JPS6062279A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To facilitate the constitution of an optical path and improve the reliability of a device by fixing a solid-state image pickup element to the bottom part of a resin envelope structure which has an opening at the upper part, sealing the opening with a transparent flat plate, and filling transparent resin between the flat plate and image pickup element. CONSTITUTION:A base board placing part 7 and a lead frame having plural lead-out conductors 8 are molded with mold resin to constitute the resin envelope structure 9 having the opening at the upper part. The solid-state image pickup element 3 is stuck to the mount part 7 of the bottom part of the envelope structure 9 with Ag paste. This element 2 and lead-out wires 8 are connected together with metallic thin wire 3 and transparent resin 10 is dropped on the surface of the element 2. This resin 10 uses silicone resin and the transparent flat plate 5 is fixed to the opeing part of the envelope structure 9 with an adhesive 4. The transparent resin 10 is filled between the flat plate 7 and element 2, and used as the effective optical path of the solid-state image pickup device to improve the reliability of the device.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は固体描像装置、とくにそのパッケージのＩ’ｊ
’）造に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a solid-state imaging device, particularly to the I'j of its package.
') Concerning construction.

従来例の構成とその問題点 従来、ＣＯＤ、ＣＰＤ等の電荷転送素子を搭載した固体
撮像装置は、通常第１図に示すように、セラミックの多
層構造体からなる外囲構体１の素子載置部に電荷転送素
子２を固定し、電極取り出しのだめの金属細線３による
ワイヤリングを行なった後、接着剤４を井１いて外囲構
体１の」二面をパイレックスガラスなどの透光性平板５
で封じた構造になっている。なお６は外部導出線である
。Conventional configurations and their problems Conventionally, solid-state imaging devices equipped with charge transfer devices such as CODs and CPDs are usually mounted on an outer structure 1 made of a ceramic multilayer structure, as shown in FIG. After fixing the charge transfer element 2 to the part and wiring with a thin metal wire 3 for taking out the electrodes, adhesive 4 is applied to the well 1 and two sides of the outer enclosure 1 are attached to a transparent flat plate 5 such as Pyrex glass.
It has a sealed structure. Note that 6 is an external lead line.

かかる構造の固体撮像装置は、外囲構体１かセラミック
の多層構造体であることから非常なコスト高となる。A solid-state imaging device having such a structure has a very high cost because the surrounding structure 1 is a ceramic multilayer structure.

このため、第２図で示すように、基板載置部７、外部導
出線８を有するリードフレームをモール）・用樹脂で成
形して外囲構体９を得、電荷転送素子２の基板載置部７
への固着、金属細線３に」＝るワが提案されるに至って
いる。この構造によれば、セラミック製の外囲構体を用
いる場合にくらへて、製品コストを大幅に引き下げるこ
とができる。For this purpose, as shown in FIG. 2, a lead frame having a substrate mounting part 7 and external lead wires 8 is molded with molding resin to obtain an outer enclosure structure 9, and a substrate mounting part for the charge transfer element 2 is formed. Part 7
It has come to be proposed that the metal wire 3 should be fixed to the metal wire. According to this structure, the product cost can be significantly reduced compared to the case where a ceramic outer enclosure structure is used.

しかしながら、透明平板５による射出が完了したのち、
固体撮像素子２が収容されている空所内に露呈ｊ−るモ
ールド用樹脂の表面から微小なダストか発生し、固体撮
像素子２の表面に附着して不良の原因となることがある
。丑だ気密性に関してもセラミック製の外囲１Ｍ体を用
い／Ｃ構造のものと比べると劣り、関部導出線とモール
ド用樹脂の界面あるいは枝１脂バルク全通して水分や不
純物が浸入して品質が損なわ八ることがある。However, after the injection by the transparent flat plate 5 is completed,
Fine dust may be generated from the surface of the molding resin exposed in the cavity in which the solid-state image sensor 2 is housed, and may adhere to the surface of the solid-state image sensor 2, causing a defect. In terms of airtightness, it is inferior to that of the ceramic outer 1M body/C structure, and moisture and impurities may infiltrate through the interface between the lead wire and the molding resin or through the entire branch resin bulk. Quality may be compromised.

発明の目的 本発明の目的は、外囲構体を樹脂で形成して、コストの
低減をｆｄかり、しかも樹脂外囲構体を用いたときに牛
しる上記の不都合が排除できる固体撮像装置を提供する
ことにある。OBJECTS OF THE INVENTION It is an object of the present invention to provide a solid-state imaging device in which the outer enclosure structure is made of resin to reduce costs and eliminate the above-mentioned disadvantages when using the resin outer enclosure structure. It's about doing.

