JPS5851465U - printed circuit board equipment - Google Patents
printed circuit board equipmentInfo
- Publication number
- JPS5851465U JPS5851465U JP14538581U JP14538581U JPS5851465U JP S5851465 U JPS5851465 U JP S5851465U JP 14538581 U JP14538581 U JP 14538581U JP 14538581 U JP14538581 U JP 14538581U JP S5851465 U JPS5851465 U JP S5851465U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- semiconductor element
- mounting hole
- board equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は半導体素子の斜面図、第2図は従来のプリント
基板装置の斜面図、第3図はこの考案によるプリント基
板装置の分解斜面図、第4図は半導体素子を取付けた状
態を示す全体斜面図、第5図は第4図■−■線に沿う断
面図、第6図は接続変形例を示す断面図、第7図はさら
に他の接続変形例を示す断面図である。
11・・・チップ、11a・・・電極、21・・・プリ
ント基板、22・・・導電パターン、22a・・・チッ
プランド、23・・・実装孔。
第4図
第5図Figure 1 is a perspective view of a semiconductor element, Figure 2 is a perspective view of a conventional printed circuit board device, Figure 3 is an exploded perspective view of a printed circuit board device according to this invention, and Figure 4 shows a state in which the semiconductor element is attached. FIG. 5 is a sectional view taken along line 1--2 in FIG. 4, FIG. 6 is a sectional view showing a modification of the connection, and FIG. 7 is a sectional view of another modification of the connection. DESCRIPTION OF SYMBOLS 11... Chip, 11a... Electrode, 21... Printed circuit board, 22... Conductive pattern, 22a... Chip land, 23... Mounting hole. Figure 4 Figure 5
Claims (1)
板に取付ける半導体素子と、を備えるプリント基板装置
において、導電パターンに接続し得るように穿設した実
装孔を有するプリント基板と、実装孔中に陥入できる半
導体素子と、を備え、前記実装孔は半導体素子の厚さに
対応した幅と、半導体素子の長さに対応した長さをもち
、実装孔中に陥入した半導体素子の電極を導電パターン
に導通させると共に固定したことを特徴とするプリント
基板装置。A printed circuit board device comprising a printed circuit board having a conductive pattern and a semiconductor element attached to the printed circuit board, the printed circuit board having a mounting hole formed so as to be connected to the conductive pattern, and a mounting hole that can be inserted into the mounting hole. a semiconductor element, the mounting hole has a width corresponding to the thickness of the semiconductor element and a length corresponding to the length of the semiconductor element, and the electrode of the semiconductor element recessed into the mounting hole is formed into a conductive pattern. A printed circuit board device characterized by being electrically conductive and fixed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14538581U JPS5851465U (en) | 1981-09-30 | 1981-09-30 | printed circuit board equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14538581U JPS5851465U (en) | 1981-09-30 | 1981-09-30 | printed circuit board equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5851465U true JPS5851465U (en) | 1983-04-07 |
Family
ID=29938318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14538581U Pending JPS5851465U (en) | 1981-09-30 | 1981-09-30 | printed circuit board equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5851465U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60236282A (en) * | 1984-05-09 | 1985-11-25 | ロ−ム株式会社 | Electronic circuit board |
-
1981
- 1981-09-30 JP JP14538581U patent/JPS5851465U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60236282A (en) * | 1984-05-09 | 1985-11-25 | ロ−ム株式会社 | Electronic circuit board |
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