JPS61137240A - Optical disk substrate - Google Patents

Optical disk substrate

Info

Publication number
JPS61137240A
JPS61137240A JP59257600A JP25760084A JPS61137240A JP S61137240 A JPS61137240 A JP S61137240A JP 59257600 A JP59257600 A JP 59257600A JP 25760084 A JP25760084 A JP 25760084A JP S61137240 A JPS61137240 A JP S61137240A
Authority
JP
Japan
Prior art keywords
parts
weight
formula
optical disk
methyl group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59257600A
Other languages
Japanese (ja)
Inventor
Tetsuo Tajima
田島 哲夫
Hiroaki Miwa
広明 三輪
Ryoichi Sudo
須藤 亮一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Maxell Ltd
Original Assignee
Hitachi Ltd
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Maxell Ltd filed Critical Hitachi Ltd
Priority to JP59257600A priority Critical patent/JPS61137240A/en
Publication of JPS61137240A publication Critical patent/JPS61137240A/en
Pending legal-status Critical Current

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  • Optical Record Carriers And Manufacture Thereof (AREA)

Abstract

PURPOSE:To obtain an optical disk substrate having high sensitivity, high density and high reliability by using a cured resin compsn. curable by UV rays for a substratum layer. CONSTITUTION:The substratum layer is formed by curing the resin compsn. curable by UV rays compounded with 100pts.wt. the mixture composed of 60-80 pts.wt. the compd. expressed by the formula I and 40-20pts.wt. the compd. expressed by the formula II and 0.5-5.0pts.wt. a photopolymn. initiator by 100pts.wt. said mixture. The compd. expressed by the formula I is satisfactory if n is 1-20. The heat resistance thereof is inferior if n is larger than 20. R is satisfactory if hydrogen or methyl group; otherwise the reactivity is low and various characteristics of the cured matter are inferior. The compd. expressed by the formula II is satisfactory if n is 2-12. The heat resistance is inferior if n is larger than 12. R is satisfactory if hydrogen or methyl group; otherwise the reactivity is low and the various characteristics of the cured matter are inferior.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は光ディスク基板に係り、特にデジタルオーディ
オディスク、光学式ビデオディスク、メモリーディスク
など光で読みとる方式の光ディスク基板に関するもので
ある。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to an optical disk substrate, and particularly to an optical disk substrate of an optically readable type such as a digital audio disk, an optical video disk, and a memory disk.

〔発明の背景〕[Background of the invention]

光ディスクは、例えば第1図に示す様にガラス、透明プ
ラスチックスなどの透明基体1と、この上に形成された
サーボトラック用などの溝状や穴状の凹凸を有する下地
層2と、この下地層2の上に形成されたBi、 In、
Te、As、Pb、8n系などの記録用金属膜3とから
なる光ディスク基板二枚を、きよう体4で記録用金属膜
3が互いに一定間隔で対向するように保持し、このきよ
う体と透明基体間を接着剤(図示せず)で封着させたも
のである。
For example, as shown in FIG. 1, an optical disk consists of a transparent substrate 1 made of glass or transparent plastic, a base layer 2 formed thereon having groove-like or hole-like irregularities for servo tracks, and a base layer 2 formed on the base layer 2 having groove-like or hole-like irregularities formed thereon. Bi, In, formed on top of stratum 2
Two optical disk substrates each having a recording metal film 3 made of Te, As, Pb, 8n, etc. are held in a housing 4 so that the recording metal films 3 face each other at a constant distance. and a transparent substrate are sealed with an adhesive (not shown).

そして、光ビームを記録用金属膜3上に照射し、照射部
分の記録用金属膜を除去し、情報の単位としている。
Then, a light beam is irradiated onto the recording metal film 3, and the irradiated portion of the recording metal film is removed to form a unit of information.