発明の構成 本発明の固体撮像装置は、上部に開口をもつ樹脂外囲構
体の底部に固体撮像素子が固着され、前記の開口が透光
性平板により封塞されるとともに、との透光（〈１゛平
板と固体撮像素子との間の間隙が透光性樹脂で満たされ
た構造とされている。この構造によシ、信頼性の高い固
体撮像装置を低コストで製作することが可能になる。Structure of the Invention In the solid-state imaging device of the present invention, a solid-state imaging device is fixed to the bottom of a resin enclosure having an opening at the top, the opening is sealed with a light-transmitting flat plate, and a light-transmitting ( 〈1゛The gap between the flat plate and the solid-state imaging device is filled with a translucent resin.With this structure, it is possible to manufacture a highly reliable solid-state imaging device at low cost. become.

実施例の説明 第３図を参照して本発明の固体撮像装置の実施例を説明
する。まず、基板載置部γおよび所定数の多部曽出線８
をもつリードフレームをエポキシ樹脂等のモールド用樹
脂により成形して得た樹脂外囲構体９を僧備し、その基
板載置部γの部分にＣＯＤ　、ＣＰＤ等の固体撮像素子
２をＡｑベニストで接着固定し、さらにＡｔ′ｙまたは
ＡｕＨ１線３に樹脂としては、可視光の透過性にすぐれ
、固体撮像素子を接着固定しているＡｑペーストの耐熱
温度よりも低い温度でキュアーができ、キュアー後も弾
性を有するとともに、透光性平板５を樹脂外囲構体９に
接着するだめの温度（１５０℃前後）に耐え、さらに水
分や不純物の含有量の少ないものが必要とされる。この
ような多岐にわたる条件ヲ満たす樹脂としては、ジャン
クシランコーティング用の透明シリコーン樹脂が好適で
ある。DESCRIPTION OF EMBODIMENTS An embodiment of the solid-state imaging device of the present invention will be described with reference to FIG. First, the substrate mounting part γ and a predetermined number of multi-part sode lines 8
A resin enclosure structure 9 obtained by molding a lead frame with a molding resin such as an epoxy resin is provided, and a solid-state imaging device 2 such as a COD or CPD is mounted on the substrate mounting portion γ using Aq Benist. The resin that is bonded and fixed to At'y or AuH1 line 3 has excellent visible light transmittance and can be cured at a lower temperature than the heat resistance temperature of the Aq paste that bonds and fixes the solid-state image sensor. It is also required to have elasticity, withstand the temperature (approximately 150° C.) at which the transparent flat plate 5 is bonded to the resin surrounding structure 9, and to have a low content of moisture and impurities. A transparent silicone resin for junk silane coating is suitable as a resin that satisfies these various conditions.

透光性明脂１ｏを滴下したのち、１５０〜２００℃の温
度で１〜２時間にわたりキュアーを行なう。After dropping 1 o of transparent clear resin, curing is performed at a temperature of 150 to 200°C for 1 to 2 hours.

ところで、透光性樹脂の滴下に際しては、滴下量を制御
し、キュアー後の透光性樹脂頂面を樹脂外囲構体９の開
口端縁よりも上側に位置させることが大切である。By the way, when dropping the translucent resin, it is important to control the amount of the drop and to position the top surface of the cured translucent resin above the opening edge of the resin outer enclosure 9.

次いで、パイレックスガラス板などの透光性平板６を樹
脂外囲Ｊ！ｌ；体９の環状に’ｆｉ　頂面へエポキシ系
の接着剤４を用いて接着し、開口を封塞する。Next, a light-transmitting flat plate 6 such as a Pyrex glass plate is wrapped around a resin envelope J! l: Glue 'fi to the annular top surface of body 9 using epoxy adhesive 4 to seal the opening.

このとき、前記のように透光性樹脂１０の頂面がｉｆ　
ＩＩＩ外囲構体９の環状壁頂面よりも上方に出ているた
め、透光性東根５によって下方向へ押圧され、透光性樹
脂１ｏがもつ弾性により透光性平板５の面に密着する。At this time, as described above, the top surface of the translucent resin 10 is
Since it protrudes above the top surface of the annular wall of the III outer enclosure structure 9, it is pressed downward by the translucent higashi root 5, and is brought into close contact with the surface of the translucent flat plate 5 due to the elasticity of the translucent resin 1o. .

以上の過程を経て図示する構造の固体撮像装置が完成す
る。なお、透光性樹脂１０は、固体撮像素子２の上側の
間隙を全て満たずことかのそ寸しいが、固体撮像装置を
動作させたときの有効光路、すなわち、固体撮像素子２
の撮像領域上の間隙を満たしていれば所期の目的は達成
される。Through the above process, a solid-state imaging device having the structure shown in the figure is completed. Although it may be difficult to fill the entire gap above the solid-state image sensor 2, the translucent resin 10 covers the effective optical path when the solid-state image sensor is operated, that is, the solid-state image sensor 2.
If the gap on the imaging area is filled, the intended purpose will be achieved.

発明の効果 本発明の固体撮像装置では外囲構体の材料をモールド用
樹脂にしたことにより大幅なコストの低減が達成できる
ことは勿論のこと、固体撮像素子と透光性平板との間の
少なくとも装置動作時の有効光路となる部分が透光性樹
脂で満たされているため、モールド用樹脂の内部表面か
ら発生するダストが固体撮像素子の表面に附着すること
、あるいは光路をさえぎることがなく、また、外囲構体
の樹脂とリード界面ならびに樹脂そのものを通過して水
分あるいは不純物が封入空間内に入り込んでも透光性樹
脂がバリヤとして働くため、固体撮像装置の信頼性が高
まるなどの効果が奏される。Effects of the Invention In the solid-state imaging device of the present invention, by using molding resin as the material for the outer surrounding structure, it is possible to achieve a significant cost reduction, and at least the device between the solid-state imaging device and the transparent flat plate can be reduced. Since the part that becomes the effective optical path during operation is filled with translucent resin, dust generated from the internal surface of the molding resin does not attach to the surface of the solid-state image sensor or block the optical path. Even if moisture or impurities enter the enclosed space through the resin-lead interface of the surrounding structure and the resin itself, the translucent resin acts as a barrier, resulting in improved reliability of the solid-state imaging device. Ru.

【図面の簡単な説明】 第１図は外囲構体をセラミックで形成した従来の固体撮
像装置の構造を示す断面図、第２図は外囲構体を樹脂で
形成した従来の固体撮像装置の構造を示す断面図、第３
図は本発明の固体撮像装置の構造を示す断面図である。 １・　・・セラミック外囲構体、２・・・・・・固体撮
像素子−１３・・・　金属細線、４・・・・・・接着剤
、５・・・・・・透光性（Ｉｉ板、６，８・　・・外部
導出線、７・・・・・基板載置部、９　・・・樹脂外囲
構体、１Ｑ・・・・・透光性樹脂。 代理人の氏名　弁理士　中　尾　敏　男　ほか１名第１
図 第２図[Brief Description of the Drawings] Fig. 1 is a cross-sectional view showing the structure of a conventional solid-state imaging device in which the surrounding structure is made of ceramic, and Fig. 2 is the structure of a conventional solid-state imaging device in which the surrounding structure is made of resin. 3rd cross-sectional view showing
The figure is a sectional view showing the structure of the solid-state imaging device of the present invention. 1...Ceramic surrounding structure, 2...Solid-state image sensor-13...Metal thin wire, 4...Adhesive, 5...Translucent (Ii plate , 6, 8...External lead-out wire, 7...Board mounting part, 9...Resin enclosure structure, 1Q...Translucent resin. Name of agent: Patent attorney Nakao Toshio and 1 other person 1st
Figure 2

Claims (3)

【特許請求の範囲】[Claims] （１）」一部に開口をもつ樹脂外囲構体の底部に固体撮
像素子が固着され、前記開口が透光性平板で封塞される
とともに、同透光性平板と前記固体撮像素子との間の間
隙が透光性樹脂で満たされていることを特徴とする固体
撮像装置。(1) A solid-state image sensor is fixed to the bottom of a resin enclosure structure having an opening in a part, the opening is sealed with a transparent flat plate, and the solid-state image sensor is connected to the transparent flat plate. A solid-state imaging device characterized in that a gap between the gaps is filled with a translucent resin. （２）透光性（句脂で満たされる間隙内に有効光路が位
置していることを特徴とする特許請求の範囲第１項に記
載の固体撮像装置。(2) The solid-state imaging device according to claim 1, characterized in that the effective optical path is located within a gap filled with translucent resin. （３）透光性樹脂がシリコーン樹脂であることを特徴と
する特許請求゛の範囲第１項に記載の固体撮像装置。(3) The solid-state imaging device according to claim 1, wherein the light-transmitting resin is a silicone resin.