JPS6068700A - Method of mounting electronic part and device therefor - Google Patents
Method of mounting electronic part and device thereforInfo
- Publication number
- JPS6068700A JPS6068700A JP59151657A JP15165784A JPS6068700A JP S6068700 A JPS6068700 A JP S6068700A JP 59151657 A JP59151657 A JP 59151657A JP 15165784 A JP15165784 A JP 15165784A JP S6068700 A JPS6068700 A JP S6068700A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component
- suction nozzle
- board
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は微小電子部品を電子回路基板等へ吸第２Ｉ保持
して載置する電子部品装着装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting apparatus for suctioning and holding minute electronic components onto an electronic circuit board or the like.
従来例の構成とその問題点
従来の電子部品装着装置は、例えば特公昭４アー１６９
１５号にその具体構成が示されており、その概要を第１
図に示す。The structure of the conventional example and its problems The conventional electronic component mounting apparatus is, for example,
The specific structure is shown in No. 15, and the summary is given in Part 1.
As shown in the figure.
１はアーム、２は真空ノズル、３はホース、４はリーフ
・スプリング、６はダイヤフラム、６は抑圧片、７は圧
縮スプリングであり、８はスプリングをアーム１に配置
された軸である。軸９には圧縮スプリング１ｏが取付け
ている。1 is an arm, 2 is a vacuum nozzle, 3 is a hose, 4 is a leaf spring, 6 is a diaphragm, 6 is a suppression piece, 7 is a compression spring, and 8 is a shaft on which the spring is arranged on the arm 1. A compression spring 1o is attached to the shaft 9.
次にこのように構成された装置において、吸着ノズルの
移動について説明する。ホース３内の空気圧が上昇する
ことにより、このホース３に連結されたダイヤフラム５
が働き、ダイヤフラム５に接して設けられた抑圧片６か
、リーフ・スゲリンダ４を上列させリーフ・スプリング
４の先端に取付られた吸着ノズル２を上昇する。下降に
ついては、抑圧片６と連動とするよう取付けられたし・
く−１１を下降をレバー下降手段（図示せず）を当接さ
せることにより行っていた。Next, the movement of the suction nozzle in the apparatus configured as described above will be explained. As the air pressure inside the hose 3 increases, the diaphragm 5 connected to the hose 3
act, and the suppressing piece 6 provided in contact with the diaphragm 5 or the leaf sugerinda 4 is brought up in the upper row, and the suction nozzle 2 attached to the tip of the leaf spring 4 is raised. Regarding the lowering, it was installed so that it would be linked with the suppression piece 6.
The lowering of the lever 11 was carried out by bringing it into contact with a lever lowering means (not shown).
しかし上記のような構成では、部品を吸着保持し、移動
する吸着ヘットが、必要以上に複雑になり、また吸着ヘ
ッドが大きなものとなってし甘うという問題点を有して
いた。However, the above configuration has the problem that the suction head that suctions and holds the parts and moves them becomes unnecessarily complicated and also tends to be large.
発明の目的
本発明は上記のような問題点に鑑み、吸着ヘッドを簡素
化した電子部品吸着装置を提供するものである。OBJECTS OF THE INVENTION In view of the above problems, the present invention provides an electronic component suction device with a simplified suction head.