このような光ディスク基板は第2図(a)〜(C)に示
すように製造される。すなわち、所定の凹凸を有するニ
ッケルなどの金属製スタンパ5と透明基体1との間に紫
外線硬化型レジンをはさみ込み、これを紫外線硬化させ
て下地層2を形成しく第2図(a))、金属製スタンパ
5をはがしく第2図6)))、凹凸を有する下地層の上
に記録用金属膜5を形成しく第2図(C))、これら二
枚の光ディスク基板を、きよう体により記録用金属膜が
互いに一定間隔で対向させ、きよう体と光ディスク基板
を接着して得ていた。
Such an optical disk substrate is manufactured as shown in FIGS. 2(a) to 2(C). That is, an ultraviolet curable resin is sandwiched between a stamper 5 made of metal such as nickel having predetermined irregularities and a transparent substrate 1, and is cured by ultraviolet rays to form a base layer 2 (FIG. 2(a)). The metal stamper 5 is peeled off and the recording metal film 5 is formed on the uneven underlayer (Fig. 2 (C)), and these two optical disc substrates are separated. The recording metal films were made to face each other at regular intervals through the body, and the body and the optical disk substrate were bonded together.

上記の下地層に用いる紫外線硬化レジン組成物は、次の
諸条件を満たさなければならない。
The ultraviolet curable resin composition used for the above-mentioned underlayer must satisfy the following conditions.

(イ)硬化物が光学的に透明であること。(a) The cured product must be optically transparent.

(ロ) ガラス、透明プラスチックなどの透明基板に良
く接着すること。
(b) Must adhere well to transparent substrates such as glass and transparent plastic.

(ハ) スタンパとはく離し易いこと。(c) It should be easy to separate from the stamper.

(ロ) 硬化物から記録用金属膜を腐食する物質を発生
しないこと。
(b) The cured product shall not generate substances that corrode the recording metal film.

(ホ) 長期間使用によって吸湿により変形して記録用
金属膜の形状が変化しないで%記録した信号を正確に読
み取れること。
(E) It is possible to accurately read the recorded signal without changing the shape of the recording metal film due to deformation due to moisture absorption after long-term use.

(へ)記録用金属膜を蒸着した凹凸の溝の熱安定性がす
ぐれ溝の深さが変ったり、形状が変化したりしないこと
(f) The uneven grooves on which the recording metal film is deposited have excellent thermal stability, and the depth of the grooves does not change or the shape changes.

())  500 r pm以上の高速回転に耐える機
械強度のあること。
()) Must have mechanical strength to withstand high speed rotation of 500 rpm or more.

が必要である。is necessary.

しかし、従来の紫外線硬化レジン組成物は、上記(イ)
〜(ト)の条件を同時に満たさなかった。
However, conventional ultraviolet curable resin compositions are
- (g) conditions were not simultaneously met.

代表的な従来例として、光ディスクに関する特開昭56
−127946号がある。
As a typical conventional example, Japanese Unexamined Patent Publication No. 1983 (1983) regarding optical discs
There is No.-127946.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、上記した従来技術の欠点をなくし、性
能の安定した光ディスク基板を提供することにある。
An object of the present invention is to eliminate the above-described drawbacks of the prior art and provide an optical disk substrate with stable performance.

〔発明の概要〕[Summary of the invention]

上記目的は、下記の一般式(菫)で示される化合物60
〜80軍量部、下記の一般式(2)で示される化合物4
0〜20重量部からなる混合物100重量部と、この混
合物100重量部に対して光重合開始剤05〜50重量
部を配合した紫外線硬化型レジン組成物を硬化させて下
地層とすることで達成される。
The above purpose is to obtain a compound 60 represented by the following general formula (violet).
~80 military parts, compound 4 represented by the following general formula (2)
Achieved by curing an ultraviolet curable resin composition containing 100 parts by weight of a mixture consisting of 0 to 20 parts by weight and 05 to 50 parts by weight of a photopolymerization initiator per 100 parts by weight of this mixture to form a base layer. be done.

(但し、式中のRは水素又はメチル基、nは整数でn 
= 1〜20) RR。
(However, R in the formula is hydrogen or a methyl group, and n is an integer.
= 1-20) RR.

(但し、式中のRは水素又はメチル基、nは整数でn 
= 2〜12) 上記一般式(1)の化合物はnが1〜20が良く、20
より大きいと耐熱性が低下する。また、Rは水素又はメ
チル基が良く、それ以外だと反応性が低下し、硬化物の
諸特性が低下する。
(However, R in the formula is hydrogen or a methyl group, and n is an integer.
= 2-12) In the compound of the above general formula (1), n is preferably 1-20, and 20
If it is larger, heat resistance will decrease. Further, R is preferably hydrogen or a methyl group; if it is other than that, the reactivity will be lowered and various properties of the cured product will be lowered.

