JPS6090873U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS6090873U JPS6090873U JP18420683U JP18420683U JPS6090873U JP S6090873 U JPS6090873 U JP S6090873U JP 18420683 U JP18420683 U JP 18420683U JP 18420683 U JP18420683 U JP 18420683U JP S6090873 U JPS6090873 U JP S6090873U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- solder
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の厚膜混成集積回路装置のスルーホール部
の断面図、第２図は本考案の一実施例による厚膜混成集
積回路装置のスルーホール部の断面図である。
１．１１・・・・・・保護体、２，１２・・・・・・導
体、３゜１３．１３’・・・・・・基板、１４・・・・
・・半田等導電材。
、！？FIG. 1 is a cross-sectional view of a through-hole portion of a conventional thick film hybrid integrated circuit device, and FIG. 2 is a cross-sectional view of a through-hole portion of a thick film hybrid integrated circuit device according to an embodiment of the present invention. 1.11...protector, 2,12...conductor, 3°13.13'...substrate, 14...
...Conductive materials such as solder. ,! ?
Claims (1)
電材で重ね合せた亜とを特徴とする混成集積回路装置。A hybrid integrated circuit device characterized by a plurality of thick-film printed circuit boards having through-holes laminated together using a conductive material such as solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18420683U JPS6090873U (en) | 1983-11-29 | 1983-11-29 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18420683U JPS6090873U (en) | 1983-11-29 | 1983-11-29 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6090873U true JPS6090873U (en) | 1985-06-21 |
Family
ID=30398471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18420683U Pending JPS6090873U (en) | 1983-11-29 | 1983-11-29 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6090873U (en) |
-
1983
- 1983-11-29 JP JP18420683U patent/JPS6090873U/en active Pending
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