発明の構成
本発明は電子部品を部品供給部からピックアップ手段で
吸着保持し、基板上に前記電子部品を搭載する電子部品
装着装置であって、前記ピックアップ手段の吸着ノズル
を、空気流通口を有するホルダーに摺動自在に嵌挿し、
前記吸着ノズルを、基板の血に平行な軸を中心として回
転可能に設けることにより、吸着ヘッドを小形・軽量化
するとともに、機構が簡素化され、電子部品の保持移送
をハイスピードにて行うことができる。また、吸着ノズ
ルの先端を部品供給部の部品取出し位置と近接させた後
、前記部品供給部の部品取出し位置へ電子部品を移動さ
せ、その後電子部品を吸着保持し、基板の面に平行な軸
を中心に前記吸着ノズル全回転させ、前記基板上に前記
電子部品を搭載するため、部品取出し位置における電子
部品ｆ６：落下、飛出し等を防ぐことができ、部品供給
を縦送り可能とすることができる。Structure of the Invention The present invention provides an electronic component mounting device for sucking and holding an electronic component from a component supply section with a pickup means and mounting the electronic component on a substrate, wherein the suction nozzle of the pickup means has an air flow opening. Slide into the holder,
By providing the suction nozzle rotatably around an axis parallel to the blood on the substrate, the suction head can be made smaller and lighter, the mechanism can be simplified, and electronic components can be held and transferred at high speed. I can do it. In addition, after bringing the tip of the suction nozzle close to the component takeout position of the component supply section, the electronic component is moved to the component takeout position of the component supply section, and then the electronic component is held by suction, and the electronic component is held on the axis parallel to the surface of the board. Since the suction nozzle is fully rotated around , and the electronic component is mounted on the board, the electronic component f6 at the component extraction position can be prevented from falling, flying out, etc., and components can be fed vertically. I can do it.
実施例の説明
以下本発明の一実施例について、図面を参照しながら説
明する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
第２図は本発明の実施例における電子部品装着装置の主
要部を示す。２１は装着ロッド、２２は支点軸、２３は
ボルトである。２４はホルダーであり支点軸２２を中心
として回転可能にボルト２３により支点軸２２に取付け
られている。FIG. 2 shows the main parts of an electronic component mounting apparatus according to an embodiment of the present invention. 21 is a mounting rod, 22 is a fulcrum shaft, and 23 is a bolt. A holder 24 is attached to the fulcrum shaft 22 with a bolt 23 so as to be rotatable about the fulcrum shaft 22.
２６はピックアップ手段を構成する吸着ノズルであり、
ホルダー２４に入方向に摺動自在にバネ２６により付熱
され保持されている。真空ノズル２５の中央にはフラン
ジ部２５ａｉ設けており、ピストンを形成している。ま
た２７はリングシールであり、ホルダー２４と吸着ノズ
ル２６とをシールしている。またホルダー２４には、カ
バー２８が固定されており、空気流入口である配管部２
８ａには、吸着ノズル２６を動作させるためチューブ２
９が外部の圧縮空気発生装置（図示ぜず）につながって
いる。吸着ノズル２５には貫通穴２５ｂが設けられてお
り、一端にはチューブ３０が取りつけられている。この
チューブ３０は外部真空発生装置（図示せず）につなが
っている。26 is a suction nozzle constituting the pickup means;
The holder 24 is heated and held by a spring 26 so as to be slidable in the entry direction. A flange portion 25ai is provided at the center of the vacuum nozzle 25, forming a piston. Further, 27 is a ring seal, which seals the holder 24 and the suction nozzle 26. Further, a cover 28 is fixed to the holder 24, and the piping portion 28, which is an air inflow port, is fixed to the holder 24.
8a is provided with a tube 2 for operating the suction nozzle 26.
9 is connected to an external compressed air generator (not shown). The suction nozzle 25 is provided with a through hole 25b, and a tube 30 is attached to one end. This tube 30 is connected to an external vacuum generator (not shown).
３１は部品供給部であり、３２はテーピングチップ部品
である。テーピングチップ部品３２はテープ移送ローラ
３３に上り間欠的に移送される。31 is a component supply section, and 32 is a taping chip component. The taping chip component 32 goes up to the tape transfer roller 33 and is intermittently transferred.
３４は部品収納側テープ、３６は部品収納側テープの開
口を被覆する被覆テープである。３６は電子部品であり
３７は電子部品３６が搭載される基板である。Reference numeral 34 denotes a tape on the parts storage side, and reference numeral 36 denotes a covering tape that covers the opening of the tape on the parts storage side. 36 is an electronic component, and 37 is a board on which the electronic component 36 is mounted.