上記一般式(2)の化合物はnが2〜12が良く、12
より大きいと耐熱性が低下する。またRは水素又はメチ
ル基が良く、それ以外だと反応性が低下し硬化物の諸特
性が低下する。
In the compound of the above general formula (2), n is preferably 2 to 12, and 12
If it is larger, heat resistance will decrease. Further, R is preferably hydrogen or a methyl group; if it is other than that, the reactivity will decrease and the properties of the cured product will deteriorate.

配合量は上記一般式(1)の化合物が80重量部より多
いと反応性が低下して硬化物の諸特性が低下する。また
、上記一般式(菫)の化合物が60重量部より少ないと
、耐湿性が低下する。
If the amount of the compound represented by the above general formula (1) is more than 80 parts by weight, the reactivity will decrease and various properties of the cured product will deteriorate. Moreover, if the amount of the compound of the above general formula (violet) is less than 60 parts by weight, the moisture resistance will decrease.

光重合開始剤は、たとえば以下に示すようなものが有効
である。すなわち、 ベンジル類、 ベンゾイン、ベンゾインエチルエーテル、ペンゾインイ
ングロビルエーテル、ベンゾインインブチルエーテルな
どのベンゾイン類。
As the photopolymerization initiator, for example, those shown below are effective. That is, benzyls, benzoins such as benzoin, benzoin ethyl ether, penzoin inglobil ether, and benzoin inbutyl ether.

1−ヒドロキシシクロへキシルベンゾフェノンなどのベ
ンゾフェノン類、 アセトフェノン類、 2−クロロチオキサントン、2−メチルチオキサントン
などのチオキサントン類、 2−エチルアントラキノン、2−メチルアントラキノン
などのアントラキノン類、 ベンジルジメチルケタールなどのベンジルケタール類、 などである。光重合開始剤の配合量は上記一般式(1)
と(2)の合計100重量部に対して0.5〜5.0重
量部が有効である。05重量部より少ないと反応性が低
下し硬化物の諸特性が低下する。また50重霊部より多
いと反応が速すぎ発熱が大きく硬化物にクラックを発生
したり不均一に硬化し諸特性が低下する。
Benzophenones such as 1-hydroxycyclohexylbenzophenone, acetophenones, thioxanthone such as 2-chlorothioxanthone and 2-methylthioxanthone, anthraquinones such as 2-ethylanthraquinone and 2-methylanthraquinone, benzyl ketal such as benzyl dimethyl ketal etc. The compounding amount of the photopolymerization initiator is according to the above general formula (1)
0.5 to 5.0 parts by weight is effective for a total of 100 parts by weight of (2) and (2). If the amount is less than 0.5 parts by weight, the reactivity will decrease and the properties of the cured product will deteriorate. On the other hand, if the amount is more than 50 parts, the reaction is too fast and heat generation is large, causing cracks in the cured product or non-uniform hardening, resulting in deterioration of various properties.

なお、上記光重合開始剤は単独もしくは二種類以上混合
して用いる。
The above photopolymerization initiators may be used alone or in combination of two or more.

また粘度調節、硬度調節、熱膨張係数の調節。Also viscosity adjustment, hardness adjustment, and thermal expansion coefficient adjustment.

吸湿性の低減、スタンパとのはく離性向上などを目的と
して、例えば以下に示す様なアクリレートやメタクリレ
ートを用いても良い。すなわち、ラウリルアクリレート
、ラウリルメタクリレート、トリデシルメタクリレート
、イソボルニルアクリレート、イソボルニルメタクリレ
ート、ネオペンチルグリコールジアクリレート、ネオペ
ンチルグリコールジメタクリレート、トリメチロールエ
タントリアクリレート、トリメチロールエタントリメタ
クリレート、トリメチロールプロパントリアクリレート
、トリメチロールプロパントリメタクリレート、1.6
−ヘキサンシオールジメタクリレート、  1.10−
デカンジオールジメタクリレートなどが有用である。
For example, acrylates and methacrylates as shown below may be used for the purpose of reducing hygroscopicity and improving releasability from the stamper. Namely, lauryl acrylate, lauryl methacrylate, tridecyl methacrylate, isobornyl acrylate, isobornyl methacrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, trimethylolethane triacrylate, trimethylolethane trimethacrylate, trimethylolpropane triacrylate. Acrylate, trimethylolpropane trimethacrylate, 1.6
-hexanethiol dimethacrylate, 1.10-
Decanediol dimethacrylate and the like are useful.

