JPS6094331A - Molding and hardening of resin impregnated product - Google Patents

Abstract

PURPOSE:To mold and harden easily a resin impregnated product free from voids by dipping a resin impregnated product in molten low-melting alloy. CONSTITUTION:The insulating coil 1 is covered with flexible light sheetlike material 2 and equipped in the heating and hardening container 6 and its inlet is supported fixedly by the upper supporter 3. The low-melting alloy 5 that has been melted to the temperature suitable to the hardening temperature of resin in the heating container 4 is injected from the inlet 9 into the heating and hardening container 6, the insulating coil 1 is dipped and the low-melting alloy is injected so that the level of the alloy is about 30cm higher than the insulating coil. The temperature of the insulating coil 1 is kept equal to the hardening temperature of the impregnating resin. When the insulating coil 1 in the bag 2 is dipped in the alloy 5, the heat of the alloy 5 and the pressure due to its own weight are given to the insulating coil 1, therefore, the straight portions and curved portions as well are hardened uniformly in the insulating coil 1.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は絶縁コイルや積層絶縁材のような樹脂含浸製品
の成形硬化方法（二関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for molding and curing resin-impregnated products such as insulated coils and laminated insulation materials.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

絶縁コイルのような樹脂含浸製品にボイドがないように
樹脂を含浸するには、ガラステープ、マイカテープなど
の基材と適当な樹脂材料を選択することは勿論であるが
、絶縁コイル内部にボイドな発生させないように製造す
ることが重要である。In order to impregnate resin-impregnated products such as insulated coils with resin so that there are no voids, it is necessary to select a base material such as glass tape or mica tape and an appropriate resin material, but it is also necessary to It is important to manufacture products in a way that prevents them from occurring.

ボイドは基材間の接着力の低下、放電による破壊電圧の
低下など、電気的、機械的性能を低下する欠陥が生じる
ものである。ボイドの発生原因としてあげられるものに
は樹脂の硬化収縮率や被含浸基材からの樹脂の流出があ
る。前者は、ポリエステル樹脂より収縮率の小さいエポ
キシな選択することで改善される。後者については樹脂
の粘度が低いほど、また含浸加圧力が高いほど流出が著
しいものである。コイルにおけるボイドの発生を防止す
るための方法は従来種々行われており、一般に絶縁コイ
ルの成形硬化（二関する製法には大別すると次のような
ものがある。その第１は蒸気あるいは電熱を利用して加
熱するとともに、油圧力または水圧力によるプレスで加
圧する専用機を用いて製造するマシンモールド法がある
。第２としては、真空加圧タンクにコイルを入れ、真空
脱気後熱溶融させたコンパウンドなどの加熱された絶縁
物で硬化させて製造するコンパウンドモールド法がある
。第３には、絶縁コイルを構成する心体に絶縁物を介し
て側板な当て熱収縮テープを巻回し、締め付は加熱して
製造する熱収縮フィルムモールド法がある。Voids are defects that reduce electrical and mechanical performance, such as a decrease in adhesive strength between base materials and a decrease in breakdown voltage due to discharge. Possible causes of voids include the curing shrinkage rate of the resin and the outflow of the resin from the impregnated substrate. The former problem can be improved by selecting an epoxy resin that has a smaller shrinkage rate than a polyester resin. Regarding the latter, the lower the viscosity of the resin and the higher the impregnation pressure, the more significant the outflow becomes. Various methods have been used to prevent the formation of voids in coils, and generally there are two manufacturing methods related to molding and hardening of insulated coils.The first is steam or electric heating. There is a machine molding method in which the coil is manufactured using a special machine that heats the coil and pressurizes it with a press using hydraulic or water pressure.The second method is to place the coil in a vacuum pressurized tank and heat melt it after vacuum degassing. There is a compound molding method, which is manufactured by curing with a heated insulating material such as a heated compound.The third method is to wrap a side plate of heat-shrinkable tape around the core that makes up the insulated coil through an insulating material. There is a heat-shrinkable film molding method in which tightening is performed by heating.