」二記のように構成された電子部品装着装置について以
下その動作を説明する。The operation of the electronic component mounting apparatus configured as described in Section 2 will be described below.
テーピングチップ部品３２は、テープ移送ローラ３３に
より間欠的に移送され、部品吸着前に被覆テープ３５を
はぎとりが行われる。はきとりが行われた後、部品収納
側テープ３４から電子部品３６が落下しないよう、吸着
ノズル２５にて１り１昆１１を取り出す位置３１ａまで
の間、電子部品を押える突出防止部３１ｂが設けられて
おり、電子部品３６が吸着される面を垂直にした状態に
される。The taped chip component 32 is intermittently transferred by a tape transfer roller 33, and the covering tape 35 is stripped off before the component is adsorbed. After the stripping is performed, a protrusion prevention part 31b is provided to hold down the electronic components until the electronic components 36 are taken out by the suction nozzle 25 to the position 31a, so that the electronic components 36 do not fall from the tape 34 on the component storage side. The surface on which the electronic component 36 is attracted is vertical.
このときに吸着ノズル２５はその先端２５ｃを、その電
子部品３６の吸着面と合致し、近接する位置に移動して
おり、チューブ２９内には圧縮空気が供給されている。At this time, the suction nozzle 25 moves to a position where its tip 25c matches and approaches the suction surface of the electronic component 36, and compressed air is supplied into the tube 29.
この状態で吸着ノズル２５の貫通穴２５ｂ全通し、真空
吸引することにより電子部品３６は、吸着ノズル２５に
保持される。その後、チューブ２９内の圧縮空気が解除
され、圧縮バネ２６により吸着ノズル２５の先端２５ｃ
は、部品収納側テープ３４より離れる方向に移動する。In this state, the electronic component 36 is held by the suction nozzle 25 by passing through the through hole 25b of the suction nozzle 25 and applying vacuum suction. Thereafter, the compressed air in the tube 29 is released, and the compression spring 26 causes the tip 25c of the suction nozzle 25 to
moves in a direction away from the component storage side tape 34.
次に、ホルダー２４は支点軸２２を中心として、外部、
駆動力により、回転させられ矢印Ｂのように吸温保持し
た電子部品３６を基板３７と対向する位置址で回転し、
この状態で再び、チューブ２９に圧縮空気を送り、真空
ノズル２５の先端２５ｃをホルダー２４から離れる方向
に移動させる。この移動により吸着保持している電子部
品３６を基板３７上に運ばれ、この時にチューブ３０が
ら真空吸引が解除されて、基板３７上にチップ部品の装
着が完了する。Next, the holder 24 is centered around the fulcrum shaft 22, and
The driving force rotates the electronic component 36, which absorbs and holds heat as shown by arrow B, at a position facing the board 37,
In this state, compressed air is sent to the tube 29 again to move the tip 25c of the vacuum nozzle 25 away from the holder 24. Due to this movement, the electronic component 36 held by suction is carried onto the substrate 37, and at this time, the vacuum suction from the tube 30 is released, and the mounting of the chip component onto the substrate 37 is completed.
以上のように本実施例によればホルダー２４の回転と、
チーープ２９よりの圧縮空気の大切、およびチューブ３
０からの真空吸引の大切のタイミング動作を部品供給部
３１の送りとあわせて繰り返すことにより、電子部品３
６を基板３７上に確実にかつハイスピードで搭載してい
くことができる。第３図は振動式パーツフィダーを利用
した場合を示す。３８は部品を移送する振動フィダーＶ
Ｘｌ（であり、３９は振動フィダ一部から分離される部
品金、間欠的に部品取出し部４ｏへ移送する間欠送り部
であり、部品を収納可能な四部４１をイエしている。部
品供給部を第３図に示すような方式としても同様の効果
を得られることはいう丑でもないＯ
発明の効果
以上のように本発明は、電子部品を電子部品供給部から
ピックアップ手段で吸着保持し、基板」−１に前記電子
部品を搭載する電子部品装着装置で５あって、前記ピッ
クアップ手段の吸着ノズル金、空気流通口を有するホル
ダーに摺動自在に嵌挿し、前記吸着ノズルの移動を、前
記ホルダー内の空気圧の変動により行うことにより、吸
着ヘッドを小形軽量化するとともに、機構を簡素化する
ことができ、電子部品の保持移送をハイスピードにて行
うことができる。As described above, according to this embodiment, the rotation of the holder 24,
The importance of compressed air from Cheap 29 and tube 3
By repeating the important timing operation of vacuum suction from 0 in conjunction with the feeding of the component supply section 31, the electronic components 3
6 can be mounted on the board 37 reliably and at high speed. Figure 3 shows the case where a vibrating parts feeder is used. 38 is a vibration feeder V for transferring parts.
