previous stage through the auxiliary storage part to fill the main storage part of the solvent supply tank in the previous stage, and each of the above-mentioned solvents for temporarily storing the overflowing solvent. A solvent cleaning device comprising: a circulation filtration mechanism that circulates solvent from the bottom of the auxiliary storage section to the bottom of the main storage section of each corresponding solvent cleaning tank to filter out impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26741984A JPS61146378A (en) | 1984-12-20 | 1984-12-20 | Solvent washer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26741984A JPS61146378A (en) | 1984-12-20 | 1984-12-20 | Solvent washer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61146378A true JPS61146378A (en) | 1986-07-04 |
| JPH0557033B2 JPH0557033B2 (en) | 1993-08-23 |
Family
ID=17444585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26741984A Granted JPS61146378A (en) | 1984-12-20 | 1984-12-20 | Solvent washer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61146378A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5769962A (en) * | 1990-03-16 | 1998-06-23 | Kabushiki Kaisha Toshiba | Cleaning method |
-
1984
- 1984-12-20 JP JP26741984A patent/JPS61146378A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5769962A (en) * | 1990-03-16 | 1998-06-23 | Kabushiki Kaisha Toshiba | Cleaning method |
| US5772781A (en) * | 1990-03-16 | 1998-06-30 | Kabushiki Kaisha Toshiba | Method for cleaning an object using an agent that includes a polyorganosiloxane or isoparaffin |
| US5833761A (en) * | 1990-03-16 | 1998-11-10 | Toshiba Silicone Co., Ltd. | Method of cleaning an object including a cleaning step and a vapor drying step |
| US5888312A (en) * | 1990-03-16 | 1999-03-30 | Toshiba Silicone Co., Ltd. | Cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0557033B2 (en) | 1993-08-23 |
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|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |