JPS61104566U - - Google Patents
Info
- Publication number
- JPS61104566U JPS61104566U JP1984189886U JP18988684U JPS61104566U JP S61104566 U JPS61104566 U JP S61104566U JP 1984189886 U JP1984189886 U JP 1984189886U JP 18988684 U JP18988684 U JP 18988684U JP S61104566 U JPS61104566 U JP S61104566U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting part
- resistor
- bonding
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Audible And Visible Signals (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
第1図は本考案に係る発光ダイオードドツトア
レイの一実施例を示す斜視図、第2図は同実施例
の光量調整時の接続図、第3図は従来例を示す斜
視図である。 11……LEDチツプ、11A……発光部、1
1B……ボンデイングパツド、12……基板、1
3……抵抗体、13A〜13D……ボンデイング
ポスト、14及び15……ワイヤー、16……外
部接続端子。
レイの一実施例を示す斜視図、第2図は同実施例
の光量調整時の接続図、第3図は従来例を示す斜
視図である。 11……LEDチツプ、11A……発光部、1
1B……ボンデイングパツド、12……基板、1
3……抵抗体、13A〜13D……ボンデイング
ポスト、14及び15……ワイヤー、16……外
部接続端子。
Claims (1)
- 所定配列の発光部を有し、基板にダイボンデイ
ングされた発光ダイオードチツプの側方に、両端
及び中間にボンデイングポストを有する抵抗体を
発光部に対応して設け、この抵抗体を介して発光
部と基板上の外部接続端子を接続するとともに、
ボンデイングポスト間のワイヤーボンデイングに
よつて各発光部の発光光量を均一化するようにし
たことを特徴とする発光ダイオードドツトアレイ
。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984189886U JPS61104566U (ja) | 1984-12-14 | 1984-12-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984189886U JPS61104566U (ja) | 1984-12-14 | 1984-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61104566U true JPS61104566U (ja) | 1986-07-03 |
Family
ID=30747334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984189886U Pending JPS61104566U (ja) | 1984-12-14 | 1984-12-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61104566U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03209781A (ja) * | 1990-01-11 | 1991-09-12 | Rohm Co Ltd | イメージセンサ用光源の製造方法 |
JPH04221838A (ja) * | 1990-12-21 | 1992-08-12 | Rohm Co Ltd | ワイヤボンダ |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117280A (ja) * | 1982-12-24 | 1984-07-06 | Ricoh Co Ltd | 半導体発光装置 |
-
1984
- 1984-12-14 JP JP1984189886U patent/JPS61104566U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117280A (ja) * | 1982-12-24 | 1984-07-06 | Ricoh Co Ltd | 半導体発光装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03209781A (ja) * | 1990-01-11 | 1991-09-12 | Rohm Co Ltd | イメージセンサ用光源の製造方法 |
JPH04221838A (ja) * | 1990-12-21 | 1992-08-12 | Rohm Co Ltd | ワイヤボンダ |