Xl (, 39 is an intermittent feeding part that intermittently transfers parts separated from a part of the vibrating feeder to the parts take-out part 4o, and has four parts 41 that can store parts. Parts supply part It goes without saying that the same effect can be obtained by using the method shown in FIG. An electronic component mounting apparatus 5 for mounting the electronic component on a board"-1, wherein the suction nozzle metal of the pickup means is slidably inserted into a holder having an air flow opening, and the movement of the suction nozzle is controlled by the suction nozzle. By changing the air pressure within the holder, the suction head can be made smaller and lighter, the mechanism can be simplified, and electronic components can be held and transferred at high speed.
１だ、吸着ノズルの先端を部品供給部の部品取出し位置
と近接一致させた後、前記部品供給部の部品取出し位置
へ電子部品を移動させ、その後電子部品を吸着保持し、
前記基板の面に平行な軸を中）し・に回転させ、基板上
に前記電子部品を搭載する方法としたため、電子部品の
取出しか、電子部品の吸着面を垂直にした状態で行って
も、部品の落下等がなくなり、部品をハイスピードにて
水平に位置決めされた基板上に搭載できる。すなわち、
部品供給を立て送り状態とすることかできる。1. After closely aligning the tip of the suction nozzle with the component take-out position of the component supply section, move the electronic component to the component take-out position of the component supply section, and then hold the electronic component by suction.
Since the electronic component is mounted on the board by rotating the board about an axis parallel to the surface of the board, it is possible to remove the electronic component or with the suction surface of the electronic component perpendicular. This eliminates the possibility of components falling and allows components to be mounted on a horizontally positioned board at high speed. That is,
It is possible to supply parts in a vertical manner.
第１図は、従来の電子部品装着装置の要部断面図、第２
図は本発明の一実施例における電子部品装着装置の要部
断面図、第３図はシュートがらの部品受渡しを示す部分
断面図である。
２１ 装着ロッド、２２・川・・支点軸、２４・・・・
・ホルタ−１２５・・・・・吸着ノズル、２６ａ・・
−・フランジ部、２５ｂ・ ・・貫通穴、２５ｃ・中・
・吸着ノズル先端、２６・・・・・バネ、２７・・・・
リングシール、３１・・一部品供給部、３１ ａ 、
４ｑ ・部品取出し位置、３１ｂ ・−・突出防止部
、３３ テープ移送ローラ、３６− ・電子部品、３７
− 基板、３８−・−・振動フィダ一部、３９ 間欠送
り部、４１・ ・凹部。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
（イ
＠２図
５
ｌ
第 ３ 図
６Figure 1 is a cross-sectional view of the main parts of a conventional electronic component mounting device;
The figure is a sectional view of a main part of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is a partial sectional view showing the delivery of components through a chute. 21 Mounting rod, 22 River... fulcrum shaft, 24...
・Holter 125...Suction nozzle, 26a...
-・Flange part, 25b・・Through hole, 25c・Medium・
・Suction nozzle tip, 26... Spring, 27...
Ring seal, 31... One component supply section, 31 a,
4q ・Component extraction position, 31b ・Protrusion prevention part, 33 Tape transfer roller, 36- ・Electronic component, 37
- Substrate, 38-- part of vibrating feeder, 39 intermittent feed section, 41- recessed part. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure (I@2 Figure 5 l Figure 3 Figure 6
Claims (4)
しない電子部品を、吸着ノズルを有するピックアップ手
段で吸着保持し、基板上の所定位置に前記電子部品を搭
載する電子部品装着方法であって、吸着ノズルの先端を
部品供給部の部品取出し位置に近接させた後、前記部品
供給部の部品取出し位置へ電子部品を移動さぜ、その後
電子部品を吸着保持し、前記基板の面に平行な軸を中心
に前記吸着ノズル全回転させて基板上に前記電子部品を
搭載する電子部品装着方法。(1) An electronic component mounting method in which an electronic component without leads, which is intermittently fed by a component supplying means, is sucked and held by a pickup means having a suction nozzle, and the electronic component is mounted at a predetermined position on a board. After bringing the tip of the suction nozzle close to the component take-out position of the component supply section, move the electronic component to the component take-out position of the component supply section, then hold the electronic component by suction, and move it parallel to the surface of the board. An electronic component mounting method in which the electronic component is mounted on a board by fully rotating the suction nozzle around an axis.
基板に対し垂直方向とじた後、前記電子部品を特徴とす
る特許請求の範囲第１項記載の電子部品装着方法。(2) The electronic component mounting method according to claim 1, wherein the electronic component is moved from a component removal position after the suction surface of the electronic component is bound in a direction perpendicular to the substrate.
り間欠的に部品取出し位置まで送り、吸着ノズルを有す
るピックアップ手段で前記電子部品を吸着保持し、基板
上の所定位置に前記電子部品を搭載する電子部品装着装
置であって、前記ピックアップ手段は、吸着ノズルを、
前記吸着ノズルの長手方向に摺動可能に内装するホルダ
ーによ弘前記基板の面に平行な軸を中心に回転可能に設
けた電子部品装着装置。(3) An electronic component without a lead wire is intermittently fed to a component removal position by a component supply unit, and a pickup means having a suction nozzle sucks and holds the electronic component, and the electronic component is placed at a predetermined position on the board. The electronic component mounting device is equipped with an electronic component mounting device, wherein the pickup means includes a suction nozzle,
The electronic component mounting device is provided with a holder that is slidable inside the suction nozzle and is rotatable about an axis parallel to the surface of the substrate.
の空気流入孔を設けた特許請求の範囲第３項記載の電子
部品装着装置。(4) The electronic component mounting device according to claim 3, wherein the holder is provided with at least one air inflow hole for supplying compressed air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59151657A JPS6068700A (en) | 1984-07-20 | 1984-07-20 | Method of mounting electronic part and device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59151657A JPS6068700A (en) | 1984-07-20 | 1984-07-20 | Method of mounting electronic part and device therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6068700A true JPS6068700A (en) | 1985-04-19 |
| JPH0222560B2 JPH0222560B2 (en) | 1990-05-18 |
Family
ID=15523362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59151657A Granted JPS6068700A (en) | 1984-07-20 | 1984-07-20 | Method of mounting electronic part and device therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6068700A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013118221A (en) * | 2011-12-01 | 2013-06-13 | Nippon Ritoru Kk | Chip mounter |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4817631U (en) * | 1971-07-06 | 1973-02-28 | ||
| JPS5388159A (en) * | 1977-01-12 | 1978-08-03 | Matsushita Electric Ind Co Ltd | Method of and device for inserting electronic part |
| JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
-
1984
- 1984-07-20 JP JP59151657A patent/JPS6068700A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4817631U (en) * | 1971-07-06 | 1973-02-28 | ||
| JPS5388159A (en) * | 1977-01-12 | 1978-08-03 | Matsushita Electric Ind Co Ltd | Method of and device for inserting electronic part |
| JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013118221A (en) * | 2011-12-01 | 2013-06-13 | Nippon Ritoru Kk | Chip mounter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0222560B2 (en) | 1990-05-18 |
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