しかしながら第１の方法では精度よく製造できるが設備
が高価となり、多数の絶縁コイルを処理するには膨大な
設備費がかかる。また曲線部などの非直線部の成形が困
難である。第２の方法は、第１の方法に比べて寸法精度
では劣るが、一度に比較的多数の絶縁コイルを処理でき
る点で優れている。しかし、処理に時間がかかり、且つ
設備費が高価となる欠点があった。第３の方法は熱収縮
テープの収縮力を利用して加圧するが、一般に用いられ
ているポリエステル熱収縮テープでは充分な圧力が得ら
れないことから巻回数をふやさなければならず、作業に
手間がかかる。また熱収縮テープの圧力が角部に集中し
、均等に加わらないので寸法精度および特性に満足なも
のが得られなかった。However, although the first method allows manufacturing with high precision, the equipment is expensive, and processing a large number of insulated coils requires enormous equipment costs. Furthermore, it is difficult to mold non-linear parts such as curved parts. The second method is inferior to the first method in dimensional accuracy, but is superior in that it can process a relatively large number of insulated coils at once. However, there are disadvantages in that the processing takes time and the equipment cost is high. The third method uses the shrinkage force of heat-shrinkable tape to apply pressure, but the commonly used polyester heat-shrinkable tape does not provide sufficient pressure, so the number of wraps must be increased, making the work time-consuming. It takes. In addition, the pressure of the heat-shrinkable tape was concentrated at the corners and was not applied evenly, making it impossible to obtain a product with satisfactory dimensional accuracy and properties.

〔発明の目的〕 本発明の目的は、ボイドを生じることなく容易に成形硬
化することができる樹脂含浸製品の成形硬化方法を提供
することにある。[Object of the Invention] An object of the present invention is to provide a method for molding and curing resin-impregnated products that can be easily molded and hardened without producing voids.

〔発明の概要〕[Summary of the invention]

本発明による樹脂含浸製品の成形硬化方法は、上記製品
を可撓性薄状物で包み、これを上記含浸樹脂の硬化温度
に見合った温度で溶融状態となっている低融性合金中に
浸漬させ、この低融性合金から熱と圧力を加えて成形硬
化させるものである。The method of molding and curing resin-impregnated products according to the present invention involves wrapping the above-mentioned product in a flexible thin material and immersing it in a low-melting alloy that is in a molten state at a temperature commensurate with the curing temperature of the above-mentioned impregnated resin. This low-melting alloy is then molded and hardened by applying heat and pressure.

〔発明の実施例〕[Embodiments of the invention]

以下本発明を図面に示す一実施例を参照して詳細に説明
する。The present invention will be described in detail below with reference to an embodiment shown in the drawings.

図面において、１は樹脂含浸製品で、例えば絶縁テープ
を巻回し樹脂を含浸して成る絶縁コイルとする。この絶
縁コイル１は絶縁コイル１に含浸された樹脂を通過させ
ない可撓性薄状物、例えば厚さ０．０３ｍ１ｎのシリコ
ーンゴムシートによる袋２で包む。この袋２の包み口は
軽く上方に引き上げ、この状態で支持体３にて支持固定
する。６は加熱硬化容器で、その内部には上記袋２で包
んだ絶縁コイル１が設置される。またこの加熱硬化容器
６の側面は図示の如く２重構造になっており、その内部
にはヒータ８が設置される。さらにこの加熱硬化容器６
の下部には内部に注入される後述する低融性金属を排出
するための排出ロアを設ける。In the drawings, reference numeral 1 denotes a resin-impregnated product, such as an insulated coil made by winding an insulating tape and impregnating it with resin. This insulated coil 1 is wrapped in a bag 2 made of a flexible thin material that does not allow the resin impregnated into the insulated coil 1 to pass through, for example, a silicone rubber sheet having a thickness of 0.03 mm. The opening of this bag 2 is slightly pulled upwards, and in this state it is supported and fixed by the support body 3. Reference numeral 6 denotes a heat curing container, in which the insulated coil 1 wrapped in the bag 2 is installed. Further, the side surface of this heat-curing container 6 has a double structure as shown in the figure, and a heater 8 is installed inside thereof. Furthermore, this heat curing container 6
A discharge lower is provided at the bottom of the chamber for discharging low-melting metal, which will be described later, injected into the interior.

４は加熱容器で、上記低融性金属５を前記絶縁コイル１
に含浸された樹脂の硬化温度に見合った温度、例えば１
２０°に加熱する。このためヒータ８を内蔵している。4 is a heating container in which the low-melting metal 5 is heated to the insulated coil 1;
temperature commensurate with the curing temperature of the resin impregnated with, for example 1
Heat to 20°. For this reason, a heater 8 is built-in.

また下部には、溶融状態の低融性金属５を前記加熱硬化
容器６に注入するための注入口９を設ける。Furthermore, an injection port 9 for injecting the molten low-melting metal 5 into the heat curing container 6 is provided at the lower part.