これらは、単独もしくは二種類以上混合して用いる。配
合割合は前記一般式(りと(2)の合計100重量部に
対して0〜40重量部である。
These may be used alone or in combination of two or more. The blending ratio is 0 to 40 parts by weight based on the total of 100 parts by weight of the general formula (2).

さらに、上記レジンの吸湿時の接着性をさらに安定化す
るために、例えば以下に示す様なシランカップリング剤
を添加することができる。
Furthermore, in order to further stabilize the adhesion of the resin upon moisture absorption, for example, a silane coupling agent as shown below can be added.

すなわち、r−アクリロキシグロビルトリメトキシシラ
ン、γ−メタクリロキシグロビルトリメトキシシラン、
ビニルトリメトキシシラン、ビニルトリエトキシシラン
、N−β−(N−4’ニルベンジルアミノ)エチル−γ
−アミ/フ。
That is, r-acryloxyglobil trimethoxysilane, γ-methacryloxyglobil trimethoxysilane,
Vinyltrimethoxysilane, vinyltriethoxysilane, N-β-(N-4'ylbenzylamino)ethyl-γ
-Ami/Fu.

ピルトリメトキシシラン・モノハロゲンクロライドなど
が有用である。
Pyrtrimethoxysilane, monohalogen chloride, etc. are useful.

これらは単独もしくは二種類以上混合して使用する。配
合割合は前記一般式(1)と(2)の合計100重量部
に対して0〜6.0重量部である。
These may be used alone or in combination of two or more. The blending ratio is 0 to 6.0 parts by weight based on the total of 100 parts by weight of the general formulas (1) and (2).

〔発明の実施例〕[Embodiments of the invention]

次に、本発明を実施例により更に詳細に説明する。前記
一般式(菫)で示される紫外線硬化型レジンは、以下(
ト)〜(ト)の化学式で表わされるものを用いた。
Next, the present invention will be explained in more detail with reference to Examples. The ultraviolet curable resin represented by the general formula (violet) has the following formula (
Those represented by the chemical formulas g) to (g) were used.

また、前記一般式(2)で示される紫外線硬化レジンは
、以下0〜σ)の化学式で表わされるものを用いた。
Further, as the ultraviolet curable resin represented by the general formula (2), one represented by the chemical formula 0 to σ below was used.

O 次に、レジン硬化物の各種特性の測定法を以下に示した
O Next, methods for measuring various properties of the cured resin product are shown below.

(1)耐湿性:60℃、 1000時間水中に放置し、
JISKIS911に準じて吸水率を求め耐湿性の良否
を判定した。記録用金属膜の溝の形状安定性についても
、上記と同一条件で放置し、変形し実用できないものを
「×」、はとんど変形がなく実用に耐えるものを「○」
とした。
(1) Moisture resistance: left in water at 60℃ for 1000 hours,
The water absorption rate was determined according to JIS KIS 911, and the quality of moisture resistance was determined. Regarding the shape stability of the grooves of the recording metal film, when left under the same conditions as above, those that are deformed and cannot be put to practical use are marked "×", and those that are hardly deformed and can be used for practical purposes are marked "○".
And so.

(2)  耐熱温度:製作した実機をある温度に100
0時間放置して、記録用金属膜の凹凸の溝の深さや形状
がほとんど変化なく実用に耐える温度を測定した。通常
は110℃程度必要である。
(2) Heat-resistant temperature: The manufactured actual machine is heated to a certain temperature at 100°C.
The recording metal film was left to stand for 0 hours, and the temperature at which the depth and shape of the grooves of the unevenness of the recording metal film hardly changed and withstand practical use was measured. Normally, a temperature of about 110°C is required.

