JPS61140565U - - Google Patents

Info

Publication number
JPS61140565U
JPS61140565U JP2265485U JP2265485U JPS61140565U JP S61140565 U JPS61140565 U JP S61140565U JP 2265485 U JP2265485 U JP 2265485U JP 2265485 U JP2265485 U JP 2265485U JP S61140565 U JPS61140565 U JP S61140565U
Authority
JP
Japan
Prior art keywords
circuit board
electronic circuit
holding film
component holding
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2265485U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2265485U priority Critical patent/JPS61140565U/ja
Publication of JPS61140565U publication Critical patent/JPS61140565U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による電子回路基板の部分断面
図、第２図、第３図、第４図は本考案による電子
回路基板の貫通孔内面に部品保持膜を付着させる
種々の方法を説明する図である。 １…回路基板、１ａ，１ｂ…回路パターン、２
…貫通孔、３…部品保持膜、４…導通部品、４ａ
…導通部品端部、５…半田。 FIG. 1 is a partial sectional view of an electronic circuit board according to the present invention, and FIGS. 2, 3, and 4 illustrate various methods for attaching a component holding film to the inner surface of a through hole of an electronic circuit board according to the present invention. It is a diagram. 1...Circuit board, 1a, 1b...Circuit pattern, 2
...Through hole, 3...Component holding membrane, 4...Conducting component, 4a
... End of conductive part, 5... Solder.

Claims (1)

【実用新案登録請求の範囲】 (1) 所定位置に形成した導通部品挿入用貫通孔
の内面に弾力性を有する部品保持膜を形成したこ
とを特徴とする電子回路基板。 (2) 前記部品保持膜が耐熱性を有することを特
徴とする実用新案登録請求の範囲第１項に記載の
電子回路基板。[Claims for Utility Model Registration] (1) An electronic circuit board characterized in that an elastic component holding film is formed on the inner surface of a through hole for inserting a conductive component formed at a predetermined position. (2) The electronic circuit board according to claim 1, wherein the component holding film has heat resistance.
JP2265485U 1985-02-21 1985-02-21 Pending JPS61140565U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2265485U JPS61140565U (en) 1985-02-21 1985-02-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2265485U JPS61140565U (en) 1985-02-21 1985-02-21

Publications (1)

Publication Number Publication Date
JPS61140565U true JPS61140565U (en) 1986-08-30

Family

ID=30515152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2265485U Pending JPS61140565U (en) 1985-02-21 1985-02-21

Country Status (1)

Country Link
JP (1) JPS61140565U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240358B2 (en) * 1973-11-27 1977-10-12
JPS53866A (en) * 1976-06-24 1978-01-07 Nippon Electric Co Printed circuit structure
JPS5749299A (en) * 1980-09-08 1982-03-23 Nippon Electric Co Printed board
JPS6010691A (en) * 1983-06-29 1985-01-19 日本電気ホームエレクトロニクス株式会社 Method of mounting chip part

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240358B2 (en) * 1973-11-27 1977-10-12
JPS53866A (en) * 1976-06-24 1978-01-07 Nippon Electric Co Printed circuit structure
JPS5749299A (en) * 1980-09-08 1982-03-23 Nippon Electric Co Printed board
JPS6010691A (en) * 1983-06-29 1985-01-19 日本電気ホームエレクトロニクス株式会社 Method of mounting chip part

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