上記構成においてまず、絶縁コイル１を袋２により包ん
で加熱硬貨容器６内に設置し、その包み口を上方の支持
体３に支持固定する。次に加熱容器４で樹脂の硬化温度
に見合った温度、例えば１２０°Ｃにて溶融した低融性
合金５を注入口９から加熱硬化容器６に注入し絶縁コイ
ル１が浸漬して更に約３０函覆うように注入する。そし
て絶縁コイル１の含浸樹脂の硬化条件である１２０°Ｃ
５時間保持し、更に１５０’Ｏで１５時間保持する。こ
の合金５中への浸漬状態において、袋２内の絶縁コイル
１には、合金５からその温度と、自重による圧力が加わ
るので、絶縁コイル１は直線部はもちろん曲線部も一様
に硬化する。また硬化時の樹脂の収縮を抑えることがで
きる。なお、注入した合金５に上部から圧力を加え、こ
れを合金５を介して絶縁コイル１全体に均等に加えるこ
とも可能である。In the above structure, first, the insulated coil 1 is wrapped in a bag 2 and placed inside the heated coin container 6, and the wrapping opening is supported and fixed to the upper support body 3. Next, the low-melting alloy 5 melted in the heating container 4 at a temperature corresponding to the curing temperature of the resin, for example, 120°C, is injected into the heating curing container 6 through the injection port 9, and the insulated coil 1 is immersed therein for about 30 minutes. Inject to cover the box. and 120°C, which is the curing condition for the impregnated resin of the insulated coil 1.
Hold for 5 hours and further hold at 150'O for 15 hours. When immersed in this alloy 5, the temperature of the alloy 5 and the pressure due to its own weight are applied to the insulated coil 1 in the bag 2, so that the insulated coil 1 hardens not only in straight parts but also in curved parts. . Furthermore, shrinkage of the resin during curing can be suppressed. Note that it is also possible to apply pressure to the injected alloy 5 from above and apply this pressure evenly to the entire insulated coil 1 via the alloy 5.

上述した温度時間関係にて合金５中に浸漬させ、所定の
硬化を行った後は、合金５の流動性を失わない程度の温
度、例えば約１００’Ｏまで冷却し、排出ロアから排出
する。これらの結果、絶縁厚さ１．６朋の絶縁コイルを
良効な状態で製作できた。After being immersed in Alloy 5 under the above-mentioned temperature and time relationship and performing a predetermined hardening, it is cooled to a temperature such as about 100'O that the alloy 5 does not lose its fluidity, and then discharged from the discharge lower. As a result, an insulated coil with an insulation thickness of 1.6 mm was successfully manufactured.

なお排出された合金５は再び加熱容器６で加熱すること
により再使用できる。Note that the discharged alloy 5 can be reused by heating it again in the heating container 6.

このようにして含浸樹脂を硬化させることにより、絶縁
コイル１としての寸法精度を保ち、がっ含浸樹脂の流出
もない良質の絶縁コイルを提供できる。By curing the impregnated resin in this manner, it is possible to maintain the dimensional accuracy of the insulated coil 1 and provide a high-quality insulated coil with no leakage of the impregnated resin.

ここで、低融性合金５としては、錫５０．鉛２５、ビス
マス２５質量チ、溶融温度９７℃、比重約９．５のもの
を用いた。低融性合金５としては融点が低く、比重は大
きいほどよい。水銀やカドミウムなどの合金で融点を下
げることもできるが、毒性の問題や、高温酸化による減
量などの問題があるので、安価でとり扱い易い上述した
錫、鉛系合金で実用化できている。Here, as the low melting alloy 5, tin 50. The material used was 25% lead, 25% bismuth, a melting temperature of 97° C., and a specific gravity of about 9.5. The lower the melting point and the higher the specific gravity of the low-melting alloy 5, the better. Although it is possible to lower the melting point with alloys such as mercury and cadmium, there are problems such as toxicity and weight loss due to high-temperature oxidation, so the above-mentioned tin and lead alloys, which are cheap and easy to handle, have been put into practical use.