(3)  光透過率:厚さ1唄のレジン板を作り、分光
光度計で830nmの光の透過率を測定して求めた。
(3) Light transmittance: This was determined by making a resin plate with a thickness of one song and measuring the transmittance of light at 830 nm using a spectrophotometer.

(4)  引張り強さ:実機で500rpmll上の高
速回転に耐える機械強度の目安として必要なもので、レ
ジン硬化物についてJISK+5911に準7  じて
求めた。
(4) Tensile strength: This is necessary as a measure of mechanical strength that can withstand high-speed rotation of 500 rpm or more in an actual machine, and was determined for cured resin products according to JISK+5911.

(6)  接着性:実機で60℃、1000 時間水中
放置した後、あるいは110tl:、1000時間加熱
した後のレジンとガラスまたは透明プラスチック(エポ
キシ系、アクリル系)などの透明基体と接着していて実
用上問題がないときを「○」問題があるときを「×」と
した。
(6) Adhesion: After being left in water at 60°C for 1,000 hours in an actual machine, or after being heated at 110 liters for 1,000 hours, the resin adheres to a transparent substrate such as glass or transparent plastic (epoxy-based, acrylic-based). When there is no practical problem, it is marked as "○", and when there is a problem, it is marked as "x".

用いたレジン組成を第1表に示す。A1−14は本発明
の実施例であり、AI5〜23は比較例である。これら
紫外線硬化型レジン組成物を紫外線硬化した場合の特性
を第2表にまとめた。なな、上記特性のうちでfll 
、 +2+ 、(5)の特性は実機を用いて測定した。
Table 1 shows the resin composition used. A1-14 are examples of the present invention, and AI5-23 are comparative examples. Table 2 summarizes the properties of these UV-curable resin compositions when UV-cured. Nana, among the above characteristics, full
, +2+, and (5) were measured using an actual machine.

すなわち、溝およびピットを有するニッケルスタンパと
直径300m+厚さ1.2簡のガラス板との間に第1表
に示す組成屋1〜23の紫外線硬化レジン組成物をはさ
み込み1of/lyd (2〜209/crl 、好ま
しくは5〜15F/6I)で加圧した後、高圧水銀灯で
150mw/c!t(50〜400 mvt/cr/l
、好ましくは100〜250mw/i )の紫外線を照
射してレジン組成物を硬化させた。そして、ガラス板を
スタンパからはがしたところスタンパと硬化した紫外線
硬化型レジン組成物の間ではがれ、硬化した紫外線硬化
型レジン組成物面上にはスタンバ上の凹凸加工部が正確
に転写された。
That is, ultraviolet curable resin compositions from composition shops 1 to 23 shown in Table 1 were sandwiched between a nickel stamper having grooves and pits and a glass plate with a diameter of 300 m and a thickness of 1.2 m, and 1 of/lyd (2 to 209/crl, preferably 5 to 15 F/6 I), then 150 mw/c with a high pressure mercury lamp! t (50-400 mvt/cr/l
The resin composition was cured by irradiation with ultraviolet rays (preferably 100 to 250 mw/i). When the glass plate was peeled off from the stamper, it was separated between the stamper and the cured ultraviolet curable resin composition, and the irregularities on the stamper were accurately transferred onto the surface of the cured ultraviolet curable resin composition. .

ガラス板に接着したレジンの凹凸面上にTe系記録膜を
蒸着法により約250λの厚さに付着せしめた後、二枚
を記録膜面を向い合わせにして約11111の空間をと
りながらガラス板周辺部分をエポキシ系接着剤を用いて
接着し、光ディスク基板を作成し、実機の特性を求めた
After adhering a Te-based recording film to a thickness of approximately 250λ by vapor deposition on the uneven surface of the resin adhered to the glass plate, the two sheets were placed on the glass plate with the recording film surfaces facing each other, leaving a space of approximately 11111 mm. The peripheral parts were glued together using epoxy adhesive to create an optical disk substrate, and the characteristics of the actual device were determined.

