JPS61111568A - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- JPS61111568A JPS61111568A JP21249885A JP21249885A JPS61111568A JP S61111568 A JPS61111568 A JP S61111568A JP 21249885 A JP21249885 A JP 21249885A JP 21249885 A JP21249885 A JP 21249885A JP S61111568 A JPS61111568 A JP S61111568A
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- package
- substrate
- ceramic
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、素子を組み込んだパッケージを他の基板上
所定位置に正確に取り付けることができる半導体パッケ
ージに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor package in which a package incorporating an element can be accurately attached to a predetermined position on another substrate.
一般に、集積回路にあっては、外部の湿気、厘あい等を
しゃ断し、素子の信頼件を向上するため、素子をパッケ
ージ内に封入するよう管こしている。Generally, integrated circuits are sealed in a package in order to block out external moisture, air pollution, etc. and improve the reliability of the device.
ところで、素子を組み込んだパッケージについては、た
とえば固体撮像素子を撮像カメラに取り付ける時など、
素子を他の基板上所定位置に正確以下余白
に取シ付けることが必要な場合がある。By the way, regarding packages that incorporate elements, for example, when attaching a solid-state image sensor to an imaging camera, etc.
It may be necessary to mount a device in a predetermined position on another substrate with less than precise margins.
このような場合、従来では何回もの試行錯誤によシ面倒
な位置合わせをしながら取シ付けているのが実状でおる
。特に、セラミック製パッケージのものでは、セラミッ
ク自体が焼成器であるため、外径方法で±０．２８程度
の誤差があシ、パンケージの外径を位置出しの基準とし
て用いることができないので、その困難は大きい。しか
し一方、カメラレンズの光軸と固体撮像素子のセンター
とが正確に位置合わせされないと、像が固体撮像素子で
絵素に分解され２値化されるとき、家の一端が撮らない
ようなことになってしまう。In such cases, in the past, the installation has been carried out through repeated trial and error and tedious positioning. In particular, with ceramic packages, since the ceramic itself is a firing device, there is an error of about ±0.28 in the outer diameter method, and the outer diameter of the pan cage cannot be used as a reference for positioning. The difficulties are great. However, on the other hand, if the optical axis of the camera lens and the center of the solid-state image sensor are not aligned accurately, when the image is separated into pixels and binarized by the solid-state image sensor, one end of the house may not be captured. Become.
この発明はこのような問題を解決するためになされたも
ので、特に大型のセラミック製パンケージ（固体撮像素
子の場合、素子の大きさは約１０×１０調で、−辺の絵
素は１００〜２５６程度である。）を正確な位置に容易
に取り付けるようにするものでるる。This invention was made to solve such problems, and is particularly suitable for large ceramic pancages (in the case of solid-state image sensors, the size of the element is approximately 10 x 10, and the - side pixels are approximately 100 to 100 pixels). (approximately 256) can be easily installed in an accurate position.
以下、この発明の内容について添付図面を参照しながら
詳述する。Hereinafter, the content of the present invention will be explained in detail with reference to the accompanying drawings.
図示のものは、固体撮像素子のセラミック製パッケージ
であシ、第１図に示すように、これは撮像カメラ１側の
部品数シ付は基板２上にレンズ３の光軸と軸を−にして
取）付けられるべきものである。とのセラミツク製パッ
ケージ４自体は、第２図に示すように、セラごツクベー
ス５上に固体撮像素子が取り付けられ、その上を透明な
ガラスキャップ６でおおわれ、セラミックベース５の両
側にリード７を有するインラインタイプのパッケージ４
側に、位置決め穴８ａ、 ８ｂを有する位置決め板９を
取シ付け、他方部品数シ付は基板２側の所定位置に、位
置決めピンｌｏａ、１０ｂを取り付け、この位置決めピ
ン１０ａ、１０ｂに位置決め穴８ａ、８ｂをはめるよう
にしてセラミック製パッケージ４を部品数）付は基板２
に取り付けるようにした点に特徴がある。この場合、位
置決め穴Ｂａ、 ８ｂおよびそれに対応する位置決めピ
ン１０ａ、１０ｂは、位置決めを正確になすためそれぞ
れ２個設けている。したがって、位置決め板９をセラミ
ックベース５の上面に取シ付ける場合には、第３図（Ａ
）に示すように、位置決め板９は左右２枚とな〕、他方
、セラミックベース５の裏面側に取シ付ける場合には、
第３図（’Ｂ ）に示すように、位置決め板９は１枚と
なる。また、位置決めの精度を高めるため、位置決め板
９については、素子の完成後、Ａｕ−８ｎの共晶か接着
剤などでセラミックベース５に取っ付け、その後、素子
の中心から一定距離の個所に位置決め穴３ａ。The one shown is a ceramic package for a solid-state image sensor, and as shown in FIG. It should be attached. As shown in FIG. 2, the ceramic package 4 itself has a solid-state imaging device mounted on a ceramic base 5, covered with a transparent glass cap 6, and leads 7 on both sides of the ceramic base 5. In-line type package with 4
A positioning plate 9 having positioning holes 8a and 8b is attached to one side, and positioning pins loa and 10b are attached to predetermined positions on the board 2 side for the other side, and the positioning holes 8a are attached to the positioning pins 10a and 10b. , 8b, and attach the ceramic package 4 to the board 2 (number of parts).
