JPS6071172U - High frequency printed circuit board bonding structure - Google Patents
High frequency printed circuit board bonding structureInfo
- Publication number
- JPS6071172U JPS6071172U JP16305183U JP16305183U JPS6071172U JP S6071172 U JPS6071172 U JP S6071172U JP 16305183 U JP16305183 U JP 16305183U JP 16305183 U JP16305183 U JP 16305183U JP S6071172 U JPS6071172 U JP S6071172U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- high frequency
- bonding structure
- board bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント基板の平面図、第２図は第１図
の■−■線に沿った断面図、第３図は本考案に係るプリ
ント基板結合構体の平面図、第４図は第３図のＩＶ−Ｉ
Ｖ線に沿った断面図、及び第５図は第４図の他の実施例
の断面図である。
１１．２１・・・・・・第１のプリント基板、１２，２
２・・・・・・第２のプリント基板、１３，１４・・・
・・・高周波線路（導電部材）、１５，１６・・・・・
・アースパターン（導電部材）、１７．１８・・・・・
・半田、１９゜２３・・・・・・当接面。FIG. 1 is a plan view of a conventional printed circuit board, FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1, FIG. 3 is a plan view of a printed circuit board combination structure according to the present invention, and FIG. IV-I in Figure 3
A sectional view taken along line V, and FIG. 5 is a sectional view of another embodiment of FIG. 4. 11.21...First printed circuit board, 12,2
2... Second printed circuit board, 13, 14...
...High frequency line (conductive member), 15, 16...
・Earth pattern (conductive member), 17.18...
・Solder, 19°23...Abutting surface.
Claims (1)
リント基板を、それぞれの両面に配設した高周波導電部
材を電気的に接続して結合するものにおいて、前記第１
及び第２のプリント基板はその結合側端部をそれぞれ傾
斜状端面に形成しこれら両端面を当接により合体し、結
合部分の両面の前記高周波導電部材間の誘電体を均一化
することを特徴とする高周波プリント基板の結合構体。A first printed circuit board and a second printed circuit board made of the same insulating material are coupled by electrically connecting high-frequency conductive members disposed on both surfaces of the first printed circuit board and the second printed circuit board, each of which is made of the same insulating material.
and the second printed circuit board is characterized in that its joining side end portions are each formed into an inclined end face, and these end faces are brought together by abutting to equalize the dielectric material between the high frequency conductive members on both sides of the joining part. A combination structure of high-frequency printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16305183U JPS6071172U (en) | 1983-10-20 | 1983-10-20 | High frequency printed circuit board bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16305183U JPS6071172U (en) | 1983-10-20 | 1983-10-20 | High frequency printed circuit board bonding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6071172U true JPS6071172U (en) | 1985-05-20 |
Family
ID=30357874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16305183U Pending JPS6071172U (en) | 1983-10-20 | 1983-10-20 | High frequency printed circuit board bonding structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6071172U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358421A (en) * | 2000-06-12 | 2001-12-26 | Matsushita Electric Ind Co Ltd | Bonding structure of printed wiring board |
-
1983
- 1983-10-20 JP JP16305183U patent/JPS6071172U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358421A (en) * | 2000-06-12 | 2001-12-26 | Matsushita Electric Ind Co Ltd | Bonding structure of printed wiring board |
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