第1表と第2表を比較すると、一般式(1)で示される
化合物が60重量部より少ない比較例l61517.1
8,21,22.25は、すべて耐湿性が実施例I61
〜14に比べて悪かった。また、一般式(1)で示され
る化合物が80重量部より多い比較例l6161?、2
0は耐湿性の他に、耐熱温度も実施何屋1〜14に比べ
て低く、引張り強さ、接着性も同様に低1J)うた。
Comparing Tables 1 and 2, Comparative Example 161517.1 contains less than 60 parts by weight of the compound represented by general formula (1).
8, 21, 22.25 are all moisture resistant to Example I61.
It was worse than ~14. Also, Comparative Example 16161, which contains more than 80 parts by weight of the compound represented by the general formula (1)? ,2
In addition to moisture resistance, 0 has a lower heat resistance temperature than the samples 1 to 14, and its tensile strength and adhesiveness are also low (1J).

また、光重合開始剤の配合量が本発明範囲より少ない比
較例/l617と多い比較例Jf61Bはともに実施例
A1〜14に比べて耐湿性だけでt、c<、耐熱温度も
低く、引張り強さ、接着性も乏しかった。
In addition, both Comparative Example /l617 and Comparative Example Jf61B, in which the amount of the photopolymerization initiator contained is smaller than the range of the present invention, and Comparative Example Jf61B, which has a larger amount than the range of the present invention, have only moisture resistance, t, c<, lower heat resistance temperature, and tensile strength than Examples A1 to 14. Adhesion was also poor.

すなわち、これらのすべての特性を満足する紫外線硬化
型レジン組成物は実施例の&1〜14のものであり、光
ディスクとしての実機の動作特性、寿命特性を満足する
レジン組成は実施例の41〜14のみであった。
That is, the ultraviolet curable resin compositions that satisfy all of these characteristics are those in Examples &1 to 14, and the resin compositions that satisfy the operating characteristics and life characteristics of the actual device as an optical disk are those in Examples 41 to 14. It was only.

〔発明の効果〕〔Effect of the invention〕

以上述べたように、本発明によれば下地層に上記した紫
外線硬化型レジン組成物を硬化したものを用いることに
より高感度、高密度、高信頼性の光ディスク基板が得ら
れる。
As described above, according to the present invention, an optical disk substrate with high sensitivity, high density, and high reliability can be obtained by using a cured ultraviolet curable resin composition as described above for the underlayer.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明を適用する光ディスクの説明図、第2図
は光ディスクを作製する方法を示す説明図である。 1・・・透明基体    2・・・下地層3・・・記録
用金属膜  4・・・きよう体5・・・金属製スタンパ
FIG. 1 is an explanatory diagram of an optical disc to which the present invention is applied, and FIG. 2 is an explanatory diagram showing a method for manufacturing the optical disc. 1... Transparent substrate 2... Base layer 3... Metal film for recording 4... Covering body 5... Metal stamper

Claims (1)

【特許請求の範囲】 透明基体と、その上に設けられた情報信号と対応した凹
凸を有する下地層と、この上に設けられた記録膜層が順
次積層されてなる光ディスク基板において、上記下地層
が下記の一般式(1)で示される化合物60〜80重量
部、下記の一般式(2)で示される化合物40〜20重
量部よりなる混合物100重量部と、この混合物100
重量部に対して光重合開始剤0.5〜5.0重量部を配
合した紫外線硬化型レジン組成物を硬化させたものであ
ることを物徴とする光ディスク基板。 ▲数式、化学式、表等があります▼・・・・・・(1) (但し、式中のRは水素又はメチル基、nは整数でn=
1〜20) ▲数式、化学式、表等があります▼・・・・・・・・(
2) (但し、式中のRは水素又はメチル基、nは整数でn=
2〜12)
[Scope of Claims] An optical disc substrate comprising a transparent substrate, an underlayer provided thereon having unevenness corresponding to an information signal, and a recording film layer provided thereon, in which the underlayer is laminated in sequence. 100 parts by weight of a mixture consisting of 60 to 80 parts by weight of a compound represented by the following general formula (1) and 40 to 20 parts by weight of a compound represented by the following general formula (2), and 100 parts by weight of this mixture.
An optical disc substrate characterized by being a cured ultraviolet curable resin composition containing 0.5 to 5.0 parts by weight of a photopolymerization initiator. ▲There are mathematical formulas, chemical formulas, tables, etc.▼・・・・・・(1) (However, R in the formula is hydrogen or a methyl group, n is an integer, and n=
1-20) ▲There are mathematical formulas, chemical formulas, tables, etc.▼・・・・・・・・・(
2) (However, R in the formula is hydrogen or a methyl group, n is an integer, and n=
2-12)
JP59257600A 1984-12-07 1984-12-07 Optical disk substrate Pending JPS61137240A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59257600A JPS61137240A (en) 1984-12-07 1984-12-07 Optical disk substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59257600A JPS61137240A (en) 1984-12-07 1984-12-07 Optical disk substrate