このようにして成形硬化することにより、非常に高度な
寸法精度を要求するもの以外はこのままで圧力媒体とも
なる低融性合金５の自重だけで充分である。またそのた
めの設備は、第１図で示すように温度調節のできる合金
を溶融するための容器４と、絶縁コイル１を成形硬化す
るに必要な大きさの容器６とで構成でき、設備費、維持
費とも安価でよい。By forming and hardening in this manner, the self-weight of the low-melting alloy 5, which also serves as a pressure medium, is sufficient unless a very high degree of dimensional accuracy is required. As shown in FIG. 1, the equipment for this purpose can be comprised of a temperature-controllable container 4 for melting the alloy, and a container 6 of a size necessary to mold and harden the insulated coil 1. Maintenance costs are also low.

なお、上記実施例では、樹脂含浸製品１として絶縁コイ
ルを例示したが、積層板や積層管など、その他積層絶縁
材または樹脂モールドトランスなど、無溶剤樹脂を注入
して成形硬化される全ての製品に適用できるものである
。In the above example, an insulated coil was exemplified as the resin-impregnated product 1, but all products that are molded and hardened by injecting solvent-free resin, such as laminated plates and laminated pipes, other laminated insulation materials, and resin molded transformers, are also applicable. It can be applied to

〔発明の効果〕〔Effect of the invention〕

以上のように本発明によれば、溶融合金により適切な硬
化温度で、全体的に均一に加圧されるので、ボイドの生
じない良効な樹脂含浸製品を、大規模な設備を要するこ
となく容易に得ることができる。As described above, according to the present invention, since the molten alloy is uniformly pressurized throughout the entire body at an appropriate curing temperature, highly effective resin-impregnated products without voids can be produced without requiring large-scale equipment. can be obtained easily.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明による樹脂含浸製品の成形硬化方法の一実
施例に用いる成形硬化装置の構成例を示す図である。 １・・・樹脂含浸製品、　２・・・可撓性薄状物、４・
・・加熱容器、　５・・低融性合金、６・・・加熱硬化
容器、７・・・υＦ出口、９・・・注入口、　８・・・
ヒーター （７３１７）代理人弁理士　則　近　憲　佑　（はが１
名）手続補正書（方式） ％式％ １、事件の表示 特願昭５８−２０２５５５号 ２、発明の名称 樹脂含浸製品の成形硬化方法 ３、補正をする者 事件との関係　特許出願人 （３０７）東京芝浦電気株式会社 ４、代理人 〒１００ 東京都千代田区内幸町１−１−６ 東京芝浦電気株式会社東京事務所内 昭和５９年１月３１日（発送日） ６、補正の対象 α）明細書の図面の簡単な説明の欄 （２）　図　面 ７、補正の内容 （１）明細書の第８頁、第５行に記載の「図面は・・・
」を「第１図は・・」と訂正する。 第　１　図The drawing is a diagram showing an example of the configuration of a molding and curing apparatus used in an embodiment of the molding and curing method for resin-impregnated products according to the present invention. 1...Resin-impregnated product, 2...Flexible thin material, 4...
...Heating container, 5...Low melting alloy, 6...Heating hardening container, 7...υF outlet, 9...Inlet, 8...
Heater (7317) Representative Patent Attorney Noriyuki Chika (Haga1
name) Procedural amendment (method) % formula % 1. Indication of the case Japanese Patent Application No. 58-202555 2. Name of the invention Method for molding and curing resin-impregnated products 3. Person making the amendment Relationship with the case Patent applicant (307 ) Tokyo Shibaura Electric Co., Ltd. 4, Agent Address: Tokyo Shibaura Electric Co., Ltd. Tokyo Office, 1-1-6 Uchisaiwai-cho, Chiyoda-ku, Tokyo 100 January 31, 1980 (shipment date) 6. Subject to amendment α) Specification Column for a brief explanation of the drawing (2) Drawing 7, contents of amendment (1) "The drawing...
" is corrected to "Figure 1 is...". Figure 1

Claims (1)

【特許請求の範囲】[Claims] 樹脂を含浸した製品を成形硬化させるに当り、上記製品
な可撓性薄状物で包み、これを上記含浸樹脂の硬化温度
に茸合った温度で溶融状態となっている低融性合金中に
浸漬させ、この低融性合金から熱と圧力を加えて成形硬
化させることを特徴とする樹脂含浸製品の成形硬化方法
。When molding and hardening a resin-impregnated product, it is wrapped in a flexible thin material such as the above-mentioned product, and then placed in a low-melting alloy that is in a molten state at a temperature that matches the curing temperature of the above-mentioned impregnated resin. A method for molding and hardening a resin-impregnated product, which is characterized by immersing the low-melting alloy and molding and hardening it by applying heat and pressure.