It is distinctive in that it is attached to the In this case, two positioning holes Ba, 8b and two corresponding positioning pins 10a, 10b are provided for accurate positioning. Therefore, when attaching the positioning plate 9 to the top surface of the ceramic base 5, as shown in FIG.
) As shown in ), there are two positioning plates 9 on the left and right sides.
As shown in FIG. 3 ('B), there is only one positioning plate 9. In order to improve positioning accuracy, the positioning plate 9 is attached to the ceramic base 5 with Au-8n eutectic or adhesive after the element is completed, and then positioned at a certain distance from the center of the element. Hole 3a.
８ｂをあけるようにする。Make sure to open 8b.
し比がって、との発明によれば、セラミック製パッケー
ジ４を部品数シ付は基板２上に取シ付ける時に、セラミ
ック製パッケージ４側の位置決めピン１０ａ、１０ｂに
はめ込むことにょシ、容易に正確な位置出しをすること
ができる。実際に得られた精度は±０．Ｏ１〜±０．０
２訓程度であった。In comparison, according to the invention, when mounting the ceramic package 4 on the substrate 2, it is easy to fit it into the positioning pins 10a and 10b on the ceramic package 4 side. Accurate positioning can be performed. The accuracy actually obtained was ±0. O1~±0.0
It was about 2 lessons.
なお、前記位置決め穴および位置決めピンを角形にする
ことによ）、それを各々１個にすることもできるが、高
い位置出し精度を得るにほやは：す。Note that by making the positioning holes and positioning pins rectangular, the number of the positioning holes and positioning pins can be reduced to one each, but this would be difficult to obtain high positioning accuracy.
複数個とするのが良い。It is better to have more than one.
第１図はこの発明が適用される撮像カメラの概略構成図
、第２図はこの発明によるセラミック製パッケージの一
実施例を示す平面図、第３図（Ａ）および（Ｂ）はそれ
ぞれ位置決め板の取シ付は例を示す斜視図である。
１・・・擦傷カメラ、２・・・部品数）付は基板、４・
・・セラミック製パッケージ、５・・・セラミックベー
ス、６・・・ガラスキャップ、７・・・リード、８ａ、
８ｂ・・・位置決め穴、９・・・位置決め板、１０ａ＋
１０ｂ・・・第 １ 図
省 Ｚ 図FIG. 1 is a schematic configuration diagram of an imaging camera to which the present invention is applied, FIG. 2 is a plan view showing an embodiment of a ceramic package according to the present invention, and FIGS. 3 (A) and (B) are positioning plates, respectively. The mounting is a perspective view showing an example. 1...Scratch camera, 2...Number of parts) included is board, 4...
... Ceramic package, 5... Ceramic base, 6... Glass cap, 7... Lead, 8a,
8b...Positioning hole, 9...Positioning plate, 10a+
10b...Figure 1 Ministry Z figure
Claims (1)
の穴を設けたことを特徴とする半導体パッケージ。1. A semiconductor package characterized in that a hole for positioning is provided on the side of the package in which a semiconductor element is incorporated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21249885A JPS61111568A (en) | 1985-09-27 | 1985-09-27 | Semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21249885A JPS61111568A (en) | 1985-09-27 | 1985-09-27 | Semiconductor package |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10915879A Division JPS5633865A (en) | 1979-08-29 | 1979-08-29 | Attachment of package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61111568A true JPS61111568A (en) | 1986-05-29 |
| JPS6255300B2 JPS6255300B2 (en) | 1987-11-19 |
Family
ID=16623656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21249885A Granted JPS61111568A (en) | 1985-09-27 | 1985-09-27 | Semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61111568A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6787791B2 (en) | 2000-11-10 | 2004-09-07 | Fuji Photo Film Co., Ltd. | Radiation image information read-out apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5067966A (en) * | 1973-10-20 | 1975-06-06 | ||
| JPS529501A (en) * | 1975-07-11 | 1977-01-25 | Fuji Photo Film Co Ltd | Photoosensitive lithographic press plate material |
| JPS5468526U (en) * | 1977-10-21 | 1979-05-15 |
-
1985
- 1985-09-27 JP JP21249885A patent/JPS61111568A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5067966A (en) * | 1973-10-20 | 1975-06-06 | ||
| JPS529501A (en) * | 1975-07-11 | 1977-01-25 | Fuji Photo Film Co Ltd | Photoosensitive lithographic press plate material |
| JPS5468526U (en) * | 1977-10-21 | 1979-05-15 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6787791B2 (en) | 2000-11-10 | 2004-09-07 | Fuji Photo Film Co., Ltd. | Radiation image information read-out apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6255300B2 (en) | 1987-11-19 |
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