Publications (1)

Publication Number Publication Date
JPS61137240A true JPS61137240A (en) 1986-06-24

Family

ID=17308517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59257600A Pending JPS61137240A (en) 1984-12-07 1984-12-07 Optical disk substrate

Country Status (1)

Country Link
JP (1) JPS61137240A (en)

Cited By (7)

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JP4543117B1 (en) * 2009-03-13 2010-09-15 株式会社東芝 Ultraviolet curable resin material for pattern transfer and method for producing magnetic recording medium using the same
JP2010218657A (en) * 2009-03-18 2010-09-30 Toshiba Corp Method for manufacturing magnetic recording medium
JP2010218605A (en) * 2009-03-13 2010-09-30 Toshiba Corp Ultraviolet-curable resin material for pattern transfer and method for manufacturing magnetic recording medium using the same
JP2010264758A (en) * 2010-06-15 2010-11-25 Toshiba Corp Pattern transfer method using ultraviolet curable resin material, and method of manufacturing semiconductor device using same
JP2011081902A (en) * 2010-12-08 2011-04-21 Toshiba Corp Method of manufacturing magnetic recording medium
JP2011090775A (en) * 2010-12-08 2011-05-06 Toshiba Corp Manufacturing method of semiconductor device
JP2011100538A (en) * 2010-11-29 2011-05-19 Toshiba Corp Method for manufacturing magnetic recording medium

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Publication number Priority date Publication date Assignee Title
US8070968B2 (en) 2009-03-13 2011-12-06 Kabushiki Kaisha Toshiba Ultraviolet-curable resin material for pattern transfer and magnetic recording medium manufacturing method using the same
JP2010218605A (en) * 2009-03-13 2010-09-30 Toshiba Corp Ultraviolet-curable resin material for pattern transfer and method for manufacturing magnetic recording medium using the same
JP2010218595A (en) * 2009-03-13 2010-09-30 Toshiba Corp Ultraviolet-curable resin material for pattern transfer and magnetic recording medium manufacturing method using the same
JP4543117B1 (en) * 2009-03-13 2010-09-15 株式会社東芝 Ultraviolet curable resin material for pattern transfer and method for producing magnetic recording medium using the same
US8372575B2 (en) 2009-03-13 2013-02-12 Kabushiki Kaisha Toshiba Ultraviolet-curing resin material for pattern transfer and magnetic recording medium manufacturing method using the same
US8551685B2 (en) 2009-03-13 2013-10-08 Kabushiki Kaisha Toshiba Ultraviolet-curing resin material for pattern transfer and magnetic recording medium manufacturing method using the same
JP2010218657A (en) * 2009-03-18 2010-09-30 Toshiba Corp Method for manufacturing magnetic recording medium
JP4729114B2 (en) * 2009-03-18 2011-07-20 株式会社東芝 Method for manufacturing magnetic recording medium
US8173029B2 (en) 2009-03-18 2012-05-08 Kabushiki Kaisha Toshiba Magnetic recording medium manufacturing method
JP2010264758A (en) * 2010-06-15 2010-11-25 Toshiba Corp Pattern transfer method using ultraviolet curable resin material, and method of manufacturing semiconductor device using same
JP2011100538A (en) * 2010-11-29 2011-05-19 Toshiba Corp Method for manufacturing magnetic recording medium
JP2011081902A (en) * 2010-12-08 2011-04-21 Toshiba Corp Method of manufacturing magnetic recording medium
JP2011090775A (en) * 2010-12-08 2011-05-06 Toshiba Corp Manufacturing method of semiconductor device

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