JPS59123369U - Multi-board mounting equipment - Google Patents
Multi-board mounting equipmentInfo
- Publication number
- JPS59123369U JPS59123369U JP1687283U JP1687283U JPS59123369U JP S59123369 U JPS59123369 U JP S59123369U JP 1687283 U JP1687283 U JP 1687283U JP 1687283 U JP1687283 U JP 1687283U JP S59123369 U JPS59123369 U JP S59123369U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- board mounting
- mounting equipment
- board
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
−第1図は従来の回路基板の実装装置を示す斜視図、第
2図はこの考案の多基板実装装置−実施例を示す斜視図
、第3図は同じく断面図、第4図、第5図、第6図及び
第7図は各々この考案の他の実施例を示す断面図である
。
図において5.21・・・第1回路基板で、この場合は
厚膜印刷基板、6,22・・・第2回路基板で、この場
合はプリント基板、?、 13.23゜230・・・第
3回路基板で、この場合はプリント基板、8.25・・
・外部接続用リード線、14.24゜240.241,
242・・・厚膜印刷基板である。
なお図中同一符号は同−又は相当部分を示す。- Fig. 1 is a perspective view showing a conventional circuit board mounting device, Fig. 2 is a perspective view showing an embodiment of the multi-board mounting device of this invention, Fig. 3 is a sectional view, and Figs. 6 and 7 are sectional views showing other embodiments of this invention. In the figure, 5.21...first circuit board, in this case a thick film printed board, 6,22...second circuit board, in this case a printed board, ? , 13.23°230... Third circuit board, in this case a printed circuit board, 8.25...
・External connection lead wire, 14.24°240.241,
242... Thick film printed board. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (2)
の順序に空間を介在して並置し、第2回路基板を貫通す
る外部接続用リード線で第1回路基板の回路と第3回路
基板の回路とを接続するようにした多基板実装装置。(1) A first circuit board, a second circuit board, and a third circuit board are juxtaposed in this order with a space interposed between them, and an external connection lead wire that passes through the second circuit board is connected to the circuit on the first circuit board. A multi-board mounting device that connects circuits on three circuit boards.
る実用新案登録請求の範囲第1項記載の多基板実装装置
。(2) The multi-board mounting device according to claim 1, wherein the external connection lead wire is a lead wire with a clip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1687283U JPS59123369U (en) | 1983-02-08 | 1983-02-08 | Multi-board mounting equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1687283U JPS59123369U (en) | 1983-02-08 | 1983-02-08 | Multi-board mounting equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59123369U true JPS59123369U (en) | 1984-08-20 |
Family
ID=30148124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1687283U Pending JPS59123369U (en) | 1983-02-08 | 1983-02-08 | Multi-board mounting equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59123369U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60200596A (en) * | 1984-03-23 | 1985-10-11 | 富士通株式会社 | Method of connecting printed circuit board |
-
1983
- 1983-02-08 JP JP1687283U patent/JPS59123369U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60200596A (en) * | 1984-03-23 | 1985-10-11 | 富士通株式会社 | Method of connecting printed circuit board |
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